CN114390800A

CN114390800A - Manufacturing method of magnetic-line-embedded circuit board and electronic element

Info

Publication number: CN114390800A
Application number: CN202111676463.6A
Authority: CN
Inventors: 李华聪; 周小平; 林以炳; 阳益美
Original assignee: Jingwang Electronic Technology Zhuhai Co ltd
Current assignee: Jingwang Electronic Technology Zhuhai Co ltd; Shenzhen Yuyinzhe Electronics Co ltd; Mornsun Guangzhou Science and Technology Ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-04-22

Abstract

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a manufacturing method of a magnetic-embedded circuit board and an electronic element. The manufacturing method of the magnetic circuit board comprises the following steps: preparing two substrates, wherein the two substrates are oppositely arranged; embedding magnetism, arranging a pressure bearing plate with preset strength between two substrates, arranging a containing through groove on the pressure bearing plate, arranging adhesive layers on two side plate surfaces of the pressure bearing plate, containing a first magnet in the containing through groove, and respectively pressing and bonding the two side plate surfaces of the pressure bearing plate with the two substrates at preset temperature and preset pressure; filling, wherein an accommodating hole is formed in one substrate and penetrates through the first magnet, the cross section area of the first magnet parallel bearing plate is larger than that of the accommodating hole parallel bearing plate, and the magnetic conductive glue is filled in the accommodating hole; and (5) curing and solidifying the magnetic conductive adhesive. The invention improves the total sensitivity value of the circuit board, does not need to enlarge the size of the circuit board and is beneficial to the miniaturization of the circuit board.

Description

Manufacturing method of magnetic-line-embedded circuit board and electronic element

Technical Field

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a manufacturing method of a magnetic-embedded circuit board and an electronic element.

Background

At present, along with the development of a power module PCB, a scheme of replacing a traditional surface-mounted inductive element by a magnetic embedding technology is developed, the power module PCB has the advantages of small size and light weight, and the reliability is better because no welding point is needed for magnetic embedding. However, in the prior art, a single magnetic core (sheet or column) is embedded, so that the mutual inductance action of the coil and the magnetic core is limited to a single direction, and therefore, the inductance value of the circuit board is small and cannot meet specific requirements.

The traditional method for improving the inductance value is to increase the number of the conductive coils, but the increase of the number of the coils causes the area of the board occupied by the inductance element to be larger, which is not beneficial to the miniaturization manufacture of the size of the printed circuit board. Therefore, the prior art is in need of improvement.

Disclosure of Invention

The embodiment of the application aims to provide a method for manufacturing a magnetic circuit board, and aims to solve the problem of how to improve the sensitivity of the circuit board.

In order to achieve the purpose, the technical scheme adopted by the application is as follows:

in a first aspect, a method for manufacturing a magnetic circuit board is provided, which includes the following steps:

preparing two substrates, wherein the two substrates are oppositely arranged;

embedding magnetism, namely arranging a pressure bearing plate with preset strength between the two substrates, arranging a containing through groove on the pressure bearing plate, arranging bonding layers on the two side plate surfaces of the pressure bearing plate, containing a first magnet in the containing through groove, and respectively pressing and bonding the two side plate surfaces of the pressure bearing plate with the two substrates at preset temperature and preset pressure;

filling, wherein an accommodating hole is formed in one of the substrates, the accommodating hole penetrates through the first magnet, the area of the cross section of the first magnet, which is parallel to the bearing plate, is larger than the area of the cross section of the accommodating hole, which is parallel to the bearing plate, and magnetic conductive glue is filled in the accommodating hole;

and curing the magnetic conductive adhesive.

In one embodiment, the filling step comprises the steps of:

s31: processing blind holes on the corresponding substrate by a mechanical depth control method;

s32: and processing the blind hole and forming the accommodating hole by a laser ablation method.

In one embodiment, the filling step further includes S33: and placing a second magnet in the accommodating hole, wherein the magnetic conductive glue completely wraps the second magnet.

In one embodiment, the step of S33 includes the steps of:

the magnetic conductive glue is guided into the accommodating hole in a primary glue printing process, the volume of the guided magnetic conductive glue is smaller than that of the accommodating hole, the second magnet is arranged in the accommodating hole, and the side surface of the second magnet and the wall of the accommodating hole are arranged at intervals; the curing step comprises pre-curing the primary glue printing step.

The secondary glue printing is used for guiding the magnetic conductive glue into the accommodating hole, and the magnetic conductive glue of the primary glue printing and the magnetic conductive glue of the secondary glue printing jointly wrap the second magnet; the curing step further comprises the step of performing final curing on the secondary glue printing step.

In one embodiment, the first magnet is in a sheet shape, and the thickness of the first magnet is equal to that of the bearing plate.

In one embodiment, the second magnet is cylindrical, and the height of the second magnet is smaller than the depth of the containing hole.

In one embodiment, the cross-sectional shape of the second magnet is circular, square or elliptical, and the shape of the containing hole is adapted to the shape of the second magnet.

In one embodiment, the substrate is a multilayer structure or a single layer structure; the multilayer structure comprises an insulating medium layer and a circuit layer, wherein the circuit layer is arranged on the surfaces of two sides of the insulating medium layer; the single-layer structure includes a conductive metal layer; wherein at least one substrate is of a multilayer structure.

In a second aspect, another object of the present application is to provide an electronic component, which includes a circuit board manufactured by the above method for manufacturing a magnetic circuit board, and a coil winding provided on the circuit board.

In one embodiment, the circuit boards are provided in two, two circuit boards are stacked, and each second magnet is located between two first magnets.

The beneficial effect of this application lies in: through set up first magnet and magnetic conduction glue in the circuit board, and first magnet and magnetic conduction glue and improve the value of feeling of circuit board along two directions respectively, wherein, first magnet improves the value of feeling of circuit board along the horizontal direction, and the magnetic conduction glues the value of feeling of improving the circuit board along vertical direction to finally improve the total value of feeling of circuit board, and need not to enlarge the circuit board size, be favorable to the miniaturization of circuit board.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a first magnet provided in an embodiment of the present application before lamination;

fig. 3 is a schematic structural diagram of a first magnet stitching according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of forming a blind hole according to an embodiment of the present application;

FIG. 5 is a schematic structural view of the accommodating hole provided in the embodiment of the present application;

fig. 6 is a schematic structural view of the magnetic conductive glue disposed in the accommodating hole provided in the embodiment of the present application;

fig. 7 is a schematic structural view of the magnetic conductive glue and the second magnet arranged in the containing hole provided in the embodiment of the present application;

FIG. 8 is a schematic structural diagram of a two-wire board stacked connection provided by an embodiment of the present application;

fig. 9 is a flowchart of a method for manufacturing a magnetic circuit board according to an embodiment of the present application.

Wherein, in the figures, the respective reference numerals:

10. a substrate; 11. an insulating dielectric layer; 12. a circuit layer; 13. an adhesive layer; 21. a pressure bearing plate; 31. a first magnet; 43. accommodating through grooves; 41. blind holes; 42. a housing hole; 32. a second magnet; 33. magnetic conductive glue;

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the present application, and the specific meanings of the above terms may be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 1 and 9, an embodiment of the present application provides a method for manufacturing a magnetic circuit board, which includes the following steps:

s1: preparing two substrates 10, and arranging the two substrates 10 oppositely; optionally, one of the substrates 10 is disposed on the worktable in a tiled manner, and the other substrate 10 is disposed above the substrate 10. Cutting the copper-clad plate large material into a substrate 10 with a preset size according to the size requirement of production makeup, wherein the copper-clad plate is a double-sided copper-clad plate.

S2: embedding magnetism, arranging a pressure bearing plate 21 with preset structural strength between the two substrates 10, arranging a containing through groove 43 on the pressure bearing plate 21, arranging adhesive layers 13 on the two side plate surfaces of the pressure bearing plate 21, accommodating the first magnet 31 in the containing through groove 43, and respectively pressing and bonding the two side plate surfaces of the pressure bearing plate 21 with the two substrates 10 at preset temperature and preset pressure. Alternatively, the two side plate surfaces of the pressure bearing plate 21 are respectively pressed and bonded to the two substrates 10 at a predetermined temperature and a predetermined pressure, and are maintained for a predetermined time, so that the two substrates 10 are sufficiently contacted and pressed with the pressure bearing plate 21.

Alternatively, the first magnet 31 is made of a material that can generate a magnetic field, and the first magnet 31 increases the inductance of the circuit board in the horizontal direction. It can be understood that, the size of the accommodating through groove 43 is adapted to the size of the first magnet 31, and the first magnet 31 is completely accommodated in the accommodating through groove 43, optionally, a gap exists between the first magnet 31 and the inner wall of the accommodating through groove 43, so that during the high-temperature pressing process, a part of the adhesive layer fills the gap to stably connect the first magnet 31. The pressure bearing plate 21 has a predetermined structural strength so that the first magnet 31 is not damaged by pressure during the press-fitting process.

Alternatively, the pressure bearing plate 21 is the insulating medium layer 11, and the insulating medium layer 11 may be made of a resin material having a flame resistance rating of FR 4.

Alternatively, the insulating medium layer can be a light plate, and the light plate is a double-sided copper-clad plate and is formed after etching away the double-sided copper layer.

Alternatively, the adhesive layer 13 may be made of a resin material, and the adhesive layer 13 may melt and flow under high temperature and high pressure conditions. The type of the resin material may be epoxy resin, or may be selected according to the application field of the circuit board, such as the application field of the circuit board in the power module field, and the type of the resin material may be polyimide resin, so as to improve the voltage resistance of the circuit board.

Optionally, a press is used for pressing and bonding, and before pressing and stacking, buffer materials such as an upper steel plate, a lower steel plate and a silica gel pad need to be added, so that pressure distribution is uniform during pressing, and the pressing effect of the circuit board is improved.

Referring to fig. 4 and 6, S3: filling, wherein an accommodating hole 42 is formed in one of the substrates 10, the accommodating hole 42 penetrates through the first magnet 31, the cross-sectional area of the first magnet 31 parallel to the pressure bearing plate 21 is larger than the cross-sectional area of the accommodating hole 42 parallel to the pressure bearing plate 21, and magnetic conductive glue 33 is filled in the accommodating hole 42;

s4: and (5) curing and solidifying the magnetic conductive adhesive 33.

Referring to fig. 4 and 6, optionally, a magnetic composite material is filled in the accommodating hole 42 by a vacuum screen printing method, wherein the magnetic composite material is also called magnetic glue or magnetic conductive glue 33 and includes magnetic particles and a resin material. In the curing step, the magnetic composite material is cured, and the magnetic composite material overflowing the accommodating hole 42 and located on the surface of the substrate 10 is ground to remove, so that the surface of the circuit board is flat. The cured magnetic composite material is bonded to the first magnet 31.

Referring to fig. 4 and 6, it can be understood that the magnetic conductive glue 33 improves the inductance of the circuit board in the vertical direction.

Through set up first magnet 31 and magnetic conduction glue 33 in the circuit board, and first magnet 31 and magnetic conduction glue 33 improve the value of feeling of circuit board along two directions respectively, wherein, first magnet 31 improves the value of feeling of circuit board along the horizontal direction, and magnetic conduction glue 33 improves the value of feeling of circuit board along vertical direction to finally improved the total value of feeling of circuit board, and need not to enlarge the circuit board size, be favorable to the miniaturization of circuit board.

Referring to fig. 4 and 6, in one embodiment, the filling step S3 includes the following steps:

s31: processing a blind hole 41 on the corresponding substrate 10 by a mechanical depth control method;

referring to fig. 4 and 6, optionally, the blind hole 41 is opened at a position opposite to the first magnetic body 31, so that a surface portion of the first magnetic body 31 can be exposed subsequently. And removing the copper layer, the core plate or part of the dielectric layer at the corresponding position by a mechanical depth control milling method. Since the mechanical depth control milling has a processing precision error, if all the dielectric layer above the first magnet 31 is removed at one time, the first magnet 31 may be damaged, and therefore, at least a part of the dielectric layer needs to be remained above the first magnet 31 in step S31.

S32: processing the blind hole 41 and forming a containing hole 42 by a laser ablation method;

referring to fig. 4 and 6, optionally, the remaining dielectric layer above the first magnetic body 31 is removed by laser ablation and the blind hole 41 is formed into a containing hole 42, so that a surface portion of the first magnetic body 31 is partially exposed through the containing hole 42. Alternatively, the laser in the laser ablation process may be CO₂Laser or UV laser.

Optionally, at least 1 accommodating hole 42 needs to be processed, in this embodiment, 3 accommodating holes 42 are provided, and each accommodating hole 42 is provided with a magnetic conductive glue 33.

Referring to fig. 6 and 8, in an embodiment, the filling step S3 further includes S33: and a second magnet 32 is placed in the containing hole 42, and the magnetic conductive glue 33 completely wraps the second magnet 32.

It can be understood that the magnetic permeability of the magnetic conductive paste 33 after curing is relatively low, and the magnetic permeability of the magnetic conductive paste 33 is improved by arranging the second magnet 32 in the magnetic conductive paste 33. Alternatively, the second magnet 32 and the first magnet 31 are both made of the same material.

Referring to fig. 6 and 8, optionally, the second magnet 32 is also made of a material capable of generating a magnetic field, and the second magnet 32 increases the inductance of the circuit board along the vertical direction. Thereby, the first magnet 31 and the second magnet 32 respectively improve the inductance of the circuit board in the horizontal direction and the vertical direction.

Referring to fig. 6 and 8, optionally, because the magnetic permeability of the cured magnetic composite material is smaller than the magnetic permeability of the second magnet 32 or the first magnet 31, in order to make the performance of the circuit board better, the second magnet 32 is disposed in the accommodating hole 42 to increase the magnetic permeability of the magnetic conductive glue 33.

Referring to fig. 6 and 8, it can be understood that the filling amount of the magnetic conductive paste 33 and the volume of the second magnet 32 are greater than the volume of the accommodating hole 42, so that the accommodating hole 42 is filled up, and the opening of the accommodating hole 42 is not recessed. And grinding is carried out after solidification, and the overflowing magnetic conductive glue 33 is removed, so that the surface of the substrate 10 is flat.

Alternatively, the magnetic composite material is used as an adhesive, and the magnetic permeability is improved while the second magnetic body 32 is adhered, thereby making the magnetic permeability of the wiring board better.

Referring to fig. 6 and 8, the cross-sectional shape of the second magnet 32 is optionally adapted to the cross-sectional shape of the receiving hole 42.

Referring to fig. 6 and 8, in one embodiment, the step of S33 includes the following steps:

s331: the magnetic conductive glue 33 is led into the containing hole 42 by one-time glue printing, the volume of the magnetic conductive glue 33 led in the one-time glue printing process is smaller than the volume of the containing hole 42, the second magnet 32 is arranged in the containing hole 42, and the side surface of the second magnet 32 and the hole wall of the containing hole 42 are arranged at intervals; the curing step comprises pre-curing the primary glue printing step.

Optionally, in the primary glue printing process, the magnetic conductive glue 33 is first introduced into the accommodating hole 42, the magnetic conductive glue 33 fills part of the accommodating hole 42, the second magnet 32 is then placed, and the magnetic conductive glue 33 is pre-cured.

Optionally, the temperature of the pre-curing is in the range of 110-130 ℃, and the duration time is in the range of 30-60 minutes.

Referring to fig. 6 and 8, S332: the secondary glue printing is to introduce the magnetic conductive glue 33 into the accommodating hole 42, and the magnetic conductive glue 33 of the primary glue printing and the magnetic conductive glue 33 of the secondary glue printing together wrap the second magnet 32; the curing step further comprises the step of performing final curing on the secondary glue printing step.

Optionally, in the secondary printing process, the gap between the second magnet 32 and the hole wall of the containing hole 42 is completely filled with the magnetic conductive glue 33. In order to conveniently and quickly place the second magnet 32 and to make the second magnet 32 in the central position in the containing hole 42, a jig may be used for assistance. The jig can use materials such as a light plate and an acrylic plate, a positioning hole is formed in the position corresponding to the containing hole 42, the aperture of the positioning hole is smaller than that of the containing hole 42, and the distance between the first magnet 31 and the peripheral side wall of the containing hole 42 is limited to be basically equal when the first magnet is placed; the diameter of the positioning hole is larger than the outer diameter of the second magnet 32 so that the second magnet 32 passes through the positioning hole.

Optionally, the temperature of the final curing is 140-160 ℃, and the duration time is 60-90 minutes.

Optionally, the cured circuit board is ground, the magnetic conductive glue 33 overflowing in the process of printing the magnetic conductive glue 33 is removed, the surface of the magnetic conductive glue 33 is smooth, and the grinding can be performed by ceramic brushing and non-woven fabric grinding.

Referring to fig. 6 and 8, in one embodiment, the first magnet 31 is shaped like a plate, and the thickness of the first magnet 31 is equal to the thickness of the pressure bearing plate 21.

Referring to fig. 1 and 3, alternatively, both side surfaces of the first magnet 31 are respectively flush with both side plate surfaces of the bearing plate 21. Wherein the thickness of the bearing plate 21 is the same as the thickness of the first magnet 31, that is, when the first magnet 31 is placed in the receiving through groove 43, the upper surface of the first magnet 31 is flush with the upper surface of the bearing plate 21, and the lower surface of the first magnet 31 is flush with the lower surface of the bearing plate 21. In the lamination stack of the embedded magnetic core, since the bearing plate 21 is a bonding material that is finally cured, the state will not change during lamination or only slightly change, the bearing plate 21 with the thickness consistent with that of the first magnetic body 31 is selected and provided with the accommodating through groove 43, so that the pressure borne by the first magnetic body 31 can be reduced, and the first magnetic body 31 is prevented from being damaged during lamination.

Referring to fig. 6 and 8, in one embodiment, the second magnet 32 is cylindrical, and the height of the second magnet 32 is smaller than the depth of the accommodating hole 42, so that the second magnet 32 can be completely accommodated in the accommodating hole 42.

Optionally, the cross-sectional area of the second magnet 32 is smaller than the area of the surface of the first magnet 31 facing the second magnet.

Alternatively, the cross-sectional shape of the second magnet 32 is circular, square, or oval, and the shape of the accommodation hole 42 is adapted to the shape of the second magnet 32.

In one embodiment, the substrate 10 is a multi-layer structure or a single-layer structure; the multilayer structure comprises an insulating medium layer 11 and a circuit layer 12, wherein the circuit layer 12 is arranged on the surfaces of two sides of the insulating medium layer 11; the single-layer structure includes a conductive metal layer; at least one substrate 10 is a multi-layer structure.

Referring to fig. 1 and fig. 3, optionally, the substrate 10 with a multi-layer structure is a copper-clad substrate 10, that is, an insulating dielectric layer 11 is disposed in the middle of the substrate 10, circuit layers 12 are disposed on two opposite side surfaces of the insulating dielectric layer 11, and the circuit layers 12 are conductive copper layers. Alternatively, a plurality of circuit layers 12 may be disposed on both sides of the insulating medium layer 11, and any two circuit layers on the same side are bonded by the bonding layer 13.

Optionally, the conductive metal layer is a copper foil.

Referring to fig. 1 and 3, optionally, the circuit layer 12 disposed adjacent to the bonding layer 13 is an internal circuit layer 12, and the processes of dry film pasting, exposure, development, etching, film stripping and the like are sequentially performed to complete the fabrication of the predetermined circuit layer 12.

The outer wiring layer 12 is a laminated, bonded outer layer and serves as a protective copper layer.

In one embodiment, a plurality of circuit layers 12 are disposed at intervals on one side surface of the insulating medium layer 11, each circuit layer 12 is connected to the adhesive layer 13, and in the step of burying the first magnetic body 31, the adhesive layer 13 is filled between any two adjacent circuit layers 12.

Referring to fig. 1 and 3, it can be understood that, during the high temperature pressing, the melted bonding layer 13 flows to fill the gap between two adjacent circuit layers 12, so that the first magnetic body 31 is bonded to the substrate 10 more firmly.

Optionally, the method for manufacturing the magnetic circuit board further comprises drilling, drilling and circuit processing are performed on the magnetic circuit board, and conduction between the circuit layers 12 is achieved through the metallized holes.

Optionally, the method for manufacturing the magnetic circuit board further includes disposing a sub-circuit layer 12 on the substrate 10 with the accommodating hole 42, and the sub-circuit layer 12 is press-fit connected to the circuit board through the adhesive layer 13.

Referring to fig. 1 and 3, it can be understood that the sub-circuit layer 12 can be a single-sided copper-clad plate, a double-sided copper-clad plate, a multilayer circuit board without embedded magnetism, or a multilayer circuit board with embedded magnetism.

The sub-wiring layer 12 in this embodiment is a wiring board which is embedded with magnetism and is manufactured by the above-described method of manufacturing a magnetic-embedded wiring board.

Referring to fig. 8, the present invention further provides an electronic component, which includes a circuit board, and the circuit board is manufactured by the method for manufacturing a magnetic circuit board, and since the electronic component adopts all the technical solutions of the above embodiments, all the beneficial effects brought by the technical solutions of the above embodiments are also achieved, and are not repeated herein.

In one embodiment, the electronic component further comprises a coil winding disposed on the wiring board.

Alternatively, the coil windings include an input coil winding disposed opposite the first magnet 31 and a coupling coil winding disposed circumferentially around the second magnet 32, the input coil winding and the coupling coil winding being disposed opposite the first magnet 31 and the second magnet 32, respectively, and together constituting a specific inductive element, such as a transformer.

In one embodiment, two circuit boards are provided, the two circuit boards being stacked and each second magnet 32 being located between two first magnets 31.

The two circuit boards are connected through the bonding layer 13 in a high-temperature pressing mode.

The above are merely alternative embodiments of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

Claims

1. A method for manufacturing a magnetic circuit board is characterized by comprising the following steps:

preparing two substrates, wherein the two substrates are oppositely arranged;

and curing the magnetic conductive adhesive.

2. The method of manufacturing a magnetic circuit board as claimed in claim 1, wherein: the filling step comprises the steps of:

3. The method of manufacturing a magnetic circuit board as claimed in claim 1, wherein: the filling step further includes S33: and placing a second magnet in the accommodating hole, wherein the magnetic conductive glue completely wraps the second magnet.

4. The method of manufacturing a magnetic circuit board as claimed in claim 3, wherein: the step of S33 includes the steps of:

s331: the magnetic conductive glue is guided into the accommodating hole in a primary glue printing process, the volume of the guided magnetic conductive glue is smaller than that of the accommodating hole, the second magnet is arranged in the accommodating hole, and the side surface of the second magnet and the wall of the accommodating hole are arranged at intervals; the curing step comprises pre-curing the primary glue printing step.

S332: the secondary glue printing is used for guiding the magnetic conductive glue into the accommodating hole, and the magnetic conductive glue of the primary glue printing and the magnetic conductive glue of the secondary glue printing jointly wrap the second magnet; the curing step further comprises the step of performing final curing on the secondary glue printing step.

5. The method for manufacturing a magnetic circuit board as claimed in any one of claims 1 to 4, wherein: the first magnet is sheet-shaped, and the thickness of the first magnet is equal to that of the pressure bearing plate.

6. The method for manufacturing a magnetic circuit board as claimed in any one of claims 3 to 4, wherein: the second magnet is columnar, and the height of the second magnet is smaller than the depth of the accommodating hole.

7. The method of manufacturing a magnetic circuit board as claimed in claim 6, wherein: the cross section of the second magnet is in a circular shape, a square shape or an oval shape, and the shape of the containing hole is matched with that of the second magnet.

8. The method for manufacturing a magnetic circuit board as claimed in any one of claims 1 to 4, wherein: the substrate is of a multilayer structure or a single-layer structure; the multilayer structure comprises an insulating medium layer and a circuit layer, wherein the circuit layer is arranged on the surfaces of two sides of the insulating medium layer; the single-layer structure includes a conductive metal layer; wherein at least one substrate is of a multilayer structure.

9. An electronic component comprising a wiring board produced by the method for producing a magnetic circuit board according to any one of claims 1 to 8, and a coil winding provided on the wiring board.

10. The electronic component of claim 9, wherein: the circuit board is provided with two, two the circuit board range upon range of setting, and each the second magnet all is located two between the first magnet.