CN103379750B - Multilayer circuit board and preparation method thereof - Google Patents
Multilayer circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN103379750B CN103379750B CN201210127848.1A CN201210127848A CN103379750B CN 103379750 B CN103379750 B CN 103379750B CN 201210127848 A CN201210127848 A CN 201210127848A CN 103379750 B CN103379750 B CN 103379750B
- Authority
- CN
- China
- Prior art keywords
- conductive
- circuit
- layer
- hole
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The manufacture method of a kind of multilayer circuit board, including step: provide multiple copper clad laminate; The copper foil layer of each copper clad laminate is made and forms conductive circuit layer, obtain multiple first circuit substrate; Two surface laminating film in part the first circuit substrate wherein; Through hole is formed in described film; Forming conductive material in described through hole, described conductive material and conductive circuit layer conduct mutually, obtain second circuit substrate; Stacking and pressing second circuit substrate and the first circuit substrate so that each second circuit substrate is between two adjacent the first circuit substrates, and only has a second circuit substrate between adjacent two the first circuit substrates, thus obtaining multilayer circuit board. The present invention also provides for a kind of multilayer circuit board adopting described method to prepare.
Description
Technical field
The present invention relates to circuit board making field, particularly relate to a kind of multilayer circuit board and preparation method thereof.
Background technology
Printed circuit board (PCB) is widely used because having packaging density advantages of higher. Application about circuit board refers to document Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, HighdensitymultilayerprintedcircuitboardforHITACM-880, IEEETrans.onComponents, Packaging, andManufacturingTechnology, 1992,15 (4): 1418-1425.
In the manufacturing process of multilayer circuit board, generally first partly start from from the internal layer base of circuit board, at both sides lamination glue-line and the conductive layer of internal substrate, thus obtaining multilayer circuit board. But, the multilayer circuit board made in such a manner, it is necessary to progressively make to outer layer from internal layer, Making programme is very long. And, often once increasing layer, the bad of making all can occur, thus, when whole circuit board making completes, it is higher that circuit for generating plate makes bad probability, and the yield causing circuit board making is relatively low.
Summary of the invention
Therefore, it is necessary to provide a kind of multilayer circuit board and preparation method thereof, so that the efficiency of circuit board making can be improved and improves the yield of circuit board making.
The manufacture method of a kind of multilayer circuit board, including step: providing 2N+1 copper clad laminate, each described copper clad laminate to include the first copper foil layer, the first insulating barrier and the second copper foil layer stacked gradually, wherein N is the natural number be more than or equal to 1, first copper foil layer of each copper clad laminate is made and forms the first conductive circuit layer, the second copper foil layer is made and forms the second conductive circuit layer, thus 2N+1 copper clad laminate being made 2N+1 the first circuit substrate, 2N+1 the first circuit substrate selects N number of first circuit substrate, fit the first film in the first conductive circuit layer surface in this N number of first circuit substrate, described first film has the first through hole, fit on the second conductive circuit layer surface of this N number of first circuit substrate the second film, described second film has the second through hole, and fill the first conductive material in described first through hole, the second conductive material is filled in described second through hole, described first conductive material and the first conductive circuit layer conduct mutually, described second conductive material and the second conductive circuit layer conduct mutually, thus this N number of first circuit substrate is made N number of second circuit substrate, and stacking described N number of second circuit substrate and N+1 the first circuit substrate, make each second circuit substrate between two adjacent the first circuit substrates, and only have a second circuit substrate between adjacent two the first circuit substrates, and N number of second circuit substrate described in one step press and N+1 the first circuit substrate, thus obtaining 4N+2 layer circuit board.
The manufacture method of a kind of multilayer circuit board, including step: providing 2N-1 copper clad laminate, each described copper clad laminate to include the first copper foil layer, the first insulating barrier and the second copper foil layer stacked gradually, wherein N is the natural number be more than or equal to 2, first copper foil layer of each copper clad laminate is made and forms the first conductive circuit layer, the second copper foil layer is made and forms the second conductive circuit layer, thus 2N-1 copper clad laminate being made 2N-1 the first circuit substrate, 2N-1 the first circuit substrate selects N number of first circuit substrate, fit the first film in the first conductive circuit layer surface in this N number of first circuit substrate, described first film has the first through hole, fit on the second conductive circuit layer surface of this N number of first circuit substrate the second film, described second film has the second through hole, and fill the first conductive material in described first through hole, the second conductive material is filled in described second through hole, described first conductive material and the first conductive circuit layer conduct mutually, described second conductive material and the second conductive circuit layer conduct mutually, thus this N number of first circuit substrate is made N number of second circuit substrate, one the first Copper Foil and second Copper Foil are provided, stacking described N number of second circuit substrate and N-1 the first circuit substrate between the first Copper Foil and the second Copper Foil, make each first circuit substrate between two adjacent second circuit substrates, and between adjacent two second circuit substrates, only have first circuit substrate, and one step press one the first Copper Foil, N number of second circuit substrate, N-1 the first circuit substrate and second Copper Foil, and described first Copper Foil is made formation the 3rd conductive circuit layer, described second Copper Foil is made and forms the 4th conductive circuit layer, thus obtaining 4N layer circuit board.
A kind of multilayer circuit board, adopts described manufacturing method of multi-layer circuit board to make and is formed.
Compared with prior art, the manufacturing method of multi-layer circuit board that the technical program provides, make multiple circuit substrate simultaneously, the mode then passing through laminating forms film on the surface of partial circuit substrate, and forms through hole in film and be formed with conductive material. So, as required, the stacking circuit substrate being fitted with film and conductive material and be not fitted with the circuit substrate of film, multilayer circuit board just can be obtained thereby through one step press. Owing to multiple circuit substrates can make simultaneously, such that it is able to shorten the time of circuit board making. Owing to each circuit substrate individually makes, compared to the mode of successively superposition in prior art, it is possible to reduce the fraction defective of circuit board making.
Accompanying drawing explanation
Fig. 1 is the generalized section of the copper clad laminate that the technical program embodiment provides.
Fig. 2 is that the copper clad laminate that the technical program embodiment provides makes the generalized section after forming the first circuit substrate.
Fig. 3 is the generalized section after the first circuit substrate two apparent surface in Fig. 2 is fitted with the first film and the second film.
Fig. 4 forms the first through hole in the first film in Fig. 3, form the generalized section after the second through hole in the second film.
Fig. 5 forms the first conductive material, the second circuit substrate generalized section obtained after forming the second conductive material in the second through hole in the first through hole in Fig. 4.
Fig. 6 is the generalized section of stacking the first Copper Foil, second circuit substrate, the first circuit substrate, second circuit substrate and the second Copper Foil.
Fig. 7 is the generalized section after forming the 3rd conductive circuit layer in first Copper Foil of Fig. 6 and forming the 4th conductive circuit layer in the second Copper Foil.
Fig. 8 forms the first welding resisting layer in the 3rd conductive circuit layer of Fig. 7, the generalized section after forming the second welding resisting layer in the 4th conductive circuit layer.
Fig. 9 is the generalized section that stacking first circuit substrate of the offer of this technical method, second circuit substrate and the first circuit substrate obtain 6-layer circuit board.
Main element symbol description
First circuit substrate 10
Second circuit substrate 20
First film 40
First through hole 41
First conductive material 42
Second film 50
Second through hole 51
Second conductive material 52
First Copper Foil 60
3rd conductive circuit layer 61
First welding resisting layer 62
Second Copper Foil 70
4th conductive circuit layer 71
Second welding resisting layer 72
Circuit board 100,200
Copper clad laminate 110
First copper foil layer 111
Insulating barrier 112
Second copper foil layer 113
Conductive hole 114
First conductive circuit layer 115
Second conductive circuit layer 116
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Below to make 8-layer printed circuit board, the manufacture method of the circuit board that the technical program embodiment provides being described, the manufacture method of described circuit board comprises the steps:
The first step, refers to Fig. 1, it is provided that three two-sided copper clad laminates 110.
Two-sided copper clad laminate 110 includes the first copper foil layer 111, insulating barrier 112 and the second copper foil layer 113 that stack gradually. Copper clad laminate 110 can be soft copper clad laminate, it is also possible to for rigid copper clad laminate.
Second step, refer to Fig. 2, conductive hole 114 is formed in each copper clad laminate 110, and the first copper foil layer 111 is made formation the first conductive circuit layer 115, second copper foil layer 113 is made formation the second conductive circuit layer 116, first conductive circuit layer 115 and the second conductive circuit layer 116 are conducted mutually by conductive hole 114, thus obtaining three the first circuit substrates 10.
The formation of conductive hole 114 can be adopted with the following method: first, adopts the mode of laser ablation to form through hole in first copper foil layer 111 and insulating barrier 112 of each copper clad laminate 110. Then, the mode internal electroplated metal at described through hole of plating is adopted, thus obtaining conductive hole 114. Preferably, when electroplating, described through hole is filled up completely with by the metal of plating.
First conductive circuit layer 115 and the second conductive circuit layer 116 are formed by image transfer technique and etch process.
In the present embodiment, the first conductive circuit layer 115 and the second conductive circuit layer 116 in three the first circuit substrates 10 are set according to being actually subjected to prepared circuit board, the first conductive circuit layer 115 in each first circuit substrate 10 is arranged with the second conductive circuit layer 116 can be identical, it is also possible to different.
3rd step, refers to Fig. 3 to Fig. 5, the first film 40 of fitting in the first conductive circuit layer 115 of two the first circuit substrates 10 wherein, the second film 50 of fitting in the second conductive circuit layer 116. Forming the first through hole 41 in the first film 40, part the first conductive circuit layer 115 is exposed bottom the first through hole 41, forms the second through hole 51 in the second film 50, and part the second conductive circuit layer 116 is exposed bottom the second through hole 51. The first conductive material 42 is formed in the first through hole 41, the second conductive material 52 is formed in the second through hole 51, thus first conductive material the 42, first conductive circuit layer 115, conductive hole the 114, second conductive circuit layer 116 and the second conductive material 52 conduct mutually, obtain second circuit substrate 20.
In the present embodiment, the first film 40 and the second film 50 are semi-solid preparation film. The solidification temperature of the first film 40 and the second film 50 should be greater than 150 degrees Celsius.
In the present embodiment, the first through hole 41 and the second through hole 51 all adopt the mode of laser ablation to be formed. First through hole 41 only runs through the first film 40, and the second through hole 51 only runs through the second film 50.
In the present embodiment, adopt the mode of type metal conductive paste to form the first conductive material 42 in the first through hole 41, in the second through hole 51, form the second conductive material 52. Described metallic conduction cream can be the silver slurry containing organic solvent. Silver slurry containing organic solvent is filled in the first through hole 41 and the second through hole 51 by the mode of silk screen printing, then the first circuit substrate 10 being printed with silver slurry is toasted, described organic solvent is volatilized, and silver slurry solidifies, and forms the first conductive material 42 and the second conductive material 52. In the present embodiment, the temperature that the first circuit substrate 10 being printed with silver slurry is toasted is 90 degrees Celsius to 100 degrees Celsius. At this temperature, the performance of the first film 40 and the second film 50 will not be produced impact.
4th step, refer to Fig. 6, first Copper Foil 60 and the second Copper Foil 70 is provided, stacks gradually and 60, second circuit substrate 20, first circuit substrate 10 of one step press the first Copper Foil, another second circuit substrate 20 and described second Copper Foil 70 one-tenth are as a whole.
When stacking first Copper Foil 60, second circuit substrate the 20, first circuit substrate 10, second circuit substrate 20 and the second Copper Foil 70, should ensure that the accurate para-position between second circuit substrate the 20, first circuit substrate 10, second circuit substrate 20. When practical operation, in carrying out stacking process, it is possible to second circuit substrate the 20, first circuit substrate 10, second circuit substrate 20 will be respectively provided with registration holes, the tool with corresponding alignment pin auspicious in registration holes is adopted to carry out para-position.
In the present embodiment, owing to relative two surfaces of second circuit substrate 20 are respectively provided with the first film 40 and the second film 50, in bonding processes, first film 40 and the second film 50 solidify, and the bond Copper Foil or the first circuit substrate 10 that are adjacent, thus in one step press process, the first Copper Foil 60, second circuit substrate the 20, first circuit substrate 10, second circuit substrate 20 and the second Copper Foil 70 one-tenth can be made as a whole. It addition, in the present embodiment, the conductive hole 114,41,51 in each circuit substrate 10,20 aligns conducting successively, constitutes the effect of a via. In other embodiments, the conductive hole 114,41,51 in each circuit substrate 10,20 can not line up mutually, it is only necessary to can make to realize mutual conduction between each circuit substrate 10,20.
5th step, refers to Fig. 7, and the first Copper Foil 60 makes formation the 3rd conductive circuit layer 61, is made by the second Copper Foil and forms the 4th conductive circuit layer 71.
3rd conductive circuit layer 61 and the 4th conductive circuit layer 71 can pass through image transfer technique and etch process is formed.
6th step, refers to Fig. 8, forms the first welding resisting layer 62 on the surface of the 3rd conductive circuit layer 61, forms the second welding resisting layer 72 on the surface of the 4th conductive circuit layer 71, obtains multilayer circuit board 100.
First welding resisting layer 62 and the second welding resisting layer 72 can be formed by the mode of solder-mask printing ink. First welding resisting layer 62 is used for protecting the 3rd conductive circuit layer 61, and the second welding resisting layer 72 is used for protecting the 4th conductive circuit layer 71.
It is understood that the manufacture method of the circuit board of the technical program offer can also be applied to the making of the circuit board of other numbers of plies. Refer to Fig. 9, when making 6-layer circuit board, it may not be necessary to the first Copper Foil 60 and the second Copper Foil 70, a second circuit substrate 20 is directly set between two the first circuit substrates 10, after disposable pressing, obtains the circuit board 200 of six layers.
When being used for making more multi-layered circuit board, during such as Floor 12 circuit board, it is possible to set gradually second circuit substrate the 20, first circuit substrate 10, second circuit substrate the 20, first circuit substrate 10 and second circuit substrate 20 between the first Copper Foil 60 and the second Copper Foil 70. It is understood that after carrying out pressing, the surface of the conductive circuit layer of the first circuit substrate 10 exposed from both sides after being additionally included in pressing forms the step of welding resisting layer.
Can be drawn from above, when the circuit board manufacturing method adopting the technical program to provide makes 4N layer circuit board (N is the natural number more than or equal to 2), N number of second circuit substrate 20 and N-1 the first circuit substrate 10 can be set between the first Copper Foil 60 and the second Copper Foil 70, and the first circuit substrate 10 is arranged between adjacent second circuit substrate 20, obtain after disposable pressing. When the manufacture method of the circuit board adopting the technical program to provide makes 4N+2 layer circuit board (N is the natural number more than or equal to 1), can without the need for the first Copper Foil 60 and the second Copper Foil 70, only need N+1 the first circuit substrate 10 and N number of second circuit substrate 20, and each second circuit substrate 20 is arranged between the first adjacent circuit substrate 10, obtain after disposable pressing.
The manufacturing method of multi-layer circuit board that the technical program provides, makes multiple circuit substrate simultaneously, and the mode then passing through laminating forms film on the surface of partial circuit substrate, and forms through hole in film and be formed with conductive material. So, as required, the stacking circuit substrate being fitted with film and conductive material and be not fitted with the circuit substrate of film, multilayer circuit board just can be obtained thereby through one step press. Owing to multiple circuit substrates can make simultaneously, such that it is able to shorten the time of circuit board making. Owing to each circuit substrate individually makes, compared to the mode of successively superposition in prior art, it is possible to reduce the fraction defective of circuit board making.
It is understood that for the person of ordinary skill of the art, it is possible to conceive according to the technology of the present invention and make other various corresponding changes and deformation, and all these change and deform the protection domain that all should belong to the claims in the present invention.
Claims (11)
1. a manufacture method for multilayer circuit board, including step:
Thering is provided 2N+1 copper clad laminate, each described copper clad laminate to include the first copper foil layer, the first insulating barrier and the second copper foil layer stacked gradually, wherein N is the natural number be more than or equal to 1; The mode adopting laser ablation forms through hole in first copper foil layer and insulating barrier of each copper clad laminate, adopts the mode of plating in the internal electroplated metal of described through hole, makes the first copper foil layer and the insulating barrier interior formation conductive hole of each copper clad laminate; First copper foil layer of each copper clad laminate is made and forms the first conductive circuit layer, the second copper foil layer is made and forms the second conductive circuit layer, thus 2N+1 copper clad laminate being made 2N+1 the first circuit substrate;
2N+1 the first circuit substrate selects N number of first circuit substrate, fit the first film in the first conductive circuit layer surface in this N number of first circuit substrate, described first film has the first through hole, part the first conductive circuit layer is exposed from the first via bottoms, fit on the second conductive circuit layer surface of this N number of first circuit substrate the second film, described second film has the second through hole, part the second conductive circuit layer is exposed from the second via bottoms, and fill the first conductive material in described first through hole, the second conductive material is filled in described second through hole, described first conductive material and the first conductive circuit layer conduct mutually, described second conductive material and the second conductive circuit layer conduct mutually, thus this N number of first circuit substrate is made N number of second circuit substrate, and
Stacking described N number of second circuit substrate and N+1 the first circuit substrate, make each second circuit substrate between two adjacent the first circuit substrates, and only have a second circuit substrate between adjacent two the first circuit substrates, and N number of second circuit substrate described in one step press and N+1 the first circuit substrate, thus obtaining 4N+2 layer circuit board.
2. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterised in that described first conductive material and the second conductive material are formed each through type metal conductive paste.
3. the manufacture method of multilayer circuit board as claimed in claim 2, it is characterised in that described metallic conduction cream is the silver slurry containing organic solvent, forms described first conductive material and the second conductive material includes step:
The described silver slurry containing organic solvent of printing in the first through hole and in the second through hole; And
N number of first circuit substrate printed after silver-colored slurry is toasted so that the organic solvent volatilization in silver slurry is thus solidifying silver slurry.
4. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterized in that, before forming the first conductive circuit layer and the second conductive circuit layer, being additionally included in the first copper foil layer and the interior step forming conductive hole of insulating barrier of copper clad laminate, described first conductive circuit layer and the second conductive circuit layer are conducted mutually by described conductive hole; In 4N+2 layer circuit board, conductive hole, the first through hole and the second through hole are mutually aligned.
5. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterized in that, described first through hole is formed by the mode of laser ablation after the first film fits in the first conductive circuit layer, and described second through hole is formed by the mode of laser ablation after the second film fits in the second conductive circuit layer.
6. a manufacture method for multilayer circuit board, including step:
Thering is provided 2N-1 copper clad laminate, each described copper clad laminate to include the first copper foil layer, the first insulating barrier and the second copper foil layer stacked gradually, wherein N is the natural number be more than or equal to 2; The mode adopting laser ablation forms through hole in first copper foil layer and insulating barrier of each copper clad laminate, adopts the mode of plating in the internal electroplated metal of described through hole, makes the first copper foil layer and the insulating barrier interior formation conductive hole of each copper clad laminate; First copper foil layer of each copper clad laminate is made and forms the first conductive circuit layer, the second copper foil layer is made and forms the second conductive circuit layer, thus 2N-1 copper clad laminate being made 2N-1 the first circuit substrate;
2N-1 the first circuit substrate selects N number of first circuit substrate, fit the first film in the first conductive circuit layer surface in this N number of first circuit substrate, described first film has the first through hole, part the first conductive circuit layer is exposed from the first via bottoms, fit on the second conductive circuit layer surface of this N number of first circuit substrate the second film, described second film has the second through hole, part the second conductive circuit layer is exposed from the second via bottoms, and fill the first conductive material in described first through hole, the second conductive material is filled in described second through hole, described first conductive material and the first conductive circuit layer conduct mutually, described second conductive material and the second conductive circuit layer conduct mutually, thus this N number of first circuit substrate is made N number of second circuit substrate,
One the first Copper Foil and second Copper Foil are provided, stacking described N number of second circuit substrate and N-1 the first circuit substrate between the first Copper Foil and the second Copper Foil, make each first circuit substrate between two adjacent second circuit substrates, and between adjacent two second circuit substrates, only have first circuit substrate, and one step press one the first Copper Foil, N number of second circuit substrate, N-1 the first circuit substrate and second Copper Foil;
Described first Copper Foil is made and forms the 3rd conductive circuit layer, described second Copper Foil is made and forms the 4th conductive circuit layer, thus obtaining 4N layer circuit board.
7. the manufacture method of multilayer circuit board as claimed in claim 6, it is characterised in that described first conductive material and the second conductive material are formed each through type metal conductive paste.
8. the manufacture method of multilayer circuit board as claimed in claim 6, it is characterised in that described metallic conduction cream is the silver slurry containing organic solvent, forms described first conductive material and the second conductive material includes step:
The described silver slurry containing organic solvent of printing in the first through hole and in the second through hole; And
N-1 after having printed silver-colored slurry the first circuit substrate is toasted so that the organic solvent volatilization in silver slurry is thus solidifying silver slurry.
9. the manufacture method of multilayer circuit board as claimed in claim 6, it is characterized in that, before forming the first conductive circuit layer and the second conductive circuit layer, being additionally included in the first copper foil layer and the interior step forming conductive hole of insulating barrier of copper clad laminate, described first conductive circuit layer and the second conductive circuit layer are conducted mutually by described conductive hole; In 4N layer circuit board, conductive hole, the first through hole and the second through hole are mutually aligned.
10. the manufacture method of multilayer circuit board as claimed in claim 6, it is characterized in that, described first through hole is formed by the mode of laser ablation after the first film fits in the first conductive circuit layer, and described second through hole is formed by the mode of laser ablation after the second film fits in the second conductive circuit layer.
11. a multilayer circuit board, it is characterised in that described multilayer circuit board adopts the manufacture method of the multilayer circuit board as according to any one of claim 1 to 10 to make.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210127848.1A CN103379750B (en) | 2012-04-27 | 2012-04-27 | Multilayer circuit board and preparation method thereof |
| TW101117071A TWI498067B (en) | 2012-04-27 | 2012-05-14 | Multilayer circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210127848.1A CN103379750B (en) | 2012-04-27 | 2012-04-27 | Multilayer circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103379750A CN103379750A (en) | 2013-10-30 |
| CN103379750B true CN103379750B (en) | 2016-06-01 |
Family
ID=49464147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210127848.1A Active CN103379750B (en) | 2012-04-27 | 2012-04-27 | Multilayer circuit board and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103379750B (en) |
| TW (1) | TWI498067B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106550530A (en) * | 2015-09-17 | 2017-03-29 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| CN108040428B (en) * | 2017-12-12 | 2020-04-24 | 惠州市金百泽电路科技有限公司 | Manufacturing method of high-order HDI (high Density interconnection) laminated hole rigid-flex circuit board |
| CN112449514B (en) * | 2019-08-31 | 2022-12-20 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN111669906B (en) * | 2020-05-27 | 2022-06-24 | 上海美维电子有限公司 | Method for manufacturing multilayer circuit board |
| CN111698847B (en) * | 2020-06-29 | 2022-07-29 | 四川海英电子科技有限公司 | Method for accurately positioning layers of high-frequency circuit board |
| CN112543550A (en) * | 2020-11-17 | 2021-03-23 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board, board body and processing method thereof |
| CN112911830A (en) * | 2020-12-17 | 2021-06-04 | 江门崇达电路技术有限公司 | Method for manufacturing any-layer high-density interconnection flexible printed circuit board |
| CN114786367A (en) * | 2021-01-22 | 2022-07-22 | 宏恒胜电子科技（淮安）有限公司 | High-density interconnection circuit board and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI267232B (en) * | 2005-09-19 | 2006-11-21 | Nat Huwei Institue Of Technolo | F-shaped microstrip planar antenna layout operated at a band of 5.8 GHz of a radio frequency identification system |
| TW200930206A (en) * | 2007-12-31 | 2009-07-01 | Foxconn Advanced Tech Inc | Printed circuit board and method for manufacturing the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW566069B (en) * | 2003-04-04 | 2003-12-11 | Via Tech Inc | Method of fabricating multi-layer printed circuit board |
| JP2005051075A (en) * | 2003-07-29 | 2005-02-24 | Matsushita Electric Ind Co Ltd | Multilayer circuit board and its manufacturing method |
| JP5014878B2 (en) * | 2007-05-18 | 2012-08-29 | 日本メクトロン株式会社 | Multilayer printed wiring board manufacturing method and wiring board |
| CN101472404B (en) * | 2007-12-25 | 2011-12-07 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| JP5406065B2 (en) * | 2010-02-03 | 2014-02-05 | 日本メクトロン株式会社 | Multilayer printed wiring board manufacturing method, substrate holder, and shielding plate |
-
2012
- 2012-04-27 CN CN201210127848.1A patent/CN103379750B/en active Active
- 2012-05-14 TW TW101117071A patent/TWI498067B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI267232B (en) * | 2005-09-19 | 2006-11-21 | Nat Huwei Institue Of Technolo | F-shaped microstrip planar antenna layout operated at a band of 5.8 GHz of a radio frequency identification system |
| TW200930206A (en) * | 2007-12-31 | 2009-07-01 | Foxconn Advanced Tech Inc | Printed circuit board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI498067B (en) | 2015-08-21 |
| TW201345354A (en) | 2013-11-01 |
| CN103379750A (en) | 2013-10-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103379750B (en) | Multilayer circuit board and preparation method thereof | |
| JP6177639B2 (en) | Multilayer printed wiring board manufacturing method and multilayer printed wiring board | |
| CN103582320B (en) | Multilayer circuit board and manufacturing method thereof | |
| KR101018109B1 (en) | Multilayer circuit board and manufacturing method thereof | |
| US9655236B2 (en) | Method to make a multilayer circuit board with intermetallic compound and related circuit boards | |
| CN103582322B (en) | Multilayer circuit board and preparation method thereof | |
| CN103517583B (en) | Multilayer circuit board and preparation method thereof | |
| TW201316853A (en) | Embedded multilayer printed circuit board and method for manufacturing same | |
| CN103906376A (en) | Flexible circuit board and manufacturing method thereof | |
| KR20110081856A (en) | Wiring board and method for manufacturing same | |
| CN103582321B (en) | Multilayer circuit board and preparation method thereof | |
| CN103517584A (en) | Manufacturing method of multilayer circuit board | |
| JP5581828B2 (en) | Multilayer circuit board and substrate manufacturing method | |
| CN104349610B (en) | The manufacture method and printed circuit board of printed circuit board daughter board and printed circuit board | |
| US20130186674A1 (en) | Multi-layer printed circuit board (pcb) | |
| JP2007180421A (en) | Multilayer circuit board and manufacturing method therefor | |
| JP2007335631A (en) | Manufacturing method of laminated wiring board | |
| CN102958293A (en) | Manufacturing method of circuit board with offset structure | |
| CN103974562B (en) | The preparation method of multilayer printed circuit board | |
| TWI389619B (en) | Method for manufacturing multi-layer printed circuit board | |
| TW201427505A (en) | Printed circuit board having buried component and method for manufacturing same | |
| CN110602871B (en) | Graphene heat-conducting PCB and preparation method thereof | |
| JP2006210533A (en) | Multilayer printed board and its manufacturing method | |
| JP2009054773A (en) | Multilayer wiring board and manufacturing method thereof | |
| KR100657409B1 (en) | Manufacturing multi-layer pcb |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: 518103 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
| CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
| CP03 | Change of name, title or address |