CN104427755A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
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- CN104427755A CN104427755A CN201310371567.5A CN201310371567A CN104427755A CN 104427755 A CN104427755 A CN 104427755A CN 201310371567 A CN201310371567 A CN 201310371567A CN 104427755 A CN104427755 A CN 104427755A
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- Prior art keywords
- circuit board
- circuit pattern
- flexible circuit
- glue
- dielectric layer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0495—Cold welding
Abstract
A flexible circuit board includes a covering film, a conductive circuit pattern and a first dielectric layer which are adhered in sequence, wherein the covering film has at least one opening that penetrates through the covering film, part of the conductive circuit pattern is exposed from the opening, the conductive circuit pattern exposed from the opening forms a bonding pad, a low temperature solder paste layer is formed on the bonding pad, an electronic component is welded to the low temperature solder paste layer and is electrically connected with the bonding pad through the low temperature solder paste layer, and the material of the first dielectric layer is polyethylene naphthalate. The invention also relates to a manufacturing method of the flexible circuit board.
Description
Technical field
The present invention relates to flexible circuit board and make field, particularly relate to a kind of flexible circuit board and preparation method thereof.
Background technology
Because electronic product is to individualized development, the requirement for the printing flexible circuit board being applied to electronic product is also more and more diversified.Have a kind of flexible circuit board at present, it is high light transmissive material for carrying and protect the insulated substrate, protective film etc. of conductive circuit pattern, thus the conductive circuit pattern of inside becomes visible for high light transmissive material due to insulating material.Usually; the insulated substrate of the high printing opacity that described flexible circuit board adopts and protective film material are polyethylene terephthalate (PET); the thermal endurance of PET material is poor; thus limit the range of application of the flexible circuit board using described PET material; as, can not soldering part etc. on the flexible circuit board using described PET material.
Summary of the invention
Therefore, be necessary the making and the method thereof that provide the good flexible circuit board of a kind of thermal endurance, making can soldering part on institute's flexible circuit board.
A manufacture method for flexible circuit board, comprises step: provide copper-clad base plate, and described copper-clad base plate comprises the first copper foil layer and the first dielectric layer, and wherein, the material of described first dielectric layer is PEN; Described first copper foil layer is made formation first conductive circuit pattern; Coverlay is formed in the side of described first conductive circuit pattern, described coverlay has the opening of at least one through described coverlay, described first conductive circuit pattern of part comes out from described opening, and described first conductive circuit pattern come out from described opening forms weld pad; And low temperature tin paste layer is formed on described weld pad, and an electronic component is welded in described low temperature tin paste layer, described electronic component is electrically connected with described weld pad by described low temperature tin paste layer, thus obtains flexible circuit board.
A kind of flexible circuit board, it comprises the coverlay be affixed successively, conductive circuit pattern and the first dielectric layer, described coverlay has the opening of at least one through described coverlay, the described conductive circuit pattern of part comes out from described opening, the described conductive circuit pattern come out from described opening forms weld pad, described weld pad is formed with low temperature tin paste layer, one electronic component is welded in described low temperature tin paste layer, described electronic component is electrically connected with described weld pad by described low temperature tin paste layer, the material of described first dielectric layer is PEN.
Compared with prior art, the PEN (PEN) that the flexible circuit board that the technical program provides and manufacture method adopt is as dielectric layer and adopt low temperature tin paste layer welding electronic part, because the heat resistance of PEN is better than the heat resistance of PET, and the fusing point of low temperature tin cream is lower, thus make on described flexible circuit board can soldering part, and can make described flexible circuit board and module bonding, thus expand the scope of application of flexible circuit board.
Accompanying drawing explanation
Fig. 1 is the generalized section of the copper-clad base plate that the technical program first embodiment provides.
Fig. 2 is that the copper-clad base plate of Fig. 1 makes the generalized section after forming circuit substrate.
Fig. 3 be form coverlay on the circuit substrate of Fig. 2 after generalized section.
Fig. 4 is the generalized section of the flexible circuit board that the circuit substrate after the formation coverlay of Fig. 3 is formed after print solder paste and welding electronic part.
Fig. 5 is the generalized section of the copper-clad base plate that the technical program second embodiment provides.
Fig. 6 be Fig. 5 copper-clad base plate on form the generalized section after conductive through hole.
Fig. 7 is that the copper-clad base plate after the formation conductive through hole of Fig. 6 makes the generalized section after forming circuit substrate.
Fig. 8 be form coverlay on the circuit substrate of Fig. 7 after generalized section.
Fig. 9 is the generalized section of the flexible circuit board formed after the circuit substrate after the formation coverlay of Fig. 8 prints low temperature tin cream and welding electronic part.
Main element symbol description
| Copper-clad base plate | 110,910 |
| Copper foil layer | 111 |
| First glue-line | 112,912 |
| First dielectric layer | 113,913 |
| Conductive circuit pattern | 120 |
| Circuit substrate | 101,901 |
| Coverlay | 130 |
| Second glue-line | 131,914 |
| Second dielectric layer | 132,932 |
| Opening | 133,933 |
| Weld pad | 121,921 |
| Low temperature tin paste layer | 140,950 |
| Electronic component | 150,960 |
| Flexible circuit board | 100,900 |
| First copper foil layer | 911 |
| Second copper foil layer | 915 |
| Conductive through hole | 916 |
| First surface copper | 917 |
| Second copper | 918 |
| First conductive circuit pattern | 920 |
| Second conductive circuit pattern | 922 |
| First coverlay | 930 |
| Second coverlay | 940 |
| 3rd glue-line | 931 |
| 4th glue-line | 941 |
| 3rd dielectric layer | 942 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
With specific embodiment, flexible circuit board provided by the invention and preparation method thereof is further detailed below.
The flexible circuit board manufacturing method that the technical program first embodiment provides comprises the steps:
The first step, refers to Fig. 1, provides copper-clad base plate 110.
In the present embodiment, copper-clad base plate 110 is one side copper-clad base plate, and it comprises copper foil layer 111, first glue-line 112 and the first dielectric layer 113 that are affixed successively.
Described copper foil layer 111 can be electrolytic copper foil, also can be rolled copper foil.The material of described first glue-line 112 is the Epocryl (Epoxy-Acrylate) or epoxy resin (Epoxy) etc. of high printing opacity.The material of described first dielectric layer 113 is the PEN (PEN) of high printing opacity.PEN material has higher heat resistance, physical and mechanical properties, gas barrier property, chemical stability etc. than PET material.
Certainly, described copper-clad base plate 110 also can not comprise described first glue-line 112.
Second step, refers to Fig. 2, is made by described copper foil layer 111 and forms conductive circuit pattern 120, thus obtain circuit substrate 101.
In this step, adopt image transfer technique and etch process, part copper layers of foil 111 is etched removal, thus obtains conductive circuit pattern 120.
3rd step, refers to Fig. 3, provides coverlay 130, described coverlay 130 is pressed on the side of the conductive circuit pattern 120 of described circuit substrate 101.
Described coverlay 130 comprises the second glue-line 131 and the second dielectric layer 132 fitted.The material of described second glue-line 131 is the Epocryl or epoxy resin etc. of high printing opacity.The material of described second dielectric layer 132 is the PEN of high printing opacity.During pressing, described second glue-line 131 is directly affixed with described conductive circuit pattern 120.Described coverlay 130 is formed with an opening 133, through described second glue-line 131 and the second dielectric layer 132 of described opening 133, the described conductive circuit pattern of part 120 comes out from described opening 133, and the described conductive circuit pattern 120 come out from described opening 133 forms a weld pad 121.
Certainly, the quantity of described opening 133 also can be multiple, thus forms multiple weld pad 121, and described coverlay 130 also only can comprise the second dielectric layer 132, is formed at the side of conductive circuit pattern by modes such as coatings.
4th step, refers to Fig. 4, described weld pad 121 forms low temperature tin paste layer 140 by the mode of printing, and is welded on described low temperature tin paste layer 140 by an electronic component 150, thus forms flexible circuit board 100.
Described electronic component 150 is electrically connected with described weld pad 121 by described low temperature tin paste layer 140.Certainly, also low temperature tin paste layer 140 can be formed by other means on described weld pad 121.
The fusing point of conventional lead-free tin cream is generally at 216 degrees Celsius to 220 degrees Celsius, and the heat resisting temperature of PEN material is generally at 175 degrees centigrade, that is, the conventional fusing point high without slicker solder is beyond the heat resisting temperature of PEN material; And the fusing point of low temperature tin cream is generally at 138 degrees centigrade, this temperature is in the heat resisting temperature scope of PEN material; Therefore, select low temperature tin cream to print in this case, thus form low temperature tin paste layer 140 on described weld pad 121.In the present embodiment, the composition of described low temperature tin cream comprises sn-bi alloy and solder flux etc., and wherein, preferably, sn-bi alloy is Sn42Bi58, and in described low temperature tin cream, the content of solder flux is 10.5% ± 0.5%.
Described flexible circuit board 100 comprises the second dielectric layer 132, second glue-line 131, conductive circuit pattern 120, first glue-line 112 and the first dielectric layer 113 that are affixed successively.Described flexible circuit board 100 is formed with an opening 133, through described second glue-line 131 and the second dielectric layer 132 of described opening 133, the described conductive circuit pattern of part 120 comes out from described opening 133, and the described conductive circuit pattern 120 come out from described opening 133 forms a weld pad 121.Described weld pad 121 is formed with low temperature tin paste layer 140, described low temperature tin paste layer 140 is welded with electronic component 150, described electronic component 150 is electrically connected with described weld pad 121 by described low temperature tin paste layer 140.Wherein, the material of each described glue-line is the Epocryl or epoxy resin etc. of high printing opacity.The material of each described dielectric layer is the PEN of high printing opacity.
In addition, in the manufacture method of above-mentioned flexible circuit board 100, the step of laminating module can also be comprised, be specially after pressing coverlay or after welding electronic part, one module and one the 3rd glue-line are provided, described module is bondd by described 3rd glue-line and described first dielectric layer 113, thus, the described flexible circuit board 100 formed also comprises a module, and described module is bonding by the first dielectric layer 113 of one the 3rd glue-line and described flexible circuit board 100.Described module can be the panel etc. of high printing opacity.
The flexible circuit board 100 that the technical program makes, conductive circuit pattern 120 wherein can be observed more clearly through the second dielectric layer 132 of the high printing opacity of flexible circuit board 100 and the second glue-line 131.In addition, in order to the transparent feel making the conductive circuit pattern 120 of formation is stronger, blackening layer can also be formed respectively at the first surface be affixed with described first glue-line 112 of the described copper foil layer 111 of described copper-clad base plate 110 and the second surface relative with described first surface.
The flexible circuit board manufacturing method that the technical program second embodiment provides comprises the steps:
The first step, refers to Fig. 5, provides copper-clad base plate 910.
In the present embodiment, copper-clad base plate 910 is double-sided copper-clad substrate, and it comprises the first copper foil layer 911, first glue-line 912, first dielectric layer 913, second glue-line 914 and the second copper foil layer 915 stacking gradually setting.
First and second copper foil layer 911,915 described can be electrolytic copper foil, also can be rolled copper foil.The material of first and second glue-line 912,914 described is the Epocryl or epoxy resin etc. of high printing opacity.The material of described first dielectric layer 913 is the PEN of high printing opacity.PEN material has higher heat resistance, physical and mechanical properties, gas barrier property, chemical stability etc. than PET material.
Certainly, described copper-clad base plate 910 also can not comprise first and second glue-line 912,914 described, and namely described copper-clad base plate 910 comprises the first copper foil layer, the first dielectric layer and the second copper foil layer that are affixed successively.
Second step, refers to Fig. 6, and described copper-clad base plate 910 is formed at least one conductive through hole 916.
The through described copper-clad base plate 910 of described conductive through hole 916 is also electrically connected described first copper foil layer 911 and the second copper foil layer 915.
In the present embodiment, the generation type of described conductive through hole 916 is: first, forms at least one through hole by machine drilling on described copper-clad base plate 910; Electroplate afterwards thus form conductive copper layer at described through hole hole wall, first surface copper 917 is formed on described first copper foil layer 911 surface, and form second copper 918 on described second copper foil layer 915 surface, and make described conductive copper layer be electrically connected described first copper foil layer 911 and the second copper foil layer 915, thus form described conductive through hole 916.Certainly, also described through hole can be formed by the mode of laser pit.
3rd step, refer to Fig. 7, described first copper foil layer 911 and described first surface copper 917 are made formation first conductive circuit pattern 920, and described second copper foil layer 915 and described second copper 918 are made formation second conductive circuit pattern 922, thus obtain circuit substrate 901.
In this step, image transfer technique and etch process is adopted to obtain first and second conductive circuit pattern 920,922 described.Described conductive through hole 916 is electrically connected described first conductive circuit pattern 920 and described second conductive circuit pattern 922.
4th step, refer to Fig. 8, first coverlay 930 and the second coverlay 940 is provided, described first coverlay 930 is pressed on the side of the first conductive circuit pattern 920 of described circuit substrate 901, described second coverlay 940 is pressed on the side of the second conductive circuit pattern 922 of described circuit substrate 901.
Described first coverlay 930 comprises the 3rd glue-line 931 and the second dielectric layer 932.Described second coverlay 940 comprises the 4th glue-line 941 and the 3rd dielectric layer 942.The material of the described 3rd and the 4th glue-line 931,941 is the Epocryl or epoxy resin etc. of high printing opacity.The material of second and third dielectric layer 932,942 described is the PEN of high printing opacity.Described first coverlay 930 is formed with an opening 933, through described 3rd glue-line 931 and the second dielectric layer 932 of described opening 933, described first conductive circuit pattern 920 of part comes out from described opening 933, and described first conductive circuit pattern 920 come out from described opening 933 forms a weld pad 921.
Certainly, the quantity of described opening 133 also can be multiple, thus forms multiple weld pad 121.In addition, described second coverlay 940 also can be formed with opening, thus exposes described second conductive circuit pattern 922 of part.First and second coverlay 930,940 described also can only comprise dielectric layer 132, is formed at the side of conductive circuit pattern by modes such as coatings.
5th step, refers to Fig. 9, described weld pad 921 forms low temperature tin paste layer 950 by the mode of printing, and is welded on described low temperature tin paste layer 950 by an electronic component 960, thus forms flexible circuit board 900.
Described electronic component 960 is electrically connected with described weld pad 921 by described low temperature tin paste layer 950.Certainly, also low temperature tin paste layer 140 can be formed by other means on described weld pad 921.
The fusing point of conventional lead-free tin cream is generally at 216 degrees Celsius to 220 degrees Celsius, and the heat resisting temperature of PEN material is generally at 175 degrees centigrade, that is, the conventional fusing point high without slicker solder is beyond the heat resisting temperature of PEN material; And the fusing point of low temperature tin cream is generally at 138 degrees centigrade, this temperature is in the heat resisting temperature scope of PEN material; Therefore, select low temperature tin cream to print in this case, thus form low temperature tin paste layer 950 on described weld pad 921.In the present embodiment, comprise the composition such as sn-bi alloy and solder flux in described low temperature tin cream, wherein, preferably, sn-bi alloy is Sn42Bi58, and in described low temperature tin cream, the content of solder flux is 10.5% ± 0.5%.。
Described flexible circuit board 900 comprises the second dielectric layer 932, the 3rd glue-line 931, first conductive circuit pattern 920, first glue-line 912, first dielectric layer 913, second glue-line 914, second conductive circuit pattern 922, the 4th glue-line 941 and the 3rd dielectric layer 942 that are affixed successively.Described flexible circuit board 900 comprises the conductive through hole 916 of at least one through described first conductive circuit pattern 920, first glue-line 912, first dielectric layer 913, second glue-line 914 and the second conductive circuit pattern 922, and described conductive through hole 916 is electrically connected described first conductive circuit pattern 920 and described second conductive circuit pattern 922.Described flexible circuit board 900 is formed with an opening 933, through described 3rd glue-line 931 and the second dielectric layer 932 of described opening 933, described first conductive circuit pattern 920 of part comes out from described opening 933, and described first conductive circuit pattern 920 come out from described opening 933 forms a weld pad 921.Described weld pad 921 is formed with low temperature tin paste layer 950, described low temperature tin paste layer 950 is welded with electronic component 960, described electronic component 960 is electrically connected with described weld pad 921 by described low temperature tin paste layer 950.Wherein, the material of each described glue-line is the Epocryl or epoxy resin etc. of high printing opacity.The material of each described dielectric layer is the PEN of high printing opacity.
In addition, described flexible circuit board 900 also can be formed with one first module and one second module, described first module is bonding by the second dielectric layer 932 of one the 5th glue-line and described flexible circuit board 900, and described second module is bonding by the 3rd dielectric layer 942 of one the 6th glue-line and described flexible circuit board 900.Described first module and the second module can be the panel etc. of high printing opacity.
The flexible circuit board 900 that the technical program makes, the first conductive circuit pattern 920 wherein can be observed more clearly through the second dielectric layer 932 of the high printing opacity of flexible circuit board 900 and the 3rd glue-line 931, and the second conductive circuit pattern 922 wherein can be observed more clearly through the 3rd dielectric layer 942 of the high printing opacity of flexible circuit board 900 and the 4th glue-line 941.In addition, in order to the transparent feel of the conductive circuit pattern making formation is stronger, blackening layer can also be formed respectively at the first surface be affixed with described first glue-line 912 of described first copper foil layer 911 of described copper-clad base plate 910 and the second surface relative with described first surface, and form blackening layer at described second copper foil layer 915 respectively with the 3rd surface that described second glue-line 914 is affixed and the 4th surface relative with described 3rd surface.
Compared to prior art, the flexible circuit board that the technical program provides and the PEN that manufacture method adopts are as dielectric layer, and adopt low temperature tin paste layer welding electronic part, because the heat resistance of PEN is better than the heat resistance of PET, and the fusing point of low temperature tin cream is lower, thus make on described flexible circuit board 100,900 can soldering part, and can make described flexible circuit board 100,900 and module bonding, thus expand the scope of application of flexible circuit board.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a manufacture method for flexible circuit board, comprises step:
There is provided copper-clad base plate, described copper-clad base plate comprises the first copper foil layer and the first dielectric layer, and wherein, the material of described first dielectric layer is PEN;
Described first copper foil layer is made formation first conductive circuit pattern;
Coverlay is formed in the side of described first conductive circuit pattern, described coverlay has the opening of at least one through described coverlay, described first conductive circuit pattern of part comes out from described opening, and described first conductive circuit pattern come out from described opening forms weld pad; And
Described weld pad is formed low temperature tin paste layer, and an electronic component is welded in described low temperature tin paste layer, described electronic component is electrically connected with described weld pad by described low temperature tin paste layer, thus obtains flexible circuit board.
2. the manufacture method of flexible circuit board as claimed in claim 1, it is characterized in that, described coverlay comprises the second glue-line and the second dielectric layer that fit, the material of described second glue-line is Epocryl or epoxy resin, the material PEN of described second dielectric layer, described coverlay is formed at described first conductive circuit pattern surface by pressing, during pressing, described second glue-line and described first conductive circuit pattern is directly affixed.
3. the manufacture method of flexible circuit board as claimed in claim 1, it is characterized in that, the composition of described low temperature tin cream comprises sn-bi alloy and solder flux.
4. the manufacture method of flexible circuit board as claimed in claim 3, it is characterized in that, described sn-bi alloy is Sn42Bi58.
5. the manufacture method of flexible circuit board as claimed in claim 1, it is characterized in that, described copper-clad base plate also comprises the second copper foil layer away from described first copper foil layer side being positioned at described first dielectric layer, the manufacture method of described flexible circuit board is also included in the step of the conductive through hole described copper-clad base plate being formed described first copper foil layer of electrical connection and the second copper foil layer, further, described first copper foil layer is made formation first conductive circuit pattern and also described second copper foil layer is made formation second conductive circuit pattern simultaneously.
6. the manufacture method of flexible circuit board as claimed in claim 1, it is characterized in that, also comprise one first glue-line between described first copper foil layer and described first dielectric layer, the material of described first glue-line is Epocryl or epoxy resin.
7. a flexible circuit board, it comprises the coverlay be affixed successively, conductive circuit pattern and the first dielectric layer, described coverlay has the opening of at least one through described coverlay, the described conductive circuit pattern of part comes out from described opening, the described conductive circuit pattern come out from described opening forms weld pad, described weld pad is formed with low temperature tin paste layer, one electronic component is welded in described low temperature tin paste layer, described electronic component is electrically connected with described weld pad by described low temperature tin paste layer, the material of described first dielectric layer is PEN.
8. flexible circuit board as claimed in claim 7, it is characterized in that, described coverlay comprises the second glue-line and the second dielectric layer that fit, the material of described second glue-line is Epocryl or epoxy resin, the material of described second dielectric layer is PEN, and described second glue-line and described conductive circuit pattern are directly affixed.
9. flexible circuit board as claimed in claim 7, it is characterized in that, the composition of described low temperature tin cream comprises sn-bi alloy.
10. flexible circuit board as claimed in claim 7, it is characterized in that, also comprise the first glue-line between described conductive circuit pattern and described first dielectric layer, the material of described first glue-line is Epocryl or epoxy resin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310371567.5A CN104427755A (en) | 2013-08-23 | 2013-08-23 | Flexible circuit board and manufacturing method thereof |
| TW102131934A TW201509257A (en) | 2013-08-23 | 2013-09-05 | Flexible printed circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310371567.5A CN104427755A (en) | 2013-08-23 | 2013-08-23 | Flexible circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104427755A true CN104427755A (en) | 2015-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310371567.5A Pending CN104427755A (en) | 2013-08-23 | 2013-08-23 | Flexible circuit board and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104427755A (en) |
| TW (1) | TW201509257A (en) |
Cited By (5)
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| CN107831610A (en) * | 2017-10-26 | 2018-03-23 | 惠科股份有限公司 | Signal transmitting apparatus and display device |
| CN110416248A (en) * | 2019-08-06 | 2019-11-05 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display device |
| CN110636702A (en) * | 2018-06-21 | 2019-12-31 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN113573497A (en) * | 2020-04-29 | 2021-10-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
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| TWI725748B (en) * | 2020-02-21 | 2021-04-21 | 達方電子股份有限公司 | Flexible circuit board connection tail and membrane circuit board |
| TWI725750B (en) * | 2020-02-21 | 2021-04-21 | 達方電子股份有限公司 | Membrane circuit board |
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