CN205921821U - Bury magnetic core circuit board - Google Patents

Bury magnetic core circuit board Download PDF

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Publication number
CN205921821U
CN205921821U CN201620889256.7U CN201620889256U CN205921821U CN 205921821 U CN205921821 U CN 205921821U CN 201620889256 U CN201620889256 U CN 201620889256U CN 205921821 U CN205921821 U CN 205921821U
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CN
China
Prior art keywords
magnetic core
layer
bury
pcb mainboard
wiring board
Prior art date
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Active
Application number
CN201620889256.7U
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Chinese (zh)
Inventor
孟昭光
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Dongguan Wuzhu Electronic Technology Co Ltd
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Dongguan Wuzhu Electronic Technology Co Ltd
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Priority to CN201620889256.7U priority Critical patent/CN205921821U/en
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Abstract

The utility model discloses a bury magnetic core circuit board, including the PCB mainboard, to inside sunken the inlaying of PCB mainboard is buried the groove and is arranged in inlay the E shape magnetic core that buries the inslot, the PCB mainboard include the multilayer by its bottom surface to the top surface fold in proper order the copper plate established with press from both sides locate adjacent two -layer PP layer between the copper plate, the copper plate is including running through the conductive through hole on it, the copper plate is greater than 8 layers, 1~6 layer every layer the thick 0.105mm that is of copper of copper plate, E shape magnetic core inlay bury in 1~8 layer of PCB mainboard, the top surface of E shape magnetic core with the top surface parallel and level of PCB mainboard and expose completely in the PCB mainboard. Compared with the prior art, the utility model discloses a bury magnetic core circuit board stable performance is fit for the miniaturized and high compacting of product design.

Description

Bury magnetic core wiring board
Technical field
This utility model is related to wiring board, more particularly, to a kind of magnetic core embedded type bury magnetic core wiring board.
Background technology
Step into system envelope with printed circuit board (PCB) (printed circuit board, pcb) also known as wiring board industry development In dress (sop) stage, the buried technology of pcb passive device also becomes the focus of current research.And in the adjustment development of automatization's progress, Pcb is one of key technology, and all control systems are required for pcb and realize Electric signal processing as carrier.
In correlation technique, in board design, inductance is widely applied, and logical direct current, the physical significance of the inductance of resistance exchange are Store alternating magnetic field energy using conductive coil, Main Function in circuit is to provide emotional resistance, in unit related to other Complete to mate accordingly under part cooperation, the circuit function such as filter, vibrate.
The power pack inductance of pcb is required for greatly manual attachment, low production efficiency, there is the bad equivalent risk of weld pads. In addition, inductance element takies power supply plate surface more than 40% area, it is unfavorable for product design miniaturization and high densification.
Therefore, it is necessary to provide a kind of new magnetic core wiring board that buries to solve above-mentioned technical problem.
Utility model content
The purpose of this utility model is to overcome above-mentioned technical problem, provides a kind of stable performance, and suitable product design is small-sized Change buries magnetic core wiring board with high densification.
What this utility model provided buries magnetic core wiring board, including pcb mainboard, being embedded into described pcb mainboard inner recess Groove and the e shape magnetic core being embedded in groove described in being placed in, described pcb mainboard includes multilamellar and folds, to top surface, the copper facing setting from its bottom surface successively Layer and be located in the pp layer between copper plate described in adjacent two layers, described copper plate includes running through conductive through hole thereon, described Copper plate is more than 8 layers, and the copper of 1~6 layer every layer described copper plate is thick to be 0.105mm, and described e shape magnetic core is embedded in described pcb master 1~8 layer of plate, the top surface of described e shape magnetic core exposes to described pcb mainboard with the either flush of described pcb mainboard and completely.
Preferably, described e shape magnetic core include rectangular main part, by described main part vertically extending two curved First auxiliary portion of column and assume the columned second auxiliary portion, described first auxiliary portion is located at the two ends of described main part, institute respectively The second auxiliary portion that states is located between two described first auxiliary portions.
Preferably, a length of 18.45mm of described main part, a width of 6.3mm;A diameter of 6.3mm in described first auxiliary portion;Two The length in individual described second auxiliary portion is 6.3mm, wide respectively 2.225mm and 2.825mm.
Preferably, the described size being embedded into groove differs ± 0.1016mm with the size of described e shape magnetic core.
Preferably, the position of 1~2 layer of the described described copper plate of correspondence being embedded into groove, its size is than described e shape magnetic core The size of correspondence position is more than 0.1016mm.
Preferably, described conductive through hole is at least 0.1778mm apart from the described distance being embedded into groove.
Preferably, described conductive through hole copper facing thickness single-point is more than 75 μm.
Preferably, the copper-plated radius-thickness ratio of described conductive through hole is less than or equal to 11:1.
Compared with correlation technique, described e shape magnetic core is embedded into into described pcb the magnetic core wiring board that buries that this utility model provides Inside mainboard, thus the production efficiency of manual attachment operation, also therefore eliminate Welding Problems, it is to avoid asking of poor welding spots Topic, improves the unfailing performance of generation.Embedded structure is that a large amount of areas are saved on the pcb surface of power panel, is conducive to product to set The miniaturization of meter and high densification.
Brief description
Fig. 1 buries the structural representation of magnetic core wiring board for this utility model.
Specific embodiment
Below in conjunction with drawings and embodiments, the utility model is described in further detail.
Refer to Fig. 1, be the structural representation that this utility model buries magnetic core wiring board.What this utility model provided buries magnetic core Wiring board 10, including pcb mainboard 1, to described pcb mainboard 1 inner recess the e shape being embedded into groove 2 and being embedded into described in being placed in groove 2 Magnetic core 3.
Described pcb mainboard 1 includes multilamellar and folds, from its bottom surface to top surface, the copper plate 11 setting successively and be located in adjacent two layers Pp layer 12 between described copper plate 11, for forming the insulation between described copper plate 11.Described copper plate 11 includes running through Conductive through hole 111 thereon, for realizing the connection between described copper plate 11.Described copper plate 11 is more than 8 layers, and 1~6 layer every The copper of the described copper plate 11 of layer is thick to be 0.105mm, and described e shape magnetic core 3 is embedded in 1~8 layer of described pcb mainboard 1, described e shape The either flush of the top surface of magnetic core 3 and described pcb mainboard 1 and expose to described pcb mainboard 1 completely.
In present embodiment, described conductive through hole 111 is at least 0.1778mm apart from the described distance being embedded into groove 2.Described Conductive through hole 111 copper facing thickness single-point is more than 75 μm.The copper-plated radius-thickness ratio of described conductive through hole 111 is less than or equal to 11:1.
The described size being embedded into groove 2 differs ± 0.1016mm with the size of described e shape magnetic core 3.Meeting smoothly embedment Require simultaneously, to decrease filler as far as possible.The position of 1~2 layer of the described described copper plate of correspondence 11 being embedded into groove 2, its chi The size of the very little correspondence position than described e shape magnetic core 3 is more than 0.1016mm, and this structure setting prevents burr from affecting, and improves product Qualification rate.
Described e shape magnetic core 3 includes rectangular main part 31, by the vertically extending two curved posts of described main part 31 First auxiliary portion 32 of shape and the columned second auxiliary portion 33 that presents, described first auxiliary 32 are located at the two of described main part 31 respectively End, described second auxiliary portion 33 is located between two described first auxiliary portions 32.
Specifically, in present embodiment, a length of 18.45mm of described main part 31, a width of 6.3mm;Described first auxiliary portion 32 a diameter of 6.3mm;The length in two described second auxiliary portions 33 is 6.3mm, wide respectively 2.225mm and 2.825mm.
Compared with correlation technique, described e shape magnetic core is embedded into into described pcb the magnetic core wiring board that buries that this utility model provides Inside mainboard, thus eliminating manual attachment operation, improve production efficiency, also therefore eliminate Welding Problems, it is to avoid solder joint Bad problem, improves the unfailing performance of generation.Embedded structure is that a large amount of areas are saved, favorably in the pcb surface of power panel Miniaturization and high densification in product design.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, every The equivalent structure made using this utility model description and accompanying drawing content or equivalent flow conversion, or be directly or indirectly used in Other related technical fields, are all included in the same manner in scope of patent protection of the present utility model.

Claims (8)

1. one kind buries magnetic core wiring board, including pcb mainboard, being embedded into groove and being placed in described embedding to described pcb mainboard inner recess Bury the e shape magnetic core in groove, described pcb mainboard includes multilamellar and folds, from its bottom surface to top surface, the copper plate setting successively and be located in adjacent Pp layer between copper plate described in two-layer, described copper plate include running through conductive through hole thereon it is characterised in that: described copper facing Layer is more than 8 layers, and the copper of 1~6 layer every layer described copper plate is thick to be 0.105mm, and described e shape magnetic core is embedded in described pcb mainboard 1 ~8 layers, the top surface of described e shape magnetic core exposes to described pcb mainboard with the either flush of described pcb mainboard and completely.
2. according to claim 1 bury magnetic core wiring board it is characterised in that described e shape magnetic core includes rectangular main body Portion, the first auxiliary portion by the vertically extending two curved columns of described main part and assume the columned second auxiliary portion, described First auxiliary portion is located at the two ends of described main part respectively, and described second auxiliary portion is located between two described first auxiliary portions.
3. according to claim 2 bury magnetic core wiring board it is characterised in that a length of 18.45mm of described main part, a width of 6.3mm;A diameter of 6.3mm in described first auxiliary portion;The length in two described second auxiliary portions is 6.3mm, wide respectively 2.225mm And 2.825mm.
4. according to claim 3 bury magnetic core wiring board it is characterised in that the described size being embedded into groove and described e shape magnetic Size difference ± the 0.1016mm of core.
5. according to claim 4 bury magnetic core wiring board it is characterised in that the described described copper plate of correspondence being embedded into groove 1~2 layer of position, the size of its correspondence position than described e shape magnetic core for the size is more than 0.1016mm.
6. according to claim 1 bury magnetic core wiring board it is characterised in that described conductive through hole is embedded into groove apart from described Distance at least 0.1778mm.
7. according to claim 1 bury magnetic core wiring board it is characterised in that described conductive through hole copper facing thickness single-point is more than 75μm.
8. according to claim 1 bury magnetic core wiring board it is characterised in that the copper-plated radius-thickness ratio of described conductive through hole is less than Or it is equal to 11:1.
CN201620889256.7U 2016-08-16 2016-08-16 Bury magnetic core circuit board Active CN205921821U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620889256.7U CN205921821U (en) 2016-08-16 2016-08-16 Bury magnetic core circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620889256.7U CN205921821U (en) 2016-08-16 2016-08-16 Bury magnetic core circuit board

Publications (1)

Publication Number Publication Date
CN205921821U true CN205921821U (en) 2017-02-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620889256.7U Active CN205921821U (en) 2016-08-16 2016-08-16 Bury magnetic core circuit board

Country Status (1)

Country Link
CN (1) CN205921821U (en)

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