JPH07169634A - Manufacture of multilayer board - Google Patents

Abstract

PURPOSE:To raise the versatility and reliability by rapidly enlarging the current capacity. CONSTITUTION:This is a multilayer board 1 which is united by inserting a plurality of conductor plates 3a, 3b, 3c,..., where circuit patterns P are modeled, and a plurality of insulating boards, which have insulating functions to insulate the surface of each conductor plate 3a..., for example, insulating boards 4a, 4b, 4c,... made of thermoplastic resin between more than one or two main boards 2a and 2b, and welding (thermocompression-bonding) them by pressurization (heating and pressurization).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a multilayer substrate suitable for manufacturing coil components such as transformers and choke coils.

[0002]

2. Description of the Related Art Conventionally, a coil component manufactured by using a printed circuit board is known in order to flatten a coil component such as a transformer and a choke coil and to facilitate its manufacture (for example, Japanese Patent Laid-Open Publication No. Hei 10 (1999) -242242). 3-183106, etc.).

In this type of coil component, a plurality of printed circuit boards on which a coil-shaped circuit pattern having a predetermined number of turns is printed are prepared, the printed circuit boards are laminated and integrated, and the coil pattern of each printed circuit board is arranged. Connect and configure.

[0004]

However, in the case of such a conventional coil component, the printed circuit board itself used is a general printed circuit board, that is, a printed circuit board obtained by etching a copper foil attached to the surface of the main circuit board. However, the circuit pattern formed in a coil shape cannot be thickened. Therefore, when it is used for a coil component, the current capacity cannot be increased, so that the application of the coil component is limited, the electric resistance is increased, and heat is easily generated due to an excessive current, resulting in poor versatility and reliability. There was a problem. In addition, in order to increase the current capacity, the pattern width of the circuit pattern is also widened, but there is a limit to increase the current capacity and there is a problem that the coil component itself becomes large.

The present invention solves the problems existing in the prior art as described above, and provides a method of manufacturing a multi-layer substrate which can improve versatility and reliability by dramatically increasing the current capacity. For the purpose of provision.

[0006]

A method of manufacturing a multi-layer substrate according to a basic form of the present invention includes one or more conductor plates 3 in the shape of a circuit pattern P between a plurality of main substrates 2a, 2b.
a, 3b, 3c ... And a plurality of insulating plates having an adhesive function to insulate the surfaces of the conductor plates 3a ..., For example, insulating plates 4a, 4b, 4c. It is characterized in that an integrated multi-layer substrate 1 is obtained by press-bonding (thermo-compression) by pressing (heating and pressing). In this case, it is desirable that the circuit pattern P be formed as a part of the coil Pc and that the circuit pattern P be integrally provided with an extension portion Pu other than the circuit. The conductor plates 3a ... Can be formed by punching out a conductor plate material having a predetermined thickness.

On the other hand, in the method for manufacturing a laminated board according to another embodiment of the present invention, a plurality of conductor plates 3a ₁ , 3a ₂ ... Having a circuit pattern P are connected between a plurality of main board members 10a. 1 or two or more conductor plate connecting members 11a ... And a plurality of insulating plate members having an adhesive function of insulating the surfaces of the respective conductor plate connecting members 11a ..., For example, insulating plate members 12a formed of thermoplastic resin are inserted. Are laminated together and pressed (thermocompression) by pressure (heating and pressure) to obtain an integrated multilayer substrate material, and a plurality of multilayer substrates 1 ... Is extracted from this multilayer substrate material. Characterize. Also in this case, the circuit pattern P, the extending portion Pu, the conductor plate 3a, ... Can be manufactured in the same manner as in the manufacturing method of the basic mode.

[0008]

According to the manufacturing method of the basic mode of the present invention, first, in advance, a plurality of main boards 2a, one or more conductor plates 3a in the shape of the circuit pattern P, and conductor plates 3a. A plurality of insulating plates 4a having an adhesive function to insulate the surface thereof are prepared. In this case, since each conductor plate 3a ... Is prepared separately, it is possible to punch and form a conductor plate material having a predetermined thickness, and
The current capacity can be increased.

On the other hand, in manufacturing, a plurality of main substrates 2a are used.
, 2b, and one or more conductor plates 3a are inserted, and a plurality of insulating plates 4a are inserted so that the surface of each conductor plate 3a is insulated. Then, by compressing in the direction perpendicular to the surface by heating and pressurizing, the insulating plates 4a ... Formed by the thermoplastic resin are melted, and the conductor plates 3a, 3b ... Or the conductor plates 3a. The pressure-bonded and integrated multilayer substrate 1 is obtained.

In this case, if the circuit pattern P is formed as a part of the coil Pc and thermocompression bonded and then the conductor plates 3a are connected, a coil component having a flat and large current capacity can be obtained. In addition, if the extension portion Pu other than the circuit is provided integrally with the circuit pattern P, the extension portion Pu can have a heat dissipation function and a function of making the entire thickness uniform during stacking.

[0011] On the other hand, according to the manufacturing method according to another embodiment of the present invention, coupled with one or more of the main board member 10a ..., the plurality of Zo' a circuit pattern P conductive plate 3a _1, 3a ₂ ... a And a plurality of conductor plate connecting members 11a ...
Since a plurality of insulating plate members 12a having an adhesive function of insulating the surfaces of 1a are used, a plurality of multilayer substrates 1 can be manufactured at the same time.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, preferred embodiments according to the present invention will be described in detail with reference to the drawings.

First, a manufacturing method according to the basic mode of the present invention will be described with reference to FIGS.

The embodiment exemplifies a method of manufacturing a transformer having the primary coils Cf, Cf and the secondary coil Cs. In this case, in particular, the secondary coil Cs is specifically specified as the multilayer substrate 1 according to the present invention.

First, a method of manufacturing the secondary coil Cs will be described. When manufacturing the secondary coil Cs, two main boards 2a and 2b and five conductor plates 3a, 3b, 3c and 3 are used.
d, 3e and the six insulating plates 4a, 4b, 4c, 4d, 4
Prepare e and 4f.

The main substrate 2a (same for 2b) is formed by using a glass epoxy resin plate or the like, and its shape is a donut-shaped coil pattern base portion 21, as shown in FIG.
The coil pattern base portion 21 has a pair of connection base portions 22 and 23 provided at positions opposite to each other by 180 °. Also,
Each of the connection base portions 22 and 23 has six lands (copper foils) 24 ... Printed in a line. Therefore, each main board 2a ... Is the same as an ordinary printed board.

On the other hand, the conductor plates 3a, 3b, 3c, 3d,
3e is formed in the shape shown in FIG. In this case, as shown in FIGS. 2 and 3, one conductor plate, for example, the conductor plate 3a has a circuit pattern P having a part Pc of the coil and connecting ends Pi and Pj and has a thickness of 0. It is formed by punching from a 5 mm copper plate (conductor plate material) with a mold or the like. It is desirable that the circuit pattern P be integrally provided with an extension portion Pu other than the circuit. In FIG. 3, a range indicated by an arrow Lu in the circuit pattern P is an extension portion Pu that does not function as a circuit. By providing the extension portion Pu, the heat dissipation function and the entire structure can be obtained without causing an inclination or the like during stacking. It can have a function of making the thickness uniform. Then, when the conductor plates 3a, 3b, 3c, 3d, and 3e are sequentially stacked, the connection end portions Pi and P that are provided at the same position are provided.
The shape of the circuit pattern P in each conductor plate 3a ... Is selected so that a coil with continuous N turns is formed by connecting j. Dotted lines in FIG. 5 indicate connection points.

Further, the insulating plates 4a, 4b, 4c, 4d,
4e and 4f are formed in a sheet shape and in the same shape as the main substrates 2a ... Using a thermoplastic resin such as glass epoxy resin having an adhesive function of insulating the surface of each conductor plate 3a.

Then, as shown in FIG. 1, an insulating plate 4f, a conductive plate 3e, an insulating plate 4e, a conductive plate 3d, an insulating plate 4d, a conductive plate 3c, and an insulating plate 4c are provided on the main substrate 2b which is turned over at the time of manufacturing. , The conductor plate 3b, the insulating plate 4b, the conductor plate 3a, the insulating plate 4a, and the main board 2a are sequentially aligned and laminated. Next, if heat and pressure are applied in the axial direction in this state, they are integrated by thermocompression bonding. That is, the insulating plates 4a ... Are melted by heating and pressurizing, and the conductor plates 3a ..., The conductor plate 3a and the main board 2a, and the conductor plate 3b and the main board 2b are bonded and insulated.

On the other hand, the land 24 in the integrated substrate
A hole 25 that penetrates the front and back in the center of the ... (See Fig. 2)
The holes 25 are formed as shown in FIG.
Copper plating 27 is applied to the inner surface of the. As a result, the connection ends Pi and Pj, and the connection ends Pi and P
The j and the land 24 are connected. With the above, the manufacturing of the secondary coil Cs is completed.

On the other hand, the primary coil Cf uses the printed circuit board 30 shown in FIG. That is, a plurality of printed circuit boards 30 each having the coil pattern Pf printed on the surface of the main substrate 31 are prepared and laminated. In this case, the coil patterns Pf of the respective printed circuit boards 30 ... Are formed in different shapes so that the coils of M turns are formed when they are connected at the time of stacking. In addition, in FIG.
32 is a connection base portion in the main substrate 31, 33 ... Is a hole, and Pu is an extending portion provided in the coil pattern Pf.

Then, as shown in FIG. 7, on the upper side and the lower side,
By arranging the laminated primary coils Cf and Cf, sandwiching the secondary coil Cs between the primary coils Cf and Cf, and further mounting a core (not shown) using the central space,
The transformer T is completed. As described above, in the manufacturing method according to the present invention, since the conductor plates 3a are separately prepared, the conductor plate material having a desired thickness can be punched and formed, and the current capacity can be increased. Moreover, the coil component can be flattened, and versatility and reliability can be improved.

Next, a modified example of the manufacturing method according to the basic mode of the present invention will be described with reference to FIGS.

As a modification, the conductor plate 3g shown in FIG. 10 is used. The conductor plate 3g is formed by punching out a copper plate having a thickness of 0.5 mm, for example, and has a circuit pattern P that integrally has, in addition to the coil pattern Pf, connection patterns Px and Py extending from both ends of the coil pattern Pf. It is a model of. The number of turns of the coil pattern Pf shown in FIG. 10 is 1 turn (1 turn).

Then, similarly to the method shown in FIGS. 1 to 5, both surfaces of the conductor plate 3g are sandwiched by the insulating plates 4g and 4h, and the upper and lower surfaces of the insulating plates 4g and 4h have a thickness of 0.1 mm.
The secondary coil Cse (multilayer substrate 1) shown in FIG. 9 can be manufactured by sandwiching the main substrates 2c and 2d of a certain degree and further applying heat and pressure. Further, in FIGS. 8 and 9, Cfe is a primary coil and can be manufactured in the same manner as the method shown in FIGS.

Therefore, the transformer Te shown in FIGS. 8 and 9 can be constructed by superposing the secondary coil Cse on the primary coil Cfe and combining them. This transformer Te is mounted on the printed board 35. At the time of mounting, the coils Cfe, Cse and the printed circuit board 3 are mounted by the method shown in FIG.
5, through holes 36 are formed, and connecting lines 37 are formed inside.
Can be connected and fixed by inserting and soldering. In the figure, 38 indicates a core, and 39m and 39n indicate electronic parts.

With this modification, the connection pattern P
The magnitude of the current capacity at x and Py also depends on the coil pattern P.
It can be set large like f. Therefore, as shown in FIG. 8, the electronic component (rectifier) 39m can be directly connected to the tip of the connection pattern Px.

Next, a method of manufacturing a multilayer substrate according to another embodiment of the present invention will be described with reference to FIG.

The manufacturing method shown in FIG. 11 is different from the manufacturing method of the basic mode in that a plurality of multilayer substrates 1 ...
Is that it can be manufactured at the same time. First, the main substrate material 10a shown in FIG. 11A, the insulating plate material 12a shown in FIG.
A plurality of conductor plate connecting members 11a shown in FIG.

In this case, the main substrate material 10a has a size capable of extracting a plurality of main substrates 2a ...
A plurality of shapes of a ... Are printed. Two main board materials 10a are prepared, and the shapes of the respective main boards 2a ... Are printed symmetrically. Further, the insulating plate materials 12a ...
One sheet is formed so as to have the same size as a, and six sheets are prepared. Furthermore, the conductor plate connecting material 11a ...
Are two or more conductor plates 3a ₁ and 3a _{2 in the} shape of the circuit pattern P.
, And the respective conductor plates 3a ₁ , 3a ₂ ... Are connected by the connecting portion 40. It is desirable that the connecting portions 40 ... Are formed at the connection end portions Pi ... Of the circuit pattern P that do not cause any trouble. Therefore, in order to achieve this, each main substrate 2a
, And the direction of the conductor plate 3a ₁ are selected. Five conductor plate connecting members 11a are prepared. In addition, the main board 2a, the conductor plate 3a _1, ..., and the insulating plate material 12a forming the insulating plate 4a, etc. can be configured in the same manner as in the embodiment of the manufacturing method according to the basic embodiment. . Further, the manufacturing itself can be carried out in the same manner as the embodiment according to the basic mode.

On the other hand, a plurality of multi-layer substrates 1 ... Are cut out and extracted from the single integrated multi-layer substrate material that is completed. This makes it possible to manufacture a plurality of multi-layer substrates 1 ... Simultaneously, reducing the manufacturing cost and improving the productivity.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment.
For example, the main substrate includes both printed and unprinted substrates. Further, although the coil component has been exemplified, it can be applied to a multilayer substrate including any other circuit. In addition, the detailed configuration, shape, material, quantity, etc. can be arbitrarily changed without departing from the scope of the present invention.

[0033]

As described above, according to the method for manufacturing a multilayer substrate according to the basic mode of the present invention, a plurality of conductor plates having a circuit pattern and the surface of each conductor plate are formed between one or more main substrates. Since a plurality of insulating plates having an insulating adhesive function are inserted and laminated, and pressure is applied by pressure to obtain an integrated multi-layer substrate, the current capacity of the circuit pattern can be increased, especially for coil components. If used,
It is possible to obtain coil parts with dramatically large current capacity without sacrificing flatness and ease of manufacturing.
The remarkable effect that versatility and reliability can be improved is achieved.

A method of manufacturing a multi-layer substrate according to another aspect of the present invention includes a plurality of conductor plates formed by connecting a plurality of conductor plates having a circuit pattern between one or more main substrate materials. A plurality of insulating plate materials having an adhesive function to insulate the surface of the connecting material and each conductor plate connecting material are inserted and laminated, and an integrated multi-layer substrate material is obtained by pressure bonding with pressure,
Since a plurality of multi-layer boards are extracted from this multi-layer board material, it is possible to manufacture a plurality of multi-layer boards at the same time, and it is possible to reduce the manufacturing cost and to enhance the productivity. .

[Brief description of drawings]

FIG. 1 is a front cross-sectional view (cross-section taken along line BB in FIG. 2) of a multilayer substrate manufactured by a manufacturing method according to a basic embodiment of the present invention,

FIG. 2 is a view taken along the line AA in FIG. 1 of the multilayer substrate manufactured by the manufacturing method,

FIG. 3 is a plan view of a conductor plate used for a multilayer substrate manufactured by the manufacturing method,

FIG. 4 is a cross-sectional view showing a part of holes in a multilayer substrate manufactured by the same manufacturing method.

FIG. 5 is a development view of a main substrate and a conductor plate used for a multilayer substrate manufactured by the manufacturing method,

FIG. 6 is a plan view of a printed circuit board used for a primary coil that is assembled to the multilayer substrate manufactured by the manufacturing method.

FIG. 7 is a front view of a transformer using a multilayer substrate manufactured by the manufacturing method,

FIG. 8 is a perspective view of a printed circuit board mounted with a multilayer substrate manufactured by a modification of the manufacturing method;

FIG. 9 is a cross-sectional view of a printed circuit board mounted with a multilayer substrate manufactured by a modification of the manufacturing method.

FIG. 10 is a plan view of a conductor plate used for a multilayer board manufactured by a modification of the manufacturing method;

FIG. 11 is a development view of a main board member, an insulating plate member, and a conductor plate connecting member for explaining a manufacturing method according to another embodiment of the present invention.

[Explanation of symbols]

1 multilayer substrate 2a ... main board 3a ... conductor plate 3a ₁ ... conductor plate 4a ... insulating plate P circuit pattern Pc portion of the coil Pu extending part 10a ... main board member 11a ... conductive plate connecting member 12a ... insulating plate

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H05K 3/46 Q 6921-4E

Claims (10)

[Claims] 1. One or more conductor plates in the shape of a circuit pattern and a plurality of insulating plates having an adhesive function of insulating the surface of each conductor plate are inserted and laminated between a plurality of main substrates, and A method for manufacturing a multi-layer substrate, characterized in that an integrated multi-layer substrate is obtained by pressure bonding with pressure. 2. The method for manufacturing a multilayer substrate according to claim 1, wherein the circuit pattern is a part of a coil. 3. The method for manufacturing a multilayer substrate according to claim 1, wherein the circuit pattern is integrally provided with an extension portion other than the circuit. 4. The method of manufacturing a multilayer substrate according to claim 1, wherein the conductor plate is formed by punching out a conductor plate material having a predetermined thickness. 5. The method of manufacturing a multilayer substrate according to claim 1, wherein an insulating plate formed of a thermoplastic resin is used and the pressure bonding is performed by heating and pressing. 6. An adhesive function for insulating one or more conductor plate connecting members formed by connecting a plurality of conductor plates having a circuit pattern between a plurality of main substrate members and the surface of each conductor plate connecting member. A plurality of insulating board materials having the above are inserted and laminated, and an integrated multi-layer board material is obtained by pressure bonding with pressure, and a plurality of multi-layer board materials are extracted from the multi-layer board material. Production method. 7. The method for manufacturing a multilayer substrate according to claim 6, wherein the circuit pattern is a part of a coil. 8. The method for manufacturing a multilayer substrate according to claim 6, wherein the circuit pattern is integrally provided with an extension portion other than the circuit. 9. The method for manufacturing a multilayer board according to claim 6, wherein the conductor plate connecting material is formed by punching out a conductor plate material having a predetermined thickness. 10. The method for manufacturing a multilayer substrate according to claim 6, wherein an insulating plate material formed of a thermoplastic resin is used and thermocompression bonding is performed by heating and pressing.