CN211047454U

CN211047454U - Printed circuit board

Info

Publication number: CN211047454U
Application number: CN201920747416.8U
Authority: CN
Inventors: 杨继刚; 王悠; 刘世生; 陈绪东; 谢占昊; 邓杰雄; 崔荣
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2019-05-22
Filing date: 2019-05-22
Publication date: 2020-07-17
Anticipated expiration: 2029-05-22
Also published as: TWM590837U

Abstract

The utility model provides a printed circuit board, which comprises a substrate combination and an embedded block, wherein the substrate combination comprises a plurality of substrates which are arranged in a stacking way and are bonded through a first bonding layer; the base material combination is provided with a groove, the side wall of the embedded block is irregular, the embedded block is arranged in the groove through a second bonding layer, and the first bonding layer and the second bonding layer of the base material combination are mutually independent bonding layers. Thus, the combination force of the embedded block and the base material combination is enhanced, and more circuit board laminated structures are obtained.

Description

Printed circuit board

Technical Field

The present application relates to circuit board technology, and more particularly to a printed circuit board.

Background

In the process of manufacturing an embedded printed circuit board, generally, a circuit pattern is first manufactured on a core board, the core board is grooved, then the grooved core boards are stacked together, an embedded block is placed in the groove, and then the embedded block is pressed through a semi-cured sheet (PP glue). For example, the metal block is placed in a groove of the core plate, and then the core plate is pressed by PP glue, the PP glue is melted into liquid at high temperature and flows into a gap between the metal block and the groove wall, and the PP glue is solidified at low temperature, so that the metal block and the groove wall are bonded together.

However, when the embedded printed circuit board is manufactured, the above process can only manufacture the laminated structure of the core board and the core board in a laminating manner, but cannot manufacture the laminated structure of the core board and the copper foil in a laminating manner. When the core plate of the groove is pressed with the copper foil, the copper foil can deviate due to the flowing of PP glue which is melted by heat, so that the grooves on the copper foil and the core plate are not aligned, the product quality is reduced, and the binding force between the embedded block and the core plate is reduced.

SUMMERY OF THE UTILITY MODEL

The present application generally provides a printed circuit board that can enhance the bonding force between an embedded block and a core board.

In order to solve the above main technical problem, the present application adopts a technical scheme that: providing a printed circuit board, wherein the printed circuit board comprises a substrate combination and an embedded block, and the substrate combination comprises a plurality of substrates which are arranged in a stacked mode and are bonded through a first bonding layer;

the base material combination is provided with a groove, the side wall of the embedded block is irregular, the embedded block is arranged in the groove through a second bonding layer, and the first bonding layer and the second bonding layer of the base material combination are mutually independent bonding layers.

The beneficial effect of this application is: be different from prior art's condition, this application is through pressing into substrate combination with multilayer substrate fluting in the substrate combination to set up the embedding piece in the groove, set up the embedding piece lateral wall into irregular shape, in order to promote the cohesion of embedding piece and substrate combination.

Drawings

Fig. 1a is a schematic structural diagram of a first embodiment of the printed circuit board of the present invention;

FIG. 1b is a schematic diagram illustrating the structure of the sidewall shape of the partially embedded block of the present invention;

FIG. 1c is a schematic structural view of the shape of the partial insert of the present invention;

fig. 2 is a schematic structural diagram of a second embodiment of the printed circuit board of the present invention;

fig. 3 is a schematic structural diagram of a third embodiment of the printed circuit board of the present invention;

fig. 4 is a schematic structural diagram of a fourth embodiment of the printed circuit board of the present invention;

fig. 5 is a schematic structural diagram of a fifth embodiment of the printed circuit board of the present invention;

fig. 6 is a schematic structural diagram of a sixth embodiment of the printed circuit board of the present invention;

fig. 7 is a schematic structural diagram of a seventh embodiment of the printed circuit board of the present invention;

fig. 8 is a schematic structural view of an eighth embodiment of the printed circuit board of the present invention;

fig. 9 is a schematic structural view of a ninth embodiment of the printed wiring board of the present invention.

Detailed Description

The utility model provides a printed circuit board, which comprises a substrate combination and an embedded block, wherein the substrate combination comprises a plurality of substrates which are arranged in a stacking way and are bonded through a first bonding layer; the substrate assembly is provided with a groove, the side wall of the embedded block is irregular, and the embedded block is bonded in the groove through a second bonding layer.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art without any creative effort based on the embodiments in the present application belong to the protection scope of the present application.

Please refer to fig. 1a, which is a schematic structural diagram of a first embodiment of the printed circuit board of the present invention. In this embodiment, the printed circuit board is formed by one-time pressing, only one core board 201, two

copper foils

202 and 203 and two first

adhesive layers

204 and 205 are schematically shown in fig. 1a, and in other embodiments, two, three, five or other numbers of core boards 201 may be stacked according to actual needs.

The printed wiring board shown in this embodiment specifically includes: the base material combination comprises a core board 201,

copper foils

202 and 203 respectively positioned at two sides of the core board 201, and

first bonding layers

204 and 205 positioned between the core board 201 and the

copper foils

202 and 203; the first bonding layer 204 bonds the core board 201 and the copper foil 202, the first bonding layer 205 bonds the core board 201 and the copper foil 203, and the surfaces of the

copper foils

202 and 203 and the two

surfaces

2011 and 2012 of the core board 201 connected with the

first bonding layers

204 and 205 form a circuit pattern layer. The printed circuit board further includes: the substrate assembly comprises a groove 211 which is positioned on the substrate assembly and penetrates through the upper surface and the lower surface of the substrate assembly, and an embedded block 212 embedded in the groove 211, wherein the height of the embedded block 212 is the same as that of the substrate assembly, and after the embedded block 212 is embedded in the groove 211, the embedded block 212 is flush with the substrate assembly; and a second adhesive layer 213 between the embedded block 212 and the groove 211 for adhering the embedded block 212 and the groove 211; the substrate assembly is further provided with a plurality of via holes, including

blind holes

207 and 208 for electrically connecting the circuit pattern layer of the copper foil 202 with the circuit pattern layer on one surface 2011 of the core board 201 and the circuit pattern layer of the copper foil 203 with the circuit pattern layer on the other surface 2012 of the core board 201, through holes 209 for electrically connecting the circuit pattern layer of the copper foil 202 with the circuit pattern layer of the copper foil 203, and buried holes 206 for electrically connecting the circuit pattern layers on the two

surfaces

2011 and 2012 of the core board 201. The core board 201, the

copper foils

202 and 203, and the first

adhesive layers

204 and 205 have the same shape and size, for example, the surfaces of the core board 201, the

copper foils

202 and 203, and the first

adhesive layers

204 and 205 are all rectangular, or the surfaces of the

copper foils

202 and 203, and the first

adhesive layers

204 and 205 are all triangular, and the like, and are not limited specifically.

In other embodiments, a plurality of core boards 201 and

copper foils

202, 203 are stacked together, and first

adhesive layers

204, 205 are stacked between core boards 201 and

copper foils

202, 203, wherein

copper foils

202, 203 are located outside of the plurality of core boards 201; and laminating the plurality of core boards, the copper foils and the first bonding layers which are stacked together to obtain a base material combination, wherein a circuit pattern layer is formed on the surface of at least part of the core boards for laminating, after lamination, the circuit pattern layer is manufactured on the copper foils positioned on the outer sides of the plurality of core boards, a groove 211 is formed in the base material combination, and the embedded block 212 is placed in the groove 211 and bonded through the second bonding layer 213.

It should be noted that the core board 201 is made of a copper-clad board, and is specifically formed by impregnating a reinforcing material (such as a paper substrate, a fiberglass fabric substrate, a synthetic fiber fabric substrate, etc.) with resin, coating one or both surfaces with copper foil, and hot-pressing, and is used as a base material of a printed circuit board. Specifically, in this embodiment, the core board 201 may be a copper-clad board with one surface covered with a copper foil, or a copper-clad board with two surfaces covered with copper foils.

In addition, in this embodiment, the shape of the insertion block 212 is square as shown in fig. 1a, or may be a boss shape, an i shape, or a T shape as shown in fig. 1c, and the specific limitation is not limited, the sidewall of the insertion block 212 is an irregular shape, such as a square protrusion shape as shown in fig. 1a, and in other embodiments, the insertion block 212 may also be a triangular groove, a triangular protrusion, a semicircular groove, or a semicircular protrusion shape as shown in fig. 1b, and the shape of the insertion block 212 may improve the combining force between the insertion block and the substrate combination. The embedded block is made of metal materials such as copper blocks, iron blocks, aluminum blocks and the like; the embedded block may also be made of a high-speed material, such as high-speed steel, to save materials, the high-speed material is used at a position where a high-speed signal needs to be sent, and the high-speed material is not used at a position where a high-speed signal does not need to be sent, for example, a low-speed material may be used to save costs.

In other embodiments, the electronic component 214 may be mounted on one surface of the embedded block 212, if the electronic component 214 is mounted on the upper surface of the embedded block, the lower surface of the embedded block 212 is used for dissipating heat, if the electronic component 214 is mounted on the lower surface of the embedded block 212, the upper surface of the embedded block 212 is used for dissipating heat, or both the upper and lower surfaces of the embedded block 214 may be mounted. The electronic component can be a high-power heating component.

It should be noted that the holes in this embodiment are obtained by laser drilling and/or mechanical drilling, and further, after the holes are formed, conductive layers or conductive columns, specifically copper layers, and conductive columns, specifically copper columns, are formed in the

holes

206, 207, 208, and 209 by electroplating, and the conductive layers or conductive columns are used to electrically connect circuit pattern layers connected to the holes, and when the conductive layers are disposed in the holes, in order to prevent the manufactured printed circuit board from sinking, it is necessary to further fill resin into the holes after the conductive layers are formed; the printed wiring board illustrated in fig. 1a can be used to fabricate four layers of circuit pattern layers, i.e., four layers of circuit pattern layers can be formed on both

surfaces

2011, 2012 of the

copper foils

202, 203 and the core 201. In other embodiments, a circuit pattern layer with less than four layers may be formed according to actual requirements, for example, three circuit pattern layers are formed, in one embodiment, three circuit pattern layers are formed on the

copper foils

202 and 203 and the surface 2011, and only two

holes

207 and 209 are formed by drilling. In other embodiments, the present application is not specifically limited herein, as the case may be.

Specifically, the first

adhesive layers

204 and 205 are prepregs, which mainly comprise resin and reinforcing materials (fiberglass cloth, paper substrates, composite materials and the like), most prepregs used for manufacturing the multilayer printing plate adopt fiberglass cloth as the reinforcing material, the fiberglass cloth is soaked with the resin, and then the prepregs are subjected to heat treatment, can be softened under heating and pressurization, and can be reacted and solidified after cooling. The second adhesive layer 213 is made of resin or conductive material, and if the embedded block and the base material are to be separated from each other, the embedded block is filled with resin such as phenol resin, polyvinyl chloride resin, polyethylene, polytetrafluoroethylene, or the like, and if the embedded block and the base material are to be electrically connected, the embedded block is filled with conductive material such as resin with copper powder or silver powder.

In addition, when the insert block is used only for heat dissipation, a filling resin bonds the insert block and the substrate assembly, and when the insert block plays a role of conduction in addition to heat dissipation, the insert block and the substrate assembly are bonded by a conductive resin containing copper powder or silver powder. The resin is in a liquid state capable of flowing in an original state, is in a stable solid state after being heated, and is combined and bonded with the base material when the resin becomes a solid state after being heated.

Fig. 2 is a schematic structural diagram of a printed circuit board according to a second embodiment of the present invention. Compared with the first embodiment, the present embodiment is different in that the present embodiment further includes

copper foils

311 and 312 outside the

copper foils

202 and 203, the first

adhesive layers

313 and 314 are disposed between the

copper foils

202 and 311 and between the

copper foils

203 and 312, and the

copper foils

311 and 312 have circuit pattern layers thereon. The printed circuit board shown in this embodiment is formed by two times of pressing, that is, the core board 201, the

copper foils

202 and 203, and the

first bonding layers

204 and 205 are firstly pressed for the first time to obtain a first substrate assembly, wherein a circuit pattern layer is formed on two

surfaces

2011 and 2012 of the core board 201 for the first time of pressing; after the lamination, a circuit pattern layer is also formed on the

copper foils

202 and 203, and then the

first bonding layers

313 and 314 and the

copper foils

311 and 312 are stacked on the outer sides of the

copper foils

202 and 203 for the second lamination. Like the first embodiment, the substrate assembly of this embodiment also includes a groove 320, an embedded block 321 is disposed in the groove 320, and a second adhesive layer 322 is used to adhere the embedded block 321 and the substrate assembly; and a plurality of via holes for connecting to the circuit pattern layer, in addition to the

holes

206, 207, 208, 209 shown in the first embodiment, the present embodiment further includes a through hole 319 for electrically connecting the copper foil 311 and the circuit pattern layer of the copper foil 312, a blind hole 317 for electrically connecting the circuit pattern layer of the copper foil 311 and the circuit pattern layer on a surface 2011 of the core board 210, a blind hole 318 for electrically connecting the circuit pattern layer of the copper foil 312 and the circuit pattern layer on a surface 2012 of the core board 210, and

blind holes

315, 316 for electrically connecting the circuit pattern layer of the copper foil 311 and the copper foil 202 and the circuit pattern layer of the copper foil 312 and the copper foil 203, respectively.

Specifically, in this embodiment, the height of the embedding block 321 is equal to the height of the substrate assembly, and the embedding block 321 is embedded in the groove 320, where the embedding block 321 is flush with the height of the substrate assembly.

A surface mounting electronic component 310 of embedded block 321, if be in the upper surface mounting electronic component 310 of embedded block 321, then the lower surface of embedded block 321 is used for the heat dissipation, if be in the lower surface mounting electronic component 310 of embedded block 321, then the upper surface of embedded block 321 is used for the heat dissipation, also can the upper and lower surface of embedded block 321 all pastes electronic component 310, or the upper and lower surface of embedded block does not paste electronic component 310.

In this embodiment, the shape of the embedded block 321 is square, and may also be a boss shape, an i shape, or a T shape shown in fig. 1c, and is not limited specifically, and the side wall of the embedded block 321 is irregular, such as a square protrusion, and in other embodiments, the embedded block 321 may also be a triangular groove, a triangular protrusion, a semicircular groove, a semicircular protrusion, or the like shown in fig. 1b, and the shape of the embedded block 321 is set to be such that the bonding force between the embedded block and the substrate combination can be improved.

Fig. 3 is a schematic structural diagram of a printed circuit board according to a third embodiment of the present invention. The printed circuit board of this embodiment is formed by two times of pressing, which is the same as the second embodiment, and is different from the second embodiment in that the height of the embedded block 321 in this embodiment is smaller than the height of the base material assembly, the groove 320 penetrates through the upper and lower surfaces of the base material assembly, the embedded block 321 is embedded in the groove 320, a groove 323 is formed on the side walls of the embedded block 321 and the groove 320, and an electronic component 310 is disposed on the surface of the embedded block 321 in the groove 323.

The shape of the embedded block 321 may be a boss, an i, or a T shape as shown in fig. 1c, and is not limited specifically, and the sidewall of the embedded block 321 may be irregular, such as a square protrusion, in other embodiments, the embedded block 321 may also be a triangular groove, a triangular protrusion, a semicircular groove, or a semicircular protrusion as shown in fig. 1b, and the combination force between the embedded block and the substrate may be improved by setting the embedded block 321 to be in such a shape.

Fig. 4 is a schematic structural diagram of a printed circuit board according to a fourth embodiment of the present invention. Compared with the second embodiment, the difference is that the core board 201, the first bonding layers 204, 205 and the copper foils 202, 203 are firstly pressed, the groove 320 is formed on the pressed base material combination, the embedded block 321 is embedded in the groove 320, the second bonding layer 322 is filled to bond the embedded block 321 and the base material combination, the first bonding layers 313, 314 and the copper foils 311, 312 are stacked outside the base material combination and the embedded block 321, and then the second pressing is carried out.

In this embodiment, the height of the embedded block 321 is less than the height of the substrate assembly, the groove 320 penetrates the copper foils 202 and 203 of the substrate assembly and is covered by the first bonding layers 313 and 314 and the copper foils 311 and 312, and the embedded block 321 is embedded in the groove 320 and bonded by the second bonding layer 322. In this embodiment, it is not necessary to mount electronic components, and the material of the embedding block 321 may be a high-speed material.

The shape of the embedding block may be a boss shape, an i shape, or a T shape as shown in fig. 1c, specifically without limitation, and the sidewall of the embedding block 321 may be an irregular shape, such as a square protrusion, in other embodiments, the side wall may also be a triangular groove, a triangular protrusion, a semicircular groove, a semicircular protrusion, or the like as shown in fig. 1b, and the embedding block 321 may be configured in such a shape to improve the bonding force between the embedding block and the substrate combination.

Fig. 5 is a schematic structural diagram of a fifth embodiment of the printed circuit board according to the present invention. Compared with the fourth embodiment, the substrate assembly is formed by two times of pressing, and the difference is that the upper surface and the lower surface of the embedded block 321 of the embodiment are connected to the upper surface and the lower surface of the substrate assembly through the

blind holes

324 and 323, the

blind holes

324 and 323 are provided with metal layers, the electronic component 325 is attached to the blind hole 324 on the upper surface of the region corresponding to the embedded block 321 of the substrate assembly, the lower surface of the substrate assembly dissipates heat, or the electronic component 325 is attached to the blind hole 323 on the lower surface of the region corresponding to the embedded block 321 of the substrate assembly, and the upper surface dissipates heat.

Fig. 6 is a schematic structural diagram of a printed circuit board according to a sixth embodiment of the present invention. The printed circuit board comprises a base material combination and an embedded block 521, wherein the embedded block 521 is arranged in a groove 520 through a second bonding layer 523, the base material combination comprises a plurality of base materials which are arranged in a stacked mode and bonded through first bonding layers 504, 505, 513 and 514, and the plurality of base materials comprise

core plates

501, 511 and 512 and copper foils 502 and 503. Wherein the first bonding layer 504 is located between the adjacent and spaced core board 501 and the copper foil 502, the first bonding layer 505 is located between the adjacent and spaced core board 501 and the copper foil 503, the first bonding layer 513 is located between the adjacent and spaced core board 511 and the copper foil 502, and the first bonding layer 514 is located between the adjacent and spaced core board 512 and the copper foil 503, that is, the adjacent and spaced core board and the copper foil are spaced apart by the first bonding layer in fig. 5. In fig. 5, the two

faces

5011 and 5012 of the core board 501, the two

faces

5111 and 5112 of the core board 511, the two

faces

5121 and 5122 of the core board 512, and the copper foils 502 and 503 are formed with a circuit pattern layer, that is, eight circuit pattern layers in total; in this embodiment, the first

adhesive layers

504, 505, 513, 514 and the second adhesive layer 523 of the substrate assembly are independent adhesive layers.

In this embodiment, the volume of the embedded block 521 is not greater than the size of the slot space of the slot 520, further, the height of the embedded block 521 is less than the height of the slot 520, the electronic component 524 is mounted at the groove 522 formed by the upper surface, the lower surface and the slot wall of the embedded block 521, and the electronic component 524 may not be mounted in other embodiments; the first

adhesive layers

504, 505, 513, and 514 are prepregs, and the second adhesive layer 523 is a resin layer. The embedded block 521 is a metal block or a high-speed material, the metal block is mainly used for heat dissipation, the heat dissipation rate can be improved when the metal block is exposed in the air, the high-speed material is mainly used for changing the transmission speed of signals, and the embedded block 521 is cylindrical, prismatic or cuboid or other shapes.

In this embodiment, the prepreg, the resin, and the core material are the same as those in the first embodiment, and are not described herein again.

The main difference from the above-described examples is that the outer base materials of the substrate combination of the above-described embodiment are copper foils 311 and 312, and the outer base materials of the present embodiment are

core boards

511 and 512.

The shape of the embedded block may be a boss, an i, or a T shape as shown in fig. 1c, specifically without limitation, and the sidewall of the embedded block 521 may be irregular, such as a square protrusion, in other embodiments, the embedded block 521 may also be a triangular groove, a triangular protrusion, a semicircular groove, a semicircular protrusion, or the like as shown in fig. 1b, and the shape of the embedded block 521 may improve the bonding force between the embedded block and the substrate.

Fig. 7 is a schematic structural diagram of a printed circuit board according to a seventh embodiment of the present invention. The main difference from the above second embodiment is that the outer base materials of the second embodiment are copper foils 311 and 312, and the outer base materials of this embodiment are

core plates

611 and 612. In this embodiment, the height of the embedded block 621 is equal to the height of the groove 620, and the embedded block 621 is embedded into the groove 620, and the upper and lower surfaces of the embedded block are flush with the upper and lower surfaces of the substrate assembly. The copper foils 602 and 603 are provided with circuit pattern layers, and circuit pattern layers are formed on two

surfaces

6011 and 6012 of the core board 601, two

surfaces

6111 and 6112 of the core board 611, and two

surfaces

6121 and 6122 of the core board 612, that is, eight circuit pattern layers in total. In fig. 6, nine

holes

606, 607, 608, 609, 615, 616, 617, 618, 619 are shown, which all serve to electrically connect the layout layers of the given layer, as in the second embodiment.

The shape of the embedded block 621 may be a boss shape, an i shape, or a T shape as shown in fig. 1c, specifically without limitation, the sidewall of the embedded block 621 is irregular, such as a square protrusion, in other embodiments, the sidewall may also be a triangular groove, a triangular protrusion, a semicircular groove, a semicircular protrusion, or the like as shown in fig. 1b, and the embedded block 621 is configured in such a shape to improve the bonding force between the embedded block and the substrate.

Please refer to fig. 8, which is a schematic structural diagram of an eighth embodiment of the printed circuit board of the present invention. The difference from the fourth example is that the outer base materials of the fourth embodiment are copper foils 311 and 312, and the outer base materials of this example are

core boards

811 and 812. In this embodiment, the height of the embedded block 821 is smaller than that of the substrate assembly, the groove 820 penetrates through the copper foils 802 and 803 of the substrate assembly and is covered by the first

adhesive layers

813 and 814 and the

core plates

811 and 812, and the embedded block 821 is embedded in the groove 820 and bonded by the second adhesive layer 822. In this embodiment, it is not necessary to mount electronic components, and the material of the embedded block may be a high-speed material. The height of the insert 821 is equal to the height of the slot 820, and the upper and lower surfaces of the insert 821 inserted into the slot 820 are flush with the upper and lower surfaces of the slot.

As in the first embodiment, the shape of the insertion block may be a boss shape, an i shape, or a T shape as shown in fig. 1c, and the side wall of the insertion block 821 is an irregular shape, such as a square protrusion, in other embodiments, the insertion block 821 may also be a triangular groove, a triangular protrusion, a semicircular groove, or a semicircular protrusion as shown in fig. 1b, and the shape of the insertion block 821 may improve the bonding force between the insertion block and the substrate.

Fig. 9 is a schematic structural diagram of a ninth embodiment of the printed circuit board of the present invention. The base material assembly of this embodiment is formed by laminating a core board and a core board, and includes a core board 901,

core boards

904 and 905 located outside the core board 901, and first

adhesive layers

903 and 902 located between the core board 901 and the

core boards

904 and 905. After the

core boards

901, 904, 905 and the first

adhesive layers

903, 902 are pressed to form a substrate assembly, a groove 906 is formed in the substrate assembly, a metal layer 909 is formed on the side wall of the groove 906, specifically, the embedded block 907 is embedded into the groove 906 by an electroplating method, and the second adhesive layer 908 is filled to bond the embedded block 907 and the substrate assembly.

Wherein, two surfaces of the

core boards

901, 904, 905 are respectively provided with a circuit pattern layer, or at least one surface of the

core boards

901, 904, 905 is not provided with a circuit pattern layer; and forming a metal layer on the side wall of the groove of the core plate so as to electrically connect the upper and lower circuit pattern layers of the core plate. In this embodiment, the process of forming the metal layer on the side wall of the groove of the core plate includes: the method comprises the steps of firstly slotting a plurality of core plates, plating a metal layer on the walls of the slots, and then laminating the core plates through a first bonding layer, wherein the metal layer connects the upper circuit graph and the lower circuit graph of the core plates. The core boards in the base material combination of the printed circuit board described in this embodiment may be core boards of different materials, that is, the core boards in the same printed circuit board are copper clad plates of different materials. The metal layer may be disposed on the side wall of the groove in any of the above embodiments, as long as the circuit pattern layers to be electrically connected can be electrically connected. In addition, the number of layers of the core board, the number of layers of the copper foil, and the positional relationship of the core board forming the base material combination in the present application are not particularly limited as long as the requirements can be satisfied.

As in the first embodiment, the shape of the insertion block 907 may be a boss shape, an i-shape, or a T-shape as shown in fig. 1c, and the specific shape is not limited, and the sidewall of the insertion block 907 may be an irregular shape, such as a square protrusion, and in other embodiments, the insertion block 907 may also be a triangular groove, a triangular protrusion, a semicircular groove, a semicircular protrusion, or the like as shown in fig. 1b, and the shape of the insertion block 907 may improve the bonding force between the insertion block and the substrate.

The utility model provides a printed circuit board, printed circuit board includes the substrate combination, through fluting and putting into the embedding piece in the substrate combination, embedding piece material is the metal, and it is right to reach printed circuit board carries out radiating purpose, will the lateral wall of embedding piece is established to irregular shape, like triangle recess, triangle arch, square groove, square bulge, circular recess, circular bulge etc. to reach the reinforcing embedding piece with the effect of the cohesion between the substrate combination.

The above description is only for the purpose of illustrating embodiments of the present invention and is not intended to limit the scope of the present invention, which is defined by the claims and their equivalents, or by direct or indirect application to other related arts.

Claims

1. A printed circuit board, characterized in that,

the printed circuit board comprises a base material combination and an embedded block, wherein the base material combination comprises a plurality of base materials which are arranged in a stacked mode and are bonded through a first bonding layer;

the base material combination is provided with a groove, the side wall of the embedded block is in a concave-convex shape, the embedded block is arranged in the groove through a second bonding layer, and the first bonding layer and the second bonding layer of the base material combination are mutually independent bonding layers.

2. The printed circuit board of claim 1, wherein the substrate assembly comprises a plurality of core boards, a plurality of copper foils disposed on the outer sides of the plurality of core boards or between the core boards, and the first adhesive layers are disposed between two adjacent core boards and between adjacent core boards and the copper foils.

3. The printed circuit board of claim 2, wherein the embedded block is in the shape of one or any combination of a cylinder, a prism, a cuboid, a U-shape, a T-shape and an i-shape;

the concave-convex shape of the side wall of the embedding block is one or any combination of a square groove, a triangular groove, a semicircular bulge, a square bulge or a triangular bulge;

the core board is a copper-clad board with the same material and/or a copper-clad board with different materials;

the circuit pattern layer is arranged on two opposite surfaces of the core board and/or the circuit pattern layer is arranged on one surface of the core board.

4. The printed circuit board of claim 1, wherein the volume of the embedded block is smaller than or equal to the size of the space of the groove, and the embedded block is bonded to the groove wall of the groove through the second adhesive layer.

5. The printed circuit board of claim 4, wherein a metal layer is provided on a wall of the groove.

6. The printed circuit board of claim 1, wherein the height of the embedded block is equal to the height of the groove and is flush with the upper surface and/or the lower surface of the substrate assembly, and the electronic components are attached to the upper surface and/or the lower surface of the embedded block.

7. The printed circuit board of claim 4, wherein the height of the embedded block is less than the height of the groove, the upper surface and/or the lower surface of the embedded block and the groove wall form a groove, and the electronic component is mounted in the groove.

8. The printed circuit board of claim 2, wherein the height of the insert is equal to the height of the groove, and the upper surface and/or the lower surface of the insert is covered with the core and/or the copper foil and the first adhesive layer.

9. The printed circuit board of claim 2, wherein the upper and/or lower surfaces of the embedded block are electrically connected to the upper and/or lower surfaces of the substrate assembly through holes passing through the core board and/or the copper foil and the first adhesive layer.

10. The printed circuit board of claim 1, wherein the first adhesive layer is a prepreg;

the second bonding layer is a resin layer;

the embedded block is made of metal or high-speed material.