CN202986235U - Double-faced flexible copper-clad plate - Google Patents
Double-faced flexible copper-clad plate Download PDFInfo
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- CN202986235U CN202986235U CN 201220677348 CN201220677348U CN202986235U CN 202986235 U CN202986235 U CN 202986235U CN 201220677348 CN201220677348 CN 201220677348 CN 201220677348 U CN201220677348 U CN 201220677348U CN 202986235 U CN202986235 U CN 202986235U
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- flexible copper
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Abstract
The utility model relates to the technical field of a copper-clad plate and particularly relates to a double-faced flexible copper-clad plate. The double-faced flexible copper-clad plate comprises a polyimide insulating based film layer, adhering layers and copper foil layers, wherein the adhering layers are coated at two sides of the polyimide insulating based film layer; and the copper foil layers are respectively pressed and covered outside the two sides of the polyimide insulating based film layer coated with the adhering layers. The double-faced flexible copper-clad plate disclosed by the utility model not only has high stability of a two-layer-method copper-clad plate, and is manufactured by adopting a three-layer method, so that the continuous production is facilitated; and the apparent quality of a product is flat, the production cost is low and the price is moderate.
Description
Technical field
The utility model relates to the copper-clad plate technical field, relates in particular to a kind of double side flexible copper coated board.
Background technology
Flexibility coat copper plate is a kind of by metallic conductor and dielectric substrate material, and by the material that adhesive is glued together, this product can optionally curvedly be coiled into an axle type, and can not fracture wherein metallic conductor or dielectric substrate.Developing rapidly along with network communication and consumption electronic products in recent years, under the demand of emphasizing high function, high-speed transfer and light weight slimming, required flexible substrate also towards more become more meticulous, high density and multi-functional development, live width, the line-spacing of flexible printed-circuit board are more and more less, correspondingly to its base material---and the characteristic requirements of flexibility coat copper plate is increasingly stringent also.
Flexibility coat copper plate is divided into two layers of method and three-layer process flexibility coat copper plate by manufacturing process, and two layers of method refer to without gluing formulation flexibility coat copper plate, dielectric substrate and metallic conductor paper tinsel are only arranged namely, get by high-temperature laminating; Three-layer process refers to the flexibility coat copper plate of adhesive, and namely by metal foil conductor and dielectric substrate, middle thermo-compression bonding forms through adhesive.Two-layer method flexibility coat copper plate has plurality of advantages, and from performance, the dimensional stability of two layers of method double side flexible copper coated board, heat resistance etc. all are better than the three-layer process double side flexible copper coated board; From becoming originally, two-layer method flexibility coat copper plate adopts Copper Foil and base material high-temperature laminating and gets, need to use high temperature hot-rolling machine, because high temperature hot-rolling pressing machine cost of investment is very high, production efficiency is low, cause the overall product cost higher, on the other hand, material when the pressing process, base material or Copper Foil moment contact high-temperature roller, heat expansion is easy to make material production fold or ripple, finally affects the quality of finished product.At electronic product to the demand trend of high density graph thinning and multiple stratification copper-clad plate more and more obviously the time, with reference to softwood market in recent years, two-layer method flexibility coat copper plate is subject to the favor of downstream manufacturers day by day, its high-dimensional stability is one of key performance that wherein attracts downstream manufacturers, but market is under the pressure of cost pressure, and downstream manufacturers is more use three-layer process flexibility coat copper plate still.The cost of two-layer method flexibility coat copper plate is much higher than the three-layer process flexibility coat copper plate in a word, and apparent being difficult to controlled.
The utility model content
For the market demand, now be badly in need of a kind of production cost low, but have simultaneously premium properties (such as the high-dimensional stability) flexibility coat copper plate of two-layer method flexibility coat copper plate.In order to reduce costs, improve simultaneously the performance of double side flexible copper coated board, solve double side flexible copper coated board high-dimensional stability problem, the utility model adopts the advantage of two layers of method and three-layer process flexibility coat copper plate, in conjunction with both manufacture methods, first apply the insulation glue-line on the insulating basement membrane of high-dimensional stability having, thereafter under 80-100 ℃ with insulation glue-line and the Copper Foil pressing of semi-solid preparation, can obtain flexibility coat copper plate.Based on above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of double side flexible copper coated board.
To achieve these goals, the technical solution of the utility model is as follows:
A kind of double side flexible copper coated board, comprise: polyimide insulative base membrane layer, gluing layer and copper foil layer, the both sides of described polyimide insulative base membrane layer are coated with the gluing layer, and described copper foil layer is overlaid on respectively described polyimide insulative base membrane layer two outsides that are coated with adhesive layer.
Wherein, described copper foil layer is electrodeposited copper foil layer or rolled copper foil layer, and thickness is 9-70 μ m.
Preferably, described copper foil layer thickness is 9-35 μ m.
Described polyimide insulative base membrane layer thickness is 10-100 μ m.
Described adhesive layer is epoxide-resin glue system, SGA system, polyester adhesive system, polyurethane adhesive system or polyimides glue system layer, and thickness is 2-20 μ m.
Preferably, described adhesive layer thickness is 2-10 μ m.
The double-faced flexible copper-clad plate of the utility model design has high-dimensional stability, price advantage cheaply, the copper-clad plate of this kind structure does not need to use the high-temperature laminating roller aborning, therefore be convenient to a large amount of productions, can make that surface quality is smooth, low-cost, the double-faced flexible copper-clad plate of high-dimensional stability simultaneously.
Description of drawings
Fig. 1 is structural representation of the present utility model.
The specific embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is described in further detail.
Embodiment 1
As shown in the figure, a kind of double side flexible copper coated board comprises polyimide insulative base membrane layer 1, and the outside that polyimide insulative base membrane layer 1 both sides are equipped with insulation glue-line 2, two insulation glue-lines 2 covers and is provided with copper foil layer 3.Wherein said copper foil layer is electrolytic copper foil, and thickness is 9 μ m; The insulation glue-line is that epoxide-resin glue is layer, and thickness is 2 μ m; Polyimide insulative base membrane layer thickness is 10 μ m.
A kind of double side flexible copper coated board comprises polyimide insulative base membrane layer 1, and the outside that polyimide insulative base membrane layer 1 both sides are equipped with insulation glue-line 2, two insulation glue-lines 2 covers and is provided with copper foil layer 3.Wherein said copper foil layer is electrolytic copper foil, and thickness is 35 μ m; The insulation glue-line is that epoxide-resin glue is layer, and thickness is 20 μ m; Polyimide insulative base membrane layer thickness is 100 μ m.
A kind of double side flexible copper coated board comprises polyimide insulative base membrane layer 1, and the outside that polyimide insulative base membrane layer 1 both sides are equipped with insulation glue-line 2, two insulation glue-lines 2 covers and is provided with copper foil layer 3.Wherein said copper foil layer is electrolytic copper foil, and thickness is 20 μ m; The insulation glue-line is that SGA is layer, and thickness is 10 μ m; Polyimide insulative base membrane layer thickness is 35 μ m.
Embodiment 4
A kind of double side flexible copper coated board comprises polyimide insulative base membrane layer 1, and the outside that polyimide insulative base membrane layer 1 both sides are equipped with insulation glue-line 2, two insulation glue-lines 2 covers and is provided with copper foil layer 3.Wherein said copper foil layer is electrolytic copper foil, and thickness is 20 μ m; The insulation glue-line is that epoxide-resin glue is layer, and thickness is 5 μ m; Polyimide insulative base membrane layer thickness is 20 μ m.
Embodiment 5
A kind of double side flexible copper coated board comprises polyimide insulative base membrane layer 1, and the outside that polyimide insulative base membrane layer 1 both sides are equipped with insulation glue-line 2, two insulation glue-lines 2 covers and is provided with copper foil layer 3.Wherein said copper foil layer is rolled copper foil, and thickness is 10 μ m; The insulation glue-line is that epoxide-resin glue is layer, and thickness is 8 μ m; Polyimide insulative base membrane layer thickness is 20 μ m.
Embodiment 6
A kind of double side flexible copper coated board comprises polyimide insulative base membrane layer 1, and the outside that polyimide insulative base membrane layer 1 both sides are equipped with insulation glue-line 2, two insulation glue-lines 2 covers and is provided with copper foil layer 3.Wherein said copper foil layer is electrolytic copper foil, and thickness is 20 μ m; The insulation glue-line is the polyurethane glue-line, and thickness is 10 μ m; Polyimide insulative base membrane layer thickness is 35 μ m.
Embodiment 7
A kind of double side flexible copper coated board comprises polyimide insulative base membrane layer 1, and the outside that polyimide insulative base membrane layer 1 both sides are equipped with insulation glue-line 2, two insulation glue-lines 2 covers and is provided with copper foil layer 3.Wherein said copper foil layer is rolled copper foil, and thickness is 20 μ m; The insulation glue-line is that polyimides glue is layer, and thickness is 10 μ m; Polyimide insulative base membrane layer thickness is 35 μ m.
The preparation method of double side flexible copper coated board in the utility model:
1, first utilize organic solvent will select insulating cement to disperse to form the liquid dispersion of insulating cement, use coating equipment the liquid dispersion of this insulating cement to be coated in a side of polyimide insulative basement membrane;
2, the polyimide insulative basement membrane that a side in step 1 is coated with the insulating cement dispersion is put into drying oven, at 80-180 ℃ of heating 1-10min, removes organic solvent and makes the quick semi-solid preparation of insulating cement;
3, under 80-100 ℃, insulating cement and Copper Foil pressing with semi-solid preparation obtain single-face flexibility copper-clad board;
4, with baking under single-face flexibility copper-clad board and 10-100 ℃ 5-20 hour, apply the insulating cement dispersion in the outside of the polyimide-based rete of copper-clad plate, repeating step 2,3 namely obtains double side flexible copper coated board;
5, double side flexible copper coated board is carried out rear curing under 80-170 ℃, namely obtain required double face copper.
Above-described embodiment, it is preferred embodiment of the present utility model, be not to limit the utility model practical range, thus all equivalence variation or modifications of being done with the described structure of the utility model claim, feature and principle, within all should being included in the utility model claim scope.
Claims (9)
1. double side flexible copper coated board, it is characterized in that: comprise polyimide insulative base membrane layer, gluing layer and copper foil layer, the both sides of described polyimide insulative base membrane layer are coated with the gluing layer, and described copper foil layer is overlaid on respectively outside the described polyimide insulative base membrane layer both sides that are coated with adhesive layer.
2. double side flexible copper coated board according to claim 1, it is characterized in that: described copper foil layer thickness is 9-70 μ m.
3. double side flexible copper coated board according to claim 2, it is characterized in that: described copper foil layer thickness is 9-35 μ m.
4. the described double side flexible copper coated board of any one according to claim 1-3, it is characterized in that: described copper foil layer is electrodeposited copper foil layer.
5. the described double side flexible copper coated board of any one according to claim 1-3, it is characterized in that: described copper foil layer is the rolled copper foil layer.
6. double side flexible copper coated board according to claim 1, it is characterized in that: described polyimide insulative base membrane layer thickness is 10-100 μ m.
7. double side flexible copper coated board according to claim 1, it is characterized in that: described adhesive layer thickness is 2-20 μ m.
8. double side flexible copper coated board according to claim 7, it is characterized in that: described adhesive layer thickness is 2-10 μ m.
9. double side flexible copper coated board according to claim 8 is characterized in that: described adhesive layer is epoxide-resin glue system, SGA system, polyester adhesive system, polyurethane adhesive system or polyimides glue system layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220677348 CN202986235U (en) | 2012-12-10 | 2012-12-10 | Double-faced flexible copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220677348 CN202986235U (en) | 2012-12-10 | 2012-12-10 | Double-faced flexible copper-clad plate |
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| Publication Number | Publication Date |
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| CN202986235U true CN202986235U (en) | 2013-06-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201220677348 Expired - Fee Related CN202986235U (en) | 2012-12-10 | 2012-12-10 | Double-faced flexible copper-clad plate |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103770400A (en) * | 2014-01-09 | 2014-05-07 | 鹤山东力电子科技有限公司 | 3D (three-dimensional) metal-based copper-clad plate |
| CN107400493A (en) * | 2017-07-27 | 2017-11-28 | 上海弘睿生物科技有限公司 | Degradable Adhesive composition and its production and use |
| CN108045025A (en) * | 2018-01-08 | 2018-05-18 | 烟台智本知识产权运营管理有限公司 | A kind of two layers of gum-free double side flexible copper coated board and preparation method thereof |
| CN108099304A (en) * | 2018-01-08 | 2018-06-01 | 烟台智本知识产权运营管理有限公司 | A kind of two layers of gum-free double side flexible copper coated board and preparation method thereof |
| CN108237742A (en) * | 2018-01-08 | 2018-07-03 | 招远春鹏电子科技有限公司 | A kind of two layers of method double side flexible copper coated board and preparation method thereof |
| CN108284652A (en) * | 2018-01-08 | 2018-07-17 | 烟台智本知识产权运营管理有限公司 | A kind of gum-free double side flexible copper coated board and preparation method thereof |
| CN108556431A (en) * | 2018-01-08 | 2018-09-21 | 招远春鹏电子科技有限公司 | A kind of double side flexible copper coated board and preparation method thereof |
| CN108943895A (en) * | 2018-07-31 | 2018-12-07 | 招远春鹏电子科技有限公司 | Two layers of method double side flexible copper coated board of one kind and preparation method thereof |
| CN108973270A (en) * | 2018-07-31 | 2018-12-11 | 招远春鹏电子科技有限公司 | A kind of gum-free double side flexible copper coated board and preparation method thereof |
| CN109109404A (en) * | 2018-07-31 | 2019-01-01 | 招远春鹏电子科技有限公司 | A kind of double side flexible copper coated board and preparation method thereof |
| CN113580713A (en) * | 2021-08-31 | 2021-11-02 | 长沙新材料产业研究院有限公司 | Polyimide copper-clad plate and preparation method thereof |
-
2012
- 2012-12-10 CN CN 201220677348 patent/CN202986235U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103770400A (en) * | 2014-01-09 | 2014-05-07 | 鹤山东力电子科技有限公司 | 3D (three-dimensional) metal-based copper-clad plate |
| CN107400493A (en) * | 2017-07-27 | 2017-11-28 | 上海弘睿生物科技有限公司 | Degradable Adhesive composition and its production and use |
| CN108045025A (en) * | 2018-01-08 | 2018-05-18 | 烟台智本知识产权运营管理有限公司 | A kind of two layers of gum-free double side flexible copper coated board and preparation method thereof |
| CN108099304A (en) * | 2018-01-08 | 2018-06-01 | 烟台智本知识产权运营管理有限公司 | A kind of two layers of gum-free double side flexible copper coated board and preparation method thereof |
| CN108237742A (en) * | 2018-01-08 | 2018-07-03 | 招远春鹏电子科技有限公司 | A kind of two layers of method double side flexible copper coated board and preparation method thereof |
| CN108284652A (en) * | 2018-01-08 | 2018-07-17 | 烟台智本知识产权运营管理有限公司 | A kind of gum-free double side flexible copper coated board and preparation method thereof |
| CN108556431A (en) * | 2018-01-08 | 2018-09-21 | 招远春鹏电子科技有限公司 | A kind of double side flexible copper coated board and preparation method thereof |
| CN108943895A (en) * | 2018-07-31 | 2018-12-07 | 招远春鹏电子科技有限公司 | Two layers of method double side flexible copper coated board of one kind and preparation method thereof |
| CN108973270A (en) * | 2018-07-31 | 2018-12-11 | 招远春鹏电子科技有限公司 | A kind of gum-free double side flexible copper coated board and preparation method thereof |
| CN109109404A (en) * | 2018-07-31 | 2019-01-01 | 招远春鹏电子科技有限公司 | A kind of double side flexible copper coated board and preparation method thereof |
| CN113580713A (en) * | 2021-08-31 | 2021-11-02 | 长沙新材料产业研究院有限公司 | Polyimide copper-clad plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20201210 |
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| CF01 | Termination of patent right due to non-payment of annual fee |