CN106170176A - Bury magnetic core wiring board and manufacture method thereof - Google Patents
Bury magnetic core wiring board and manufacture method thereof Download PDFInfo
- Publication number
- CN106170176A CN106170176A CN201610675397.3A CN201610675397A CN106170176A CN 106170176 A CN106170176 A CN 106170176A CN 201610675397 A CN201610675397 A CN 201610675397A CN 106170176 A CN106170176 A CN 106170176A
- Authority
- CN
- China
- Prior art keywords
- magnetic core
- embedded
- main board
- copper plate
- pcb main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
Abstract
The open one of the present invention buries magnetic core wiring board, including PCB main board, it is embedded into groove and the magnetic core being embedded in groove described in being placed in described PCB main board inner recess, described PCB main board include multilamellar by its bottom surface to the end face successively folded copper plate set and the PP layer that is located in described in adjacent two layers between copper plate, described copper plate includes running through conductive through hole thereon, described copper plate is more than 8 layers, the copper thickness of 1～6 layer every layer described copper plate is 0.105mm, described magnetic core is embedded in 1～8 layer of described PCB main board, the either flush of the end face of described magnetic core and described PCB main board and expose to described PCB main board completely.Compared with correlation technique, the present invention buries magnetic core wiring board stable performance, is suitable for product design miniaturization and high densification.The present invention also provide for a kind of described in bury the manufacture method of magnetic core wiring board.
Description
Technical field
The present invention relates to wiring board, particularly relate to a kind of magnetic core embedded type buries magnetic core wiring board and manufacture method thereof.
Background technology
Along with printed circuit board (PCB) (Printed Circuit Board, PCB) steps into system envelope also known as wiring board industry development
In dress (SOP) stage, the buried technology of PCB passive device also becomes the focus of current research.And in the adjustment development of automatization's progress,
PCB is one of key technology, and all control systems are required for PCB and realize Electric signal processing as carrier.
In correlation technique, in board design, inductance is widely applied, and the physical significance of the inductance that logical direct current, resistance exchange is
Utilizing conductive coil to store alternating magnetic field energy, Main Function in circuit is to provide emotional resistance, in unit relevant to other
The circuit functions such as part completes to mate accordingly under coordinating, filters, vibration.
The power pack inductance of PCB is required for greatly manual attachment, and production efficiency is low, there is the bad equivalent risk of weld pads.
It addition, inductance element takies power panel surface more than 40% area, it is unfavorable for product design miniaturization and high densification.
Therefore, it is necessary to provide a kind of new to bury magnetic core wiring board and manufacture method solves above-mentioned technical problem.
Summary of the invention
It is an object of the invention to overcome above-mentioned technical problem, it is provided that a kind of stable performance, be suitable for product design miniaturization and
High densification bury magnetic core wiring board and manufacture method thereof.
One buries magnetic core wiring board, including PCB main board, being embedded into groove and being placed in described to described PCB main board inner recess
The magnetic core being embedded in groove, described PCB main board includes that multilamellar to the end face successively folded copper plate set and is located in adjacent by its bottom surface
PP layer between copper plate described in two-layer, described copper plate includes running through thereon and the most copper-plated conductive through hole, institute
Stating copper plate and be more than 8 layers, the copper thickness of 1～6 layer every layer described copper plate is 0.105mm, and described magnetic core is embedded in described PCB main board
1～8 layer of described copper plate between, the end face of described magnetic core is not higher than the end face of described PCB main board and exposes to described completely
PCB main board.
Preferably, described magnetic core is circular cylindrical or E type.
Preferably, the size of the size and described magnetic core that are embedded into groove described in differs ± 0.0762mm.
Preferably, described in be embedded into the position of 1～2 layer of the described copper plate of correspondence of groove, right than described magnetic core of its size
Answer the big 0.1016mm of size of position.
Preferably, the aperture of described conductive through hole is 0.5mm, and the distance being embedded into groove described in its distance is at least 0.18mm.
Preferably, described conductive through hole copper facing thickness single-point is more than 78 μm.
Preferably, the copper-plated radius-thickness ratio of described conductive through hole is less than or equal to 11:1.
The present invention also provides for a kind of manufacture method burying magnetic core wiring board described above, and this manufacture method includes walking as follows
Rapid:
Thering is provided described magnetic core and wait to imbed the described PCB main board of described magnetic core, described PCB main board includes that multilamellar is by its bottom surface
To the end face successively folded copper plate set and the PP layer that is located in described in adjacent two layers between copper plate, described copper plate is more than 8 layers；
Offer and be embedded into groove, by the end face of described PCB main board to its direction, bottom surface offer on described PCB main board described in be embedded into
Groove, make described in be embedded into groove and be extended down to the 8th layer of copper plate, and the size of the size and described magnetic core being embedded into groove described in making differ ±
0.0762mm；
Be sticked foil, and the aspect that is sticked by the end face of described magnetic core amasss the metal foil more than described magnetic core top surface area
Sheet, and make the part beyond described magnetic core end face of described foil be bent to form dismounting to the direction away from described magnetic core
Portion；
Magnetic core is fixed, described magnetic core is placed in described in be embedded in groove, and by laminating technology that pressure is 290～295PSI
It is embedded in groove described in described magnetic core is fixed on；
Dismounting foil, is removed described foil by described disassembling part and is sticked at the glue on its surface to remove,
Described magnetic core end face is made to expose completely；
Offer through hole, described PCB main board is offered multiple through hole so that multiple through holes are arranged around described magnetic core, and
Making described through hole is 0.18mm apart from the minimum range of described magnetic core；
Through hole copper facing, in described through hole, copper facing forms described conductive through hole, and described conductive through hole is electrically connected to form magnetic
Core coiling, copper facing thickness single-point be more than 78 μm, prepare described in bury magnetic core wiring board.
Compared with correlation technique, the present invention provide bury magnetic core wiring board and manufacture method thereof, described magnetic core is embedded into into
Inside described PCB main board, thus the production efficiency of manual attachment operation, the most therefore eliminate Welding Problems, it is to avoid solder joint
Bad problem, improves the unfailing performance of generation.Embedded structure is that the PCB surface of power panel saves a large amount of areas, favorably
Miniaturization and high densification in product design.
Accompanying drawing explanation
Fig. 1 is the structural representation that the present invention buries magnetic core wiring board；
Fig. 2 is the manufacture method flow chart that the present invention buries magnetic core wiring board.
Detailed description of the invention
Below in conjunction with drawings and embodiments, the invention will be further described.
Refer to Fig. 1, bury the structural representation of magnetic core wiring board for the present invention.What the present invention provided buries magnetic core wiring board
10, including PCB main board 1, to the magnetic core 3 being embedded into groove 2 and being embedded in groove 2 described in being placed in of described PCB main board 1 inner recess.
Described PCB main board 1 includes that multilamellar to the end face successively folded copper plate 11 set and is located in adjacent two layers by its bottom surface
PP layer 12 between described copper plate 11, for forming the insulation between described copper plate 11.Described copper plate 11 includes running through
Thereon and the most copper-plated conductive through hole 111, for realizing the connection between described copper plate 11.Described copper plate 11
More than 8 layers, the copper thickness of 1～6 layer every layer described copper plate 11 is 0.105mm, and described magnetic core 3 is embedded into 1 in described PCB main board 1
～8 layers, the end face of described magnetic core 3 is not higher than the end face of described PCB main board 1 and exposes to described PCB main board 1 completely.
Concrete, described magnetic core 3 is circular cylindrical or E type.
In present embodiment, the aperture of described conductive through hole 111 is 0.5mm, is embedded into the distance of groove 2 at least described in its distance
For 0.18mm.Described conductive through hole 111 copper facing thickness single-point is more than 75 μm.The described copper-plated radius-thickness ratio of conductive through hole 111 is less than
Or equal to 11:1.
The size of the described size and described magnetic core 3 being embedded into groove 2 differs ± 0.0762mm.In the requirement meeting embedment smoothly
Meanwhile, filler is decreased as far as possible.The position of 1～2 layer of the described described copper plate of correspondence 11 being embedded into groove 2, its size ratio
The size of the correspondence position of described magnetic core 3 is more than 0.1016mm, and this structure arranges and prevents burr from affecting, and improves conforming product rate.
Incorporated by reference to refering to Fig. 2, bury the manufacture method flow chart of magnetic core wiring board for the present invention.Present invention also offers one
Such as the above-mentioned manufacture method burying magnetic core wiring board, the method comprises the steps:
Step S1, providing described magnetic core 3 and wait to imbed the described PCB main board 1 of described magnetic core, described PCB main board 1 includes many
Layer by its bottom surface to the end face successively folded copper plate 11 set and the PP layer 12 that is located in described in adjacent two layers between copper plate 11, institute
State copper plate 11 more than 8 layers.
Step S2, offer and be embedded into groove, the end face of described PCB main board 1 open on described PCB main board 1 to its direction, bottom surface
Be embedded into groove 2 described in if, make described in be embedded into groove 2 and be extended down to the 8th layer of copper plate, and be embedded into the size of groove 2 and described magnetic core 3 described in making
Size difference ± 0.0762mm.
Step S3, be sticked foil, and the aspect that is sticked by the end face of described magnetic core 3 is long-pending more than described magnetic core 3 end face face
Long-pending foil (not shown), and make the part beyond described magnetic core 3 end face of described foil to away from described magnetic core 3
Direction be bent to form disassembling part；
Step S4, magnetic core are fixed, described magnetic core 3 is placed in described in be embedded in groove 2, and be 290～295PSI by pressure
Laminating technology described magnetic core 3 is fixed on described in be embedded in groove 2；
Step S5, dismounting foil, removed described foil by described disassembling part and be sticked at its table to remove
The glue in face, makes described magnetic core 3 end face expose completely；
Step S6, offer through hole, described PCB main board 1 offers multiple through hole so that multiple through holes are around described magnetic core
3 are arranged, and to make described through hole be 0.18mm apart from the minimum range of described magnetic core 3；
Step S7, through hole copper facing, in described through hole, copper facing forms described conductive through hole 111, by described conductive through hole 111
Be electrically connected to form magnetic core coiling, copper facing thickness single-point be more than 78 μm, prepare described in bury magnetic core wiring board 10.
Compared with correlation technique, described magnetic core is embedded in described PCB main board by the magnetic core wiring board that buries that the present invention provides
Portion, thus eliminate manual attachment operation, improve production efficiency, the most therefore eliminate Welding Problems, it is to avoid poor welding spots
Problem, improves the unfailing performance of generation.Embedded structure is that the PCB surface of power panel saves a large amount of areas, beneficially product
The miniaturization of design and high densification.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description and accompanying drawing content are made convert, or are directly or indirectly used in other relevant skill
Art field, is the most in like manner included in the scope of patent protection of the present invention.
Claims (8)
1. bury a magnetic core wiring board, including PCB main board, being embedded into groove and being placed in described embedding to described PCB main board inner recess
Bury the magnetic core in groove, it is characterised in that described PCB main board include multilamellar by its bottom surface to the end face successively folded copper plate set and folder
Being located at the PP layer between copper plate described in adjacent two layers, described copper plate includes running through thereon and the most copper-plated conduction
Through hole, described copper plate is more than 8 layers, and the copper thickness of 1～6 layer every layer described copper plate is 0.105mm, and described magnetic core is embedded in described
Between 1～8 layer of described copper plate of PCB main board, the end face of described magnetic core is not higher than the end face of described PCB main board and exposes completely
In described PCB main board.
The most according to claim 1 bury magnetic core wiring board, it is characterised in that described magnetic core is circular cylindrical or E type.
The most according to claim 1 bury magnetic core wiring board, it is characterised in that described in be embedded into the size of groove and described magnetic core
Size difference ± 0.0762mm.
The most according to claim 3 bury magnetic core wiring board, it is characterised in that described in be embedded into the described copper plate of correspondence of groove
The position of 1～2 layer, its size 0.1016mm bigger than the size of the correspondence position of described magnetic core.
The most according to claim 1 bury magnetic core wiring board, it is characterised in that the aperture of described conductive through hole is 0.5mm, its
The distance being embedded into groove described in Ju Li is at least 0.18mm.
The most according to claim 1 bury magnetic core wiring board, it is characterised in that described conductive through hole copper facing thickness single-point is more than
78μm。
The most according to claim 1 bury magnetic core wiring board, it is characterised in that the copper-plated radius-thickness ratio of described conductive through hole is less than
Or equal to 11:1.
8. the manufacture method burying magnetic core wiring board as described in claim 1-8 any one, it is characterised in that this manufacture
Method comprises the steps:
Described magnetic core is provided and waits to imbed the described PCB main board of described magnetic core, described PCB main board include multilamellar by its bottom surface to top
The face folded copper plate set successively and the PP layer being located in described in adjacent two layers between copper plate, described copper plate is more than 8 layers；
Offer and be embedded into groove, by the end face of described PCB main board to its direction, bottom surface offer on described PCB main board described in be embedded into groove,
Be embedded into groove described in making and be extended down to the 8th layer of copper plate, and the size of the size and described magnetic core being embedded into groove described in making differ ±
0.0762mm；
Be sticked foil, and the aspect that is sticked by the end face of described magnetic core amasss the foil more than described magnetic core top surface area,
And make the part beyond described magnetic core end face of described foil be bent to form disassembling part to the direction away from described magnetic core；
Magnetic core is fixed, described magnetic core is placed in described in be embedded in groove, and by laminating technology that pressure is 290～295PSI by institute
State magnetic core be fixed on described in be embedded in groove；
Dismounting foil, is removed described foil by described disassembling part and is sticked at the glue on its surface to remove, make institute
State magnetic core end face to expose completely；
Offer through hole, described PCB main board is offered multiple through hole so that multiple through holes are arranged around described magnetic core, and make institute
Stating through hole apart from the minimum range of described magnetic core is 0.18mm；
Through hole copper facing, in described through hole, copper facing forms described conductive through hole, described conductive through hole is electrically connected to form magnetic core around
Line, copper facing thickness single-point be more than 78 μm, prepare described in bury magnetic core wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610675397.3A CN106170176B (en) | 2016-08-16 | 2016-08-16 | Bury magnetic core wiring board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610675397.3A CN106170176B (en) | 2016-08-16 | 2016-08-16 | Bury magnetic core wiring board and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106170176A true CN106170176A (en) | 2016-11-30 |
| CN106170176B CN106170176B (en) | 2019-09-06 |
Family
ID=58065871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610675397.3A Active CN106170176B (en) | 2016-08-16 | 2016-08-16 | Bury magnetic core wiring board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106170176B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882524A (en) * | 2018-08-06 | 2018-11-23 | 胜宏科技（惠州）股份有限公司 | One kind burying electromagnet core wiring board core plate production method |
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| JP2004319875A (en) * | 2003-04-18 | 2004-11-11 | Nec Tokin Corp | Inductor built-in multilayer substrate and method for manufacturing the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882524A (en) * | 2018-08-06 | 2018-11-23 | 胜宏科技（惠州）股份有限公司 | One kind burying electromagnet core wiring board core plate production method |
| CN108882524B (en) * | 2018-08-06 | 2021-01-15 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing core board of electromagnetic core embedded circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106170176B (en) | 2019-09-06 |
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