CN206332909U - A kind of combined type folds structure mould release membrance - Google Patents
A kind of combined type folds structure mould release membrance Download PDFInfo
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- CN206332909U CN206332909U CN201621348238.4U CN201621348238U CN206332909U CN 206332909 U CN206332909 U CN 206332909U CN 201621348238 U CN201621348238 U CN 201621348238U CN 206332909 U CN206332909 U CN 206332909U
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Abstract
Structure mould release membrance is folded the utility model discloses a kind of combined type, including one layer of intermediate layer, two buffer layer and two layers of release layer, intermediate layer is PE layers, pet layer, PP layers or PA layers, release layer is TPX layers, the hardness of cushion is less than the hardness in intermediate layer, cushion and release layer constitute the folded structure that vicat softening temperature is 150 170 DEG C, the temperature of current FPC process for pressing is general at 160 180 DEG C, in bonding processes, mould release membrance of the present utility model can fully soften, and the pit and corner along PCB surface are stayed and are close to, filling and laminating effect are good, play splendid resistance glue effect, and have the advantages that levelability is good and easily removes, it is simultaneously not siliceous, plasticizer and halogen, environmental protection, remove the problem of rear flexible PCB is not in secondary pollution.
Description
Technical field
The utility model is related to mould release membrance and its preparing technical field, more particularly to a kind of flexible PCB (FPC) pressing
Combined type folds structure mould release membrance.
Background technology
Flexible PCB (Flexible Printed Circuit Board) referred to as " soft board ", FPC is commonly called as in industry, is had
Have the advantages that many rigid printed circuit boards do not possess, for example it can be with free bend, winding, folding.It can be contracted significantly using FPC
The volume of small electronic product, the need for applicable electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC exists
Obtained on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, palm PC, digital camera or product
It is widely applied.
FPC is mainly formed by flexible copper clad substrate and diaphragm through high-temperature laminating, and diaphragm is that one kind is coated with sticker
Heat resistant resin film, for insulate and circuit protection.To avoid bonding processes center platen and flexible PCB from occurring bonding or damaging
It is bad, it is ensured that because the sticker that high temperature is melted out does not damage flexible PCB, and separate layer need to be set between pressing plate and flexible PCB,
To ensure the quality of product in hot pressing, its separate layer is that flexible circuit board compression moulding shares release liners (film), it is desirable in hot pressing
The middle sticker for ensureing to overflow is not bonded on flexible copper clad substrate, and is separated very well with flexible PCB after pressing.
Current mould release membrance (paper) is generally PET mould release membrances (paper), i.e., thin film layer is combined on body paper or intermediate layer
(CPP or PET), is coated with one layer of silicone oil parting agent layer composition, and above-mentioned described soft board is pressed with release (film) paper soon, such as Fig. 1 with
Shown in Fig. 2, after FPC pressings, release and resistance glue poor performance is simultaneously difficult to control to, easy excessive glue and residuing in need exposed circuit it
Outside, short circuit or failure welding are caused；For above-mentioned excessive glue situation, at present mostly using chemical agent, plasma-based slagging-off or frosted
The mode of removal removes the part glue of circuit surface, not only time-consuming, increase cost, and yield is relatively low；And PET from
Type film A100 silicone oil parting agent layer adherence is excessive, and cull is left when removing, and secondary pollution, Er Qiexu can be caused to circuit board
Manually to remove, cost can be increased, while surface is siliceous, pollute environment.
In order to overcome disadvantages mentioned above, the positive research and innovation of the design people, to create a kind of flexible PCB (FPC) pressure
The combined type shared folds structure mould release membrance.
Utility model content
The utility model folds structure mould release membrance mainly solving the technical problems that providing a kind of combined type, not only with resistance colloidality
Can good, glue-line flow uniformity is good and the advantage that easily removes, while not siliceous, environmental protection, and flexible PCB is not in two
The problem of secondary pollution.
In order to solve the above technical problems, the technical scheme that the utility model is used is：A kind of combined type is provided and folds structure
Mould release membrance, including intermediate layer, release layer and hardness are less than the cushion in the intermediate layer；
The intermediate layer be PE layers, pet layer, PP layers or PA layers；The intermediate layer has relative upper and lower surface；
The cushion has two layers and is respectively upper cushion and bottom breaker, the upper cushion and the lower buffering
Layer is respectively formed in the upper and lower surface in the intermediate layer；
The release layer has two layers and is respectively upper release layer and lower release layer, the upper release layer and it is described under it is release
Layer is all TPX layers；The upper release layer is formed at the upper surface of the upper cushion, and the upper cushion bonding it is described on from
Type layer and the intermediate layer；The lower release layer is formed at the lower surface of the bottom breaker, and bottom breaker bonding institute
State lower release layer and the intermediate layer.
In order to solve the above technical problems, the further technical scheme that the utility model is used is：
The cushion and the release layer constitute the folded structure that vicat softening temperature is 150-170 DEG C.
Further say, the thickness of the upper cushion and the bottom breaker is all 10-100 μm.
Further say, the thickness in the intermediate layer is 12-50 μm.
Further say, the thickness of the upper release layer and the lower release layer is all 10-40 μm.
Further say, it is that flexible circuit board compression moulding shares mould release membrance that the combined type, which folds structure mould release membrance,.
Further say, the combined type folds structure mould release membrance and the glue overflow amount of glue-line after pressing is controlled within 2mil.
The beneficial effects of the utility model are：The utility model includes intermediate layer, upper and lower cushion and upper and lower release layer
It is totally five layers, rational in infrastructure, therefore the utility model at least has advantages below：
First, the hardness of cushion of the present utility model is less than the hardness in intermediate layer, and cushion and folding that release layer is constituted
The vicat softening temperature of structure is at 150-170 DEG C, and the temperature of current FPC process for pressing is general at 160-180 DEG C, of the present utility model
This firmness change and vicat softening temperature are not higher than the setting of process for pressing temperature so that in bonding processes, mould release membrance
Can fully it soften, and pit along PCB surface and corner stay and are close to, and effect of filling and fit is good, plays splendid
Resistance glue effect, to the control of glue overflow amount up to 2mil within, the pressure programming of high-precision circuit board can be competent at completely, enters one
Step promotes electronic product and the miniaturization of fine equipment；It is additionally, since in pressing with certain levelability, can be to prevent
Only high-accuracy FPC presses unreal and bubble generation；
2nd, the utility model is due to splendid resistance colloidality energy, to the control of glue overflow amount up to 2mil within, can be with complete
The pressing of high-precision circuit board is appointed in complete victory, without being removed the gred or frosted to excessive glue chemical agent, plasma-based as traditional mould release membrance
The process of removal, therefore, reduces process, saves man-hour and cost, improve production efficiency and yield；
3rd, release layer of the present utility model is poly- 4- methylpentenes layer, and after hot pressing softening, viscosity is smaller, and mould release membrance is easy to
Remove, and cull is free of after removing, secondary pollution will not be caused to circuit board, it is not necessary to artificial to remove, reduce operational sequence, carry
High efficiency, is applicable to multi-layer FPC because viscosity is small and presses simultaneously, further improve production efficiency；
4th, the utility model not silicate-containing oil and plasticizer, mould release membrance will not cause secondary pollution to circuit board after removing, and
And environmental protection；
5th, the utility model because its outermost release layer is employed poly- 4- methylpentenes layer, with levelability, low suction
Water rate and antistatic performance so that mould release membrance of the present utility model, which has, to be prevented from mutually transferring between FPC products, prevents electrostatic,
Chemical resistance is strong and the low advantage of water absorption rate；
6th, it is halogen-free to meet environmental requirement.
Described above of the present utility model is only the general introduction of technical solutions of the utility model, in order to better understand this
The technological means of utility model, and can be practiced according to the content of specification, below with preferred embodiment of the present utility model
And coordinate accompanying drawing to describe in detail as after.
Brief description of the drawings
Fig. 1 is that the PET mould release membrances of prior art press structural representation when completing not removing PET mould release membrances；
Fig. 2 is that the PET mould release membrances pressing of prior art completes and removes the structural representation after PET mould release membrances；
Fig. 3 is structural representation of the present utility model；
Folded structure schematic diagram when Fig. 4 is the utility model pressing；
Fig. 5 is structural representation when the utility model pressing completes not removing mould release membrance；
Fig. 6 is that the utility model pressing completes and removes the structural representation after mould release membrance；
Each several part mark is as follows in accompanying drawing：
A100-PET mould release membrances；
Under the upper release layer of 100- mould release membrances, 101-, the upper cushions of 102-, 103- intermediate layers, 104- bottom breakers, 105- from
Type film layer；
200- top boards；300- diaphragms, 301- glue-lines；400- copper clad laminates, 401- copper foil circuits；500- lower platens.
Embodiment
Illustrate embodiment of the present utility model below by way of particular specific embodiment, those skilled in the art can
Advantage of the present utility model and effect are understood by content disclosed in the present specification easily.The utility model can also it is other not
Same mode is practiced, i.e. under the scope of without departing substantially from disclosed in the utility model, can give different modifications and change.
Embodiment：A kind of combined type folds structure mould release membrance 100, as shown in figure 3, including intermediate layer 103, release layer and hardness
Less than the cushion in the intermediate layer 103；
The intermediate layer 103 be PE (polyethylene) layer, PET (PET) layer, PP (polypropylene) layers or
PA (polyamide-based resin) layer；The intermediate layer 103 has relative upper and lower surface；
The cushion has two layers and is respectively upper cushion 102 and bottom breaker 104, the upper He of cushion 102
The bottom breaker 104 is respectively formed in the upper and lower surface in the intermediate layer 103；
The release layer has two layers and is respectively upper release layer 101 and lower release layer 105, the upper He of release layer 101
The lower release layer 105 is all TPX (poly- 4- methylpentenes) layer；The upper release layer 101 is formed at the upper cushion 102
Upper surface, and the upper cushion 102 is bonded the upper release layer 101 and the intermediate layer 103；The shape of lower release layer 105
The lower surface of bottom breaker 104 described in Cheng Yu, and the bottom breaker 105 is bonded the lower release layer 104 and the intermediate layer
103。
The hardness of the upper cushion 102 and the bottom breaker 104 is between release layer and intermediate layer, and its material can
To be by TPX (poly- 4- methylpentenes), PE (polyethylene), PP (polypropylene) and EMMA (ethylene methyl methacrylate copolymerization
Thing), one or more compositions in EMA (ethylene-methyl acrylate copolymer) and EVA (ethylene-vinyl acetate copolymer).
The cushion and the release layer constitute the folded structure that vicat softening temperature is 150-170 DEG C.
The thickness in the intermediate layer 103 is 12-50 μm, and the thickness of the upper cushion 102 and the bottom breaker 104 is all
For 10-100 μm, the thickness of the upper release layer 101 and the lower release layer 105 is 10-40 μm.
It is that flexible circuit board compression moulding shares mould release membrance that the combined type, which folds structure mould release membrance 100,.
The resistance glue amount that the combined type folds structure mould release membrance 100 is 2mil, i.e., the control to excessive glue is within 2mil.
Operation principle and the course of work of the present utility model are as follows：
Mould release membrance is used for folded structure during flexible PCB hot pressing process, as shown in figure 4, being followed successively by pressure from top to bottom
Plate 200, mould release membrance 100, diaphragm 300, copper clad laminate 400 (upper strata of copper clad laminate 400 is copper foil circuit 401) and lower platen
500, the folded structure is pressed using 160-180 DEG C of temperature, it is hard due to cushion of the present utility model in bonding processes
Degree is less than the hardness in intermediate layer 101, and the vicat softening temperature of folded structure that cushion and release layer are constituted is at 150-170 DEG C,
Traditional release film hardness is high and is difficult softening, during hot pressing, the pit and corner of traditional mould release membrance for PCB surface
Laminating effect it is poor, even the mould release membrance traditional in high-temperature laminating also can not be complete with the pit of PCB surface and corner
, there is space, and then easily excessive glue, therefore resistance glue poor performance, while the glue-line 301 of diaphragm 300 can be caused to flow in full laminating
Property it is poor, easily produce bubble, influence following process and properties of product, as depicted in figs. 1 and 2；
And this firmness change of the present utility model and vicat softening temperature are not higher than the setting of process for pressing temperature, make
In bonding processes, mould release membrance can fully soften, and pit along PCB surface and corner stay and be close to, and fill
And laminating effect is good, plays splendid resistance glue effect, to the control of glue overflow amount up to 2mil within, prevent the glue of diaphragm 300
Uneven and bubble the generation of the flowing of layer 301, the pressure programming of high-precision circuit board can be competent at completely, further promotes electronics production
The miniaturization of product and fine equipment；It is additionally, since in pressing with certain levelability, high-accuracy FPC can be prevented
Unreal and bubble the generation of pressing, as shown in Figure 5 and Figure 6.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalent structure made using the utility model specification and accompanying drawing content, or directly or indirectly it is used in other related technologies
Field, is similarly included in scope of patent protection of the present utility model.
Claims (6)
1. a kind of combined type folds structure mould release membrance, it is characterised in that：It is less than the intermediate layer including intermediate layer, release layer and hardness
Cushion；
The intermediate layer be PE layers, pet layer, PP layers or PA layers；The intermediate layer has relative upper and lower surface；
The cushion has two layers and is respectively upper cushion and bottom breaker, the upper cushion and the bottom breaker point
The upper and lower surface in the intermediate layer is not formed at；
The release layer has two layers and is respectively upper release layer and lower release layer, and the upper release layer and the lower release layer are all
For TPX layers；The upper release layer is formed at the upper surface of the upper cushion, and the upper cushion is bonded the upper release layer
With the intermediate layer；Under the lower release layer is formed at the lower surface of the bottom breaker, and bottom breaker bonding is described
Release layer and the intermediate layer.
2. a kind of combined type according to claim 1 folds structure mould release membrance, it is characterised in that：The cushion and described release
Layer constitutes the folded structure that vicat softening temperature is 150-170 DEG C.
3. a kind of combined type according to claim 1 folds structure mould release membrance, it is characterised in that：The upper cushion and it is described under
The thickness of cushion is all 10-100 μm.
4. a kind of combined type according to claim 1 folds structure mould release membrance, it is characterised in that：The thickness in the intermediate layer is
12-50μm。
5. a kind of combined type according to claim 1 folds structure mould release membrance, it is characterised in that：The upper release layer and it is described under
The thickness of release layer is all 10-40 μm.
6. fold structure mould release membrance according to a kind of combined type described in claim 1, it is characterised in that：The combined type folds structure mould release membrance
Flexible circuit board compression moulding shares mould release membrance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621348238.4U CN206332909U (en) | 2016-12-09 | 2016-12-09 | A kind of combined type folds structure mould release membrance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621348238.4U CN206332909U (en) | 2016-12-09 | 2016-12-09 | A kind of combined type folds structure mould release membrance |
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| Publication Number | Publication Date |
|---|---|
| CN206332909U true CN206332909U (en) | 2017-07-14 |
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| CN201621348238.4U Active CN206332909U (en) | 2016-12-09 | 2016-12-09 | A kind of combined type folds structure mould release membrance |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235594A (en) * | 2016-12-09 | 2018-06-29 | 松本涂层科技（昆山）有限公司 | A kind of combined type folds structure release film and preparation method thereof |
| CN110193982A (en) * | 2019-05-29 | 2019-09-03 | 深圳市一心电子有限公司 | High temperature adhesive block film and its manufacturing method |
| US11924958B2 (en) | 2021-06-23 | 2024-03-05 | Western Digital Technologies, Inc. | Flexible printed circuit copper overlay for temperature management |
-
2016
- 2016-12-09 CN CN201621348238.4U patent/CN206332909U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235594A (en) * | 2016-12-09 | 2018-06-29 | 松本涂层科技（昆山）有限公司 | A kind of combined type folds structure release film and preparation method thereof |
| CN110193982A (en) * | 2019-05-29 | 2019-09-03 | 深圳市一心电子有限公司 | High temperature adhesive block film and its manufacturing method |
| CN110193982B (en) * | 2019-05-29 | 2021-03-30 | 珠海市一心材料科技有限公司 | High-temperature glue-resistant film and manufacturing method thereof |
| US11924958B2 (en) | 2021-06-23 | 2024-03-05 | Western Digital Technologies, Inc. | Flexible printed circuit copper overlay for temperature management |
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