CN205667014U - High heat -resisting high roughness integrated circuit laminated structure has - Google Patents
High heat -resisting high roughness integrated circuit laminated structure has Download PDFInfo
- Publication number
- CN205667014U CN205667014U CN201521065279.8U CN201521065279U CN205667014U CN 205667014 U CN205667014 U CN 205667014U CN 201521065279 U CN201521065279 U CN 201521065279U CN 205667014 U CN205667014 U CN 205667014U
- Authority
- CN
- China
- Prior art keywords
- layer
- tpi
- integrated circuit
- flatness
- resisting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a high heat -resisting high roughness integrated circuit laminated structure has includes line layer and TPI function rete at least among the laminated structure, TPI function rete is by heating flowable polyimide coating and alternative range upon range of the forming of compliance polyimide base plate. The utility model discloses in, adopt special TPI function rete to replace traditional protective cover and adhesive linkage for the line layer can a pressfitting shaping and is handled, has simplified the production procedure greatly, has shortened the process, has reduced the accumulative error in the course of working, thereby has improved product precision and yield, has reduced the cost in the production. And the polyimides material is one of heat -resisting ability best material in as the macromolecular material, can stand 350 DEG C high temperature, is higher than 260 DEG C of temperature resistant upper limits of ordinary circuit board far away.
Description
Technical field
This utility model belongs to integrated circuit fields, is specifically related to one and has high heat-resisting high-flatness integrated circuit stack
Structure.
Background technology
Flexible circuit board (FPC) in printed circuit board, mainly by the heat-resisting and epoxy resin base plate of good stability of the dimension
Or high heat-resisting pliability polyimide substrate, through hole, electroplates, etching, pressing, print, the procedure for processing production such as test
Form.The supporting body being electrically connected mainly as every electronic building brick, is requisite critical component in electronic system, supports
The development of whole electronics and information industry；Along with the development of domestic economy, electronics and information industry includes that printed circuit board industry must
The development of preferential high speed will be obtained.Currently, consumer electronic devices is all toward lightening, miniaturization, Large Copacity, high-performance
Change, low heatingization develops, correspondingly be that FPC industry also can be toward development on the frivolous direction such as heat-resisting small and exquisite, high.
Conventional flex wiring board (FPC), rigid-flexible combined circuit board (R-F) produce in generally require use flexibility circuit layer,
Rigid line layer, thicken supporting layer, protective mulch, this five classes material layer of adhesive linkage, general during being processed into finished product
Need through " flexibility circuit layer: blanking → figure → brill target → brown → patch protective mulch → brown → matching board；Rigid line
Layer: blanking → figure → brill target → groove milling → brown → matching board；Thicken supporting layer: blanking → groove milling → matching board；Protective mulch:
Blanking → cutting → laminating；Outer-layer circuit: matching board → pressing → brill target → boring → plasma desmearing → tape → PI adjusts
Whole → hole → VCP plating → figure → DES → figure → DES → welding resistance → character → change gold → test → profile → last instance →
Packaging " etc. about 40 procedures, overall craft is relatively complicated.And the epoxy resin used in adhesive linkage, polyacrylic acid
Class binding agent can highlight when preparing Novel flexible circuit board its thermostability the best, in Drilling operation processing procedure desmearing difficulty
The problem of (generally require use plasma beam-plasma operate), the cost that these fixing flow processs make wiring board produce is difficult to
Compression further, error accumulation step by step will also result in quality of finished and is also difficult to improve further.Additionally, due to epoxy resin
With physical characteristic and the chemical characteristic of polyacrylic acid itself, the wiring board so produced also can be sudden and violent when for multilayer build-up
Expose the drawback that flatness is poor, it is difficult to meet that novel consumption electronic product is lightening, the demand of high performance；The more important thing is
The thermostability of this two classes chemical substance is the best, 260 DEG C i.e. can decomposes, can by badly influence terminal electronic product
By property.
Utility model content
This utility model purpose is to provide one and has high heat-resisting high-flatness integrated circuit stack structure, solves existing
Surface-mounted integrated circuit planarization is bad, the problem that thermostability is the highest.
The technical solution of the utility model is: one has high heat-resisting high-flatness integrated circuit stack structure, and lamination is tied
Structure at least includes line layer and TPI functional film layer, described TPI functional film layer by heat flowable polyimide coating with can
Flexible polyimide substrate is alternately laminated to be formed.
Further, heating flowable polyimide coating thickness range is 1 μm-200 μm.Preferably, heating can be flowed
Dynamic polyimide coating thickness range is 3 μm-150 μm.
Further, pliability polyimide substrate thickness range is 3 μm-200 μm.Preferably, pliability polyimides
Substrate thicknesses range is 6 μm-175 μm.
Further, described line layer includes flexibility circuit layer or rigid line layer.
Further, laminated construction by TPI functional film layer, line layer, thicken in supporting layer, protective mulch or adhesive linkage
Any two-layer or multilayer laminated form, wherein must comprise TPI functional film layer and line layer.
This utility model compared with prior art has the advantage that
In this utility model, use special TPI functional film layer to replace traditional protective mulch and adhesive linkage so that
Line layer can enormously simplify production procedure, shorten operation, reduce the course of processing with one step press molding and process
In cumulative error, thus improve Product Precision and yield, reduce the cost in production.The TPI obtained it is coated with through precision
Functional membrane, has benefited from heating flowable TPI and pliability polyimide substrate both polyimide materials
Between material, the fabulous compatibility, the thermal deformation shrinkage factor of fairly similar and lamination used chemically has reduced, its circuit prepared
Plate flatness also can be much higher than the flatness of traditional circuit plate.Further, polyimide-type materials is as resistance in macromolecular material
One of material that heat energy power is best, can stand 260 DEG C of heatproof upper limits of the high temperature of 350 DEG C, significantly larger than common line plate.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1；
Fig. 2 is the structural representation of embodiment 2；
Fig. 3 is the structural representation of embodiment 3；
Fig. 4 is the structural representation of embodiment 4；
Fig. 5 is the structural representation of comparative example；
In figure, reference is: 1-rigid line layer, and 2-thickens supporting layer, 3-TPI functional film layer, 4-flexibility circuit layer,
5-protective mulch, 6-adhesive linkage.
Detailed description of the invention
Flexibility circuit layer includes: with polyethylene terephthalate (PET), polyimides (PI), poly terephthalic acid
Glycol ester (PEN), polyether-ether-ketone (PEEK), Merlon (PC), liquid crystal polymer (LCP) and poly aromatic fiber (Aramid)
Single, double surface flexibility coat copper plate (FCCL) for dielectric layer；Preferably with polyethylene terephthalate (PET), polyimides
And single, double surface flexibility coat copper plate (FCCL) that liquid crystal polymer (LCP) is dielectric layer (PI)；With polyimides (PI) it is further preferably
The single, double surface flexibility coat copper plate (FCCL) of dielectric layer.
Rigid line layer includes: copper sheet (Copper)；Single, double surface copper-clad base plate (CCL).
Thicken supporting layer to include: PP prepreg (Prepreg)；Fire-retardant cured sheets FR4；Single, double surface copper-clad base plate
(CCL)；Liquid crystal polymer (LCP)；Polyimides (PI).Preferably PP prepreg (Prepreg)；Fire-retardant cured sheets FR4.
Protective mulch includes: gum Copper Foil (ECC), polyimides (PI) substrate gum coverlay, poly terephthalic acid
Glycol ester (PET) substrate gum coverlay, liquid crystal polymer (LCP) substrate gum coverlay, epoxy resin substrate gum cover
Epiphragma, polyacrylic resin substrate gum coverlay.
Adhesive linkage includes: epoxy resin, thermoplastic polyimide resin, phenolic resin, modified epoxy, polyacrylic acid
The materials such as resin polyflon, liquid crystal polymer resin；Preferred epoxy, phenolic resin, modified epoxy, poly-
Acrylic resin.
TPI functional film layer refers to heating the material that flowable polyimides is combined into pliability polyimide substrate
Material.
Embodiment 1:
The method preparing 7 sandwich circuit wiring boards: use with the polyimides (PI) double side flexible copper coated board as dielectric layer
(FCCL) as flexibility circuit layer 4, copper sheet as rigid line layer 1, PP prepreg as thickening supporting layer 2, TPI functional membrane
Layer 3, overlaps according to the folded structure of Fig. 1, through " flexibility circuit layer: blanking → figure → brill target → brown → join in the course of processing
Plate；Rigid line layer: blanking → brill target → matching board；Thicken supporting layer: blanking → groove milling → matching board；TPI functional film layer: blanking →
Cutting → matching board；Outer-layer circuit: matching board → pressing → brill target → boring → plasma desmearing → PI adjustment → hole → VCP electricity
Plating → figure → DES → welding resistance → character → change gold → test → profile → last instance → packaging " step makes.
Embodiment 2:
The method preparing 3 sandwich circuit wiring boards: use with two-sided as dielectric layer of polyethylene terephthalate (PET)
Flexibility coat copper plate (FCCL), as flexibility circuit layer 4, TPI functional film layer 3, overlaps according to the folded structure of Fig. 2, warp in the course of processing
Cross " flexibility circuit layer: blanking → figure → brill target → brown → matching board；TPI functional film layer: blanking → cutting → matching board → pressure
Close " step makes.
Embodiment 3:
The method preparing 15 sandwich circuit wiring boards: use and cover copper with the liquid crystal polymer (LCP) double-faced flexible as dielectric layer
Plate (FCCL) props up as thickening as rigid line layer 1, fire-retardant cured sheets FR4 as flexibility circuit layer 4, double-sided copper-clad substrate
Support layer 2, TPI functional film layer 3, overlap according to the folded structure of Fig. 3, and the course of processing is similar to Example 1, mainly changes lamination quantity
The concrete material with layer.
Embodiment 4:
The method preparing 32 sandwich circuit wiring boards: use and make with the Merlon (PC) double side flexible copper coated board as dielectric layer
For flexibility circuit layer 4, one side copper-clad base plate as rigid line layer 1, polyimides (PI) as thickening supporting layer 2, TPI function
Film layer 3, overlaps according to the folded structure of Fig. 4, and the course of processing is similar to Example 1, and main change lamination quantity is concrete material with layer
Material.
Comparative example:
The method preparing 7 sandwich circuit wiring boards: use with the polyimides (PI) double side flexible copper coated board as dielectric layer
(FCCL) as flexibility circuit layer 4, one side copper-clad base plate as rigid line layer 1, PP prepreg as thicken supporting layer 2,
Epoxy resin substrate gum coverlay, is carried out according to the folded structure of Fig. 5 as adhesive linkage 6 as protective mulch 5, modified epoxy
Overlapping, through " flexibility circuit layer: blanking → figure → brill target → brown → patch protective mulch → brown → join in the course of processing
Plate；Rigid line layer: blanking → figure → brill target → groove milling → brown → matching board；Thicken supporting layer: blanking → groove milling → matching board；
Protective mulch: blanking → cutting → laminating；Outer-layer circuit: matching board → pressing → brill target → boring → plasma desmearing → patch
Adhesive tape → PI adjustment → hole → VCP plating → figure → DES → figure → DES → welding resistance → character → change gold → test → outer
Shape → last instance → packaging " step makes.
TPI functional membrane can be prepared in the following ways:
Preparation example 1
Accurate rubbing method is used to prepare the flowable polyimides functional membrane that is heated, at the polyimides PI that thickness is 12.5 μm
By the flowable polyimides TPI that is heated that accurate coating apparatus coating thickness is 3 μm on film, it is then passed through tunnel oven or red
Outer stove carries out the imidization of temperature programming and processes, then enters stitching wheel and carry out pressing and process and obtain being heated of structure as shown in Figure 1
Flowable polyimides functional membrane product.Product passes through 320 DEG C of resistance to Thermal test of scolding tin；Dimensional stability MD=-0.04%, TD=+
0.03% 。
Preparation example 2
Accurate rubbing method is used to prepare the flowable polyimides functional membrane that is heated, at the polyimides PI that thickness is 12.5 μm
By the flowable polyimides TPI that is heated that accurate coating apparatus coating thickness is 8 μm on film, it is then passed through tunnel oven or red
Outer stove carries out the imidization of temperature programming and processes, then enters stitching wheel and carry out pressing and processed coated on one side；Again pass by
Accurate coating apparatus coating thickness is the flowable polyimides that is heated of 6 μm, also passes through tunnel oven or infra-red furnace carries out journey
The imidization that sequence heats up processes, then enters stitching wheel and carry out pressing and process and obtain the flowable polyamides that is heated of structure as shown in Figure 2
Imines functional membrane product.Product passes through 320 DEG C of resistance to Thermal test of scolding tin；Dimensional stability MD=-0.06%, TD=+0.02%.
Preparation example 3
Accurate rubbing method and pressing legal system is used to enjoy hot flowable polyimides functional membrane, according to preparation example 1, preparation example 2
After preparing product respectively, two samples are put in high-temperature laminating machine, by obtaining after evacuation, temperature programming, pressure programming
The flowable polyimides functional membrane product that is heated of structure as shown in Figure 3.Product passes through 320 DEG C of resistance to Thermal test of scolding tin；Size is steady
Qualitative MD=-0.07%, TD=+0.03%.
Preparation example 4
Using accurate rubbing method to prepare the flowable polyimides functional membrane that is heated, method, with preparation example 2, simply changes PI layer
With TPI layer thickness.The polyimides PI film wherein using thickness to be 3 μm；It is respectively coated the TPI layer of 1 μm and 200 μm.Product leads to
Cross 320 DEG C of resistance to Thermal test of scolding tin；Dimensional stability MD=-0.08%, TD=+0.03%.
Preparation example 5
Using accurate rubbing method to prepare the flowable polyimides functional membrane that is heated, method, with preparation example 2, simply changes PI layer
With TPI layer thickness.The polyimides PI film wherein using thickness to be 6 μm；It is respectively coated the TPI layer of 3 μm and 150 μm.Product leads to
Cross 320 DEG C of resistance to Thermal test of scolding tin；Dimensional stability MD=-0.05%, TD=+0.01%.
Preparation example 6
Using accurate rubbing method to prepare the flowable polyimides functional membrane that is heated, method, with preparation example 2, simply changes PI layer
With TPI layer thickness.The polyimides PI film wherein using thickness to be 200 μm；It is respectively coated the TPI layer of 6 μm and 20 μm.Product leads to
Cross 320 DEG C of resistance to Thermal test of scolding tin；Dimensional stability MD=-0.03%, TD=+0.01%.
Preparation example 7
Using accurate rubbing method to prepare the flowable polyimides functional membrane that is heated, method, with preparation example 2, simply changes PI layer
With TPI layer thickness.The polyimides PI film wherein using thickness to be 175 μm；It is respectively coated the TPI layer of 8 μm and 15 μm.Product leads to
Cross 320 DEG C of resistance to Thermal test of scolding tin；Dimensional stability MD=-0.04%, TD=+0.02%.
Preparation example 8
Use accurate rubbing method and pressing legal system to enjoy hot flowable polyimides functional membrane, produce according to preparation example 1 preparation
After product, 8 products are put in high-temperature laminating machine, by obtaining flowable gathering of being heated after evacuation, temperature programming, pressure programming
Acid imide functional membrane product.Product passes through 320 DEG C of resistance to Thermal test of scolding tin；Dimensional stability MD=-0.06%, TD=+0.02%.
Preparation example 9
Use accurate rubbing method and pressing legal system to enjoy hot flowable polyimides functional membrane, produce according to preparation example 1 preparation
After product, 16 products are put in high-temperature laminating machine, flowable by obtaining after evacuation, temperature programming, pressure programming being heated
Polyimides functional membrane product.Product passes through 320 DEG C of resistance to Thermal test of scolding tin；Dimensional stability MD=-0.06%, TD=+0.02%.
Preparation example 10
Accurate rubbing method and pressing legal system is used to enjoy hot flowable polyimides functional membrane, according to preparation example 1, preparation example 2
After preparing product respectively, 1 preparation example 1 sample, 1 preparation example 2 sample, 1 preparation example 1 sample are overlapped successively and put into height
In temperature pressing machine, by obtaining the flowable polyimides functional membrane product that is heated after evacuation, temperature programming, pressure programming.Produce
Product pass through 320 DEG C of resistance to Thermal test of scolding tin；Dimensional stability MD=-0.04%, TD=+0.01%.
Compared to the preparation method of traditional wiring board, this utility model:
(1) integrated circuit stack structure is simplified；
(2) eliminate when preparing integrated circuit patch protective mulch, brown, figure, groove milling, brown, fit, tape,
Some operations such as DES.
(3) owing to decreasing process, the error accumulation in processing is not only decreased but also TPI functional film layer can be straight
Connect to be combined with pcb layer and substitute protective mulch and adhesive linkage, thus without considering that protective mulch is multiple with bonding interlayer
The error closed, therefore substantially increases the machining accuracy of integrated circuit: producing with the folded structure layer of tradition, machining accuracy is general only
± 0.1 mm can be reached；And use new folded structure layer to carry out production and processing precision up to ± 0.05mm, production will be greatly improved good
Rate, increases the benefit.
(4) have benefited from heating flowable polyimides and pliability polyimide substrate both polyimide-type materials
Between the fabulous compatibility, the thermal deformation shrinkage factor of fairly similar and lamination used chemically reduced, its flexible wire prepared
The flatness of road plate also can be much higher than the flatness of traditional circuit plate.
(5) polyimide-type materials is as one of best material of temperature capacity in macromolecular material, can stand 350 DEG C
High temperature, with polyimide-type materials substitute epoxy resin, polyacrylic is made the material of bonding agent and is greatly improved product
Thermostability and reliability.
Embodiment described above only have expressed the detailed description of the invention of the application, and it describes more concrete and detailed, but also
Therefore the restriction to the application protection domain can not be interpreted as.It should be pointed out that, for those of ordinary skill in the art
For, on the premise of conceiving without departing from technical scheme, it is also possible to make some deformation and improvement, these broadly fall into this
The protection domain of application.
Claims (7)
1. one kind has high heat-resisting high-flatness integrated circuit stack structure, it is characterised in that at least include line in laminated construction
Road floor and TPI functional film layer, described TPI functional film layer is polyimide-based with pliability by heating flowable polyimide coating
Plate is alternately laminated to be formed.
One the most according to claim 1 has high heat-resisting high-flatness integrated circuit stack structure, it is characterised in that add
The flowable polyimide coating thickness range of heat is 1 μm-200 μm.
One the most according to claim 2 has high heat-resisting high-flatness integrated circuit stack structure, it is characterised in that add
The flowable polyimide coating thickness range of heat is 3 μm-150 μm.
One the most according to claim 1 has high heat-resisting high-flatness integrated circuit stack structure, it is characterised in that can
Flexible polyimide substrate thicknesses range is 3 μm-200 μm.
One the most according to claim 4 has high heat-resisting high-flatness integrated circuit stack structure, it is characterised in that can
Flexible polyimide substrate thicknesses range is 6 μm-175 μm.
One the most according to claim 1 has high heat-resisting high-flatness integrated circuit stack structure, it is characterised in that institute
State line layer and include flexibility circuit layer or rigid line layer.
7. having high heat-resisting high-flatness integrated circuit stack structure according to the one described in any one of claim 1-5, it is special
Levying and be, laminated construction is by TPI functional film layer, line layer, any two layers thickened in supporting layer, protective mulch or adhesive linkage
Or multilayer laminated form, wherein must comprise TPI functional film layer and line layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521065279.8U CN205667014U (en) | 2015-12-18 | 2015-12-18 | High heat -resisting high roughness integrated circuit laminated structure has |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521065279.8U CN205667014U (en) | 2015-12-18 | 2015-12-18 | High heat -resisting high roughness integrated circuit laminated structure has |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205667014U true CN205667014U (en) | 2016-10-26 |
Family
ID=57162413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521065279.8U Active CN205667014U (en) | 2015-12-18 | 2015-12-18 | High heat -resisting high roughness integrated circuit laminated structure has |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205667014U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658957A (en) * | 2017-03-20 | 2017-05-10 | 成都多吉昌新材料股份有限公司 | All-polyimide type flexible copper clad laminate base plate and integrated circuit board |
| CN109068472A (en) * | 2018-08-24 | 2018-12-21 | 武汉恒泰通技术有限公司 | A kind of double-faced flexible soft board and its assembling jig |
-
2015
- 2015-12-18 CN CN201521065279.8U patent/CN205667014U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658957A (en) * | 2017-03-20 | 2017-05-10 | 成都多吉昌新材料股份有限公司 | All-polyimide type flexible copper clad laminate base plate and integrated circuit board |
| CN109068472A (en) * | 2018-08-24 | 2018-12-21 | 武汉恒泰通技术有限公司 | A kind of double-faced flexible soft board and its assembling jig |
| CN109068472B (en) * | 2018-08-24 | 2020-10-30 | 武汉恒泰通技术有限公司 | Double-sided flexible soft board and assembly fixture thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102630126B (en) | Compound double-side copper clad laminate and manufacturing method thereof | |
| US6334922B1 (en) | Coating method utilizing a polymer film and method of making metal-polymer laminates | |
| CN102794962A (en) | Composite double-sided copper foil substrate and manufacturing method thereof | |
| WO2007066788A1 (en) | Fluororesin laminate substrate | |
| CN205667014U (en) | High heat -resisting high roughness integrated circuit laminated structure has | |
| CN102340937B (en) | Manufacturing method of flexible multi-layer circuit board | |
| CN104640375A (en) | Method for manufacturing soft-hard combination board | |
| CN103374307A (en) | Gummed copper foil, production method for same, multilayer flexible circuit board and production method for same | |
| CN106585046B (en) | The thin copper copper-clad plate manufacture craft of ultra micro and the five axis pressing machines for cooperating it to use | |
| CN109532145B (en) | Non-adhesive double-sided flexible copper-clad plate and preparation method thereof | |
| CN206525025U (en) | A kind of full polyimide type pliability copper-clad base plate and surface-mounted integrated circuit | |
| CN202573178U (en) | Composite double-faced copper foil base plate | |
| CN205946355U (en) | Flowable polyimide functional membrane is heated | |
| CN202782009U (en) | Composite double-sided copper clad laminate | |
| CN103029375B (en) | Composite double-face copper foil substrate and manufacture method thereof | |
| CN204674123U (en) | The copper-clad plate of a kind of two-layered medium non-gel flexible | |
| CN205364721U (en) | Copper -clad plate of heat -resisting type paper base with high peel strength intensity | |
| CN110366330A (en) | FPC multi-layer board and technique based on high frequency FRCC Yu high frequency dual platen | |
| CN2902689Y (en) | Flexible composite board | |
| CN208128661U (en) | FPC multi-layer board based on high frequency FRCC Yu high frequency dual platen | |
| CN205416589U (en) | Two -sided copper -clad plate of improved generation high peel strength intensity | |
| CN203126052U (en) | Composite double-sided copper foil substrate | |
| CN201501140U (en) | Prepreg with resin beds of asymmetric thicknesses | |
| JP2008034702A (en) | Rigid flex circuit board and its manufacturing method | |
| CN103057208B (en) | Composite cover film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |