CN208273346U - A kind of printed circuit board and electronic equipment - Google Patents
A kind of printed circuit board and electronic equipment Download PDFInfo
- Publication number
- CN208273346U CN208273346U CN201820666492.1U CN201820666492U CN208273346U CN 208273346 U CN208273346 U CN 208273346U CN 201820666492 U CN201820666492 U CN 201820666492U CN 208273346 U CN208273346 U CN 208273346U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- layer
- plate core
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a kind of printed circuit board and electronic equipment, the printed circuit board includes substrate and the IC chip on the substrate, wherein the IC chip is equipped with several pins, the IC chip is welded and fixed by the pin and the substrate, gap between the IC chip and the substrate is equipped with adhesive, and the adhesive is adhesively fixed with the IC chip and substrate connect respectively.Due to being provided with adhesive between substrate and IC chip, the fixation between IC chip and substrate is further realized by adhesive, it can be directly delivered in this way to avoid vibration on the pin of IC chip welding, therefore, the utility model reduces the risk that the pin that IC chip is welded and fixed generates desoldering or falls off, and improves the reliability that printed circuit board uses.
Description
Technical field
The utility model relates to circuit board manufacturing area more particularly to a kind of printed circuit boards and electronic equipment.
Background technique
It is well known that the manufacture of existing multilayer circuit board is usually to pass through prepreg to glue plate core core or layers of copper
It is combined, and forms one layer of reliable insulator.In the prior art, it is generally the case that multilayer circuit is by conductive layer, semi-solid preparation
Piece and plate core, which are laminated, to be formed, wherein the two sides of plate core are respectively arranged with layers of copper, for two cloth as multilayer printed circuit
Line layer uses, and conductive layer is used also as wiring layer use.The thickness of multilayer circuit board is all according to as defined in standard, and tradition is more
Layer circuit board is to be determined to determine using the quantity of plate core according to the wiring number of plies.For example, setting N layer circuit board, the quantity of plate core
For (N-2)/2.Since the hardness of multilayer circuit board is mainly reflected in plate core, and the installation needs of part multilayer circuit board are curved
Folding, when plate core negligible amounts, the hardness of multilayer circuit board is inadequate, is easy to produce phenomena such as fractureing.
Utility model content
The utility model embodiment provides a kind of printed circuit board and electronic equipment, with solve the hardness of multilayer circuit board compared with
Weak problem.
The utility model embodiment provides a kind of printed circuit board, including is laminated by conductive layer, prepreg and plate core
The multilayer circuit board of formation, wherein the plate core includes the first plate core, the two opposite tables of first plate core in a thickness direction
Face does not cover layers of copper.
Optionally, the printed circuit board is N layer circuit board, and the conductive layer is N layers, and the N is positive even numbers.
Optionally, the plate core further includes the second plate core, second plate core two covering to surface in a thickness direction
It is stamped layers of copper.
Optionally, the printed circuit board is P layer circuit board, and the conductive layer is M layers, and the layers of copper of second plate core has
L layers, wherein the P is the even number greater than 2, and the M is the even number greater than 2, and the summation of L and M is equal to P.
Optionally, the conductive layer, prepreg and plate core are symmetrical junction on the thickness direction of the printed circuit board
Structure.
Optionally, the conductive layer is made of copper.
Optionally, the outermost layer of the printed circuit board is the conductive layer.
Optionally, the printed circuit board is except the outermost middle layer is by prepreg and the plate core successively row of interval
Column, the conductive layer are adjacent with the prepreg.
The utility model embodiment additionally provides a kind of electronic equipment, which includes printed circuit board, the printing
Circuit board includes being laminated the multilayer circuit board formed by conductive layer, prepreg and plate core, wherein the plate core includes the first plate
Core, two apparent surfaces of first plate core in a thickness direction do not cover layers of copper.
The utility model embodiment includes being laminated to be formed by conductive layer, prepreg and plate core by setting printed circuit board
Multilayer circuit board, wherein the plate core include the first plate core, two apparent surfaces of first plate core in a thickness direction are not
Cover layers of copper.Do not cover the first plate core of layers of copper due to being arranged on multilayer circuit board, compared to the prior art in the identical number of plies
Printed circuit board, the utility model improves the hardness of printed circuit board.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the utility model embodiment, the utility model embodiment will be retouched below
Attached drawing needed in stating is briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model
Some embodiments for those of ordinary skill in the art without any creative labor, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of the utility model printed circuit board；
Fig. 2 is one of the structural schematic diagram of IC chip in the utility model printed circuit board；
Fig. 3 is the second structural representation of IC chip in the utility model printed circuit board.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It clearly and completely describes, it is clear that the embodiments are a part of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without creative efforts
The every other embodiment taken, fall within the protection scope of the utility model.
Unless otherwise defined, technical term or scientific term used in the utility model should be the utility model institute
The ordinary meaning that personage in category field with general technical ability is understood." first ", " second " used in the utility model with
And similar word is not offered as any sequence, quantity or importance, and be used only to distinguish different component parts.Together
Sample, the similar word such as "one" or " one " does not indicate that quantity limits yet, but indicates that there are at least one." connection " or
The similar word such as " connected " is not limited to physics or mechanical connection, but may include electrical connection, regardless of
It is direct or indirect."upper", "lower", "left", "right" etc. are only used for indicating relative positional relationship, when being described object
After absolute position changes, then the relative positional relationship also correspondingly changes.
Referring to Fig.1, the structural schematic diagram of the utility model printed circuit board is provided.As shown in Figure 1, the printed circuit board
Including being laminated the multilayer circuit board that is formed by conductive layer 101, prepreg 102 and plate core 103, wherein the plate core 103 includes
First plate core 1031, two apparent surfaces of first plate core 1031 in a thickness direction do not cover layers of copper.
In the utility model embodiment, above-mentioned conductive layer 101 can be made of metal material, it is generally the case that conductive layer
101 can be made of copper.For example, copper facing operation can be carried out on prepreg 102, thus the one of prepreg 102
Surface covers copper, to form conductive layer；Copper foil can also be set on prepreg 102, to form conductive layer.
Specifically, forming the sheet dielectric material that Prepreg is PCB after prepreg lamination.Prepreg is before being laminated
For prepreg, also known as preimpregnation material, it is mainly used for the jointing material and insulation material of the inner layer conductive figure of multilayer board
Material.After Prepreg is laminated, the epoxy resin of semi-solid preparation, which is extruded, to come, and starts to flow and solidify, multilayer circuit board is glued
It is combined, and forms one layer of reliable insulator.
Core is then the basic material for making printed circuit board.Core is also referred to as plate core, has certain hardness and thickness
Degree, and two-sided copper-clad.Multilayer circuit board be Core and Prepreg pressing made of, and outermost layer setting copper foil formed lead
Electric layer 101.The layers of copper of two apparent surfaces of Core forms the first plate core 1031 in the utility model embodiment after all removing.
Wherein, the mode for removing the layers of copper of two apparent surfaces of Core can be configured according to actual needs.For example, in the present embodiment
In, above-mentioned Core can remove layers of copper by way of corrosion, and the thickness for removing layers of copper can be supplemented by prepreg.
It should be noted that may include second plate core with two-sided copper-clad in above-mentioned printed circuit board, it can also not
Including double second plate cores, this is described in detail below.
For example, in one embodiment, which does not include the second plate core.Printed circuit board is N layer circuit board, institute
Stating conductive layer is N layers, and the N is positive even numbers.
As shown in Figure 1, printed circuit board is dual platen, the N=2.Specifically, the printed circuit board includes the first plate core
1031, the two sides of the first plate core 1031 in a thickness direction are respectively arranged with prepreg 102, and prepreg 102 is far from first
The side of plate core 1031 is equipped with conductive layer 101.I.e. in the present embodiment, printed circuit board shown in Fig. 1 is structurally, can recognize
To be four-layer circuit board, it is substantially double-layer circuit board.So compared with the existing technology in double-layer circuit board, electricity can be increased
The hardness of road plate.
It should be understood that in the present embodiment, semi-solid preparation can be arranged again far from the side of prepreg 102 in conductive layer 101
Piece 102 and conductive layer 101, to form multilayer circuit board, the design quantity of specific plate layer is not further herein to be limited.
In another embodiment, which includes the second plate core.As shown in Fig. 2, in the present embodiment, above-mentioned plate
Core 103 further includes the second plate core 1032, second plate core 1032 in a thickness direction two be covered with layers of copper to surface.
Specifically, above-mentioned printed circuit board is P layer circuit board, the conductive layer is M layers, the copper of second plate core 102
Layer has L layers, wherein the P is the even number greater than 2, and the M is the even number greater than 2, and the summation of L and M is equal to P.
The size of above-mentioned M can be configured according to actual needs, in the present embodiment, it is preferred that M be equal to 2, that is,
It says, the outermost layer of above-mentioned printed circuit board is conductive layer 101.It should be noted that printed circuit board except it is described it is outermost in
The distribution form of interbed can be configured according to actual needs, in the present embodiment, in order to simplify the production of multilayer circuit board
Technique, it is preferred that above-mentioned middle layer is sequentially arranged at intervals by prepreg 102 and plate core 103, and the conductive layer 101 and institute
It is adjacent to state prepreg 102.
Further, in order to improve the stability of printed circuit board, it is preferred that the conductive layer 101, prepreg 102
It is symmetrical structure on the thickness direction of the printed circuit board with plate core 103.
As shown in Fig. 2, when using one layer of first plate core 1031, the plate layer design of printed circuit board in a thickness direction according to
It is secondary for conductive layer 101, prepreg 102, the second plate core 1032, prepreg 102, the first plate core 1031, prepreg 102,
Second plate core 1032, prepreg 102 and conductive layer 101.In structure shown in Fig. 2, eight layers of circuit are designed as from structure
Plate, substantially 6-layer circuit board.Using conductive layer 101, prepreg 102, the second plate core 1032, half in compared with the existing technology
6-layer circuit board made of cured sheets 102, the second plate core 1032, prepreg 102 and conductive layer 101, the utility model can be with
Improve the hardness of printed circuit board.
As shown in figure 3, when using two layers of first plate cores 1031, the plate layer design of printed circuit board in a thickness direction according to
It is secondary for conductive layer 101, prepreg 102, the second plate core 1032, prepreg 102, the first plate core 1031, prepreg 102,
First plate core 1031, prepreg 102, the second plate core 1032, prepreg 102 and conductive layer 101.Structure shown in Fig. 3
In, ten layer circuit boards, substantially 6-layer circuit board are designed as from structure.Using conductive layer 101, half in compared with the existing technology
Made of cured sheets 102, the second plate core 1032, prepreg 102, the second plate core 1032, prepreg 102 and conductive layer 101
The hardness of printed circuit board can be improved in 6-layer circuit board, the utility model.
In this way, the utility model embodiment includes by conductive layer 101,102 and of prepreg by setting printed circuit board
The multilayer circuit board that the lamination of plate core 103 is formed, wherein the plate core 103 includes the first plate core 1031, first plate core 1031
Two apparent surfaces in a thickness direction do not cover layers of copper.Do not cover the first plate core of layers of copper due to being arranged on multilayer circuit board
1031, compared to the prior art in the identical number of plies printed circuit board, the utility model improves the hardness of printed circuit board.
Further, the utility model embodiment additionally provides a kind of electronic equipment, which includes above-mentioned implementation
Printed circuit board in example, the structure of the printed circuit board are referred to above-described embodiment, and details are not described herein, due to this implementation
Example provide electronic equipment use above-described embodiment printed circuit board, therefore the electronic equipment in the present embodiment have with it is upper
State the identical beneficial effect of printed circuit board in embodiment.
More than, only specific embodiment of the present utility model, but protection scope of the utility model is not limited thereto,
Anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation or replace
It changes, should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with claim
Subject to protection scope.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820666492.1U CN208273346U (en) | 2018-05-04 | 2018-05-04 | A kind of printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820666492.1U CN208273346U (en) | 2018-05-04 | 2018-05-04 | A kind of printed circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208273346U true CN208273346U (en) | 2018-12-21 |
Family
ID=64682182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820666492.1U Active CN208273346U (en) | 2018-05-04 | 2018-05-04 | A kind of printed circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208273346U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495451A (en) * | 2018-05-04 | 2018-09-04 | 深圳佰维存储科技股份有限公司 | Printed circuit board and electronic equipment |
-
2018
- 2018-05-04 CN CN201820666492.1U patent/CN208273346U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495451A (en) * | 2018-05-04 | 2018-09-04 | 深圳佰维存储科技股份有限公司 | Printed circuit board and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104582325B (en) | Rigid-flex combined board and preparation method thereof, circuit board module | |
| TWI466606B (en) | Printed circuit board having buried component and method for manufacturing same | |
| JP6226167B2 (en) | Multilayer wiring board | |
| TW201410097A (en) | Multilayer flexible printed circuit board and method for manufacturing same | |
| CN106304607B (en) | Rigid-flex board and manufacturing method thereof | |
| CN103857209A (en) | Multi-layer circuit board and manufacture method for the same | |
| CN103635005A (en) | Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing methods | |
| CN104254213A (en) | Multi-layer circuit board and manufacturing method thereof | |
| CN103889165B (en) | Circuit board with embedded element and preparation method thereof | |
| US20080308315A1 (en) | Multilayer printed circuit board and method of fabricating the same | |
| CN208273346U (en) | A kind of printed circuit board and electronic equipment | |
| CN103052281A (en) | Embedded multilayer circuit board and manufacturing method thereof | |
| JP2006269979A (en) | Flex-rigid printed wiring board and method for manufacturing flex-rigid printed wiring board | |
| CN105307387B (en) | A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof | |
| JP2011249549A (en) | Flexible printed wiring board, connection structure thereof, method of manufacturing them, and electronic equipment | |
| KR101368043B1 (en) | Structure of double-sided flexible printed circuit board | |
| CN101990791B (en) | Printed circuit board and manufacturing method thereof | |
| CN101111131A (en) | A kind of manufacturing method of multi-layer flexible circuit board | |
| CN203788548U (en) | flexible circuit board | |
| CN116390362A (en) | A double-layer flexible circuit board and its manufacturing method | |
| CN115696775A (en) | Circuit board and method for manufacturing the same | |
| CN220123122U (en) | Printed circuit board connection structure | |
| CN211297117U (en) | Multilayer circuit board structure | |
| TWI462678B (en) | Method of manufacturing printed circuit board | |
| CN2922382Y (en) | Surface installation printed-circuit board circuit module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 518000 floors 1-3 and 4 of buildings 4 and 8, zone 2, Zhongguan honghualing Industrial South Zone, No. 1213 Liuxian Avenue, Pingshan community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong Patentee after: BIWIN STORAGE TECHNOLOGY Co.,Ltd. Address before: 518000 1st, 2nd, 4th and 5th floors of No.4 factory building, tongfuyu industrial town, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: BIWIN STORAGE TECHNOLOGY Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |