JP3290510B2 - Laminated mold coil and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated mold coil which can be widely used for various electric products such as industrial equipment and consumer equipment, and a method of manufacturing the same. The present invention relates to a laminated mold coil formed above and suitable for mass production with a simple configuration, and a method for manufacturing the same.

[0002]

2. Description of the Related Art A coil and various power transformers formed by coupling several coils are widely used in all fields regardless of industrial equipment or consumer equipment. When a transformer is configured, signal insulation performance and reliability are regarded as important as its basic performance. For this reason, a structure in which a coil is formed by a printed wiring technology and a method of manufacturing the same have been proposed (for example, see Japanese Patent Application Laid-Open No. H10-163,197). 58-155711, JP-A-60-245208, etc.).

FIG. 11 is a conceptual diagram showing an example of this type of a conventional molded coil. In this figure, 1 is a primary coil and 2 is a secondary coil, all of which are wound in a cylindrical shape and are arranged concentrically in the circumferential direction. Here, each of the coils 1 and 2 may be configured by a printed wiring technique. Reference numeral 3 denotes an insulating layer portion formed of a resin covering between the coils and an outer periphery thereof. Reference numeral 4 denotes a through-hole in which a core is arranged when configured as a transformer.

FIG. 12 is a conceptual diagram for explaining a method of manufacturing a molded coil having such a configuration. First,
A mold 5 having a predetermined size capable of accommodating the coils 1 and 2 is prepared, and the coils 1 and 2 are arranged on the form 5 so as to be concentric in the circumferential direction. Subsequently, a thermosetting resin such as an epoxy resin is injected and filled between and around each of the coils 1 and 2, and after being cured by heating, the mold 5 is removed (release). It is completed through a slow cooling process.

[0005]

The conventional molded coil completed by such a configuration and manufacturing method has problems in the following structural aspects and manufacturing method. (A) It is not suitable for mass production because the mold 5 needs to be prepared according to each size and it takes time to infiltrate the resin. (B) In order to ensure that the resin penetrates, an appropriate gap is required between the coils and on the outer periphery, so that the coil dimensions cannot be reduced.

SUMMARY OF THE INVENTION The present invention has been made in view of these problems, and has as its object to provide a laminated molded coil which can be miniaturized, has high performance, and is suitable for mass production which can be manufactured at low cost. And

[0007]

According to the present invention, there is provided a laminated molded coil having at least one coil substrate formed by a printed wiring technique on both sides of an insulating substrate. A resin sheet formed by curing a resin material into a sheet shape is laminated and arranged on both surface sides of the substrate, and the resin sheet is formed between each layer and between the coils.
With the integrated structure
To a coil substrate or a laminate of multiple coil substrates.
A through hole is provided and the inner wall of the through hole
Connect between the coil patterns formed on the coil substrate
To form a conductive layer for
Semi-cured resin material on the outer surface to form a sheet
The covering insulating layer is arranged via the
A hole provided between the covering insulating layer and the laminate.
So that the resin constituting the separated resin sheet is filled
It was done.

The method of manufacturing a laminated mold coil according to the present invention includes a step of forming a coil on both surfaces of an insulating substrate by a printed wiring technique, and a step of forming between the at least two or more coil substrates obtained by the step. A step of laminating and disposing a resin sheet formed into a sheet by curing the resin material,
The laminated board obtained by the above-mentioned process is heated and pressed to fill the gap between each coil substrate and between the coils with the resin constituting the resin sheet to form a laminated board having an integrated structure.
Forming and forming, thereby forming a through-hole penetrating the two or more coils substrate to the laminate, the conductive layer for connecting the connection terminal pattern mutually to the through hole's inner wall is formed on the coil substrate And the step of forming the through-hole on the outermost surface of the laminated plate
Through a resin sheet formed by curing the resin material to form a sheet
Then, a cover sheet to be a covering insulating layer is arranged, and these are again heated and pressed to make the through holes in front of the laminate.
And filling the resin sheet provided between the cover sheet and the cover sheet with the resin constituting the resin sheet to form an integrated structure.

[0009]

On the coil substrate, a coil pattern having a predetermined shape and a lead wire pattern connected to the coil pattern are formed by a printed wiring technique, and the thickness of each pattern (conductor) is thin. It is also possible to reduce the distance between the coil patterns.

When the resin sheet is heated and pressurized, the resin material constituting the sheet easily penetrates between the coil patterns, between the coil pattern and the coating insulating layer, etc., and the resin material eventually hardens. Each coil substrate, cover sheet and the like have an integrated structure.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a configuration sectional view of a laminated mold coil according to the present invention. In the figure, 10 is an insulating substrate,
For example, an insulating film or the like may be used instead of a resin material. The coils 1 and 2 are formed on both surfaces of the insulating substrate 10 by a printed wiring technique such as etching, vapor deposition, and electroless plating to form a coil substrate. In this example, one coil substrate is used, but two or more coil substrates are used to secure the type of coil and the required number of turns.

Numeral 11 is a resin sheet provided on both surface sides of the coil substrate. As the resin sheet, for example, a cloth or sheet made of glass fiber and impregnated with a resin material containing a filler such as epoxy or an inorganic material in advance and semi-cured (a so-called prepreg sheet is used). And a sheet formed from the above-described resin material and subjected to a drying treatment or a semi-curing treatment. When these resin sheets are heated and pressurized, the resin material forming the sheet (or impregnating the cloth) melts and flows out.

Reference numeral 12 denotes a covering insulating layer (cover sheet) disposed on both outermost surfaces of the laminate of the insulating substrate 10 and the resin sheet 11. The resin material 20 flowing out of the resin sheet 11 is filled into the coil substrate, between the layers, and between the coils to form an integrated structure. FIG. 2 is an explanatory view showing a method of manufacturing the laminated mold coil having the configuration shown in FIG. 1 according to each step, and reference numerals (a) to (c) in each figure correspond to each step (procedure) described below. I have.

Step (a) First, the coils 1 and 2 are formed on both surfaces of the insulating substrate 10 by a printed wiring technique. If necessary, a lead wire from each coil and a pattern serving as a terminal are also formed. The coils 1 and 2 formed on both surfaces of the insulating substrate 10 ensure insulation from each other such that the coil formed on one surface is, for example, the primary side and the coil formed on the other surface is the secondary side. Necessary coils are separated and arranged via a substrate. The shapes of these coil patterns are selected so as to be effectively magnetically coupled, such as concentric spiral shapes, and the size of each coil is selected in consideration of the density of the current flowing therethrough.

The thickness d1 of the insulating substrate 10 is also selected according to the degree of insulation required between the coils formed on both surfaces of the substrate. For example, when a resin substrate is used as the insulating substrate 10 and the withstand voltage required between the coils formed on both surfaces of the substrate is 10 KV, the substrate thickness d1 is:
0.2 mm and withstand voltage of 2500 V, the substrate thickness d
1 is selected to be about 0.05 mm.

Step (b) The resin sheets 11 are laminated on both surface sides of the coil substrate obtained in the step (a). Here, when two or more coil substrates are used, one coil substrate is provided between the coil substrates.
Two resin sheets will be arranged. That is, the coil substrates and the resin sheets are alternately stacked.

In this case, in the two coil substrates, the relationship between the coils provided on the surfaces opposing each other is such that a high insulation is ensured, for example, as described above between the primary sides (or between the secondary sides). The coils are stacked so that the types of coils that do not need to be disposed are arranged via the resin sheet 11. When the lamination is repeated in consideration of such points, the cross-sectional structure of the laminated plate becomes a vertically symmetric structure in the laminating direction.

Step (c) A cover sheet 12 (thickness d2) serving as a coating insulating layer is disposed on the outermost surface of the laminated plate laminated in the step (b), and a coil substrate, a resin sheet Then, the laminated plate composed of the cover sheet is heated and pressed to fill each layer and between the coils with the resin constituting the resin sheet 11 to form an integrated structure. When the work of heating and pressurizing the laminate is performed, particularly in a vacuum, the resin sheet 11 is melted and pressed.
The resin that flows out is effectively filled between the layers and between the coils, so that no voids are formed inside. In addition,
Since the insulating substrate 10 and the cover sheet 12 are both made of a completely cured insulating material, their thickness does not fluctuate significantly with respect to the heating / pressing work in this integration process. .

Thereafter, the resin melted and flown out of the resin sheet 11 is cured to complete the resin. When using a laminated mold coil manufactured through such a process as a transformer, processing such as providing a coil through hole for attaching a core to the laminated mold plate, or connecting lead wires and terminals Is performed. According to the laminated mold coil manufactured through such a process,
The distance between the two coils 1 and 2 formed on both surface sides of the insulating substrate depends on the thickness d1 of the insulating substrate 10, the distance between the coil 1 and the outside of the laminate, and the distance between the coil 2 and the outside of the laminate. Is regulated by the thickness d2 of the cover sheet 12, so that the insulation distance between each coil and the outside can be accurately managed. Also, when the shape of the coil is spiral, the distance between the coil conductors depends on the processing accuracy of the printed wiring technology,
Accuracy can be maintained.

Therefore, a highly reliable laminated molded coil having a stable structure can be realized. FIG. 3 is a diagram showing a manufacturing method in the case of manufacturing a laminated mold coil using two coil substrates and electrically connecting the coils to each other inside the mold structure. Step (a) On both surfaces of the insulating substrate 10, the coils 1 and 2, terminals for interconnecting these coils and connection terminals (external circuit connection terminals) 31 for drawing out to an external circuit are formed by printed wiring technology.
32, 33, 41, 42, etc. are formed, respectively. The connection terminals between the coils are determined in consideration of the shape of each coil pattern, the relationship with the primary coil and the secondary coil, the arrangement positions of the external circuit connection terminals, and the like. Here, it is assumed that the coil 1 is a primary side coil and the coil 2 is a secondary side coil, and both have a concentric spiral pattern.
On the secondary coil 2 side, it is assumed that the current density is higher than the current density on the primary coil side 1, and the conductor width is larger than the conductor width of the primary coil.

Step (b) The two coil substrates 10 obtained in the step (a)
A and 10B are laminated with the resin sheet 11 interposed therebetween. Here, in the two coil substrates 10A and 10B, the relationship between the coils provided on the surfaces opposing each other is such that the secondary coils 2 oppose each other via the resin sheet 11 as shown in the figure (accordingly. , Each primary coil is located on the outer surface).

Step (b1) A laminated plate composed of two coil substrates laminated via the resin sheet 11 is heated and pressed, and then cured to form an integrated structure. Step (b2) Through holes 51 and 52 for connecting between the connection terminals 32 and between the connection terminals 33 and 41 provided on the inner peripheral side of the spiral coil pattern are formed, and the inside of those through holes is formed. The conductive layer 50 is formed by plating or the like. The through-hole is provided so as to penetrate each layer of the laminate and communicate with both surfaces, and the diameter and the thickness of the conductive layer are determined in consideration of the density of the current flowing through the connected coil. Here, the through hole 51 connecting the connection terminals 32 and the conductive layer 50 on the inner wall portion are for connecting the primary coils formed on the two coil substrates, and connect the connection terminals 33 and 41 to each other. The connecting through-hole 52 and the conductive layer 50 on the inner wall thereof are formed on two coil substrates.
It is for connecting the next coils.

Step (c) A cover sheet 12 serving as a coating insulating layer is formed on each outer surface of the laminated plate (the laminated plate having the through holes 51 and 52) laminated in the step (b2). Laminated and arranged via a resin sheet 11, a coil substrate, a resin sheet,
The laminate made of the cover sheet is heated and pressed again, and then cured to form an integrated structure.

After this step, the through holes 51, 5
The resin flowing out of the resin sheet 11 is also filled into the inside of 2, and the surface of the conductive layer 50 is covered. In the case where the resin sheet 11 is made of resin having a suppressed fluidity, the inside of the through holes 51 and 52 is not filled with resin, but becomes hollow. However, such a structure may be used.

Step (c1) Next, through holes 53 and 54 for connecting between the connection terminals 31 and between the connection terminals 42 provided on the outer peripheral side of the spiral coil pattern are formed, and the through holes 53 and 54 are formed. Conductive layer 5 by plating or the like inside the hole (inner wall)
0 is formed. Here, the through-hole 53 connecting the connection terminals 31 and the conductive layer 50 on the inner wall portion are intended to connect the primary coils formed on the two coil substrates and to provide an external circuit connection terminal. Terminal
The through-hole 54 connecting the connection terminals 42 and the conductive layer 50 on the inner wall portion connect the secondary coils formed on the two coil substrates to each other, and are also provided with terminals for which external circuit connection terminals are to be provided. Has become.

Step (c2) Terminals (pins) 61, 62 for connection to an external circuit are connected to the through holes 53, 54. The attachment of the connection terminal is performed, for example, by inserting (or press-fitting) a pin as a connection terminal into a through hole. When this laminated mold coil is used for a transformer, a through hole 7 for disposing a core is formed.

According to such a manufacturing method, each of the formation of the through-hole for connecting the respective coils provided on the plurality of coil substrates constituting the laminate and the formation of the conductive layer on the inner wall of the through-hole is performed. By adding a process, a laminated integrated structure of a large number of coil substrates can be simplified. FIG. 4 shows FIG.
FIG. 21 is a diagram showing another manufacturing method in the case of forming a connection terminal to an external circuit in the manufacturing method shown in FIG.

The above steps (a) to (c1)
Take the same steps. In this embodiment, after the step (c1),
As shown in the figure, the laminated board is cut along the broken lines so that the through holes 53 (54) have a semicircular shape. Then, (c
As shown in 2), the conductive layer 50 on the inner wall of the through hole 53 (54) is exposed on the outer peripheral surface of the laminate, and that portion can be used as a substantially semi-cylindrical external connection terminal. It should be noted that the cutting of the laminate may be performed in combination with, for example, an operation of separating the laminates.

According to this embodiment, as shown in FIG. 3, there is no need to specially provide the external circuit connection terminals (pins) 61, 62, and the cost can be further reduced. FIG. 5 is a diagram showing another manufacturing method in the case of manufacturing a laminated mold coil using a plurality of coil substrates and electrically connecting the coils to each other inside the mold structure.

Steps (a) to (b1) of stacking a plurality of coil substrates and forming them into an integrated structure are as follows:
This is the same as FIG. 3, and the description is omitted. Step (b2) Through holes 51 and 52 for connecting between the connection terminals 32 and between the connection terminals 33 and 41 provided on the inner peripheral side of the spiral coil pattern, and provided on the outer peripheral side of the coil pattern. Through holes 53 and 54 for connecting between the connection terminals 31 and between the connected terminals 42 are formed, and a conductive layer 50 is formed inside each of the through holes by plating or the like.

Step (c) A resin sheet 11 is interposed on each outer surface of the laminated plate (the laminated plate in which the through holes 51, 52, 53, 54 are formed) laminated by the process of (b2). The cover sheets 12 are stacked and arranged. Here, in this embodiment, the through holes 53 and 54 provided on the outer periphery of the coil on the upper surface side are used.
(Through holes where connection terminals to external circuits are planned to be provided)
The cover sheet 12 is avoided so as not to be covered. After these are stacked and arranged, the laminate composed of the coil substrate, the resin sheet and the cover sheet is heated and pressed again and cured to form an integrated structure. In this case, as the resin sheet 11, a material in which the fluidity of the resin material to be impregnated is suppressed is used, so that the resin is heated and pressurized to allow the resin to pass therethrough.
3, 54 are not covered.

Step (c1) External circuit connection terminals (pins) 61, 62 are inserted into the through holes 53, 54 provided on the outer peripheral side of the spiral coil pattern and exposed on the surface, for example, to connect. I do. According to such a manufacturing method, there is an advantage that the step of forming a through hole can be completed only once, as compared with the manufacturing method shown in FIG.

FIGS. 6 to 8 are sectional views showing other examples of terminals for connecting external circuits in the laminated molded coil completed by the manufacturing method shown in FIG. In the embodiment of FIG. 6, the connection terminal pin 61 inserted into the through hole is used.
Are L-shaped so as to be perpendicular to the central axis of the through hole, and the connection pins are led out in the plane direction of the laminate.

In the embodiment shown in FIG. 7, the through-hole 54 is not covered with the resin sheet 11 and the cover sheet 12 on the lower surface of the laminated board, and the connection terminal pins 61 are formed. Through hole 54
Is a clip structure that is sandwiched from both surface sides. Note that the connection pins may be led out in a plane direction of the laminated plate or in a vertical direction as illustrated.

In the embodiment of FIG. 8, the through hole 54 is cut (separated) into a semi-cylindrical shape (similar to the case of FIG. 4) in the embodiment of FIG. And the connection terminal pin 6 having a clip structure so as to contact the through hole 54 from both sides.
1 is attached. FIG. 9 is a view showing still another manufacturing method of the present invention.

This embodiment is a combination of the manufacturing method shown in FIG. In this embodiment, a large number of coil substrates 10
A, 10B, and 10C are supposed to be stacked in large numbers. Through holes are formed at predetermined locations for each multilayer board, and these multilayer boards are further attached to a resin sheet 11.
And the cover sheet 12 is disposed on the outermost surface side, and is heated and pressed to form an integrated structure. The outer surface of the cover sheet 12 is covered with a copper foil.

FIG. 10 is a view showing still another manufacturing method of the present invention. This embodiment is suitable for producing a large number of laminated mold coils of the same size at one time. Step (a) A primary side coil and a secondary side coil are formed on both surfaces of the insulating substrate 10 by a printed wiring technique so that a large number of coils are arranged. The coil pattern arranged on the insulating substrate is formed such that a large number of coils are arranged in a line in both the vertical and horizontal directions on the substrate surface as shown in the figure.

Step (b) The plurality of coil substrates prepared in the step (a) are laminated via the resin sheet 11, and the cover sheet 12 (which serves as a coating insulating layer) is formed on both outermost surfaces of the laminate. Here, it is assumed that a translucent material is used) is laminated via a resin sheet 11, and heated, pressed and cured to form an integrated structure. Steps such as creation of a through hole for connection between the coils are performed before this step, as in the above-described method.

Step (c) The laminate having the integrated structure obtained in the step (b) is separated into predetermined units including a coil pattern as shown by a broken line.
At this time, the through holes for forming the semi-cylindrical external connection terminals described with reference to FIG. In addition, the hole processing for installing a core is performed before or after separation as needed. As this separation work, for example, cutting is performed with a cutter or the like.

Step (d) Terminal connection for external circuit connection is performed for each of the separated unit laminated mold coils. With the laminated molded coil manufactured by such a process, a large number of laminated molded coils of the same quality can be simultaneously produced. In addition, there is a special effect such as a high material utilization rate.

In the above description, when two or more coil substrates are stacked, the conductive layer 50 is provided on the inner wall of the through hole for connecting the related coils. A configuration may be employed in which the inside of the through hole is filled with solder, conductive resin, or the like. Such a configuration can be realized by solder reflow or dipping of the laminate after forming the through holes, or by press-fitting a conductive resin by a printing method.

Further, in one laminated mold coil after completion, two or more coils are arranged in the surface direction.
A configuration in which they are stacked may be used.

[0043]

As described in detail above, according to the present invention, the following various effects can be expected. (A) A planar insulating substrate, a resin sheet, and a cover sheet are laminated, and they are heated and pressed to form an integrated structure. Therefore, a mold is not required at the time of molding, and the quality is reduced by a simple process. A uniform laminated mold coil can be realized. (B) The coil pattern is formed on the insulating substrate by a printed wiring technique, and has a conductor width, a distance between conductors,
The thickness and the like can be accurately controlled by the already established printed wiring technology. (C) Since the heating and pressurizing of the laminated plate, the formation of through holes, and the like are all completed by a combination of simple steps, the cost can be reduced.

The laminated molded coil having such a configuration can be applied not only to a transformer in combination with a core but also to various fields such as an antenna for transmitting and receiving electromagnetic waves and a coil for detecting a magnetic field.

[Brief description of the drawings]

FIG. 1 is a configuration sectional view of a laminated mold coil according to the present invention.

FIG. 2 is an explanatory view showing a method of manufacturing the laminated mold coil having the configuration shown in FIG. 1 in accordance with each step.

FIG. 3 is a diagram showing a manufacturing method in the case of manufacturing a laminated molded coil using two coil substrates and electrically connecting the coils to each other inside a molded structure.

FIG. 4 is a diagram showing another manufacturing method in the case of forming a connection terminal to an external circuit in the manufacturing method shown in FIG.

FIG. 5 is a view showing another manufacturing method in the case of manufacturing a laminated mold coil in which a plurality of coil substrates are used and the coils are electrically connected inside the mold structure.

FIG. 6 is a sectional view showing another example of a structure of a connection terminal to an external circuit in the laminated molded coil completed by the manufacturing method shown in FIG. 5;

7 is a cross-sectional view illustrating another example of a structure of a connection terminal to an external circuit in the laminated molded coil completed by the manufacturing method illustrated in FIG. 5;

8 is a cross-sectional view showing another example of a structure of a connection terminal to an external circuit in the laminated molded coil completed by the manufacturing method shown in FIG.

FIG. 9 is a view showing still another manufacturing method of the present invention.

FIG. 10 is a view showing still another manufacturing method of the present invention.

FIG. 11 is a conceptual diagram illustrating an example of a conventional molded coil.

FIG. 12 is a conceptual diagram for explaining a method of manufacturing the molded coil having the configuration shown in FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 primary coil 2 secondary coil 10 insulating substrate 11 resin sheet 12 covering insulating layer (cover sheet) 20 resin material 31, 32, 33, 41, 42 connection terminal 50 conductive layer 51, 52, 53, 54 through hole 61, 62 connection terminal (pin)

Continuation of the front page (72) Inventor Akihiro Demura 2-1-1 Kanda-cho, Ogaki-shi, Gifu Examiner in IBIDEN Co., Ltd. Examiner Tomohiro Sakai (56) References Japanese Utility Model No. 2-27719 (JP, U) Japanese Utility Model Akira Nikai 62-80304 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01F 17/00, 27/28 H01F 27/32, 41/12

Claims (7)

(57) [Claims] 1. A resin sheet comprising at least one coil substrate having coils formed on both surfaces of an insulating substrate by a printed wiring technique, and a resin material cured on both surface sides of the coil substrate to form a sheet. Are arranged in layers, and
And the resin constituting the resin sheet between the coils
To form an integrated structure, coil substrate or
When a through hole is provided in a laminate of multiple coil substrates
Both were formed on the coil substrate on the inner wall of the through hole
Forming conductive layer to connect between coil patterns
Resin on the outer surface of the laminated board
Through a resin sheet that is made by curing the material into a sheet shape
Place a coating insulation layer and cover the insulation
Forming a resin sheet provided between the layer and the laminate
Laminated mold coil that is filled with a resin . With wherein providing the through-holes penetrating respectively and said coil substrate the coating insulating layer, the conductive layer connected to the connecting terminal pattern formed on the coil substrate in the through-hole inner wall is provided, on the through hole The laminated mold coil according to claim 1, further comprising a terminal for external connection. The 3. A through-hole penetrating each said coil substrate and the coating insulating layer, with a substantially semi-cylindrical shape is disposed on the outer peripheral surface of the laminate, the external connection terminal to the semicircular portion The laminated molded coil according to claim 2, wherein the laminated molded coil is provided. 4. A step of forming coils on both surfaces of an insulating substrate by a printed wiring technique, and a resin formed into a sheet by curing a resin material between at least two or more coil substrates obtained in the step. laminating placing sheet stack, and the resulting integrated heating and pressing the laminate between the coil substrates and between the windings mutually is filled with a resin that comprised the resin sheet structure by the step Board
Forming and forming, thereby forming a through-hole penetrating the two or more coils substrate to the laminate, the conductive layer for connecting the connection terminal pattern mutually to the through hole's inner wall is formed on the coil substrate And curing the resin material on the outermost surface of the laminate having the through-holes formed thereon to form a sheet-like resin sheet.
A cover sheet to be a coating insulating layer is placed via a heat source, and these are again heated and pressed to laminate the through holes.
A process of filling a resin sheet provided between a plate and the cover sheet with a resin constituting the resin sheet to form an integrated structure. 5. A step of forming coils on both surfaces of an insulating substrate by a printed wiring technique, and a resin formed into a sheet by curing a resin material between at least two or more coil substrates obtained in the step. laminating placing sheet stack, and the resulting integrated heating and pressing the laminate between the coil substrates and between the windings mutually is filled with a resin that comprised the resin sheet structure by the step Board
Forming and forming, thereby forming a through-hole penetrating the two or more coils substrate to the laminate, the conductive layer for connecting the connection terminal pattern mutually to the through hole's inner wall is formed on the coil substrate And curing the resin material on the outermost surface of the laminate having the through-holes formed thereon to form a sheet-like resin sheet.
A cover sheet to be a coating insulating layer is placed via a heat source, and these are again heated and pressed to laminate the through holes.
A step of filling the resin sheet provided between the plate and the cover sheet with the resin constituting the resin sheet to form an integrated structure, and penetrating the coil substrate and the covering insulating layer, respectively.
And through holes inside
Connected to the connection terminal pattern formed on the coil substrate on the wall
A conductive layer is provided, and this through hole has an end for external connection.
And a step of providing a coil. 6. A step of forming coils on both surfaces of an insulating substrate by a printed wiring technique, and a resin formed into a sheet by curing a resin material between at least two or more coil substrates obtained in the step. laminating placing sheet stack, and the resulting integrated heating and pressing the laminate between the coil substrates and between the windings mutually is filled with a resin that comprised the resin sheet structure by the step Board
Forming and forming, thereby forming a through-hole penetrating the two or more coils substrate to the laminate, the conductive layer for connecting the connection terminal pattern mutually to the through hole's inner wall is formed on the coil substrate And curing the resin material on the outermost surface of the laminate having the through-holes formed thereon to form a sheet-like resin sheet.
The cover sheet made of a coating insulating layer via preparative, and arranged so as to avoid the through hole portion are scheduled to be provided connection terminals to external circuitry, heat and pressure them again outside
Thru not intended to have connection terminals to the circuit
A hole is provided between the laminate and the cover sheet.
And filling the resin sheet with the resin constituting the resin sheet to form an integrated structure. 7. A step of forming coils on both surfaces of an insulating substrate by a printed wiring technique, and a resin formed into a sheet by curing a resin material between at least two or more coil substrates obtained in the step. laminating placing sheet stack, and the resulting integrated heating and pressing the laminate between the coil substrates and between the windings mutually is filled with a resin that comprised the resin sheet structure by the step Board
Forming and forming, thereby forming a through-hole penetrating the two or more coils substrate to the laminate, the conductive layer for connecting the connection terminal pattern mutually to the through hole's inner wall is formed on the coil substrate And curing the resin material on the outermost surface of the laminate having the through-holes formed thereon to form a sheet-like resin sheet.
The cover sheet made of a coating insulating layer via preparative, and arranged so as to avoid the through hole portion are scheduled to be provided connection terminals to external circuitry, heat and pressure them again outside
Thru not intended to have connection terminals to the circuit
A hole is provided between the laminate and the cover sheet.
A step of the integrated structure was allowed to fill the resin constitute the resin sheet and that are scheduled to be provided connection terminals to external circuitry
And providing a connection terminal to an external circuit in the hole .