CN107041082A - The PCB process for pressing of dissymmetrical structure - Google Patents

The PCB process for pressing of dissymmetrical structure Download PDF

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Publication number
CN107041082A
CN107041082A CN201611023029.7A CN201611023029A CN107041082A CN 107041082 A CN107041082 A CN 107041082A CN 201611023029 A CN201611023029 A CN 201611023029A CN 107041082 A CN107041082 A CN 107041082A
Authority
CN
China
Prior art keywords
pieces
pressing
pcb
copper foil
dissymmetrical
Prior art date
Application number
CN201611023029.7A
Other languages
Chinese (zh)
Inventor
张华勇
敖四超
钟宇玲
寻瑞平
Original Assignee
江门崇达电路技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 江门崇达电路技术有限公司 filed Critical 江门崇达电路技术有限公司
Priority to CN201611023029.7A priority Critical patent/CN107041082A/en
Publication of CN107041082A publication Critical patent/CN107041082A/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets

Abstract

The invention belongs to PCB manufactures field there is provided a kind of PCB process for pressing of dissymmetrical structure, the beneficial effects of the present invention are:By carrying out gong groove processing to core material, core material is separated into multiple zonules, is conducive to balancing the internal stress of levels PP pieces, alleviates dissymmetrical structure PCB plate Qu Chengdu.

Description

The PCB process for pressing of dissymmetrical structure

Technical field

Field is manufactured the present invention relates to PCB, a kind of PCB process for pressing of dissymmetrical structure is referred in particular to.

Background technology

PCB (Printed Circuit Board's writes a Chinese character in simplified form) also known as printed circuit board (PCB), PCB from individual layer develop into dual platen, Multi-layer sheet and flex plate, and constantly develop to high accuracy, high density and high reliability direction.Multi-layer PCB is in adjacent lines layer Between it is general press what is bonded together by prepreg (PP pieces, polypropylene material) glue-line, be specifically between adjacent layers The PP pieces of whole are superimposed respectively, then adjacent lines layer is bonded together by PP pieces by hot pressing.

In the conventional design of multilayer circuit board, the PP pieces between line layer are all identical thickness, by taking 4 laminates as an example, pressure L1-L2 layers are closed using 2 PP pieces, L3-L4 layers are also, using 2 identical PP pieces, to belong to full symmetric structure.However, due to Client has particular/special requirement to PCB, such as impedance matching the problem of, often L1-L2 layers are carried with L3-L4 layers of dielectric thickness Go out inconsistent requirement, when making this PCB, the PP pieces quantity or type of levels are different.

PP pieces are in semi-cured state (B-stage) at normal temperatures, after heating resin start to melt, flow, gel it is last Hardening, during which occurs macromolecular polymerization reaction, is converted into solid polymer, reaches solid state (C-stage).PP pieces are in pressing During, by flowable state to solid state when, can band flexible-core plate shrink, when levels PP pieces thickness or type are different, produce Internal stress it is also inconsistent, cause core plate to be bent to the one side of medium thickness, produced according to existing conventional compression method, PCB's Curvature can be more than 0.75%, cause client's component leg failure welding in SMT below, influence electric property.

The content of the invention

The technical problems to be solved by the invention are:Levels PP pieces variable thickness is solved to cause to cause to occur during pressing PCB The problem of plate song transfinites.

In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is that a kind of PCB of dissymmetrical structure presses work Skill, is comprised the steps of successively:

In S1, internal layer circuit film design cycle, increase on the edges of boards tooling hole of the film for positioning molding gong groove Positioning hole is marked;

S2, to internal layer circuit etching finish after, practiced shooting using X-ray, and with drill bit core plate positioning hole mark on brill Go out positioning hole;

S3, shaping gong groove is carried out to core plate handle;

S4, by core plate, PP pieces and copper foil carry out lamination pressing processing;

S5, the multilayer circuit board progress microetch completed to pressing subtract Copper treatment.

Further, increased positioning hole has two groups in step S1, respectively positioned at the adjacent both sides of the film.

Further, the aperture of the positioning hole is 1.5mm.

Further, step S3 gong groove processing is to go out shaping to gong between the periphery of core plate longer side and a shorter side and SET Groove.

Further, the groove width of the forming tank is 1.0mm, and flute length is 50-100mm.

Further, in step S4, PP pieces include the first PP pieces and the 2nd PP pieces, wherein the first PP pieces thickness is more than second PP pieces;Copper foil includes the first copper foil and the second copper foil, wherein the first copper thickness is more than the second copper foil.

Further, by core plate, the first PP pieces, the 2nd PP pieces, the first copper foil and the second copper foil according to the first copper foil, second Pressed after PP pieces, core plate, the first PP pieces, the order lamination of the second copper foil.

Further, step S5 microetch subtracts in Copper treatment, using the copper foil of dry film covering protection second, to the first copper foil one Side carries out microetch processing.

Further, the step of drilling, heavy copper, plating, outer graphics, welding resistance, shaping is also included after step S5 successively.

The beneficial effects of the present invention are:By carrying out gong groove processing to core material, core material is separated into multiple Zonule, is conducive to balancing the internal stress of levels PP pieces, alleviates dissymmetrical structure PCB plate Qu Chengdu.

Brief description of the drawings

The idiographic flow of the present invention is described in detail below in conjunction with the accompanying drawings:

Fig. 1 is schematic flow sheet of the invention;

Fig. 2 is core plate structure schematic diagram of the invention;

Fig. 3 is PCB laminated construction schematic diagrames of the invention.

1- core plates;2- forming tanks;3-SET;11- thickness copper foils;The thin PP pieces of 12-;13- core plates;14- thickness PP pieces;The thin copper of 15- Paper tinsel.

Embodiment

To describe the technology contents of the present invention in detail, feature, the objects and the effects being constructed, below in conjunction with embodiment And coordinate accompanying drawing to be explained in detail.

Referring to Fig. 1, a kind of PCB process for pressing of dissymmetrical structure, is comprised the steps of successively:

In S1, internal layer circuit film design cycle, increase on the edges of boards tooling hole of the film for positioning molding gong groove Positioning hole;

S2, to internal layer circuit etching finish after, practiced shooting using X-ray, and positioning hole is got out on core plate with drill bit;

S3, shaping gong groove is carried out to core plate handle;

S4, by core plate, PP pieces and copper foil carry out lamination pressing processing;

S5, the multilayer circuit board progress microetch completed to pressing subtract Copper treatment.

It was found from foregoing description, the beneficial effects of the present invention are:By carrying out gong groove processing to core material, by internal layer Core plate is separated into multiple zonules, is conducive to balancing the internal stress of levels PP pieces, alleviates dissymmetrical structure PCB plate Qu Cheng Degree.

Implement example

As shown in Figure 2 and Figure 3, four layers of asymmetric pressing structure PCB of one kind, using two PP pieces between wherein L1-L2 layers, Using three PP pieces between L3-L4 layers, the copper thickness of customer requirement L1, L4 layer is 1OZ.

First in the edges of boards increase positioning hole mark of the core plate film, through overexposure by positioning hole marking transfer to core plate, Then according to positioning hole be marked at the long and short side of core plate edges of boards also have SET between gong go out forming tank, then with 2OZ copper foils, two PP Piece, core plate, three PP pieces, the laminate structures of 1OZ copper foils carry out lamination, are then pressed, are pasted after the completion of pressing in 1OZ copper faces Dry film, then PCB progress microetch is subtracted into Copper treatment, 2OZ copper thicknesses are reduced into 1OZ, that is, four layers obtained required by client are not right Claim pressing structure PCB.

Embodiment 1

Increased positioning hole is marked with two groups in step S1, respectively positioned at the adjacent both sides of the film.

Two groups of positioning holes are set to be marked with beneficial to raising precision.

Embodiment 2

The aperture of the positioning hole is 1.5mm.

Embodiment 3

Step S3 gong groove processing is to go out forming tank to gong between the periphery of core plate longer side and a shorter side and SET.

By core plate periphery and SET between gong have forming tank, bulk core plate is divided into multiple zonules, be conducive to release Internal stress, and levels resin realizes that part is connected by forming tank, is conducive to balancing levels internal stress.

Embodiment 4

The groove width of the forming tank is 1.0mm, and flute length is 50-100mm.

Be conducive to setting between core plate edges of boards and SET, without influenceing other hole positions and SET plates.

Embodiment 5

In step S4, PP pieces include the first PP pieces and the 2nd PP pieces, wherein the first PP pieces thickness is more than the 2nd PP pieces;Copper foil Including the first copper foil and the second copper foil, wherein the first copper thickness is more than the second copper foil.

By adjusting the thickness of pressing copper foil, alleviate the pulling force that resin shrinkage is brought, reduce plate curvature.

Embodiment 6

By core plate, the first PP pieces, the 2nd PP pieces, the first copper foil and the second copper foil according to the first copper foil, the 2nd PP pieces, core Pressed after plate, the first PP pieces, the order lamination of the second copper foil.

The relatively thin one side of dielectric layer (PP pieces) uses thicker copper foil, the receipts for being conducive to the one side for alleviating medium thickness to bring Contracting pulling force, alleviates plate curvature.

Embodiment 7

Step S5 microetch subtracts in Copper treatment, using the copper foil of dry film covering protection second, the first copper foil side is carried out micro- Erosion is handled.

The unnecessary copper of etching off, makes copper thickness reach the requirement of client.

Embodiment 8

Also include the step of drilling, heavy copper, plating, outer graphics, welding resistance, shaping after step S5 successively.

PCB production efficiency can be ensured well by this flow.

Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair Equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills Art field, is included within the scope of the present invention.

Claims (9)

1. a kind of PCB process for pressing of dissymmetrical structure, is comprised the steps of successively:
In S1, internal layer circuit film design cycle, the positioning for positioning molding gong groove is increased on the edges of boards tooling hole of the film Hole is marked;
S2, internal layer circuit etching is finished after, practiced shooting using X-ray, and got out on the positioning hole mark of core plate with drill bit it is fixed Position hole;
S3, shaping gong groove is carried out to core plate handle;
S4, by core plate, PP pieces and copper foil carry out lamination pressing processing;
S5, the multilayer circuit board progress microetch completed to pressing subtract Copper treatment.
2. the PCB process for pressing of dissymmetrical structure as claimed in claim 1, it is characterised in that:Increased positioning in step S1 Hole has two groups, respectively positioned at the adjacent both sides of the film.
3. the PCB process for pressing of dissymmetrical structure as claimed in claim 2, it is characterised in that:The aperture of the positioning hole is 1.5mm。
4. the PCB process for pressing of dissymmetrical structure as claimed in claim 1, it is characterised in that:Step S3 gong groove is handled Forming tank is gone out to gong between the periphery of core plate longer side and a shorter side and SET.
5. the PCB process for pressing of dissymmetrical structure as claimed in claim 4, it is characterised in that:The groove width of the forming tank is 1.0mm, flute length is 50-100mm.
6. the PCB process for pressing of dissymmetrical structure as claimed in claim 1, it is characterised in that:In step S4, PP pieces include the One PP pieces and the 2nd PP pieces, wherein the first PP pieces thickness is more than the 2nd PP pieces;Copper foil includes the first copper foil and the second copper foil, wherein First copper thickness is more than the second copper foil.
7. the PCB process for pressing of dissymmetrical structure as claimed in claim 6, it is characterised in that:By core plate, the first PP pieces, Two PP pieces, the first copper foil and the second copper foil are folded according to the order of the first copper foil, the 2nd PP pieces, core plate, the first PP pieces, the second copper foil Pressed after plate.
8. the PCB process for pressing of dissymmetrical structure as claimed in claim 1, it is characterised in that:Step S5 microetch subtracts at copper In reason, using the copper foil of dry film covering protection second, microetch processing is carried out to the first copper foil side.
9. the PCB process for pressing of dissymmetrical structure as claimed in claim 1, it is characterised in that:Also wrapped successively after step S5 Include the step of drilling, heavy copper, plating, outer graphics, welding resistance, shaping.
CN201611023029.7A 2016-11-18 2016-11-18 The PCB process for pressing of dissymmetrical structure CN107041082A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611023029.7A CN107041082A (en) 2016-11-18 2016-11-18 The PCB process for pressing of dissymmetrical structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107734852A (en) * 2017-09-22 2018-02-23 郑州云海信息技术有限公司 A kind of pcb board design method and pcb board for realizing uniformly folded structure machinability

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009105345A (en) * 2007-10-25 2009-05-14 Ngk Spark Plug Co Ltd Wiring substrate with built-in plate-like component
EP2127509A2 (en) * 2006-12-22 2009-12-02 Robert Bosch GmbH Pressure compensation element for a housing and electrical automotive component comprising said pressure compensation element
CN102036483A (en) * 2010-09-30 2011-04-27 北大方正集团有限公司 Method and system for forming blind gongs on printed circuit board (PCB) and circuit board
CN103200770A (en) * 2013-04-15 2013-07-10 竞陆电子(昆山)有限公司 Asymmetric pressing control slab warping structure of multilayer printed circuit board
CN105430944A (en) * 2015-11-13 2016-03-23 广州兴森快捷电路科技有限公司 Manufacturing method for multi-layer printed circuit board and multi-layer printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2127509A2 (en) * 2006-12-22 2009-12-02 Robert Bosch GmbH Pressure compensation element for a housing and electrical automotive component comprising said pressure compensation element
JP2009105345A (en) * 2007-10-25 2009-05-14 Ngk Spark Plug Co Ltd Wiring substrate with built-in plate-like component
CN102036483A (en) * 2010-09-30 2011-04-27 北大方正集团有限公司 Method and system for forming blind gongs on printed circuit board (PCB) and circuit board
CN103200770A (en) * 2013-04-15 2013-07-10 竞陆电子(昆山)有限公司 Asymmetric pressing control slab warping structure of multilayer printed circuit board
CN105430944A (en) * 2015-11-13 2016-03-23 广州兴森快捷电路科技有限公司 Manufacturing method for multi-layer printed circuit board and multi-layer printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107734852A (en) * 2017-09-22 2018-02-23 郑州云海信息技术有限公司 A kind of pcb board design method and pcb board for realizing uniformly folded structure machinability

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