CN214901450U - Microwave multi-layer board structure - Google Patents
Microwave multi-layer board structure Download PDFInfo
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- CN214901450U CN214901450U CN202121069071.9U CN202121069071U CN214901450U CN 214901450 U CN214901450 U CN 214901450U CN 202121069071 U CN202121069071 U CN 202121069071U CN 214901450 U CN214901450 U CN 214901450U
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Abstract
The application relates to a microwave multiply wood structure, including the microwave multiply wood, the microwave multiply wood is equipped with the multilayer signal board, the multilayer signal board includes: the circuit board comprises at least six layers of circuit boards, wherein each layer of circuit board is provided with a conducting hole and an insulating positioning hole, a positioning column is arranged in each insulating positioning hole, and the positioning columns are used for stacking and positioning the six layers of circuit boards; the prepreg is arranged between two adjacent circuit boards and used for connecting the two adjacent circuit boards; the signal layer is arranged on the top surface of the circuit board; and the signal interconnection layer is arranged in the via hole and used for connecting the signal layers on the two adjacent circuit boards. According to the microwave board positioning method and device, due to the fact that the positioning columns are used for positioning the laminated circuit boards, no layer deviation exists between the laminated microwave boards after positioning, the positions of the through holes between the boards are consistent, the through holes are connected through the defined signal interconnection layers, multiple times of processing are avoided, the process flow is simplified, and the processing cost is saved.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a microwave multilayer board structure.
Background
At present, high-frequency microwave boards produced by domestic PCB manufacturers are mainly divided into a single-sided microwave board and a multi-layer microwave board. Wherein, the single-sided and double-sided microwave boards are printed with circuits on one side or two sides of one board; the multilayer microwave board is divided into a pure PTFE material multilayer microwave board and a microwave digital composite substrate. The pure PTFE material multilayer microwave board is a composite superposition of microwave boards, and because the sub-boards slide mutually when bonding sheets in the microwave board melt and flow, the laminated multilayer microwave board causes layer deviation.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the application provides a microwave multilayer plate structure, has no layer partially, simplifies processing and saves cost's advantage.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
a microwave multilayer board structure, comprising a microwave multilayer board, the microwave multilayer board is provided with a multilayer signal board, the multilayer signal board includes:
the circuit board comprises at least six layers of circuit boards, wherein each layer of circuit board is provided with a conducting hole and an insulating positioning hole, a positioning column is arranged in each insulating positioning hole, and the positioning columns are used for stacking and positioning the six layers of circuit boards;
the prepreg is arranged between two adjacent circuit boards and used for connecting the two adjacent circuit boards;
the signal layer is arranged on the top surface of the circuit board;
and the signal interconnection layer is arranged in the via hole and used for connecting the signal layers on the two adjacent circuit boards.
By the technical scheme, the microwave multilayer board is high in assembly density, small in size, high in signal transmission speed and convenient to wire; wherein the signal layer is a signal line arranged on the circuit board, the via hole is used for the communication between the circuit boards so as to be convenient for the signal interconnection layer to communicate the signal layers between the multilayer circuit boards, the positioning column is used for the connection and the positioning between the boards between the multilayer circuit boards,
as a preferred scheme of the utility model, establish to metallic copper on the signal layer, metallic copper is the line type and locates the circuit board is avoided insulating locating hole.
The technical scheme is realized and used for arranging the signal lines on the circuit board.
As an optimized scheme of the utility model, the via hole is equipped with a plurality ofly, every all be equipped with one in the via hole and be used for connecting adjacent two on the circuit board the signal interconnection layer on signal layer.
The technical scheme is realized, and the signal connection device is used for connecting signals among multiple layers of signal plates.
As a preferred embodiment of the present invention, the signal interconnection layer is uniformly covered on the hole wall of the via hole.
The technical scheme is realized and used for signal connection on two adjacent circuit boards.
As a preferable embodiment of the present invention, the signal interconnection layer is made of copper.
The technical scheme is realized so as to facilitate the signal connection and transmission between the circuit boards.
As a preferable aspect of the present invention, the prepreg is a glass fiber resin sheet.
The technical scheme is realized and used for connecting and fixing the circuit boards.
As a preferred scheme of the utility model, be equipped with the through-hole in the reference column, the pore wall of through-hole and the top surface and the bottom surface of reference column evenly cover there is the signal conduction layer, the signal conduction layer is established to metallic copper.
The technical scheme is realized, and the connecting device is used for connecting the upper layer and the lower layer of the multilayer signal plate.
As an optimized scheme of the utility model, the top surface of multilayer signal board still is equipped with the signal connection layer.
The technical scheme is realized, and the microwave multi-layer signal board is connected with the upper layer in the microwave multi-layer board so as to facilitate signal transmission.
To sum up, the utility model discloses following beneficial effect has:
the embodiment of the utility model provides a through providing a microwave multilayer board structure, including the microwave multiply wood, the microwave multiply wood is equipped with the multilayer signal board, the multilayer signal board includes: the circuit board comprises at least six layers of circuit boards, wherein each layer of circuit board is provided with a conducting hole and an insulating positioning hole, a positioning column is arranged in each insulating positioning hole, and the positioning columns are used for stacking and positioning the six layers of circuit boards; the prepreg is arranged between two adjacent circuit boards and used for connecting the two adjacent circuit boards; the signal layer is arranged on the top surface of the circuit board; and the signal interconnection layer is arranged in the via hole and used for connecting the signal layers on the two adjacent circuit boards. According to the microwave board positioning method and device, due to the fact that the positioning columns are used for positioning the laminated circuit boards, no layer deviation exists between the laminated microwave boards after positioning, the positions of the through holes between the boards are consistent, the through holes are connected through the defined signal interconnection layers, multiple times of processing are avoided, the process flow is simplified, and the processing cost is saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of a microwave multilayer board in an embodiment of the present invention.
Fig. 2 is a schematic view of the multilayer signal board in the embodiment of the present invention.
Fig. 3 is a schematic plan view of a circuit board according to an embodiment of the present invention.
Fig. 4 is a schematic view of a resin plug in an embodiment of the present invention.
The corresponding part names indicated by the numbers and letters in the drawings:
1. a microwave multilayer board; 2. a plurality of layers of signal plates; 3. a circuit board; 4. a via hole; 5. insulating positioning holes; 6. a positioning column; 7. a prepreg; 8. a signal layer; 9. a signal interconnection layer; 10. a through hole; 11. a signal conducting layer; 12. a signal connection layer; 13. and (5) resin plugs.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
A microwave multilayer board structure is disclosed, as shown in fig. 1 and fig. 2, comprising a microwave multilayer board 1, wherein a multilayer signal board 2 is arranged in the microwave multilayer board 1, the multilayer signal board 2 can be provided with at most 20 layers of circuit boards 3, each layer of circuit board 3 is provided with a signal layer 8, a via hole 4 and an insulation positioning hole 5, wherein the positions of the via hole 4 and the insulation positioning hole 5 are consistent, so that a single circuit board 3 or a plurality of circuit boards 3 can be drilled together; the signal layer 8 is a linear metal copper wire covered on the circuit board 3, and the metal copper wire needs to avoid the insulation positioning hole 5 on the circuit board 3, as shown in fig. 3; the insulating positioning hole 5 is internally provided with a positioning column 6, the positioning column 6 is used for stacking and positioning the multilayer circuit boards 3, the upper layer and the lower layer of the multilayer signal board 2 are connected and conducted through a layer of metal copper covered by a through hole 10 arranged in the middle, the hole wall of the conducting hole 4 is covered by the metal copper, and the metal copper is used for connecting and conducting a signal layer 8 between two adjacent circuit boards 3.
Referring back to fig. 2, a prepreg 7 is disposed between each layer of circuit boards 3, and the prepreg 7 is mainly composed of resin and fiberglass cloth, and is used for softening under heat and pressure during lamination, reacting and curing after cooling, and bonding two adjacent circuit boards 3 together.
Returning to fig. 2 again, the top and the bottom of the positioning column 6 are covered with a signal conducting layer 11 having one side connected with the hole wall, and the signal conducting layer 11 can be used for laminating and conducting the upper layer and the lower layer with the multilayer signal plate 2.
As shown in fig. 3, the circuit board 3 is provided with a signal connection layer 12, the signal connection layer 12 is connected to the signal layer 8, the signal layer 8 is provided with a signal copper wire, and the signal copper wire is arranged to avoid the insulation positioning hole 5 but to be connected to the via hole 4.
In the present embodiment, the via hole 4 is not filled; in other embodiments, the via hole 4 may be filled with the resin plug 13, and the resin plug 13 is used to be softened by heat and filled in the via hole 4 at the time of lamination, as shown in fig. 4.
In the present embodiment, the via hole 10 is covered with a layer of copper; in other embodiments, the vias 10 may be used to route and fill the resin plugs 13, as shown in fig. 4.
In this embodiment, circuit board 3 in the multiply wood can range upon range of 20 layers at most for microwave multiply wood 1 assembly density is high, and is small, and the line between electronic components shortens, and signal transmission speed improves, conveniently lays wire, to high frequency circuit, adds the ground plane, makes the signal line form invariable low impedance to ground, and shielding effect is good.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A microwave multilayer board structure, including microwave multilayer board (1), microwave multilayer board (1) is equipped with multilayer signal board (2), its characterized in that, multilayer signal board (2) include:
the circuit board structure comprises at least six layers of circuit boards (3), wherein each layer of circuit board (3) is provided with a conducting hole (4) and an insulating positioning hole (5), a positioning column (6) is arranged in each insulating positioning hole (5), and each positioning column (6) is used for stacking and positioning the six layers of circuit boards (3);
the prepreg (7) is arranged between two adjacent circuit boards (3) and used for connecting the two adjacent circuit boards (3);
the signal layer (8) is arranged on the top surface of the circuit board (3);
and the signal interconnection layers (9) are arranged on the via holes (4) and are used for connecting the signal layers (8) on the two adjacent circuit boards (3).
2. A microwave multilayer board structure according to claim 1, characterized in that the signal layer (8) is made of copper, and the copper is arranged on the circuit board (3) in a line shape and avoids the insulation positioning hole (5).
3. A microwave multilayer board structure according to claim 1, characterized in that said via hole (4) is provided in plurality, and each of said via holes (4) is provided with a signal interconnection layer (9) for connecting said signal layers (8) of two adjacent circuit boards (3).
4. A microwave multilayer board structure according to claim 1, characterized in that said signal interconnection layer (9) is uniformly covered on the wall of said via hole (4).
5. A microwave multilayer board structure according to claim 1, characterized in that the signal interconnection layer (9) is provided as metallic copper.
6. A microwave multilayer board structure according to claim 1, characterized in that the prepreg (7) is provided as a glass fiber resin sheet.
7. A microwave multilayer board structure according to claim 1, characterized in that a through hole (10) is provided in the positioning pillar (6), the hole wall of the through hole (10) and the top and bottom surfaces of the positioning pillar (6) are uniformly covered with a signal conducting layer (11), and the signal conducting layer (11) is made of copper.
8. A microwave multilayer board structure according to claim 1, characterized in that the top surface of the multilayer signal board (2) is further provided with a signal connection layer (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121069071.9U CN214901450U (en) | 2021-05-18 | 2021-05-18 | Microwave multi-layer board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121069071.9U CN214901450U (en) | 2021-05-18 | 2021-05-18 | Microwave multi-layer board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214901450U true CN214901450U (en) | 2021-11-26 |
Family
ID=78891478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121069071.9U Active CN214901450U (en) | 2021-05-18 | 2021-05-18 | Microwave multi-layer board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214901450U (en) |
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2021
- 2021-05-18 CN CN202121069071.9U patent/CN214901450U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 211304 No. 1 Gutan Avenue, economic development zone, Gaochun District, Nanjing, Jiangsu Province Patentee after: Nanjing Xindafei Technology Co.,Ltd. Address before: 211304 No. 1 Gutan Avenue, economic development zone, Gaochun District, Nanjing, Jiangsu Province Patentee before: NANJING HONGRUIPULIN MICROWAVE TECHNOLOGY CO.,LTD. |
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| CP01 | Change in the name or title of a patent holder |