CN206703656U - A kind of fast pressing of flexible circuit release liners - Google Patents
A kind of fast pressing of flexible circuit release liners Download PDFInfo
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- CN206703656U CN206703656U CN201720495054.9U CN201720495054U CN206703656U CN 206703656 U CN206703656 U CN 206703656U CN 201720495054 U CN201720495054 U CN 201720495054U CN 206703656 U CN206703656 U CN 206703656U
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Abstract
A kind of fast pressing of flexible circuit release liners, carried on the back including TPX without silicon release layer, cushion, original paper layer and PBT and apply air-permeable layer, the TPX is formed at the upper surface of the cushion without silicon release layer, the cushion is formed at the upper surface of the original paper layer, and the PBT back ofs the body apply the lower surface that air-permeable layer is formed at the original paper layer；The PBT back ofs the body apply air-permeable layer and are evenly distributed with multiple air-vents；Thickness of the TPX without silicon release layer is 20 28 μm；The thickness of the cushion is 20 30 μm；The thickness of the original paper layer is 90 102 μm；The thickness that the PBT back ofs the body apply air-permeable layer is 15 25 μm.The release effect of the utility model release liners is good, and shrinkage ratio is small, and resistance colloidality can be good, and resistance to elevated temperatures improves, peel strength is low, and bending strength is high, and simple structure of the present utility model, stablized from material performance and price is relatively low, beneficial to production cost is reduced, manufactured suitable for large and small type enterprise.
Description
Technical field
The utility model belongs to flexible PCB release liners technical field, is used more particularly to a kind of fast pressing of flexible circuit
Release liners.
Background technology
Flexible PCB (Flexible Printed Circuit Board) referred to as " soft board ", FPC is commonly called as in industry, is had
There is the advantages of many rigid printed circuit boards do not possess, such as it can be with free bend, winding, folding.It can be contracted significantly using FPC
The volume of small electronic product, it is applicable the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC exists
Obtained on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, palm PC, digital camera or product
It is widely applied.
FPC is mainly formed by flexible copper clad substrate and diaphragm through high-temperature laminating, and diaphragm is that one kind is coated with sticker
Heat resistant resin film, for insulate and circuit protection.To avoid bonding processes center platen and flexible PCB that bonding or damage occurs
Bad, the sticker for ensureing to melt out by high temperature does not damage flexible PCB, and separate layer need to be set between pressing plate and flexible PCB,
To ensure the quality of product in hot pressing, its separate layer is that flexible circuit board compression moulding shares release liners (film), it is desirable in hot pressing
The middle sticker for ensureing to overflow is not bonded on flexible copper clad substrate, and is separated very well with flexible PCB after pressing.
Current release liners are mostly TBT (tributyl tin) release liners, i.e., in the compound one layer of TBT film of original paper layer or intermediate layer
Layer, it is coated with one layer of silicone oil mould release and forms, above-mentioned described soft board release liners, product is yielding when being pressed with FPC, shrinks
Than big, release effect is poor after pressing, and easily excessive glue and residuing in is needed outside exposed circuit, causes short circuit or welding not
It is good, for above-mentioned excessive glue situation, remove circuit surface by the way of chemical agent slagging-off or probe are struck off mostly at present
Part glue, not only time-consuming, increase cost, and also yield is relatively low；Other TBT purchasing price is relatively expensive, is made from TBT
For raw materials for production, the production cost of enterprise can be increased, be not suitable for small enterprise's mass production.
Utility model content
The utility model is mainly solving the technical problems that provide a kind of fast pressing of flexible circuit release liners, the release liners
Release effect is good, and shrinkage ratio is small, and resistance colloidality can be good, and resistance to elevated temperatures improves, and peel strength is low, and bending strength is high, and this reality
With new simple structure, stablized from material performance and price is relatively low, beneficial to production cost is reduced, looked forward to suitable for large and small type
Industry is manufactured.
In order to solve the above technical problems, the technical scheme that the utility model uses is：A kind of fast pressing of flexible circuit
With release liners, including TPX (poly- 4- methylpentenes) is without silicon release layer, cushion, original paper layer and PBT (poly terephthalic acid fourths two
Alcohol ester) painting air-permeable layer is carried on the back, the TPX is formed at the upper surface of the cushion without silicon release layer, and the cushion is formed at institute
The upper surface of original paper layer is stated, the PBT back ofs the body apply the lower surface that air-permeable layer is formed at the original paper layer；
The PBT back ofs the body apply air-permeable layer and are evenly distributed with multiple air-vents；
Thickness of the TPX without silicon release layer is 20-28 μm；
The thickness of the cushion is 20-30 μm；
The thickness of the original paper layer is 90-102 μm；
The thickness that the PBT back ofs the body apply air-permeable layer is 15-25 μm.
Further say, thickness of the TPX without silicon release layer is 24 μm.
Further say, the thickness of the cushion is 25 μm.
Further say, the thickness of the original paper layer is 96 μm.
Further say, the thickness that the PBT back ofs the body apply air-permeable layer is 20 μm.
Further say, the grammes per square metre of the original paper layer is 80-90g/m2。
Further say, the grammes per square metre that the PBT back ofs the body apply air-permeable layer is 20-30g/m2。
Further say, the original paper layer is heat sublimation original paper layer.
Further say, the aperture for the air-vent that the PBT back ofs the body apply air-permeable layer is 0.3-0.5mm and pitch-row is 1-2mm.
The beneficial effects of the utility model at least have it is following some：
First, the utility model TPX vicat softening temperature is 160-170 DEG C, can be filled when pressing process with flexible PCB
Point softening, and pit along PCB surface and corner stay and be close to, fills and is bonded that effect is good, plays splendid tool
There is resistance glue effect good, glue overflow amount control can be competent at the pressure programming of high-precision circuit board completely, further in 0.08-0.1mm
Promote electronic product and the miniaturization of fine equipment；
2nd, the utility model PBT has high-fire resistance, toughness, fatigue durability, and coefficient of friction is small, there is a self-lubricity, under high temperature
Deform small, dimensional stability is good, excellent insulating property, and electric performance stablity can be also kept in hot environment；
3rd, the utility model PBT back ofs the body apply air-permeable layer and are evenly distributed with several air-vents and symmetry is good, during high-temperature laminating
Product is not easy to be layered and will not deform, and dimensional contraction is than small；In addition, gas permeability is good after the PBT back ofs the body apply air-permeable layer punching, not only favorably
Flatness when pressing is high, moreover it is possible to ensures dimensional stability during FPC pressings；
4th, the utility model is due to splendid resistance colloidality energy, and the control to glue overflow amount, can be with complete in 0.08-0.1mm
The pressing of high-precision circuit board is appointed in complete victory, without striking off work to the chemical slagging-off of excessive glue progress or probe as traditional release liners
Sequence, therefore, reduce process, save man-hour and cost, improve production efficiency and yield；
5th, simple structure of the present utility model, and price stable from material performance is relatively low, beneficial to reducing production cost,
Manufactured suitable for large and small type enterprise.
Brief description of the drawings
Fig. 1 is the cross-sectional view of the present invention；
Fig. 2 is the structural representation of the present invention；
Each several part mark is as follows in accompanying drawing：
100-TPX breathes freely without silicon release layer, 200- cushions, 300- original paper layers, 400-PBT back ofs the body painting air-permeable layer and 401-
Hole.
Embodiment
Preferred embodiment of the present utility model is described in detail below in conjunction with the accompanying drawings, so that the advantages of the utility model
It can be easier to be readily appreciated by one skilled in the art with feature, it is apparent clear and definite so as to be made to the scope of protection of the utility model
Define.
Embodiment：A kind of fast pressing of flexible circuit release liners, as shown in Figure 1-2, including TPX is without silicon release layer 100, slow
Rush layer 200, original paper layer 300 and the PBT back ofs the body and apply air-permeable layer 400, the TPX is formed at the cushion 200 without silicon release layer 100
Upper surface, the cushion 200 are formed at the upper surface of the original paper layer 300, and the PBT back ofs the body apply air-permeable layer 400 and are formed at institute
State the lower surface of original paper layer 300；
The PBT back ofs the body apply air-permeable layer 400 and are evenly distributed with multiple air-vents 401；
Thickness of the TPX without silicon release layer 100 is 20-28 μm；
The thickness of the cushion 200 is 20-30 μm；
The thickness of the original paper layer 300 is 90-102 μm；
The thickness that the PBT back ofs the body apply air-permeable layer 400 is 15-25 μm.
Preferably, thickness of the TPX without silicon release layer 100 is 24 μm；
The thickness of the cushion 200 is 25 μm；
The thickness of the original paper layer 300 is 96 μm；
The thickness that the PBT back ofs the body apply air-permeable layer 400 is 20 μm.
The grammes per square metre of the original paper layer 300 is 80-90g/m2。
The grammes per square metre that the PBT back ofs the body apply air-permeable layer 400 is 20-30g/m2。
The original paper layer 300 is heat sublimation original paper layer.
401 apertures of the air-vent that the PBT back ofs the body apply air-permeable layer 400 are 0.3-0.5mm and pitch-row is 1-2mm.
Embodiment 1 is respectively provided with above-mentioned identical structure to embodiment 6, and difference is：
Embodiment 1：Thickness of the TPX without silicon release layer 100 is 22 μm；The thickness of the cushion 200 is 30 μm；Institute
The thickness for stating original paper layer 300 is 95 μm；The thickness that the PBT back ofs the body apply air-permeable layer 400 is 25 μm.
Embodiment 2：Thickness of the TPX without silicon release layer 100 is 24 μm；The thickness of the cushion 200 is 27 μm；Institute
The thickness for stating original paper layer 300 is 102 μm；The thickness that the PBT back ofs the body apply air-permeable layer 400 is 20 μm.
Embodiment 3：Thickness of the TPX without silicon release layer 100 is 28 μm；The thickness of the cushion 200 is 20 μm；Institute
The thickness for stating original paper layer 300 is 96 μm；The thickness that the PBT back ofs the body apply air-permeable layer 400 is 24 μm.
Embodiment 4：Thickness of the TPX without silicon release layer 100 is 25 μm；The thickness of the cushion 200 is 24 μm；Institute
The thickness for stating original paper layer 300 is 90 μm；The thickness that the PBT back ofs the body apply air-permeable layer 400 is 21 μm.
Embodiment 5：Thickness of the TPX without silicon release layer 100 is 20 μm；The thickness of the cushion 200 is 22 μm；Institute
The thickness for stating original paper layer 300 is 92 μm；The thickness that the PBT back ofs the body apply air-permeable layer 400 is 23 μm.
Embodiment 6：Thickness of the TPX without silicon release layer 100 is 27 μm；The thickness of the cushion 200 is 25 μm；Institute
The thickness for stating original paper layer 300 is 100 μm；The thickness that the PBT back ofs the body apply air-permeable layer 400 is 22 μm.
Performance test, record such as table 1 below are carried out to embodiment 1- embodiments 6：
Performance test is carried out to release liners made from the utility model by the following method：
Peel strength (GB-8808 peel strengths determination method)：In peel bond strength meter 250mm*50mm release liners (Jinan orchid
Light type BLD-50N precision 0.001N) peel strength simulated when film is stripped in pressing production process is determined, with constant speed
Test tape and release liners are peeled off (180 ° of angles) by (300mm/min).Parallel 10 times, average, unit：g/30mm；
Contractibility method of testing：The a length of L 200mm*200mm piece samples of finished product release liners cutting edge are taken, put 180 DEG C of bakings
Taken out in case after 2min, the measurement length of side is Ln, then shrinkage from mold dimensions is (L-Ln) ÷ L × 100%.
Table 1：
As shown in Table 1：The sur-face peeling intensity of release liners of the present utility model can as little as 20g/30mm, release is good and steady
It is fixed；Size changing rate as little as 1.5%, the good dimension stability of product.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is every
The equivalent structure transformation made using the utility model specification and accompanying drawing content, or directly or indirectly it is used in other correlations
Technical field, similarly it is included in scope of patent protection of the present utility model.
Claims (9)
- A kind of 1. fast pressing of flexible circuit release liners, it is characterised in that：Including TPX without silicon release layer, cushion, original paper layer and The PBT back ofs the body apply air-permeable layer, and the TPX is formed at the upper surface of the cushion without silicon release layer, and the cushion is formed at described The upper surface of original paper layer, the PBT back ofs the body apply the lower surface that air-permeable layer is formed at the original paper layer；The PBT back ofs the body apply air-permeable layer and are evenly distributed with multiple air-vents；Thickness of the TPX without silicon release layer is 20-28 μm；The thickness of the cushion is 20-30 μm；The thickness of the original paper layer is 90-102 μm；The thickness that the PBT back ofs the body apply air-permeable layer is 15-25 μm.
- A kind of 2. fast pressing of flexible circuit release liners according to claim 1, it is characterised in that：The TPX without silicon from The thickness of type layer is 24 μm.
- A kind of 3. fast pressing of flexible circuit release liners according to claim 1, it is characterised in that：The thickness of the cushion Spend for 25 μm.
- A kind of 4. fast pressing of flexible circuit release liners according to claim 1, it is characterised in that：The thickness of the original paper layer Spend for 96 μm.
- A kind of 5. fast pressing of flexible circuit release liners according to claim 1, it is characterised in that：The PBT back ofs the body apply saturating The thickness of gas-bearing formation is 20 μm.
- A kind of 6. fast pressing of flexible circuit release liners according to claim 1, it is characterised in that：Gram of the original paper layer Weight is 80-90g/m2.
- A kind of 7. fast pressing of flexible circuit release liners according to claim 1, it is characterised in that：The PBT back ofs the body apply saturating The grammes per square metre of gas-bearing formation is 20-30g/m2.
- A kind of 8. fast pressing of flexible circuit release liners according to claim 1, it is characterised in that：The original paper layer is heat Distil original paper layer.
- A kind of 9. fast pressing of flexible circuit release liners according to claim 1, it is characterised in that：The PBT back ofs the body apply saturating The aperture of the air-vent of gas-bearing formation is 0.3-0.5mm and pitch-row is 1-2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720495054.9U CN206703656U (en) | 2017-05-05 | 2017-05-05 | A kind of fast pressing of flexible circuit release liners |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720495054.9U CN206703656U (en) | 2017-05-05 | 2017-05-05 | A kind of fast pressing of flexible circuit release liners |
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| CN206703656U true CN206703656U (en) | 2017-12-05 |
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| CN201720495054.9U Active CN206703656U (en) | 2017-05-05 | 2017-05-05 | A kind of fast pressing of flexible circuit release liners |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110193982A (en) * | 2019-05-29 | 2019-09-03 | 深圳市一心电子有限公司 | High temperature adhesive block film and its manufacturing method |
| CN110834443A (en) * | 2018-08-17 | 2020-02-25 | 宁波长阳科技股份有限公司 | Low-glue-overflow TPX release film |
-
2017
- 2017-05-05 CN CN201720495054.9U patent/CN206703656U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110834443A (en) * | 2018-08-17 | 2020-02-25 | 宁波长阳科技股份有限公司 | Low-glue-overflow TPX release film |
| CN110193982A (en) * | 2019-05-29 | 2019-09-03 | 深圳市一心电子有限公司 | High temperature adhesive block film and its manufacturing method |
| CN110193982B (en) * | 2019-05-29 | 2021-03-30 | 珠海市一心材料科技有限公司 | High-temperature glue-resistant film and manufacturing method thereof |
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