CN103660490A - Manufacturing method for two-layer method produced double-side flexible copper-clad plate - Google Patents
Manufacturing method for two-layer method produced double-side flexible copper-clad plate Download PDFInfo
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- CN103660490A CN103660490A CN201310601206.5A CN201310601206A CN103660490A CN 103660490 A CN103660490 A CN 103660490A CN 201310601206 A CN201310601206 A CN 201310601206A CN 103660490 A CN103660490 A CN 103660490A
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Abstract
The invention relates to the field of flexible printed circuit board manufacturing, in particular to a manufacturing method for a two-layer method produced double-side flexible copper-clad plate. The manufacturing method comprises the following steps: preparing a thermoplastic polyimide precursor solution and a thermoset polyimide precursor solution; laying copper foil on a coating machine, coating a two-formula three-layer polyamic acid structure on the copper foil at one time, and then performing high-temperature solidification to obtain a single-side plate, wherein in the three-layer structure, the middle sandwich layer is made of thermoset polyimide precursor solution, and the inner layer and the outer layer are made of thermoplastic polyimide precursor solution; allowing the copper foil and the single-side plate to be subjected to high temperature heat pressing and imidization processing to obtain the two-layer method produced double-side flexible copper-clad plate. According to the method, a three-cavity coating die head is adopted for coating the two-formula three-layer polyimide precursor solution at one time, then the solution is subjected to high-temperature solidification to obtain the single-side plate, and finally, the copper foil and the single-side plate are subjected to high temperature heat pressing and imidization processing, thereby obtaining the two-layer method produced double-side flexible copper-clad plate. Moreover, the process method is simple, and the production efficiency is improved.
Description
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Technical field
The present invention relates to flexibility printed circuit board and make field, be specifically related to a kind of preparation method of two layers of method double side flexible copper coated board.
Background technology
Along with the development of mechanics of communication, personal electric product is tending towards slimming gradually in recent years.Flexible printed-circuit board has been widely used in the consumption electronic products such as notebook computer, mobile phone and digital camera, due to improving constantly of electron trade specification requirement, it is compact that consumption electronic products move towards just fast, day by day requires corresponding flexibility coat copper plate lighter and thinner and have high-fire resistance and a high reliability.
Because current process is complicated and be unfavorable for the raising of production efficiency and the raising of production yields.Therefore studying a kind of simple process is extremely necessary.
Summary of the invention
In order to overcome above-mentioned defect, the object of the present invention is to provide a kind of preparation method of two layers of method double side flexible copper coated board, process is simple, and enhances productivity.
To achieve these goals, the technical solution adopted in the present invention is: a kind of preparation method of two layers of method double side flexible copper coated board, it is characterized in that, and comprise the steps:
(1) prepare TPI precursor aqueous solution and Thermocurable polyimide precursor aqueous solution;
(2) Copper Foil is layed on coating machine, the disposable polyamic acid structure that is coated with out two kinds of formula three-deckers on Copper Foil obtains single sided board after hot setting; In three-decker, intermediate core layer is that heat curing-type polyimides precursor aqueous solution is made, inside and outside two-layerly make for thermoplastics type's polyimides precursor aqueous solution;
(3) Copper Foil and above-mentioned single sided board are carried out obtaining two layers of method double side flexible copper coated board after high temperature hot pressing and imidization processing.
The preparation method of aforesaid a kind of two layers of method double side flexible copper coated board, in step (1), take a certain amount of diamine monomer ODA or DAPE and be dissolved in polar solvent dimethyl formamide, dimethylacetylamide, in 1-METHYLPYRROLIDONE or dimethyl sulfoxide (DMSO), the mass fraction of diamine monomer is 10% ~ 15%, then stirring at normal temperature 1-2 hour, above-mentioned solution is divided into two parts, add respectively different dianhydrides, portion adds BPDA, another part adds PMDA, one or both reagent of BAPP, the mass fraction that dianhydride accounts for solution is 15%, stir 2-3 hour, obtain respectively Thermocurable polyimide precursor aqueous solution and TPI precursor aqueous solution.
The preparation method of aforesaid a kind of two layers of method double side flexible copper coated board, in step (2), hot setting refers to: coated Copper Foil is put into the oven for baking 5 minutes of 180 ℃, taken out and place a period of time, until copper foil surface is dry, copper foil surface forms single sided board.
The preparation method of aforesaid a kind of two layers of method double side flexible copper coated board, in step (2), three chamber coating die heads complete the coating of three-decker, 100 ~ 150 ℃ of coating temperatures by three dispense tips.
The preparation method of aforesaid a kind of two layers of method double side flexible copper coated board, in step (3), high-temperature laminating refers to when 200 ℃ ~ 250 ℃ of temperature, pressure 20MPa ~ 30MPa pressing 1 ~ 3 minute; The concrete steps that imidization is processed are: in room temperature situation, be warming up to 160 ℃ in 30 minutes, constant temperature 2 hours was then warming up to 320 ℃ in 2 hours, constant temperature half an hour, finally in 2 hours, are cooled to room temperature.
The preparation method of aforesaid a kind of two layers of method double side flexible copper coated board, in step (3), two layers of method double side flexible copper coated board consist of Copper Foil, Thermocurable polyimide intermediate core layer and inside and outside two-layer thermoplastics type's polyimide layer; The dried thickness of thermoplastic polyimide layer is 10-15 μ m, peel strength>=1N/mm, surface resistivity>=1.0 * 10
13Ω, specific insulation>=1.0 * 10
15Ω; The thickness 0.025mm of Thermocurable polyimide layer, hot strength>=110MPa, dielectric constant is 3-4.
The preparation method of aforesaid a kind of two layers of method double side flexible copper coated board, described Copper Foil is electrolytic copper foil, thickness is 10-60 μ m.
The present invention's two layers of method double side flexible copper coated board that also prepared by claimed aforesaid method.
The present invention utilizes three chamber coating die heads, the disposable polyimides precursor aqueous solution that is coated with out two kinds of formula three-deckers, after hot setting, obtain single sided board, by Copper Foil and above-mentioned single sided board carries out high temperature hot pressing and two layers of method double side flexible copper coated board are processed and obtained in imidization, process is simple, and enhances productivity.
Accompanying drawing explanation
Fig. 1 is three chamber coating die head coating flow figure of the present invention.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
A preparation method for two layers of method double side flexible copper coated board, concrete steps are as follows:
Take a certain amount of diamine monomer ODA or DAPE and be dissolved in polar solvent dimethyl formamide, dimethylacetylamide, in one or both reagent of 1-METHYLPYRROLIDONE or dimethyl sulfoxide (DMSO), the mass fraction of diamine monomer is 10% ~ 15%, then stirring at normal temperature 1-2 hour, above-mentioned solution is divided into two parts, add respectively different dianhydrides, portion adds BPDA, another part adds PMDA, one or both reagent of BAPP, the mass fraction that dianhydride accounts for solution is 15%, stir 2-3 hour, obtain respectively Thermocurable polyimide precursor aqueous solution and TPI precursor aqueous solution.
Copper Foil is laid on coating machine, adopt three chamber coating die heads, the disposable polyamic acid structure that is coated with out three-decker, coating squence is followed successively by 3,2,1, and intermediate core layer is heat curing-type polyamic acid layer 2, two outside layers is thermoplastics type's polyamic acid layer (1,3), then coated Copper Foil is put into the oven for baking 5 minutes of 180 ℃, taken out and place a period of time, until copper foil surface is dry, copper foil surface forms the single sided board of three-decker.
Copper Foil and above-mentioned single sided board are carried out to high-temperature laminating, then carry out imidization processing, finally obtain two layers of method double side flexible copper coated board.Imidization engineering is: in room temperature situation, be warming up to 160 ℃ in 30 minutes, constant temperature 2 hours was then warming up to 320 ℃ in 2 hours, constant temperature half an hour, finally in 2 hours, is cooled to room temperature.
The specific requirement of the dual platen that the present embodiment is made is: Copper Foil is electrolytic copper foil, and thickness is 10-60 μ m, and the dried thickness of TPI coating is 10-15 μ m, peel strength>=1N/mm, soldering resistance is good, good stability of the dimension, surface resistivity>=1.0 * 10
13Ω, specific insulation>=1.0 * 10
15Ω.
Above-described embodiment does not limit the present invention in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops on protection scope of the present invention.
Claims (8)
1. a preparation method for two layers of method double side flexible copper coated board, is characterized in that, comprises the steps:
Prepare TPI precursor aqueous solution and Thermocurable polyimide precursor aqueous solution;
Copper Foil is layed on coating machine, and the disposable polyamic acid structure that is coated with out two kinds of formula three-deckers on Copper Foil obtains single sided board after hot setting; In three-decker, intermediate core layer is that heat curing-type polyimides precursor aqueous solution is made, inside and outside two-layerly make for thermoplastics type's polyimides precursor aqueous solution;
Copper Foil and above-mentioned single sided board are carried out obtaining two layers of method double side flexible copper coated board after high temperature hot pressing and imidization processing.
2. the preparation method of a kind of two layers of method double side flexible copper coated board according to claim 1, it is characterized in that, in step (1), take a certain amount of diamine monomer ODA or DAPE and be dissolved in polar solvent dimethyl formamide, dimethylacetylamide, in one or both reagent of 1-METHYLPYRROLIDONE or dimethyl sulfoxide (DMSO), the mass fraction of diamine monomer is 10% ~ 15%, then stirring at normal temperature 1-2 hour, above-mentioned solution is divided into two parts, add respectively different dianhydrides, portion adds BPDA, another part adds PMDA, one or both reagent of BAPP, the mass fraction that dianhydride accounts for solution is 15%, stir 2-3 hour, obtain respectively Thermocurable polyimide precursor aqueous solution and TPI precursor aqueous solution.
3. the preparation method of a kind of two layers of method double side flexible copper coated board according to claim 1 and 2, it is characterized in that: in step (2), hot setting refers to: coated Copper Foil is put into the oven for baking 5 minutes of 180 ℃, take out and place a period of time, until copper foil surface is dry, copper foil surface forms single sided board.
4. the preparation method of a kind of two layers of method double side flexible copper coated board according to claim 3, is characterized in that: in step (2), three chamber coating die heads complete the coating of three-decker, 100 ~ 150 ℃ of coating temperatures by three dispense tips.
5. the preparation method of a kind of two layers of method double side flexible copper coated board according to claim 3, is characterized in that: in step (3), high-temperature laminating refers to when 200 ℃ ~ 250 ℃ of temperature, pressure 20MPa ~ 30MPa pressing 1 ~ 3 minute; The concrete steps that imidization is processed are: in room temperature situation, be warming up to 160 ℃ in 30 minutes, constant temperature 2 hours was then warming up to 320 ℃ in 2 hours, constant temperature half an hour, finally in 2 hours, are cooled to room temperature.
6. the preparation method of a kind of two layers of method double side flexible copper coated board according to claim 5, it is characterized in that: in step (3), two layers of method double side flexible copper coated board consist of Copper Foil, Thermocurable polyimide intermediate core layer and inside and outside two-layer thermoplastics type's polyimide layer; The dried thickness of thermoplastic polyimide layer is 10-15 μ m, peel strength>=1N/mm, surface resistivity>=1.0 * 10
13Ω, specific insulation>=1.0 * 10
15Ω; The thickness 25 μ m of Thermocurable polyimide layer, hot strength>=110MPa, dielectric constant is 3-4.
7. according to the preparation method of a kind of two layers of method double side flexible copper coated board described in claim 1-6 any one, it is characterized in that: described Copper Foil is electrolytic copper foil, thickness is 10-60 μ m.
8. two layers of method double side flexible copper coated board that prepared by claim 1-6 any one method.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105015099A (en) * | 2014-04-30 | 2015-11-04 | 台虹科技股份有限公司 | Polyimide/metal composite laminated plate and preparation method thereof |
| CN106903944A (en) * | 2017-03-15 | 2017-06-30 | 深圳市弘海电子材料技术有限公司 | Single, double surface non-gel flexible copper-clad plate and preparation method thereof |
| US9694569B2 (en) | 2014-06-24 | 2017-07-04 | Taiflex Scientific Co., Ltd. | Polyimide metal laminated plate and method of making the same |
| CN109228586A (en) * | 2018-08-31 | 2019-01-18 | 株洲时代新材料科技股份有限公司 | A kind of low dielectric polyimide composite film and preparation method thereof |
| CN109532145A (en) * | 2018-11-30 | 2019-03-29 | 曾瑾 | A kind of gum-free double side flexible copper coated board and preparation method thereof |
| WO2021035918A1 (en) * | 2019-08-23 | 2021-03-04 | 李龙凯 | High-frequency circuit board layer structure and method for preparing same |
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| JP2001270034A (en) * | 2000-03-28 | 2001-10-02 | Ube Ind Ltd | Flexible metal foil laminate |
| CN1989008A (en) * | 2004-07-27 | 2007-06-27 | 株式会社钟化 | Adhesive film and use thereof |
| CN101353424A (en) * | 2008-05-21 | 2009-01-28 | 广东生益科技股份有限公司 | Thermoplastic polyimide resin containing active lateral group, flexible copper clad laminate manufactured with the same and manufacturing method thereof |
| CN102729561A (en) * | 2012-07-19 | 2012-10-17 | 宜兴市高拓高分子材料有限公司 | Polyimide thin film for manufacturing glue system-free flexible circuit board and perpetration method thereof |
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2013
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| JP2001164006A (en) * | 1999-12-09 | 2001-06-19 | Du Pont Toray Co Ltd | Polyimide film |
| JP2001270034A (en) * | 2000-03-28 | 2001-10-02 | Ube Ind Ltd | Flexible metal foil laminate |
| CN1989008A (en) * | 2004-07-27 | 2007-06-27 | 株式会社钟化 | Adhesive film and use thereof |
| CN101353424A (en) * | 2008-05-21 | 2009-01-28 | 广东生益科技股份有限公司 | Thermoplastic polyimide resin containing active lateral group, flexible copper clad laminate manufactured with the same and manufacturing method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105015099A (en) * | 2014-04-30 | 2015-11-04 | 台虹科技股份有限公司 | Polyimide/metal composite laminated plate and preparation method thereof |
| CN105015099B (en) * | 2014-04-30 | 2017-06-06 | 台虹科技股份有限公司 | Polyimides/metal composite laminated plates and preparation method thereof |
| US9694569B2 (en) | 2014-06-24 | 2017-07-04 | Taiflex Scientific Co., Ltd. | Polyimide metal laminated plate and method of making the same |
| CN106903944A (en) * | 2017-03-15 | 2017-06-30 | 深圳市弘海电子材料技术有限公司 | Single, double surface non-gel flexible copper-clad plate and preparation method thereof |
| CN109228586A (en) * | 2018-08-31 | 2019-01-18 | 株洲时代新材料科技股份有限公司 | A kind of low dielectric polyimide composite film and preparation method thereof |
| CN109532145A (en) * | 2018-11-30 | 2019-03-29 | 曾瑾 | A kind of gum-free double side flexible copper coated board and preparation method thereof |
| WO2021035918A1 (en) * | 2019-08-23 | 2021-03-04 | 李龙凯 | High-frequency circuit board layer structure and method for preparing same |
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Application publication date: 20140326 |