CN202573178U - Composite double-faced copper foil base plate - Google Patents
Composite double-faced copper foil base plate Download PDFInfo
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- CN202573178U CN202573178U CN 201220137511 CN201220137511U CN202573178U CN 202573178 U CN202573178 U CN 202573178U CN 201220137511 CN201220137511 CN 201220137511 CN 201220137511 U CN201220137511 U CN 201220137511U CN 202573178 U CN202573178 U CN 202573178U
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- Prior art keywords
- copper foil
- glue
- copper
- plate
- layer
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Abstract
The utility model discloses a composite double-faced copper foil base plate. The base plate is formed by laminating a non-adhesive single-faced copper-clad plate and an adhesive copper foil plate, wherein the non-adhesive single-faced copper-clad plate consists of a first layer of copper foil and an insulating base film formed on one surface of the first layer of copper foil; the adhesive copper foil plate consists of a second layer of copper foil and an insulating adhesive layer coated on one surface of the second layer of copper foil; the insulating base film is adjacent to the insulating adhesive layer and can be produced by a simple low-temperature laminating process, so that the high-temperature laminating process and an expensive thermoplastic polyimide (TPI) raw material which are adopted in the prior art are not required, and the composite double-faced copper foil base plate which has the characteristics of non-adhesive double-faced plate can be obtained; and therefore, the production cost is saved, the product yield is improved, the application range of products is enlarged; and the base plate has high dimensional stability and bending resistance, a color masking effect, high heat resistance and high reflectivity.
Description
Technical field
The utility model belongs to the flexible printed wiring board field, is specifically related to the two-sided copper clad laminate of a kind of combined type.
Background technology
At present the global electronic industry development to compact, high-fire resistance, multifunctionality, densification, high reliability and cheaply direction develop, so selecting for use of substrate just becomes very significant effects factor.And good substrate must possess high thermal conductivity, high dimensional stability, the high material behavior that hides chromatic effect, high-cooling property, high-fire resistance, reaches low thermal coefficient of expansion.The polyimide resin heat endurance is high and have excellent thermal diffusivity, mechanical strength and adherence, often applies to multiple electronic material, as is used for flexible printed wiring board (Flexible Printed Circuit).
Because at present the employed no glue copper foil base material of FPC industry generally receives the technology control of external former material manufacturer such as Japan; Higher and the complex manufacturing of relative production cost; Need be through very high high-temperature process, be not easy to the cost control with price of promoting the use of of product.The processing procedure of traditional no glue dual platen is: produce finished product after two-sided Copper Foil pressing TPI (TPI) process high temperature pressing baking processing procedure curing reaction is complete.This production technology not only expends the energy, and uses the higher TPI raw material of relative cost, and yield is on the low side in process of production.Therefore; Usually there is the restriction that needs processing procedure controls such as high-temperature process, long-time high-temperature baking when producing at the two-sided copper clad laminate of the no glue that uses at present; Not only need higher production cost; Waste energy and the production time, and can't guarantee the yield and the efficient of producing to have limited production capacity.
In view of above-mentioned defective, be necessary to develop superior performance, be convenient to volume production and cost is low, yield is high two-sided copper clad laminate and manufacturing process.A kind of double side flexible copper coated board and preparation method thereof is disclosed like Chinese patent 200810217932.6; This double side flexible copper coated board comprises a single-side coated copper plate, coats the adhesive layer on this single-side coated copper plate and is overlaid on another Copper Foil or another single face flexibility coat copper plate on this adhesive layer; Said single-side coated copper plate comprises a Copper Foil and coats the polyimide layer on the Copper Foil, the adjacent setting of said polyimide layer and adhesive layer; Its preparation method comprises the steps: step 1, Copper Foil is provided and prepares polyamic acid and adhesive; Step 2, coating one deck polyamic acid forms the single-sided polyimide flexibility coat copper plate after super-dry, high-temperature sub amination on Copper Foil; Step 3, coating one deck adhesive on the polyimides face of a single face flexibility coat copper plate that makes, through dry back and Copper Foil or the roll-in of another single face flexibility coat copper plate process is compound and curing after make double side flexible copper coated board.Though the original idea of patent 200810217932.6 provides and a kind ofly can overcome three-layer process and make double side flexible copper coated board and be difficult to slimming and the relatively poor deficiency of dimensional stability, and the problem of the expensive and apparent difference of two-layer method flexibility coverlay, and excellent combination property, with low cost; Can realize the double side flexible copper coated board and preparation method thereof of the slimming of base material; But can there be disadvantage in it in actual production: procedure for producing is difficult, and equipment need get Tension Control fine, be coated with upper glue layer after; Be easy to produce wrinkle in the pressing section; Length can't be done length, and yield is not high, and yield has only about 30%.
The utility model content
In order to overcome above-mentioned defective, the utility model provides a kind of and has carried out that process for pressing produces, and can use lower temperature production, and produce simple, the yield two-sided copper clad laminate of combined type high, excellent performance, easy to use.
The utility model for the technical scheme that solves its technical problem and adopt is:
The two-sided copper clad laminate of a kind of combined type; Pressing constitutes with band glue copper foil plate by no glue single-side coated copper plate; Said no glue single-side coated copper plate is made up of one deck Copper Foil and the insulating basement membrane that is formed at Copper Foil one surface; Said band glue copper foil plate is made up of another Copper Foil and insulation adhesive glue-line of being coated on another Copper Foil one surface, and said insulating basement membrane and the adjacent setting of said insulation adhesive glue-line.
Preferably, said insulating basement membrane is polyimides (PI) film, PETG (PET) film, gather a kind of in naphthalene ester (PEN) film and liquid crystal polymer (PLC) film, and the thickness of said insulating basement membrane is 7～100um.
Preferably, said insulating basement membrane is polyimides (PI) film.
Preferably, a kind of in calendering (RA) Copper Foil, electrolysis (ED) Copper Foil and high (HD) Copper Foil that extends of said Copper Foil, and the thickness of said Copper Foil is 7.5～35um.
Preferably, said insulation adhesive glue-line is a kind of in epoxide-resin glue system layer, SGA system layer, PETG glue system layer, polyurethane adhesive system layer and the polyimides glue system layer, and the thickness of said insulation adhesive glue-line is 5～50um.
The beneficial effect of the utility model is: the utility model carries out the two-sided copper clad laminate of combined type that the low-temperature heat pressing makes the utility model through using no glue single-side coated copper plate commonly used and band glue copper foil plate; The high temperature pressure programming and the TPI raw material that uses costliness of prior art have been avoided; And obtain to satisfy the two-sided copper clad laminate of combined type of no glue dual platen characteristic needs; Not only practice thrift production cost, and improved the yield of production, expanded the scope of application of product; And the two-sided copper clad laminate of the combined type of the utility model has excellent size stability and anti-bending performance, and has chromatic effect, high-fire resistance and the high reflectance of screening.
Description of drawings
Fig. 1 is the two-sided copper clad laminate structural representation of the combined type of the utility model;
Fig. 2 is the preparation method sketch map of the two-sided copper clad laminate of combined type of the utility model.
The specific embodiment
Embodiment: the preferred embodiment of the utility model is set forth in detail below in conjunction with accompanying drawing; Thereby the protection domain of the utility model is made more explicit defining so that advantage of the utility model and characteristic can be easier to it will be appreciated by those skilled in the art that.
The two-sided copper clad laminate of a kind of combined type; 2 both pressings constitute with band glue copper foil plate by no glue single-side coated copper plate 1; Said no glue single-side coated copper plate 1 is made up of one deck Copper Foil 11 and the insulating basement membrane 12 that is formed at Copper Foil one surface; Said band glue copper foil plate 2 is made up of another Copper Foil 21 and insulation adhesive glue-line 22 of being coated on another Copper Foil one surface, and said insulating basement membrane 12 and said insulation adhesive glue-line 22 adjacent settings.
Wherein, Said insulating basement membrane 12 is polyimides (PI) film, PETG (PET) film, gather a kind of in naphthalene ester (PEN) film and liquid crystal polymer (PLC) film; Polyimides (PI) film preferably, the thickness of said insulating basement membrane 12 is 7～100um.
Wherein, a kind of in calendering (RA) Copper Foil, electrolysis (ED) Copper Foil and high (HD) Copper Foil that extends of said Copper Foil 11,21, and the thickness of said Copper Foil 11,21 is 7.5～35um.
Wherein, said insulation adhesive glue-line 22 is a kind of in epoxide-resin glue system layer, SGA system layer, PETG glue system layer, polyurethane adhesive system layer and the polyimides glue system layer, and the thickness of said insulation adhesive glue-line 22 is 5～50um.
The manufacturing approach of the two-sided copper clad laminate of above-mentioned combined type is following:
One, the preparation of no glue single-side coated copper plate 1: utilize organic solvent to come each required component of mixed dissolution; Form the liquid dispersion of insulating basement membrane, use the coating production equipment that this liquid dispersion is coated to and form insulating basement membrane 12 on the Copper Foil 11, make insulating basement membrane after this coating through online drying oven; Remove the organic solvent that includes and reach curing; In order to avoid when rolling, adhere to each other, and reach composition reaction curing through follow-up baking process, form no glue single-side coated copper plate 1;
Two, the preparation of RCC copper clad laminate: utilize organic solvent to mix each required component; Form the liquid dispersion of insulation adhesive glue-line 22, the liquid dispersion of this insulation adhesive glue-line is used be coated with the matsurface side that production equipment is coated on Copper Foil 21, through the baking of online drying oven; The organic solvent that removal includes; And making the insulation adhesive glue-line reach the moving semi-cured state of semi-fluid, card covers release layer on the insulation adhesive glue-line at last, forms the RCC copper clad laminate;
Three, use no glue single-side coated copper plate 1 and RCC copper clad laminate; The release layer of RCC copper clad laminate removed obtain being with glue copper foil plate 2; Do not obtain the two-sided copper clad laminate of combined type through overcuring again after will not having glue single-side coated copper plate 1 and being with glue copper foil plate 2 through pressing machine hot pressing (said insulating basement membrane 12 and said insulation adhesive glue-line 22 adjacent settings), wherein the hot pressing temperature is controlled at 30～100 ℃.
In the said method, the adjustment through prescription makes insulating basement membrane and insulation adhesive glue-line reach approaching thermal coefficient of expansion.
The manufacturing approach of the utility model tension force is aborning controlled easily, and can produce continuously, needn't worry to reload midway and causes problem such as machine down, produces yield also than higher, and yield reaches more than 90%.Adopt the no glue single-side coated copper plate of length range 100～1000m to carry out hot pressing, realize continuous volume production.Through using the two-sided copper clad laminate of combined type that obtains utility model after no glue single-side coated copper plate commonly used and the compound combination of RCC copper foil base material; Can satisfy no glue dual platen characteristic needs; Practice thrift production cost, improved the yield of production, expanded the scope of application of product.
The dimensional stability test result of the two-sided copper clad laminate of two-sided copper clad laminate of the combined type of the utility model and prior art such as following table 1:
Table 1:
| |
|
Sample 3 | Sample 4 | |
| Copper Foil | RA copper | ED copper | RA copper | RA copper |
| Insulating basement membrane | Polyimides | Polyimides | Polyimides | TPI |
| The insulation adhesive glue-line | Transparent | Transparent | Do not have | Transparent |
| Dimensional stability | 0.05％ | 0.06％ | 0.08％ | 0.07％ |
| The scolding tin hear resistance | 288℃10S | 288℃10S | 288℃10S | 288℃10S |
| Reflectivity | 95％ | 85％ | 82％ | 83％ |
| Cover power | Opaque | Opaque | Opaque | Opaque |
| The number of times of anti-the bending | ＞10 ten thousand times | ＞9 ten thousand times | ＞7 ten thousand times | ＞8 ten thousand times |
In the last table 1, sample 1 and 2 is the two-sided copper clad laminate of combined type of the utility model; Sample 3 is the two-sided copper clad laminate of prior art with sample 4.
Show that by table 1 data the two-sided copper clad laminate of the combined type of the utility model has excellent size stability and anti-bending performance, and have chromatic effect, high-fire resistance and the high reflectance of screening.
The foregoing description is merely illustrative the utility model principle and effect thereof, but not is used to limit the utility model.The rights protection scope of the utility model should be listed like claims.
Claims (5)
1. two-sided copper clad laminate of combined type; It is characterized in that: constitute by no glue single-side coated copper plate (1) and both pressings of band glue copper foil plate (2); Said no glue single-side coated copper plate (1) is made up of one deck Copper Foil (11) and the insulating basement membrane (12) that is formed at Copper Foil one surface; Said band glue copper foil plate (2) is made up of another Copper Foil (21) and insulation adhesive glue-line (22) of being coated on another Copper Foil one surface, and said insulating basement membrane (12) and the adjacent setting of said insulation adhesive glue-line (22).
2. the two-sided copper clad laminate of combined type as claimed in claim 1; It is characterized in that: said insulating basement membrane (12) is polyimide film, PETG film, gather a kind of in naphthalene ester film and the liquid crystalline polymer film, and the thickness of said insulating basement membrane (12) is 7～100um.
3. the no glue single face copper clad foil substrate with paste functionality as claimed in claim 2, it is characterized in that: said insulating basement membrane (12) is a polyimide film.
4. the two-sided copper clad laminate of combined type as claimed in claim 1 is characterized in that: a kind of in rolled copper foil, electrolytic copper foil and the high extension Copper Foil of said Copper Foil (11,21), and the thickness of said Copper Foil (11,21) is 7.5～35um.
5. the two-sided copper clad laminate of combined type as claimed in claim 1; It is characterized in that: said insulation adhesive glue-line (22) is a kind of in epoxide-resin glue system layer, SGA system layer, PETG glue system layer, polyurethane adhesive system layer and the polyimides glue system layer, and the thickness of said insulation adhesive glue-line (22) is 5～50um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220137511 CN202573178U (en) | 2012-04-01 | 2012-04-01 | Composite double-faced copper foil base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220137511 CN202573178U (en) | 2012-04-01 | 2012-04-01 | Composite double-faced copper foil base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202573178U true CN202573178U (en) | 2012-12-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220137511 Expired - Fee Related CN202573178U (en) | 2012-04-01 | 2012-04-01 | Composite double-faced copper foil base plate |
Country Status (1)
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| CN (1) | CN202573178U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630126A (en) * | 2012-04-01 | 2012-08-08 | 松扬电子材料(昆山)有限公司 | Compound double-side copper clad laminate and manufacturing method thereof |
| TWI469697B (en) * | 2013-01-11 | 2015-01-11 | ||
| CN108012414A (en) * | 2018-01-08 | 2018-05-08 | 昆山雅森电子材料科技有限公司 | High frequency high-transmission FPC and preparation method with FRCC |
| CN110996536A (en) * | 2019-12-25 | 2020-04-10 | 广东生益科技股份有限公司 | Carrier copper foil and preparation method and application thereof |
-
2012
- 2012-04-01 CN CN 201220137511 patent/CN202573178U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630126A (en) * | 2012-04-01 | 2012-08-08 | 松扬电子材料(昆山)有限公司 | Compound double-side copper clad laminate and manufacturing method thereof |
| TWI469697B (en) * | 2013-01-11 | 2015-01-11 | ||
| CN108012414A (en) * | 2018-01-08 | 2018-05-08 | 昆山雅森电子材料科技有限公司 | High frequency high-transmission FPC and preparation method with FRCC |
| CN110996536A (en) * | 2019-12-25 | 2020-04-10 | 广东生益科技股份有限公司 | Carrier copper foil and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121205 Termination date: 20150401 |
|
| EXPY | Termination of patent right or utility model |