CN103118507A - Production method of multilayer printed circuit board - Google Patents
Production method of multilayer printed circuit board Download PDFInfo
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- CN103118507A CN103118507A CN2013100367406A CN201310036740A CN103118507A CN 103118507 A CN103118507 A CN 103118507A CN 2013100367406 A CN2013100367406 A CN 2013100367406A CN 201310036740 A CN201310036740 A CN 201310036740A CN 103118507 A CN103118507 A CN 103118507A
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- copper
- epoxy resin
- printed circuit
- insulation board
- circuit board
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a production method of a multilayer printed circuit board. Two copper foil wire layers are disposed on upper and lower surfaces of a copper-clad substrate or insulating plate respectively, and circuit through holes by which the upper and lower surface are communicated are established between the layers. After wiring on the copper-clad substrate or insulating plate is complete, oxidation is performed and the copper-clad substrate or insulating plate is placed in an epoxy resin glue cell for cycle control of temperature, humidity and solid-content ratio. The copper-clad substrate or insulating plate is coated with an epoxy resin glue layer. After the epoxy resin glue layer fully solidifies, an epoxy resin thin glue layer is applied to the copper-clad substrate or insulating plate and is baked to semi-solid state. Multiple copper-clad substrates or insulating plates are stacked. After copper foils are spread to the top and bottom of the stack, the stack is subjected to high-temperature press-fitting. The press-fitted copper-clad substrates or insulating plates are subjected to surface circuit treatment, and circuit through holes are established between the plates to allow for communication of circuits in all layers. Flatness of the inner layer of the printed circuit board is improved, inner buried holes are smoothed, manufacturing yield of fine lines and uniformity of line width are improved, and bending and warping degree of the printed circuit board is lowered.
Description
Technical field
The present invention relates to the production procedure of PCB Layer increasing method, relate in particular to a kind of manufacture method of multilayer printed circuit board.
Background technology
due to improving rapidly of volume circuit, speed as the volume circuit accelerates, area reduces, radiating requirements increases flesh, impact immediately the structure packing technique of volume circuit, nowadays new structure packing technique and the compact market demand, impact again the technology of multi-layer sheet, connected (the High Density Interconnection of the high density of at present common name namely, HDI) printed circuit board (Printed Circuit Board, PCB), for high density, the fine rule road, the printed wiring board of the blind buried via hole design of tool, control the difficulty or ease of the smooth and blind buried via hole filler of thickness, present important problem.For solving this difficulty, the technology production procedure of the Epoxy Resin Thin Core Layer increasing method of special construction one cover high-reliability.Prepreg hot pressing Layer increasing method is arranged in prior art, and method is as follows: make circuit and build through hole circuit communication upper and lower surface at interlayer cloth on copper-clad base plate or insulation board; After this substrate or insulation board circuit are completed, deceive brown and process; Interior interlayer in every two-layer substrate sandwiches heat insulating lamina (prepreg, Prepreg, resin add the film that glass cloth forms); At last multilager base plate top and bottom are respectively added a Copper Foil hot pressing and form multilayer printed circuit board.The shortcoming of this kind method is: in hot pressing, the limited glue amount of Prepreg is for filling up internal layer circuit erosion copper district, and after hot pressing, outer copper face evenness is not good; Blind buried via hole plate, the filler difficulty easily causes plate bursting; Prepreg is take glass cloth as fid, electrically DK value higher (5.4 left and right); In hot pressing, Press Flow is difficult for grasping, and the finished product thickness variation is large.
Summary of the invention
The object of the invention is exactly in order to make up the defective of prior art, provide occur in a kind of manufacturing process that can effectively solve multilayer printed circuit board that evenness is not good, the manufacture method of the multilayer printed circuit board of the problem such as easy plate bursting, finished product thickness differ greatly.
The present invention is achieved by the following technical solutions:
A kind of manufacture method of multilayer printed circuit board is characterized in that: comprise the following steps:
(1) upper and lower faces at copper-clad base plate or insulation board arranges respectively one deck Copper Foil wiring layer and builds circuit through hole connection upper and lower faces at interlayer cloth;
(2) after described copper-clad base plate or insulation board circuit are completed, deceive brown and process, then insert loop control temperature, humidity, admittedly contain the epoxide-resin glue groove of ratio, enclose one deck epoxy resin glue and solidify fully;
(3) more described copper-clad base plate or insulation board are enclosed one deck epoxy resin thin layer glue and be baked to semi-cured state;
(4) many described copper-clad base plates or insulation board are superimposed together, and carry out high-temperature laminating after Copper Foil on the two-berth;
(5) copper-clad base plate after pressing or insulation board are carried out surface lines is processed and between plate cloth build the circuit through hole and be communicated with each sandwich circuit.
In after internal layer circuit is completed black brown, internal layer being inserted the epoxide-resin glue groove, this glue groove is similar with the glue that is used for the making internal layer, two-sided one deck epoxy resin glue of enclosing of internal layer when taking out internal layer, glue can be become semi-solid preparation or solidify fully through overbaking again, also can repeat this step, to reach better flatness and bondline thickness;
When internal layer has the buried via hole design, can improve the flow direction of glue groove, to the solid glue of buried via hole, completing buried via hole and reach smoothing after overbaking;
Two internal layers for the multi-layer sheet outermost, no matter use individual Copper Foil when the multi-layer sheet pressing, or the continous way Copper Foil all can be with the outer copper foil pressing, this processing procedure can be completed in the PCB processing procedure thus, no longer rely on " gum Copper Foil ", not only reduce costs the dielectric thickness that also can freely determine skin with the yield of raising blind hole;
Flatness rising due to each internal layer, the buried via hole smooth flat that also becomes, arrange in pairs or groups again with the Prepreg of even thickness, under suitable hot pressing environment, must improve the flatness of multi-layer sheet, after flatness promoted, the coating of photoresist is planarization thereupon also, the uniformity of relative image exposure development has also promoted naturally, and this has pure front to improve to the HDI plate;
After the gross thickness improving uniformity of multi-layer sheet, the nature can reduce because of uneven thickness produce within stress; And under the different temperatures environment, what the plate bent plate stuck up extremely also reduces thereupon.
Advantage of the present invention is: the problems such as the present invention efficiently solves that the evenness that occurs is not good in the manufacture method of existing multilayer printed circuit board, easy plate bursting, finished product thickness differ greatly, improved the internal layer flatness, the internal layer buried via hole reaches smoothing, improve the fine ratio of product of fine rule and the uniformity of live width, reduced the degree that the plate bent plate sticks up.
Description of drawings
Fig. 1 is the structural representation of each step of the present invention.
Embodiment
As shown in Figure 1, a kind of manufacture method of multilayer printed circuit board is characterized in that: comprise the following steps:
(1) upper and lower faces at copper-clad base plate or insulation board 1 arranges respectively one deck Copper Foil wiring layer 2 and builds circuit through hole 3 connection upper and lower faces at interlayer cloth;
(2) after described copper-clad base plate or insulation board 1 circuit are completed, deceive brown and process, then insert loop control temperature, humidity, admittedly contain the epoxide-resin glue groove of ratio, enclose one deck epoxy resin glue 4 and solidify fully;
(3) more described copper-clad base plate or insulation board 1 are enclosed one deck epoxy resin thin layer glue 5 and be baked to semi-cured state;
(4) many described copper-clad base plates or insulation board 1 are superimposed together, and carry out high-temperature laminating after Copper Foil 6 on the two-berth;
(5) copper-clad base plate after pressing or insulation board 1 are carried out surface lines is processed and between plate cloth build circuit through hole 3 and be communicated with each sandwich circuits.
Claims (1)
1. the manufacture method of a multilayer printed circuit board is characterized in that: comprise the following steps:
(1) upper and lower faces at copper-clad base plate or insulation board arranges respectively one deck Copper Foil wiring layer and builds circuit through hole connection upper and lower faces at interlayer cloth;
(2) after described copper-clad base plate or insulation board circuit are completed, deceive brown and process, then insert loop control temperature, humidity, admittedly contain the epoxide-resin glue groove of ratio, enclose one deck epoxy resin glue and solidify fully;
(3) more described copper-clad base plate or insulation board are enclosed one deck epoxy resin thin layer glue and be baked to semi-cured state;
(4) many described copper-clad base plates or insulation board are superimposed together, and carry out high-temperature laminating after Copper Foil on the two-berth;
(5) copper-clad base plate after pressing or insulation board are carried out surface lines is processed and between plate cloth build the circuit through hole and be communicated with each sandwich circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100367406A CN103118507A (en) | 2013-01-31 | 2013-01-31 | Production method of multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100367406A CN103118507A (en) | 2013-01-31 | 2013-01-31 | Production method of multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103118507A true CN103118507A (en) | 2013-05-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100367406A Pending CN103118507A (en) | 2013-01-31 | 2013-01-31 | Production method of multilayer printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN103118507A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039092A (en) * | 2014-06-09 | 2014-09-10 | 沪士电子股份有限公司 | Producing method for optimizing board thickness uniformity of multilayer circuit board |
| CN105451472A (en) * | 2014-08-26 | 2016-03-30 | 深南电路有限公司 | Laminated circuit board processing method and laminated circuit board |
| CN105451428A (en) * | 2014-08-26 | 2016-03-30 | 深南电路有限公司 | Laminated circuit board processing method and laminated circuit board |
| CN112533381A (en) * | 2020-12-01 | 2021-03-19 | 生益电子股份有限公司 | Method for manufacturing mother board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1465213A (en) * | 2001-07-18 | 2003-12-31 | 松下电器产业株式会社 | Circuit formed substrate and method of manufacturing circuit formed substrate |
| CN101225276A (en) * | 2008-01-18 | 2008-07-23 | 义乌市先通电子材料有限公司 | Method for preparing copper clad laminate with high glass transition temperature |
| CN102002208A (en) * | 2009-09-03 | 2011-04-06 | 联茂(无锡)电子科技有限公司 | Epoxy resin composition and adhesive sheet and substrate made by same |
| CN102514353A (en) * | 2011-12-13 | 2012-06-27 | 广东生益科技股份有限公司 | Production method of copper-clad plate and copper-clad plate |
| CN102523685A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacturing method for printed circuit board (PCB) with stepped grooves |
-
2013
- 2013-01-31 CN CN2013100367406A patent/CN103118507A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1465213A (en) * | 2001-07-18 | 2003-12-31 | 松下电器产业株式会社 | Circuit formed substrate and method of manufacturing circuit formed substrate |
| CN101225276A (en) * | 2008-01-18 | 2008-07-23 | 义乌市先通电子材料有限公司 | Method for preparing copper clad laminate with high glass transition temperature |
| CN102002208A (en) * | 2009-09-03 | 2011-04-06 | 联茂(无锡)电子科技有限公司 | Epoxy resin composition and adhesive sheet and substrate made by same |
| CN102523685A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacturing method for printed circuit board (PCB) with stepped grooves |
| CN102514353A (en) * | 2011-12-13 | 2012-06-27 | 广东生益科技股份有限公司 | Production method of copper-clad plate and copper-clad plate |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039092A (en) * | 2014-06-09 | 2014-09-10 | 沪士电子股份有限公司 | Producing method for optimizing board thickness uniformity of multilayer circuit board |
| CN105451472A (en) * | 2014-08-26 | 2016-03-30 | 深南电路有限公司 | Laminated circuit board processing method and laminated circuit board |
| CN105451428A (en) * | 2014-08-26 | 2016-03-30 | 深南电路有限公司 | Laminated circuit board processing method and laminated circuit board |
| CN105451472B (en) * | 2014-08-26 | 2018-10-23 | 深南电路有限公司 | A kind of processing method and stacked wiring board of stacked wiring board |
| CN105451428B (en) * | 2014-08-26 | 2018-10-26 | 深南电路有限公司 | A kind of processing method and stacked wiring board of stacked wiring board |
| CN112533381A (en) * | 2020-12-01 | 2021-03-19 | 生益电子股份有限公司 | Method for manufacturing mother board |
| CN112533381B (en) * | 2020-12-01 | 2022-02-15 | 生益电子股份有限公司 | Method for manufacturing mother board |
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Application publication date: 20130522 |