CN202652692U - Dulling and reinforcing plate used for printed circuit board - Google Patents
Dulling and reinforcing plate used for printed circuit board Download PDFInfo
- Publication number
- CN202652692U CN202652692U CN 201220261092 CN201220261092U CN202652692U CN 202652692 U CN202652692 U CN 202652692U CN 201220261092 CN201220261092 CN 201220261092 CN 201220261092 U CN201220261092 U CN 201220261092U CN 202652692 U CN202652692 U CN 202652692U
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- polyimide
- circuit board
- printed circuit
- composite film
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a dulling and reinforcing plate used for a printed circuit board. The dulling and reinforcing plate includes a black polyimide film, a polyimide composite film and an adhesive layer, wherein the polyimide composite film is clamped between the black polyimide film and the adhesive layer, the polyimide composite film includes at least one polyimide layer and an adhesion agent layer formed between the black polyimide film and the polyimide composite film, and the total thickness of the black polyimide film and the polyimide composite film is from 3 mil to 9 mil. After bonded on the printed circuit board, the dulling and reinforcing plate of the utility model is advantageous in reduced warpage height and circuit-masking effect; and the dulling and reinforcing plate is especially applicable to consumption electronic products for protecting circuit patterns.
Description
Technical field
The utility model relates to a kind of stiffening plate for printed circuit board (PCB), specifically relates to a kind of delustring stiffening plate with reinforcement and screening effect.
Background technology
The polyimide resin thermal stability is high and have excellent insulating properties, mechanical strength and resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As being used for the insulating barrier of flexible printed wiring board (Flexible Printed Circuit), perhaps be used for further electronic building brick, for example the reinforcement purposes of printed circuit board (PCB).
Polyimide film has been widely used in electronic material, and wherein, racemization photosensitiveness black polyamide thin film also is widely used in electronic material.In the used polyimides stiffening plate of printed circuit board (PCB), generally can divide into the polyimides stiffening plate of individual layer slab or combined type.The polyimides stiffening plate of combined type, the polyimides plate structure of I257898 Taiwan patent announcement for example, it is the combined type polyimide plate that forms different-thickness with the thermmohardening solid of the polyimide plate of 2 Mills (mil) and different-thickness, yet, this combined type polyimide plate is being used the problem that meets with, be to be subject to the thickness of polyimide plate cost and composite membrane, and can't cover the circuit layout pattern and be easy to be plagiarized by the same trade.In addition, owing to polyimide composite film is get by the combination of polyimide plate and adhesion agent layer, but its two thermal expansion coefficient difference often causes pasting to flexible circuit board for the composite membrane of reinforcement the phenomenon of generation warpage.
Therefore, still need to develop a kind of circuit layout of covering effect that has, and pasting to flexible printed wiring board, be difficult for producing the delustring stiffening plate of warping phenomenon.
The utility model content
In order to overcome defects, the utility model provides a kind of delustring stiffening plate for printed circuit board (PCB), and the delustring stiffening plate that should be used for printed circuit board (PCB) have the circuit layout of covering effect, and is difficult for producing warping phenomenon pasting to flexible printed wiring board.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of delustring stiffening plate for printed circuit board (PCB), be provided with black polyamide film, polyimide composite film and adhesion layer, described polyimide composite film is folded between described black polyamide film and the adhesion layer, described polyimide composite film comprises at least one strata imide layer, and has adhesion agent layer between described black polyamide film and the described polyimide composite film, wherein, the thickness summation of described black polyamide film and described polyimide composite film is 3 mil to 9 mil.
The thickness of described black polyamide film is 0.5mil to 2 mil.
Described polyimide composite film comprises at least two strata imide layer, and is formed with adhesion agent layer between the adjacent polyimide layer.
The thickness of described polyimide layer is 1 mil to 2 mil.
The thickness of each described adhesion agent layer is 10 microns to 40 microns.
Each described adhesion agent layer is the adhesion agent layer that contains epoxy resin and colouring agent.
Each described adhesion agent layer is the black adhesion agent layer that contains epoxy resin and black colorant.
Also comprise fit on the described adhesion layer lateral surface from the shape layer.
The beneficial effects of the utility model are: black polyamide film of the present utility model has the racemization photosensitiveness; be conducive to the protective circuit pattern; and the adhesion agent layer that is formed at the adhesion agent layer between each polyimide layer in the polyimide composite film and is formed between black polyamide film and the polyimide composite film comprises black colorant; can make the circuit pattern screening effect better; need not to increase operation; can reach best circuit screening effect; and the utility model can be by the thickness of control black polyamide film and polyimide layer, with reduction polyimide composite film is pasted depth of camber to the circuit board.
Description of drawings
Fig. 1 is the delustring stiffening plate structural representation that is used for printed circuit board (PCB) of the utility model embodiment 1;
Fig. 2 is the delustring stiffening plate structural representation that is used for printed circuit board (PCB) of the utility model embodiment 2.
Embodiment
Below by specific instantiation embodiment of the present utility model is described, those skilled in the art can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can other different mode be implemented, and, under the category that does not disclose departing from the utility model, can give different modifications and change that is.
Embodiment 1: a kind of delustring stiffening plate for printed circuit board (PCB) as shown in Figure 1, is provided with black polyamide film 11, polyimide composite film 10 and adhesion layer 14; Polyimide composite film 10 is formed on this black polyamide film 11, and this polyimide composite film 10 comprises at least one deck or multilayer polyimide layer 12 and adhesion agent layer 13; These adhesion layer 14 usefulness so that this delustring stiffening plate attach on the printed circuit board (PCB), this adhesion layer 14 is formed on this polyimide composite film 10, this polyimide composite film 10 is folded between this adhesion layer 14 and the black polyamide film 11, wherein, the thickness summation Z of this black polyamide film 11 and polyimide composite film 10 is between between 3 to 9 mil.
Embodiment 2: a kind of delustring stiffening plate for printed circuit board (PCB) as shown in Figure 2, is provided with black polyamide film 21, polyimide composite film 20 and adhesion layer 24; Polyimide composite film 20 is formed on this black polyamide film 21, and this polyimide composite film 20 comprises at least one deck or multilayer polyimide layer 22 and adhesion agent layer 23; Adhesion layer 24 is formed on this polyimide composite film 20, and this polyimide composite film 20 is folded between this adhesion layer 24 and the black polyamide film 21; Also comprise release film 25, fractal film 25 is formed on these adhesion layer 24 outer surfaces, this adhesion layer 24 is folded between this fractal film 25 and the polyimide composite film 20, and wherein, the thickness summation Z ' of this black polyamide film 21 and polyimide composite film 20 is between between 3 to 9 mil.
Among the utility model embodiment 1 and 2, this polyimide composite film comprises the multilayer polyimide layer and is formed at the respectively adhesion agent layer between this polyimide layer, in addition, adhesion agent layer also is formed between this black polyamide film and the polyimide composite film, and this adhesion agent layer comprises epoxy resin and colouring agent.
In the polyimide composite film of the present utility model, respectively the thickness of this polyimide layer and is preferably between between 1.5 to 2 mil usually between between 1 to 2 mil; And respectively the thickness of this adhesion agent layer normally between 10 to 40 microns.
The thickness of the black polyamide film that the utility model is used and is preferably between between 1.5 to 2 mil normally between between 0.5 to 2 mil.
In addition, the utility model utilization makes the symmetry of the thickness of black polyamide film and polyimide layer, to reduce polyimide composite film is pasted depth of camber to the circuit board.In concrete application, that thickness summation Z with black polyamide film and polyimide composite film is adjusted between between 3 to 9 mil, wherein, be preferably adjustment and make the thickness of black polyamide film and polyimide layer suitable, and the thickness of adhesion agent layer is to decide according to the Z value.
During implementation, when the thickness summation Z of black polyamide film and polyimide composite film was 3 mil, then making the thickness of black polyamide film was 1mil, and to make polyimide layer be adjusted into 1 layer and thickness be 1mil; When thickness summation Z was 4, then making the thickness of black polyamide film was 2mil, and to make polyimide layer be adjusted into 1 layer and thickness be 1mil; When thickness summation Z was 5, the thickness that then makes the black polyamide film was between 1.5 to 2mil, and to adjust polyimide layer be 1 layer or 2 layers; When thickness summation Z was 6, the capable of regulating polyimide layer was 2 layers or 3 layers; When thickness summation Z was 7, the capable of regulating polyimide layer was 2 layers or 3 layers; When thickness summation Z was 8, the capable of regulating polyimide layer was 2 layers, 3 layers or 4 layers; When thickness summation Z was 9, the capable of regulating polyimide layer was 3 layers or 4 layers.According to the black polyamide film of adjusting racemization photosensitiveness of the present utility model and the thickness symmetry of polyimide layer, can reduce that polyimide composite film is pasted depth of camber to circuit board.
Colouring agent as adhesion agent layer of the present utility model, for example can use black colorant, wherein, this black colorant is selected from the atrament of black pigment, carbon dust or carbon nanotube, and the content of this black colorant generally accounts for 3 to 15%(weight of this epoxy resin solid content), be preferably 4 to 8%(weight).Because racemization photosensitiveness black polyamide film and black adhesion agent layer present low-refraction and black hues, so the outer surface of delustring stiffening plate of the present utility model has the cloudy surface characteristic, are particularly suitable for being applied to cover the printed circuit board (PCB) of circuit pattern demand.
The kind of the employed black polyamide film of the utility model and polyimide layer is not particularly limited, and is preferably the not halogen-containing polyimide material of use, and better is to use to have from stickiness and not halogen-containing polyimide material.
The delustring stiffening plate that the utility model is used for printed circuit board (PCB) can make by following step: at first, surface-coated one deck thermmohardening black solid at a racemization photosensitiveness black polyamide film, after placing the baking oven heat drying, with hot roller and another polyimide layer pressing, by that analogy, to the thickness of required polyimide composite film; Then, slaking 1 hour under 180 ℃ condition; At last, at the adhesion layer of the surface-coated of this polyimide composite film such as epoxy resin and so on, be formed for the delustring stiffening plate sample of printed circuit board (PCB).
Further, in order to keep the stickiness of this adhesion layer, be beneficial to follow-up be bonding on circuit board or the use of other pressure programmings, as shown in Figure 2, can be at outer surface applying one deck release liners or the release film of this adhesion layer.
Accordingly; the utility model is the polyimide composite film formation delustring stiffening plate that utilizes the black polyamide film of specific thicknesses and contain black colorant; this delustring stiffening plate has the circuit pattern screening effect and reduces the advantage of depth of camber, especially is applicable in the consumption electronic products of protective circuit pattern.
Test case: prepare the delustring stiffening plate for printed circuit board (PCB) of the present utility model according to the data in the following table one.In the delustring stiffening plate of test case 1 to 7 of the present utility model, include the black polyamide film, and the black adhesion agent layer in the polyimide composite film comprises epoxy resin and black pigment, carbon dust or rice carbon dust how.
In addition, prepare reference examples 1 to 7 sample (prior art), the delustring stiffening plate of this reference examples sample is only to use general polyimide film and adhesion layer again, but not black polyamide film and black adhesion agent layer, all the other are all the same with test case.
The pure glue (trade name D3430) that the stiffening plate of test case and reference examples sample all uses Sony Corporation to produce.Then, stiffening plate is cut into the size of 25 cm * 25 cm, and in being pressure bonded under 180 ℃ of conditions on the 3-Layer double-surface flexible copper foil substrate of 74.5 ± 1 um, carry out slaking with 160 ℃ of conditions again, again each sample is placed on the smooth flat, leave standstill 20 minutes after, measure the depth of camber (centimetre) of four corners, carry out the flatness test, the result is embedded in table one.
Table one
Shown in table one result, under the identical condition of thickness summation Z, compared to the stiffening plate sample that does not use black polyamide film and black adhesion agent layer, the depth of camber less of delustring stiffening plate of the present utility model, thereby has a better flatness, and along with gross thickness increases, flatness is more obvious.
Above-mentioned specification and embodiment only are illustrative principle of the present utility model and effect thereof, but not are used for restriction originally.Rights protection scope of the present utility model should be listed such as claims.
Claims (8)
1. delustring stiffening plate that is used for printed circuit board (PCB), it is characterized in that: be provided with black polyamide film, polyimide composite film and adhesion layer, described polyimide composite film is folded between described black polyamide film and the adhesion layer, described polyimide composite film comprises at least one strata imide layer, and has adhesion agent layer between described black polyamide film and the described polyimide composite film, wherein, the thickness summation of described black polyamide film and described polyimide composite film is 3 mil to 9 mil.
2. the delustring stiffening plate for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: the thickness of described black polyamide film is 0.5mil to 2 mil.
3. the delustring stiffening plate for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: described polyimide composite film comprises at least two strata imide layer, and is formed with adhesion agent layer between the adjacent polyimide layer.
4. the delustring stiffening plate for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: the thickness of described polyimide layer is 1 mil to 2 mil.
5. such as claim 1 or 3 described delustring stiffening plates for printed circuit board (PCB), it is characterized in that: the thickness of each described adhesion agent layer is 10 microns to 40 microns.
6. such as claim 1 or 3 described delustring stiffening plates for printed circuit board (PCB), it is characterized in that: each described adhesion agent layer is the adhesion agent layer that contains epoxy resin and colouring agent.
7. the delustring stiffening plate for printed circuit board (PCB) as claimed in claim 6, it is characterized in that: each described adhesion agent layer is the black adhesion agent layer that contains epoxy resin and black colorant.
8. the delustring stiffening plate for printed circuit board (PCB) as claimed in claim 1 is characterized in that: also comprise fit on the described adhesion layer lateral surface from the shape layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220261092 CN202652692U (en) | 2012-06-05 | 2012-06-05 | Dulling and reinforcing plate used for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220261092 CN202652692U (en) | 2012-06-05 | 2012-06-05 | Dulling and reinforcing plate used for printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN202652692U true CN202652692U (en) | 2013-01-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220261092 Expired - Lifetime CN202652692U (en) | 2012-06-05 | 2012-06-05 | Dulling and reinforcing plate used for printed circuit board |
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| Country | Link |
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| CN (1) | CN202652692U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458607A (en) * | 2012-06-05 | 2013-12-18 | 昆山雅森电子材料科技有限公司 | Extinction stiffening plate used for printed circuit board |
| CN103945635A (en) * | 2013-01-23 | 2014-07-23 | 昆山雅森电子材料科技有限公司 | Ultrathin printing ink protection film and manufacturing method thereof |
-
2012
- 2012-06-05 CN CN 201220261092 patent/CN202652692U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458607A (en) * | 2012-06-05 | 2013-12-18 | 昆山雅森电子材料科技有限公司 | Extinction stiffening plate used for printed circuit board |
| CN103945635A (en) * | 2013-01-23 | 2014-07-23 | 昆山雅森电子材料科技有限公司 | Ultrathin printing ink protection film and manufacturing method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130102 |