CN103379750A - Multilayer circuit board and manufacturing method thereof - Google Patents
Multilayer circuit board and manufacturing method thereof Download PDFInfo
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- CN103379750A CN103379750A CN2012101278481A CN201210127848A CN103379750A CN 103379750 A CN103379750 A CN 103379750A CN 2012101278481 A CN2012101278481 A CN 2012101278481A CN 201210127848 A CN201210127848 A CN 201210127848A CN 103379750 A CN103379750 A CN 103379750A
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Abstract
A manufacturing method of a multilayer circuit board includes the steps: (1) providing a plurality of copper foil substrates, (2) manufacturing copper foil layers of the copper foil substrates into a conductive line layer to obtain a plurality of first circuit substrates, (3) adhering two films to two surfaces of a part of the first circuit substrates, (4) forming a through hole in each film, (5) arranging a conductive material in each through hole and obtaining second circuit substrates, wherein the conductive materials and the conductive line layer are connected electrically, and (6) stacking and pressing the second circuit substrates and the first circuit substrates so that each second circuit substrate can be located between two adjacent first circuit substrates, wherein only one second circuit substrate is located between the two adjacent first circuit substrates so as to obtain the multilayer circuit board. The invention further provides the multilayer circuit board manufactured by means of the manufacturing method.
Description
Technical field
The present invention relates to the circuit board making field, relate in particular to a kind of multilayer circuit board and preparation method thereof.
Background technology
Printed circuit board (PCB) is widely used because having the packaging density advantages of higher.Application about circuit board sees also document Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 1418-1425.
In the manufacturing process of multilayer circuit board, usually partly begin to make from the internal layer base of circuit board first, at the both sides of internal substrate lamination glue-line and conductive layer, thereby obtain multilayer circuit board.Yet the multilayer circuit board of making in such a manner need to progressively be made to skin from internal layer, and the making flow process is very long.And, once increase layer whenever, what all can occur making be bad, thus when whole circuit board making was finished, it is higher that the circuit for generating plate is made bad probability, causes the yield of circuit board making lower.
Summary of the invention
Therefore, be necessary to provide a kind of multilayer circuit board and preparation method thereof, with the efficient that can improve circuit board making and the yield that improves circuit board making.
A kind of manufacture method of multilayer circuit board comprises step: 2N+1 copper clad laminate is provided, and each described copper clad laminate comprises the first copper foil layer, the first insulating barrier and the second copper foil layer that stacks gradually, and wherein N is the natural number more than or equal to 1; The first copper foil layer of each copper clad laminate is made formation the first conducting wire layer by layer, the second copper foil layer is made forming the second conducting wire layer by layer, thereby 2N+1 copper clad laminate made 2N+1 the first circuit substrate; In 2N+1 the first circuit substrate, select N the first circuit substrate, layer by layer surface applying of the first conducting wire in this N the first circuit substrate the first film, described the first film has the first through hole, at layer by layer surface applying of the second conducting wire of this N the first circuit substrate the second film, described the second film has the second through hole, and in described the first through hole, fill the first electric conducting material, in described the second through hole, fill the second electric conducting material, described the first electric conducting material and the first conducting wire layer conduct mutually, described the second electric conducting material and the second conducting wire layer conduct mutually, thereby this N the first circuit substrate made N second circuit substrate; And a stacking described N second circuit substrate and N+1 the first circuit substrate, so that each second circuit substrate is between two adjacent the first circuit substrates, and between two adjacent the first circuit substrates a second circuit substrate is only arranged, and the described N of an one step press second circuit substrate and N+1 the first circuit substrate, thereby obtain the 4N+2 layer circuit board.
A kind of manufacture method of multilayer circuit board comprises step: 2N-1 copper clad laminate is provided, and each described copper clad laminate comprises the first copper foil layer, the first insulating barrier and the second copper foil layer that stacks gradually, and wherein N is the natural number more than or equal to 2; The first copper foil layer of each copper clad laminate is made formation the first conducting wire layer by layer, the second copper foil layer is made forming the second conducting wire layer by layer, thereby 2N-1 copper clad laminate made 2N-1 the first circuit substrate; In 2N-1 the first circuit substrate, select N the first circuit substrate, the first conducting wire layer surface applying the first film in this N the first circuit substrate, described the first film has the first through hole, the second conducting wire layer surface applying the second film at this N the first circuit substrate, described the second film has the second through hole, and in described the first through hole, fill the first electric conducting material, in described the second through hole, fill the second electric conducting material, described the first electric conducting material and the first conducting wire layer conduct mutually, described the second electric conducting material and the second conducting wire layer conduct mutually, thereby this N the first circuit substrate made N second circuit substrate; First Copper Foil and second Copper Foil are provided, a stacking described N second circuit substrate and N-1 the first circuit substrate between the first Copper Foil and the second Copper Foil, so that each first circuit substrate is between two adjacent second circuit substrates, and between two adjacent second circuit substrates first circuit substrate is only arranged, and described first Copper Foil of one step press, a N second circuit substrate, N-1 the first circuit substrate and second Copper Foil; And with described the first Copper Foil making formation the 3rd conducting wire layer, described the second Copper Foil is made formation the 4th conducting wire layer, thereby obtain the 4N layer circuit board.
A kind of multilayer circuit board adopts described manufacturing method of multi-layer circuit board to make and forms.
Compared with prior art, the manufacturing method of multi-layer circuit board that the technical program provides is made a plurality of circuit substrates simultaneously, then forms film by the mode of fitting on the surface of partial circuit substrate, and forms through hole and be formed with electric conducting material in film.Like this, as required, the stacking circuit substrate that is fitted with the circuit substrate of film and electric conducting material and is not fitted with film, thus just can obtain multilayer circuit board by one step press.Because a plurality of circuit substrates can be made simultaneously, thereby can shorten the time of circuit board making.Because each circuit substrate is made separately respectively, the mode of stack successively in the prior art can reduce the fraction defective of circuit board making.
Description of drawings
Fig. 1 is the generalized section of the copper clad laminate that provides of the technical program embodiment.
Fig. 2 is that the copper clad laminate that provides of the technical program embodiment is made the generalized section that forms behind the first circuit substrate.
Fig. 3 is the generalized section after the first circuit substrate two apparent surfaces among Fig. 2 are fitted with the first film and the second film.
Fig. 4 is interior first through hole that forms of the first film among Fig. 3, the generalized section in the second film behind formation the second through hole.
Fig. 5 is interior first electric conducting material that forms of the first through hole among Fig. 4, forms the second circuit substrate generalized section that obtains behind the second electric conducting material in the second through hole.
Fig. 6 is the generalized section of stacking the first Copper Foil, second circuit substrate, the first circuit substrate, second circuit substrate and the second Copper Foil.
Fig. 7 is the generalized section after forming the 3rd conducting wire layer and form the 4th conducting wire layer in the first Copper Foil of Fig. 6 in the second Copper Foil.
Fig. 8 forms the first welding resisting layer, the generalized section after the 4th conducting wire layer forms the second welding resisting layer on the 3rd conducting wire layer of Fig. 7.
Fig. 9 is the generalized section that stacking the first circuit substrate, second circuit substrate and first circuit substrate that provide of present technique method obtains 6-layer circuit board.
The main element symbol description
| The |
10 |
| The |
20 |
| The |
40 |
| The first through |
41 |
| The first electric conducting |
42 |
| The |
50 |
| The second through |
51 |
| The second electric conducting |
52 |
| The |
60 |
| The 3rd conducting |
61 |
| The first |
62 |
| The |
70 |
| The 4th conducting wire layer | 71 |
| The second welding resisting layer | 72 |
| Circuit board | 100、200 |
| Copper |
110 |
| The first |
111 |
| |
112 |
| The second |
113 |
| |
114 |
| The first conducting |
115 |
| The second conducting |
116 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
The below illustrates the manufacture method of the circuit board that the technical program embodiment provides to make 8-layer printed circuit board as example, and the manufacture method of described circuit board comprises the steps:
The first step sees also Fig. 1, and three two-sided copper clad laminates 110 are provided.
Two-sided copper clad laminate 110 comprises the first copper foil layer 111, insulating barrier 112 and the second copper foil layer 113 that stacks gradually.Copper clad laminate 110 can be soft copper clad laminate, also can be rigid copper clad laminate.
Second step, see also Fig. 2, at each copper clad laminate 110 interior formation conductive hole 114, and with the first copper foil layer 111 making formation the first conducting wire layer 115, the second copper foil layer 113 is made formation the second conducting wire layer 116, the first conducting wire layer 115 and the second conducting wire layer 116 conduct mutually by conductive hole 114, thereby obtain three the first circuit substrates 10.
The formation of conductive hole 114 can be adopted following method: at first, adopt the mode of laser ablation at the first copper foil layer 111 and the insulating barrier 112 interior formation through holes of each copper clad laminate 110.Then, adopt the mode of plating at the internal electroplated metal of described through hole, thereby obtain conductive hole 114.Preferably, when electroplating, the metal of plating is filled described through hole fully.
The first conducting wire layer 115 and the second conducting wire layer 116 form by image transfer technique and etch process.
In the present embodiment, the first conducting wire layer 115 and the second conducting wire layer 116 in three the first circuit substrates 10 are set according to the actual circuit board that will make, the first conducting wire layer 115 in each first circuit substrate 10 arranges with the second conducting wire layer 116 can be identical, also can be different.
The 3rd step saw also Fig. 3 to Fig. 5, and first film 40 of fitting on the first conducting wire layer 115 of two the first circuit substrates 10 therein is at the second conducting wire layer 116 applying the second film 50.At the first film 40 interior formation the first through holes 41, part the first conducting wire layer 115 exposes from the first through hole 41 bottoms, and at the second film 50 interior formation the second through holes 51, part the second conducting wire layer 116 exposes from the second through hole 51 bottoms.At the first through hole 41 interior formation the first electric conducting materials 42, at the second through hole 51 interior formation the second electric conducting materials 52, thereby the first electric conducting material 42, the first conducting wire layer 115, conductive hole 114, the second conducting wire layer 116 and the second electric conducting material 52 conduct mutually, obtain second circuit substrate 20.
In the present embodiment, the first film 40 and the second film 50 are the semi-solid preparation film.The curing temperature of the first film 40 and the second film 50 should be greater than 150 degrees centigrade.
In the present embodiment, the first through hole 41 and the second through hole 51 all adopt the mode of laser ablation to form.The first through hole 41 only runs through the first film 40, the second through holes 51 and only runs through the second film 50.
In the present embodiment, adopt the mode of type metal conductive paste at the first through hole 41 interior formation the first electric conducting materials 42, at the second through hole 51 interior formation the second electric conducting materials 52.Described metallic conduction cream can be for containing the silver slurry of organic solvent.The silver slurry that will contain organic solvent is filled in the first through hole 41 and the second through hole 51 by the mode of silk screen printing, then the first circuit substrate 10 that is printed with the silver slurry is toasted, so that described organic solvent volatilization, the silver slurry solidifies, and forms the first electric conducting material 42 and the second electric conducting material 52.In the present embodiment, the temperature that the first circuit substrate 10 that is printed with the silver slurry is toasted is 90 degrees centigrade to 100 degrees centigrade.Under this temperature, can not exert an influence to the performance of the first film 40 and the second film 50.
The 4th step, see also Fig. 6, the first Copper Foil 60 and the second Copper Foil 70 are provided, stack gradually and one step press the first Copper Foil 60, second circuit substrate 20, the first circuit substrate 10, another second circuit substrate 20 and 70 one-tenth of described second Copper Foils as a whole.
When stacking the first Copper Foil 60, second circuit substrate 20, the first circuit substrate 10, second circuit substrate 20 and the second Copper Foil 70, should guarantee the accurate contraposition between second circuit substrate 20, the first circuit substrate 10, the second circuit substrate 20.When practical operation, in carrying out stacking process, can will in second circuit substrate 20, the first circuit substrate 10, the second circuit substrate 20 registration holes be set respectively, adopt the tool have with the auspicious corresponding alignment pin of registration holes to carry out contraposition.
In the present embodiment, because relative two surfaces of second circuit substrate 20 have respectively the first film 40 and the second film 50, in the pressing process, the first film 40 and the second film 50 solidify, and the Copper Foil or the first circuit substrate 10 that bond and be adjacent, thereby in the one step press process, can be so that the first Copper Foil 60, second circuit substrate 20, the first circuit substrate 10, second circuit substrate 20 and 70 one-tenth of the second Copper Foils be as a whole.In addition, in the present embodiment, the conducting of aliging successively of the conductive hole 114,41,51 in each circuit substrate 10,20 consists of the effect of a via.In other embodiments, the conductive hole 114,41 in each circuit substrate 10,20,51 can not line up mutually, and only needing can be so that realizes between each circuit substrate 10,20 that mutual conduction gets final product.
The 5th step saw also Fig. 7, the first Copper Foil 60 was made forming the 3rd conducting wire layer 61, the second Copper Foil was made forming the 4th conducting wire layer 71.
The 3rd conducting wire layer 61 and the 4th conducting wire layer 71 can form by image transfer technique and etch process.
The 6th step saw also Fig. 8, formed the first welding resisting layer 62 on the surface of the 3rd conducting wire layer 61, formed the second welding resisting layer 72 on the surface of the 4th conducting wire layer 71, obtained multilayer circuit board 100.
The first welding resisting layer 62 and the second welding resisting layer 72 can form by the mode of solder-mask printing printing ink.The first welding resisting layer 62 for the protection of the 3rd conducting wire layer 61, the second welding resisting layer 72 for the protection of the 4th conducting wire layer 71.
Be understandable that the manufacture method of the circuit board that the technical program provides also can be applied to the making of the circuit board of other numbers of plies.See also Fig. 9, when making 6-layer circuit board, can not need the first Copper Foil 60 and the second Copper Foil 70, a second circuit substrate 20 directly is set between two the first circuit substrates 10, obtain six layers circuit board 200 through after the disposable pressing.
When being used for making more multi-layered circuit board, during such as the Floor 12 circuit board, can between the first Copper Foil 60 and the second Copper Foil 70, set gradually second circuit substrate 20, the first circuit substrate 10, second circuit substrate 20, the first circuit substrate 10 and second circuit substrate 20.Be understandable that after carrying out pressing, the surface that also is included in the conducting wire layer of the first circuit substrate 10 that exposes from both sides after the pressing forms the step of welding resisting layer.
By on can draw, when the circuit board manufacturing method that adopts the technical program to provide is made 4N layer circuit board (N is greater than or equal to 2 natural number), N second circuit substrate 20 and N-1 the first circuit substrate 10 can be set between the first Copper Foil 60 and the second Copper Foil 70, and the first circuit substrate 10 is arranged between the adjacent second circuit substrate 20, obtain through after the disposable pressing.When the manufacture method of the circuit board that adopts the technical program to provide is made 4N+2 layer circuit board (N is greater than or equal to 1 natural number), can need the first Copper Foil 60 and the second Copper Foil 70, only need N+1 the first circuit substrate 10 and N second circuit substrate 20, and each second circuit substrate 20 is arranged between the first adjacent circuit substrate 10, obtain through after the disposable pressing.
The manufacturing method of multi-layer circuit board that the technical program provides is made a plurality of circuit substrates simultaneously, then forms film by the mode of fitting on the surface of partial circuit substrate, and forms through hole and be formed with electric conducting material in film.Like this, as required, the stacking circuit substrate that is fitted with the circuit substrate of film and electric conducting material and is not fitted with film, thus just can obtain multilayer circuit board by one step press.Because a plurality of circuit substrates can be made simultaneously, thereby can shorten the time of circuit board making.Because each circuit substrate is made separately respectively, the mode of stack successively in the prior art can reduce the fraction defective of circuit board making.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (11)
1. the manufacture method of a multilayer circuit board comprises step:
2N+1 copper clad laminate is provided, and each described copper clad laminate comprises the first copper foil layer, the first insulating barrier and the second copper foil layer that stacks gradually, and wherein N is the natural number more than or equal to 1;
The first copper foil layer of each copper clad laminate is made formation the first conducting wire layer by layer, the second copper foil layer is made forming the second conducting wire layer by layer, thereby 2N+1 copper clad laminate made 2N+1 the first circuit substrate;
In 2N+1 the first circuit substrate, select N the first circuit substrate, layer by layer surface applying of the first conducting wire in this N the first circuit substrate the first film, described the first film has the first through hole, at layer by layer surface applying of the second conducting wire of this N the first circuit substrate the second film, described the second film has the second through hole, and in described the first through hole, fill the first electric conducting material, in described the second through hole, fill the second electric conducting material, described the first electric conducting material and the first conducting wire layer conduct mutually, described the second electric conducting material and the second conducting wire layer conduct mutually, thereby this N the first circuit substrate made N second circuit substrate; And
Stacking described N second circuit substrate and N+1 the first circuit substrate, so that each second circuit substrate is between two adjacent the first circuit substrates, and between two adjacent the first circuit substrates a second circuit substrate is only arranged, and the described N of an one step press second circuit substrate and N+1 the first circuit substrate, thereby obtain the 4N+2 layer circuit board.
2. the manufacture method of multilayer circuit board as claimed in claim 1 is characterized in that, described the first electric conducting material and the second electric conducting material all form by the type metal conductive paste.
3. the manufacture method of multilayer circuit board as claimed in claim 2 is characterized in that, described metallic conduction cream is the silver slurry that contains organic solvent, forms described the first electric conducting material and the second electric conducting material and comprises step:
The described silver slurry that contains organic solvent of printing in the first through hole and in the second through hole; And
Toast having printed silver-colored slurry N afterwards first circuit substrate, thus so that the organic solvent volatilization curing silver slurry in the silver slurry.
4. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterized in that, before forming the first conducting wire layer and the second conducting wire layer, also be included in the first copper foil layer and the interior step that forms conductive hole of insulating barrier of copper clad laminate, described the first conducting wire layer and the second conducting wire layer conduct mutually by described conductive hole; In the 4N+2 layer circuit board, conductive hole, the first through hole and the second through hole align mutually.
5. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterized in that, described the first through hole mode by laser ablation after the first film fits in the first conducting wire layer forms, and described the second through hole mode by laser ablation after the second film fits in the second conducting wire layer forms.
6. the manufacture method of a multilayer circuit board comprises step:
2N-1 copper clad laminate is provided, and each described copper clad laminate comprises the first copper foil layer, the first insulating barrier and the second copper foil layer that stacks gradually, and wherein N is the natural number more than or equal to 2;
The first copper foil layer of each copper clad laminate is made formation the first conducting wire layer by layer, the second copper foil layer is made forming the second conducting wire layer by layer, thereby 2N-1 copper clad laminate made 2N-1 the first circuit substrate;
In 2N-1 the first circuit substrate, select N the first circuit substrate, the first conducting wire layer surface applying the first film in this N the first circuit substrate, described the first film has the first through hole, the second conducting wire layer surface applying the second film at this N the first circuit substrate, described the second film has the second through hole, and in described the first through hole, fill the first electric conducting material, in described the second through hole, fill the second electric conducting material, described the first electric conducting material and the first conducting wire layer conduct mutually, described the second electric conducting material and the second conducting wire layer conduct mutually, thereby this N the first circuit substrate made N second circuit substrate;
First Copper Foil and second Copper Foil are provided, a stacking described N second circuit substrate and N-1 the first circuit substrate between the first Copper Foil and the second Copper Foil, so that each first circuit substrate is between two adjacent second circuit substrates, and between two adjacent second circuit substrates first circuit substrate is only arranged, and described first Copper Foil of one step press, a N second circuit substrate, N-1 the first circuit substrate and second Copper Foil;
Described the first Copper Foil is made formation the 3rd conducting wire layer, described the second Copper Foil is made forming the 4th conducting wire layer, thereby obtained the 4N layer circuit board.
7. the manufacture method of multilayer circuit board as claimed in claim 6 is characterized in that, described the first electric conducting material and the second electric conducting material all form by the type metal conductive paste.
8. the manufacture method of multilayer circuit board as claimed in claim 6 is characterized in that, described metallic conduction cream is the silver slurry that contains organic solvent, forms described the first electric conducting material and the second electric conducting material and comprises step:
The described silver slurry that contains organic solvent of printing in the first through hole and in the second through hole; And
Toast having printed silver-colored slurry N-1 afterwards first circuit substrate, thus so that the organic solvent volatilization curing silver slurry in the silver slurry.
9. the manufacture method of multilayer circuit board as claimed in claim 6, it is characterized in that, before forming the first conducting wire layer and the second conducting wire layer, also be included in the first copper foil layer and the interior step that forms conductive hole of insulating barrier of copper clad laminate, described the first conducting wire layer and the second conducting wire layer conduct mutually by described conductive hole; In the 4N layer circuit board, conductive hole, the first through hole and the second through hole align mutually.
10. the manufacture method of multilayer circuit board as claimed in claim 1, it is characterized in that, described the first through hole mode by laser ablation after the first film fits in the first conducting wire layer forms, and described the second through hole mode by laser ablation after the second film fits in the second conducting wire layer forms.
11. a multilayer circuit board is characterized in that, described multilayer circuit board adopts and makes such as the manufacture method of each described multilayer circuit board in the claim 1 to 10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210127848.1A CN103379750B (en) | 2012-04-27 | 2012-04-27 | Multilayer circuit board and preparation method thereof |
| TW101117071A TWI498067B (en) | 2012-04-27 | 2012-05-14 | Multilayer circuit board and method for manufacturing same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210127848.1A CN103379750B (en) | 2012-04-27 | 2012-04-27 | Multilayer circuit board and preparation method thereof |
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| CN103379750A true CN103379750A (en) | 2013-10-30 |
| CN103379750B CN103379750B (en) | 2016-06-01 |
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| CN201210127848.1A Active CN103379750B (en) | 2012-04-27 | 2012-04-27 | Multilayer circuit board and preparation method thereof |
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| TW (1) | TWI498067B (en) |
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| CN106550530A (en) * | 2015-09-17 | 2017-03-29 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| CN108040428A (en) * | 2017-12-12 | 2018-05-15 | 惠州市金百泽电路科技有限公司 | The production method that a kind of high-order HDI folds the rigid-flexible combined circuit plate in hole |
| CN111669906A (en) * | 2020-05-27 | 2020-09-15 | 上海美维电子有限公司 | Method for manufacturing multilayer circuit board |
| CN111698847A (en) * | 2020-06-29 | 2020-09-22 | 四川海英电子科技有限公司 | Method for accurately positioning layers of high-frequency circuit board |
| CN112449514A (en) * | 2019-08-31 | 2021-03-05 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN112543550A (en) * | 2020-11-17 | 2021-03-23 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board, board body and processing method thereof |
| CN112911830A (en) * | 2020-12-17 | 2021-06-04 | 江门崇达电路技术有限公司 | Method for manufacturing any-layer high-density interconnection flexible printed circuit board |
| CN113905511A (en) * | 2021-10-12 | 2022-01-07 | 深圳市静宇鑫照明科技有限公司 | Mixed conductive material circuit board and soldering conduction method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111698847A (en) * | 2020-06-29 | 2020-09-22 | 四川海英电子科技有限公司 | Method for accurately positioning layers of high-frequency circuit board |
| CN112543550A (en) * | 2020-11-17 | 2021-03-23 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board, board body and processing method thereof |
| CN112911830A (en) * | 2020-12-17 | 2021-06-04 | 江门崇达电路技术有限公司 | Method for manufacturing any-layer high-density interconnection flexible printed circuit board |
| CN114786367A (en) * | 2021-01-22 | 2022-07-22 | 宏恒胜电子科技（淮安）有限公司 | High-density interconnection circuit board and preparation method thereof |
| CN113905511A (en) * | 2021-10-12 | 2022-01-07 | 深圳市静宇鑫照明科技有限公司 | Mixed conductive material circuit board and soldering conduction method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI498067B (en) | 2015-08-21 |
| TW201345354A (en) | 2013-11-01 |
| CN103379750B (en) | 2016-06-01 |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |