200930206 .九、發明說明： 【發明所屬之技術領域】 本發明涉及電路板製作技術，尤其涉及一種電路板及 電路板之製作方法。 【先前技術】 隨著電子產品往小型化、高速化方向之發展，電路板 亦從單面電路板、雙面電路板往多層電路板方向發展。多 ©層電路板係指具有多層導電線路之電路板，其具有較多之 佈線面積、較高互連密度，因而得到廣泛之應用，參見文 Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880 5 IEEE Trans, on Components, Packaging, and Manufacturing Technology, 1992，15(4): 418-425 。 電路板製作過程中，通常係由壓合於基材上之銅箔經 ¥過壓合、曝光、顯影、蝕刻等步驟形成導電線路。目前， 不管單層電路板還係多層電路板之製作都採用這種方法；。 以多層電路板為例，多層電路板一般採用傳統之積層壓合 工藝進行製作。第一步，製作内層板，於内層板上製作出 相應之導電線路及導孔。而於内層板之製作過程中，通常 首先於基材（通常為環氧樹脂半固化片）之預定位置鑽孔，其 次印刷導電膏或有機樹脂等塞孔材料進行塞孔，之後再壓 合銅箔到基材之相對兩表面，最後，採用曝光顯影蝕刻之 6 200930206 方法將銅箔形成導電圖形，從而製 拉万道^ “ ^ ㈣展作出具有相應之導電線 1及導孔之内層基板。第二步，將另—完成塞孔之環 月曰半固化片基材與銅箔經加熱加壓壓合於具有相應之 =路及導孔之内層板之相對兩表面並與内層板予以黏人。 ^三^，制曝絲職刻之方法加工壓合於㈣^鋼 >白’製作出相應之導電線路。經過第三步 声 e ❹ 基板又可視為内層板，重複第二步至第三步，即 層電路板之製作。 耳現多 習知多層電路板之製作工序本身就十分複雜，加之於 每層結構之製作過程中又要進行步驟十分複雜之路 製^不斷重複之進行基材塞孔、M合㈣、曝光顯影# 刻等步驟’使得多層電路板製作之勞動強度較大，製作效 率較低。此外’習知電路板之製作使用㈣來製作導電線 路’使得電路板之製作尤其係於製作多層電路板時成本較 高。 有鑑於此，提供一種電路板之製作方法，以簡化電路 板之製作工序，降低電路板之製作成本實屬必要。 【發明内容】 以下將以實施例說明一種電路板及電路板之製作方 法。 該電路板，其包括開設有至少一孔之基材，該孔中填 充有塞孔物，該基材表面形成有導電線路，該塞孔物與該 導電線路均由導電膏製成。 η " 7 200930206 •該電路板之製作方法，其包括以下步驟：於基材開設 .至少一孔；於基材表面印刷導電膏，使導電膏填充到孔中 形成塞孔物，並印刷於基材表面形成導電線路，固化該塞 孔物及導電線路。 本技術方案之電路板及電路板之製作方法具有如下優 點：於採用導電膏進行基材塞孔同時，採用導電膏製作導 電線路不僅可大大縮減電路板之製作時間及所需勞動 力，提高電路板之產率，而且節約丁銅箔之使用量，可降 0低電路板之製作成本。 【實施方式】 下麵將結合附圖及實施例，以製作多層電路板為例對 本技術方案提供之電路板及電路板之製作方法作進一步之 詳細說明。 本技術方案提供之電路板之製作方法用於製作多層電 ❹路板。本實施例將以採用印刷導電膏同時進行塞孔及導電 線=製作之方法製作多層電路板之内層板為例對該電路板 之製作方法進行說明。 該電路板之製作方法包括以下步驟： 第步’於基材10a開設至少一孔2〇a。 片。月參閱圖1，該基材1〇a為半固化片，亦即玻璃纖維膠 饵,。半固化片係由玻璃纖維布加環氧樹脂經過浸潰、壓合、 &分j半透明半固化之絕緣體樹脂及增強材料構成之一預 ；該基材1〇a於溫度與壓力作用下，具有可流動性 200930206200930206. IX. INSTRUCTIONS: FIELD OF THE INVENTION The present invention relates to circuit board fabrication techniques, and more particularly to a circuit board and a method of fabricating the same. [Prior Art] With the development of electronic products in the direction of miniaturization and high speed, circuit boards have also evolved from single-sided circuit boards and double-sided circuit boards to multilayer circuit boards. A multi-layer circuit board refers to a circuit board having a plurality of layers of conductive lines, which has a large wiring area and a high interconnect density, and thus has been widely used, see, for example, Takahashi, A. Ooki, N. Nagai, A. Akahoshi , H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880 5 IEEE Trans, on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425 . During the manufacturing process of the circuit board, the copper foil laminated on the substrate is usually formed into a conductive line by the steps of over-pressing, exposing, developing, etching, and the like. At present, this method is adopted regardless of whether a single-layer circuit board or a multi-layer circuit board is produced; Taking a multilayer circuit board as an example, a multilayer circuit board is generally fabricated by a conventional laminate process. In the first step, an inner layer is fabricated, and corresponding conductive lines and via holes are formed on the inner layer. In the process of fabricating the inner layer, the hole is usually firstly drilled at a predetermined position of the substrate (usually an epoxy resin prepreg), and then a plug material such as a conductive paste or an organic resin is printed to be plugged, and then the copper foil is pressed to The opposite surfaces of the substrate, and finally, the copper foil is formed into a conductive pattern by the method of exposure and development etching, and the inner layer substrate having the corresponding conductive line 1 and the via hole is formed. Step, the other-finished ring-shaped matte prepreg substrate and the copper foil are pressed and pressed against the opposite surfaces of the inner layer plate having the corresponding = way and the guide hole and adhered to the inner layer board. ^, the method of manufacturing the exposed wire is pressed and pressed in (4) ^ steel > white' to make the corresponding conductive circuit. After the third step e ❹ the substrate can be regarded as the inner layer, repeat the second step to the third step, The production of layered circuit boards. The production process of multi-layer circuit boards is very complicated. In addition, in the production process of each layer structure, the steps are very complicated. , M (four), exposure and development # engraving steps, etc., make the multi-layer circuit board production labor intensity, production efficiency is low. In addition, the use of the traditional circuit board (four) to make conductive lines 'making the circuit board production especially In view of the above, it is necessary to provide a method for manufacturing a circuit board, which simplifies the manufacturing process of the circuit board and reduces the manufacturing cost of the circuit board. [Description of the Invention] A circuit board and a circuit board manufacturing method thereof, the circuit board comprising a substrate having at least one hole, the hole being filled with a plug hole, the surface of the substrate being formed with a conductive line, the plug hole and the conductive The circuit is made of conductive paste. η " 7 200930206 • The method for manufacturing the circuit board comprises the steps of: opening at least one hole in the substrate; printing a conductive paste on the surface of the substrate to fill the hole with the conductive paste Forming a plug hole, and printing on the surface of the substrate to form a conductive line, curing the plug hole and the conductive line. The circuit board and the circuit board of the technical solution The utility model has the following advantages: the conductive paste is used for the substrate plugging, and the conductive paste is used to make the conductive circuit not only greatly reduces the manufacturing time and labor required of the circuit board, but also improves the yield of the circuit board, and saves the use of the copper foil. The manufacturing cost of the circuit board and the circuit board provided by the present technical solution will be further described in detail below by taking the multi-layer circuit board as an example. The manufacturing method of the circuit board provided by the technical solution is used for manufacturing a multi-layer electric circuit board. In this embodiment, an inner layer board of a multi-layer circuit board is prepared by using a printed conductive paste simultaneously with a plug hole and a conductive line= fabrication method. The manufacturing method of the circuit board is described. The manufacturing method of the circuit board includes the following steps: First, at least one hole 2〇a is opened in the substrate 10a. sheet. Referring to Fig. 1, the substrate 1〇a is a prepreg, that is, a glass fiber glue bait. The prepreg is pre-formed by a glass fiber cloth and an epoxy resin by impregnation, pressing, & j translucent semi-cured insulator resin and reinforcing material; the substrate 1〇a is under temperature and pressure, Liquidity 200930206
並能很快地固化及完成黏結過程。該基材10a具有第一表 面11及與第一表面u相對之第二表面12，該第一表面U 與該第一表面12用於設置導電線路。 可採用雷射鑽孔或機械鑽孔之方法於該基材1〇a開設 一個或複數孔20a。該孔20a可貫通或不貫通第一表面u 及第二表面12，亦即該孔2〇a可為形成於基材1〇a之通孔 或=孔。本實施例中，該基材1〇a開設有兩個孔2〇a，且均 為貫通第一表面11及第二表面12之通孔。 第一步，於基材10a表面印刷導電膏，使得導電膏填 充到孔20a中形成塞孔物31a，並印刷於基材l〇a表面形成 導電線路32。 該導電膏可為銅膏、銀膏或碳膏等，優選為銅膏。導 電膏可採用網版印刷之方法填充到孔遍中形成塞孔物 31a’並印刷於基材1〇a表面形成導電線路32。請參閱圖2， ^實施例中’需要於基材1〇a之第一表自u與第二表面 ❸^別進行—次導電膏之印刷，從而於基材IGa第-表面η 形成第一導電線路321與第二表面ΐ2分別形成第二導電線 22並於孔2〇a中形成塞孔物31a。當然，如果只需要 =面製作導電線路32 ’則僅需要於基材_之第—表面n 一第一表面12中之一表面印刷導電膏即可。 本實施例中，首先，於基材l〇a之第一表面Π印刷導 體地，採用具有與孔20a以及第一導電線路321 2置相對應之網印圖案之印刷網版，使其設置於基材 表面11，然後利用刮刀將導電膏擠壓通過印刷網版 9 200930206 -之網印圖案，從而填充到孔2〇a中形成塞孔物3ia，同時， •刮刀亦會將導電膏擠壓通過印刷網版之網印圖案，印刷於 基材10a之第一表面η形成第一導電線路％卜本實施例 中第導電線路321與塞孔物31a相連。其次，於基材 10a之第二表面12印刷導電膏。具體地，可採用具有與孔 20a以及第—導電線路322位置相對應之網印圖案之印刷網 版’使其設置於基材10a之第二表s 12，然後利用刮刀將 導電膏擠壓通過印刷網版之網印圖案，利用刮刀將導電膏 〇擠壓通過印刷網版之網印圖案，從而填充到孔施中形成 塞孔物31a，同時，刮刀亦會將導電膏擠壓通過印刷網版之 網印圖案，印刷於基材10a之第一表面^形成第二導電線 路322。本實施例中，第二導電線路322亦與塞孔物相 連。由於，第一導電線路321、第二導電線路322與塞孔物 31a由導電膏構成，故，塞孔物3U可實現第一導電線路 321與弟一導電線路322之電連接。 ❿ 此外’於印刷導電膏於第二表面12之過程中，可採用 常用之釘床對第一表面n已經印刷導電膏之基材i〇a進行 支撐’使釘床之平釘與第一表面n沒有第一導電線路 之區域與孔2〇a區域接觸支撐，從而防止印刷於第一表面 11之第一導電線路321於印刷導電膏於第二表面12時受到 影響’同時防止導電膏從孔2〇a中流出。 導電膏填充到孔20a中並印刷於基材1〇a表面形成導 電線路32後，經固化即可牢固之存在於導孔2〇&中與基材 10a表面。導電膏之固化通常根據導電膏自身之組成與ς質 200930206 •決定，可採用紫外固化或者熱固化。本實施例中，採用之 -導電膏具有紫外固化之特性，故採用紫外光照射3〇~60秒 即可快速固化。完成上述步驟之基材l〇a即可視為多層電 路板之内層板100’以繼續進行後續多層板之製作步驟。當 然，該内層板100亦可視為單層雙面電路板。 第三步，將麼合基材壓合於該内層板之至少一表 面，並於壓合基材開設至少一孔。 壓合基材可壓合於内層板1〇〇之一表面或相對兩表 ❹面。請參閱圖3，本實施例中，於内層板100具有第一導電 線路321之第一表面11與具有第二導電線路322之第二表 面12分別熱壓合壓合基材10b、10c，壓合基材i〇b、i〇c 亦為半固化片，亦即玻璃纖維膠片，於溫度與壓力作用下， 具有可流動性並能很快地固化及完成與第一導電線路 321、第一表面11以及第二導電線路322、第二表面12之 黏結過程。可採用雷射鑽孔或機械鑽孔之方法於壓合基材 q l〇b、l〇c開設一個或複數孔20b、20c，該孔20b、20c可貫 通或不貫通壓合基材10b、10c相對兩表面。本實施例中， 該壓合基材10b、10c分別開設有兩個孔20b、20c，為了實 現電連接，孔20b、20c均為貫通壓合基材10b、10c相對 兩表面之通孔，第一導電線路321與第二導電線路322分 別從孔20b、20c露出。當然，孔20b、20c亦可於壓合基 材10b、10c壓合於内層板100之前開設。 此外，還可於内層板100之基材10a開設與孔20b或 20c相連通之孔，如此，於導電膏塞孔之後，可實現更大範 11 200930206 •圍内導電線路之電連接。 • 第四步，於壓合基材l〇b、10c表面印刷導電膏，使得 導電膏填充到孔20b、20c中形成塞孔物31b、31c，並印刷 於壓合基材l〇b、10c表面形成導電線路331，332。 請參閱圖4 ’同樣地’類似於基材.i〇a印刷導電膏形成 内層板100之過程’導電膏可採用網版印刷之方法填充到 分別壓合於内層板100相對兩表面之壓合基材l〇b、l〇c之 孔20b、20c中形成塞孔物31b，31c，並印刷導電膏於壓合 ❹於内層板100相對兩表面之壓合基材10b、10c表面形成導 電線路331，332。導電線路331與内層板1〇〇之第一導電 線路321通過塞孔物31b實現電連接，導電線路322與内 層板100之第二導電線路322通過塞孔物31c現電連接。 之後，採用紫外固化之方法利用紫外光照射30〜60秒快速 完成導電膏之固化，即製成了多層電路板200，該多層電路 板200為三層結構之電路板，且每層結構之製作均採用了 _印刷導電膏之方法同時進行基材塞孔與導電線路製作。當 ❹ 然，如果需要製作更多層結構之電路板，只需要重複進行 第三步與第四步之步驟，即可方便之製作任意多層結構之 電路板。 由上述方法製作之多層電路板200’如圖4所示’其包 括一内層板100，該内層板100包括基材10a ’ 基材l〇a 開設有至少一孔20a，塞孔物31a、第一導電線路321、第 二導電線路322均由導電膏製成。多層電路板200還可包 括壓合於内層板100之相對兩表面之壓合基材l〇b、10c ’ 12 200930206 -壓合基材1 〇b、10c之塞孔物31b、31c由導電膏製成，壓 .合基材10b、10c表面之導電線路331、332由亦由導電膏 製成。 另外，於製作導電線路時，亦可於多層電路板之某一 層結構選擇性地使用銅箔來製作導電線路。 例如，於内層板100壓合開設有孔20b、20c之壓合基 材10b、10c之後，可僅進行導電膏印刷塞孔之步驟，即採 用僅具有與孔20b、20c位置相對應之網印圖案之印刷網 ❹版，使其設置於壓合基材l〇b、10c之表面，然後利用刮刀 將導電膏擠壓通過印刷網版之網印圖案，從而將導電膏分 別填充到孔20b、20c中形成塞孔物31b、31c，採用紫外固 化之方法利用紫外光照射30〜60秒快速完成導電膏之固 化，如圖5所示。然後，分別壓合銅箱40於壓合基材10b、 10c之表面，銅箔40可選擇柔韌性較好之壓延銅箔。最後， 採用曝光顯影蝕刻之方法將銅箔40形成導電線路421， ❹422，從而製成三層結構之電路板300，如圖7所示。該多 層電路板300為三層結構之電路板，且内層板之製作是採 用了印刷導電膏之方法同時進行基材塞孔與導電線路製 作，而壓合基材之導電線路是採用銅箔蝕刻之方法。當然， 之後還可選擇性地於多層電路板之某一層結構使用銅箔來 製作導電線路，或直接印刷導電膏塞孔時同時製成線路， 從而製作任意多層結構之電路板。 由上述方法製作之多層電路板300，如圖7所示，其亦 包括一内層板100，該内層板100包括基材10a， 基材10a 13 200930206 •開設有至少一孔20a，塞孔物31a、第一導電線路321、第 .二導電線路322均由導電膏製成。與多層電路板2〇〇不同 之處在於’多層電路板300還可包括壓合於内層板1〇〇之 相對兩表面之壓合基材l〇b、10c，壓合基材i〇b、l〇c之塞 孔物3lb、31c由導電膏製成，壓合基材i〇b、10c表面之 導電線略421、422由銅箔製成。當然，多層電路板300亦 可同時包括其他多層壓合基材，壓合基材之塞孔物由導電 膏製成’壓合基材表面之導電線路由亦由導電膏製成。 ❿ 可理解，多層電路板之内層板亦可採用傳統之方式製 作’即於内層板之製作過程中’先於基材之預定位置鑽孔， 其次印刷導電膏進行塞孔，之後再壓合銅箔到基材之相對 兩表面’最後’採用曝光顯影蝕刻之方法將銅箔形成導電 圖形。而於壓合基材結構層採用本技術方案提供之同時印 刷塞孔與印刷導電線路之方法。 ‘上所述，本發明確已符合發明專利之要件，遂依法 ❹提出專利申請。惟’以上所述者僅為本發明之較佳實施方 式’自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應)函蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案實施方式提供之基材之剖視圖。 圖2係本技術方案實施方式提供之由圖1中之基材印 刷導電膏形成内層板之剖視圖。 圖3係本技術方案實施方式提供之於圖2之内層板壓 200930206 -合了壓合基材之剖視圖。 . 圖4係本技術方案實施方式提供之於圖3之壓合於内 層板之壓合基材印刷導電膏塞孔與形成導電線路後之剖視 圖。 圖5係本技術方案實施方式提供之於圖2之内層板壓 合了壓合基材，且壓合基材用導電膏塞孔後之剖視圖。 圖6係本技術方案實施方式提供之於圖5中之壓合於 内層板之塞孔後之壓合基材表面壓合銅箔之剖視圖。 ❹ 圖7係本技術方案實施方式提供之將圖6中之銅箔製 成導電線路之剖視圖。 【主要元件符號說明】 基材 第一表面 第二表面It can quickly cure and complete the bonding process. The substrate 10a has a first surface 11 and a second surface 12 opposite the first surface u, the first surface U and the first surface 12 being used to provide conductive traces. One or more holes 20a may be formed in the substrate 1A by laser drilling or mechanical drilling. The hole 20a may or may not penetrate the first surface u and the second surface 12, that is, the hole 2〇a may be a through hole or a hole formed in the substrate 1A. In this embodiment, the substrate 1A is provided with two holes 2〇a, and both are through holes penetrating the first surface 11 and the second surface 12. In the first step, the conductive paste is printed on the surface of the substrate 10a so that the conductive paste is filled into the hole 20a to form the plug 31a, and printed on the surface of the substrate 10a to form the conductive line 32. The conductive paste may be a copper paste, a silver paste or a carbon paste, etc., preferably a copper paste. The conductive paste can be filled into the hole through the screen printing to form the plug 31a' and printed on the surface of the substrate 1A to form the conductive line 32. Referring to FIG. 2, in the embodiment, the first surface of the substrate 1A is required to be printed from the second surface and the second surface is printed to form the first surface of the substrate IGa. The conductive line 321 and the second surface ΐ2 respectively form the second conductive line 22 and form the plug 31a in the hole 2〇a. Of course, if it is only necessary to make the conductive line 32', it is only necessary to print the conductive paste on the surface of the first surface 12 of the substrate_the surface n. In this embodiment, first, a printed screen having a screen printing pattern corresponding to the hole 20a and the first conductive line 32 2 is printed on the first surface of the substrate 10a, and is disposed on the printed surface. The substrate surface 11 is then extruded by a doctor blade through a screen printing plate 9 200930206 - a screen printing pattern, thereby filling the hole 2 〇 a to form a plug hole 3ia, and at the same time, the squeegee will also squeeze the conductive paste The printed circuit board is printed on the first surface η of the substrate 10a to form a first conductive line. In the embodiment, the first conductive line 321 is connected to the plug 31a. Next, a conductive paste is printed on the second surface 12 of the substrate 10a. Specifically, a printing screen having a screen printing pattern corresponding to the position of the hole 20a and the first conductive line 322 may be used to be disposed on the second surface s 12 of the substrate 10a, and then the conductive paste is extruded through the blade. Printing a screen printing screen, using a doctor blade to squeeze the conductive paste through the screen printing pattern of the printing screen, so as to fill the hole application to form the plug hole 31a, at the same time, the blade will also squeeze the conductive paste through the printing net The screen printing pattern of the plate is printed on the first surface of the substrate 10a to form a second conductive line 322. In this embodiment, the second conductive line 322 is also connected to the plug. Since the first conductive line 321, the second conductive line 322 and the plug 31a are made of a conductive paste, the plug 3U can electrically connect the first conductive line 321 with the first conductive line 322. ❿ In addition, in the process of printing the conductive paste on the second surface 12, the base surface i〇a on which the conductive paste has been printed on the first surface n can be supported by a commonly used nail bed. n the area where the first conductive line is not in contact with the hole 2〇a area, thereby preventing the first conductive line 321 printed on the first surface 11 from being affected when printing the conductive paste on the second surface 12 while preventing the conductive paste from the hole Flow out in 2〇a. The conductive paste is filled in the hole 20a and printed on the surface of the substrate 1A to form the conductive line 32, and then solidified to be firmly present in the via hole 2& and the surface of the substrate 10a. The curing of the conductive paste is usually based on the composition and enamel of the conductive paste itself. 200930206 • It is determined that UV curing or thermal curing can be used. In this embodiment, the conductive paste has the characteristics of ultraviolet curing, so that it can be rapidly cured by ultraviolet light irradiation for 3 〇 to 60 seconds. The substrate l〇a which has completed the above steps can be regarded as the inner layer 100' of the multilayer circuit board to continue the subsequent steps of fabricating the multilayer board. Of course, the inner panel 100 can also be considered as a single layer double sided circuit board. In the third step, the substrate is pressed against at least one surface of the inner layer, and at least one hole is opened in the pressed substrate. The press-fit substrate can be pressed against one of the inner sheets 1 相对 or opposite the two sides. Referring to FIG. 3, in the embodiment, the first surface 11 of the inner conductive plate 100 having the first conductive line 321 and the second surface 12 having the second conductive line 322 are respectively pressed and pressed together with the pressed substrates 10b and 10c. The substrate i〇b, i〇c is also a prepreg, that is, a glass fiber film, which has flowability under temperature and pressure and can be quickly solidified and completed with the first conductive line 321, the first surface 11 And a bonding process of the second conductive line 322 and the second surface 12. One or a plurality of holes 20b, 20c may be opened in the press-bonding substrate ql〇b, l〇c by means of laser drilling or mechanical drilling, and the holes 20b, 20c may or may not penetrate through the pressed substrates 10b, 10c. Relative to both surfaces. In this embodiment, the press-bonding substrates 10b and 10c are respectively provided with two holes 20b and 20c. In order to achieve electrical connection, the holes 20b and 20c are through holes penetrating the opposite surfaces of the pressed substrates 10b and 10c. A conductive line 321 and a second conductive line 322 are exposed from the holes 20b, 20c, respectively. Of course, the holes 20b, 20c may be opened before the press-bonding substrates 10b, 10c are pressed against the inner layer 100. In addition, a hole communicating with the hole 20b or 20c may be formed in the substrate 10a of the inner layer 100, so that after the conductive paste is plugged, the electrical connection of the inner conductive line can be realized. • In the fourth step, the conductive paste is printed on the surface of the pressed substrate l〇b, 10c, so that the conductive paste is filled into the holes 20b, 20c to form the plugs 31b, 31c, and printed on the pressed substrates l〇b, 10c The surface forms conductive traces 331, 332. Referring to FIG. 4 'similarly' similar to the substrate. i〇a printing conductive paste to form the inner layer plate 100 'the conductive paste can be filled by screen printing to press the opposite surfaces of the inner layer plate 100 respectively. The plug holes 31b, 31c are formed in the holes 20b, 20c of the substrate 10b, lc, and the conductive paste is printed on the surface of the press-bonded substrates 10b, 10c which are pressed against the opposite surfaces of the inner layer 100 to form a conductive line. 331,332. The conductive line 331 and the first conductive line 321 of the inner layer 1 are electrically connected through the plug 31b, and the conductive line 322 and the second conductive line 322 of the inner board 100 are electrically connected through the plug 31c. Thereafter, the curing of the conductive paste is quickly completed by ultraviolet curing by ultraviolet light for 30 to 60 seconds, that is, the multilayer circuit board 200 is formed, and the multilayer circuit board 200 is a three-layer circuit board, and each layer structure is fabricated. The substrate plug hole and the conductive line are simultaneously fabricated by using a method of printing a conductive paste. Of course, if you need to make a circuit board with more layers, you only need to repeat the steps of the third and fourth steps to make a circuit board of any multi-layer structure. The multilayer circuit board 200' produced by the above method is as shown in FIG. 4, which includes an inner layer board 100 including a substrate 10a'. The substrate 10a is provided with at least one hole 20a, a plug 31a, A conductive line 321 and a second conductive line 322 are each made of a conductive paste. The multilayer circuit board 200 may further include a press-bonding substrate lb, 10c' 12 200930206 which is pressed against the opposite surfaces of the inner layer board 100. The plugs 31b, 31c of the press-bonded substrate 1 〇b, 10c are made of a conductive paste. The conductive traces 331, 332 which are formed to press and bond the surfaces of the substrates 10b, 10c are also made of a conductive paste. Further, in the case of fabricating a conductive line, it is also possible to selectively use a copper foil to form a conductive line in a layer structure of the multilayer circuit board. For example, after the inner layer plate 100 presses the press-bonded base materials 10b and 10c with the holes 20b and 20c, the step of printing the plug holes only by the conductive paste may be performed, that is, the screen printing having only the positions corresponding to the holes 20b and 20c may be employed. a printing screen of the pattern is disposed on the surface of the pressing substrate l〇b, 10c, and then the conductive paste is pressed through the screen printing pattern of the printing screen by a doctor blade, thereby filling the conductive paste into the hole 20b, The plug holes 31b and 31c are formed in the 20c, and the curing of the conductive paste is quickly completed by ultraviolet light irradiation for 30 to 60 seconds by ultraviolet curing, as shown in FIG. Then, the copper box 40 is press-bonded to the surface of the pressed substrates 10b, 10c, respectively, and the copper foil 40 can be selected from a rolled copper foil having a good flexibility. Finally, the copper foil 40 is formed into a conductive line 421, ❹ 422 by exposure development etching, thereby forming a three-layered circuit board 300, as shown in FIG. The multi-layer circuit board 300 is a three-layer circuit board, and the inner layer board is formed by printing a conductive paste simultaneously to make a substrate plug hole and a conductive line, and the conductive line of the press-bonded substrate is etched by copper foil. The method. Of course, it is also possible to selectively use a copper foil to form a conductive line in a certain layer structure of the multilayer circuit board, or to directly form a circuit when the conductive paste plug hole is directly printed, thereby fabricating a circuit board of any multilayer structure. The multilayer circuit board 300 produced by the above method, as shown in FIG. 7, also includes an inner layer board 100 including a substrate 10a, a substrate 10a 13 200930206, at least one hole 20a, and a plug 31a. The first conductive line 321 and the second conductive line 322 are both made of a conductive paste. The difference from the multilayer circuit board 2 is that the 'multilayer circuit board 300 may further include press-bonded substrates lb, 10c pressed against the opposite surfaces of the inner layer 1〇〇, the pressed substrate i〇b, The plugs 3lb and 31c of the layer c are made of a conductive paste, and the conductive lines 421 and 422 of the surface of the substrate i〇b, 10c are made of copper foil. Of course, the multilayer circuit board 300 can also include other multi-laminate substrates, and the plugs of the press-bonded substrate are made of a conductive paste. The conductive lines for pressing the surface of the substrate are also made of a conductive paste. ❿ It can be understood that the inner layer of the multi-layer circuit board can also be fabricated in a conventional manner. That is, in the process of manufacturing the inner layer board, the hole is drilled before the predetermined position of the substrate, and then the conductive paste is printed for the plug hole, and then the copper is pressed. The copper foil is formed into a conductive pattern by the exposure and development etching of the foil to the opposite surfaces of the substrate. The method for printing the plug hole and printing the conductive line is provided by the technical solution provided in the press-bonded substrate structural layer. ‘Because, the invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention is not limited thereto. Any equivalent modifications or variations made by those skilled in the art to the spirit of the present invention are hereby incorporated by reference. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a substrate provided by an embodiment of the present technical solution. 2 is a cross-sectional view showing an inner layer plate formed by printing a conductive paste of the substrate of FIG. 1 according to an embodiment of the present technical solution. Figure 3 is a cross-sectional view of the inner layer of the substrate of Figure 2 provided by the embodiment of the present invention. Fig. 4 is a cross-sectional view showing the conductive paste plug hole of the press-bonded substrate laminated to the inner layer of Fig. 3 and the conductive line formed by the embodiment of the present invention. Fig. 5 is a cross-sectional view showing the inner layer of Fig. 2 pressed against the pressed substrate, and the laminated substrate is filled with a conductive paste. Fig. 6 is a cross-sectional view showing a press-bonded substrate surface-bonded copper foil provided by the embodiment of the present invention after being laminated to the plug hole of the inner layer. Figure 7 is a cross-sectional view showing the conductive wiring of the copper foil of Figure 6 provided by an embodiment of the present technical solution. [Main component symbol description] Substrate First surface Second surface
塞孔物 導電線路 第一導電線路 第二導電線路 内層板 壓合基材 電路板 銅羯 10a 11 12 20a ' 20b ' 20c 31a、31b、31c 32、 331、332、421、422 321 322 100 10b 、 10c 200 ' 300 40 15Plug-in conductive line first conductive line second conductive line inner layer laminated substrate circuit board copper raft 10a 11 12 20a ' 20b ' 20c 31a, 31b, 31c 32, 331, 332, 421, 422 321 322 100 10b, 10c 200 ' 300 40 15