CN205364721U - Copper -clad plate of heat -resisting type paper base with high peel strength intensity - Google Patents
Copper -clad plate of heat -resisting type paper base with high peel strength intensity Download PDFInfo
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- CN205364721U CN205364721U CN201521061250.2U CN201521061250U CN205364721U CN 205364721 U CN205364721 U CN 205364721U CN 201521061250 U CN201521061250 U CN 201521061250U CN 205364721 U CN205364721 U CN 205364721U
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- copper
- wood pulp
- clad plate
- paper
- refill
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Abstract
The utility model discloses a copper -clad plate of heat -resisting type paper base with high peel strength intensity has refill and glued copper foil, this refill comprises a plurality of layers of gumming wood pulp paper and glass fiber layer complex, and these a plurality of layers of gumming wood pulp paper and glass fiber layer are crisscross to be set up, and every layer of gumming wood pulp paper flooding has cardanol modified phenolic resin, glued copper foil is compound on the upper surface of refill, scribbles melamine -modified urea -formaldehyde resin 's barium phenolic resin glue film on this glued copper foil's the composite surface. This novel paper base copper -clad plate has not only improved the heat resistance and the panel wet skid resistance of copper -clad plate, but also has improved the peel strength and the peel strength's of copper -clad plate homogeneity for among the slim copper foil paper base copper -clad plate production, better economic benefits has been gained.
Description
Technical field
This utility model relates to circuit substrate field, specifically refers to a kind of heat resistant type paper-based copper-coated board with high-peeling strength.
Background technology
Paper-based copper-coated board has purposes widely in electronic product.In paper-based copper-coated board manufactures, mainly making product obtain good punching, the technology producing paper-based copper-coated board with tung oil modified phenolic resin, epoxy soybean oil modified phenolic resin reaches its maturity, and obtains a wide range of applications.But adopting the copper-clad plate punching that conventional art produces not good, bow warping is big, and resistance to dip solderability undesirable, thermostability, tear resistance there is also deficiency.Copper-clad plate production Copper Foil is developing to slimming direction, and tradition paper-based copper-coated board Copper Foil is based on 35um thickness, and current 18um thickness Copper Foil is occupied an leading position.15um, 13um thickness Copper Foil increases year by year in the usage ratio of paper-based copper-coated board in recent years.Along with the minimizing of copper thickness, the roughened layer thickness of adhesive surface is also reducing, and the peel strength of product is affected, in electronic product assembling process, it is easy to copper sheet obscission occurring, causes product rejection, economic loss is serious.How to improve thin copper foil or the peel strength of extra thin copper foil paper-based copper-coated board, improve the reliability of electronic product, be paper-based copper-coated board production firm concern.
Utility model content
The purpose of this utility model is in that to provide a kind of heat resistant type paper-based copper-coated board with high-peeling strength, not only improve thermostability and the sheet material tear resistance of copper-clad plate, but also improve the peel strength of copper-clad plate and the uniformity of peel strength, in producing for slim Copper Foil paper-based copper-coated board, achieve good economic benefit.
In order to reach above-mentioned purpose, solution of the present utility model is:
A kind of heat resistant type paper-based copper-coated board with high-peeling strength, has refill and adhesive coated foil；This refill is made up of some layers of impregnation wood pulp paper and glass layer compound, and these some layers of impregnation wood pulp papers and glass layer are crisscross arranged, and every layer of impregnation wood pulp paper is impregnated with Cardanol Modified PF Resin；Adhesive coated foil is compound on the upper surface of refill, and the composite surface of this adhesive coated foil scribbles cyanurotriamide modified ba phenolic resin glue-line.
Described glass layer is provided with at least three layers, and some layers of impregnation wood pulp paper even group-division one_to_one corresponding are folded in every between two between adjacent glass fibers layer.
Described glass layer is impregnated with epoxy resin.
The thickness of described adhesive coated foil is 10-40um.
After adopting such scheme, this case has the heat resistant type paper-based copper-coated board of high-peeling strength, refill is made up of the staggered compound of some layers of impregnation wood pulp paper and glass layer, impregnation wood pulp paper adopts Cardanol Modified PF Resin dipping, the refill made has good toughness and thermostability, in this thermostability substantially improving copper-clad plate and sheet material tear resistance.Glass layer can strengthen heat resistance, uses in high temperature environments and is not likely to produce deformation.Have again, cyanurotriamide modified ba phenolic resin glue-line is adopted to bind between Copper Foil and refill, cyanurotriamide modified ba phenolic resin crosslink density is high, highly polar group is many, it is remarkably improved thermostability and the adhesion strength of resin, in electronic product assembling process, it is not easy that the defects such as layering, foaming, Copper Foil come off occur, also improve adhesion strength, improve the peel strength of Copper Foil and improve the uniformity of peel strength, in producing for slim Copper Foil paper-based copper-coated board, achieve good economic benefit.
Accompanying drawing explanation
Fig. 1 is the Rotating fields schematic diagram that this case has the heat resistant type paper-based copper-coated board of high-peeling strength.
Label declaration
Refill 1 impregnation wood pulp paper 11
Cardanol Modified PF Resin 12 glass layer 13
Adhesive coated foil 2.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, this case is described in further detail.
This case relates to a kind of heat resistant type paper-based copper-coated board with high-peeling strength, as it is shown in figure 1, have refill 1 and adhesive coated foil 2.
Refill 1 is made up of some layers of impregnation wood pulp paper 11 and glass layer 13 compound.Described impregnation wood pulp paper 11 and glass layer 13 are respectively provided with some layers, and the two is in being crisscross arranged.Preferably, glass layer 13 is provided with at least three layers, and some layers of impregnation wood pulp paper 11 even group-division one_to_one corresponding are folded in every between two between adjacent glass fibers layer 13.Providing in specific embodiment, glass layer 13 is provided with three layers, and impregnation wood pulp paper 11 is provided with eight, and these eight impregnation wood pulp papers 11 are provided with and are divided into two groups, and sandwiched is compound in two groups between two between adjacent glass fibers layer 13 respectively.
Every layer of impregnation wood pulp paper 11 is impregnated with Cardanol Modified PF Resin 12.During impregnation wood pulp paper 11 makes, adopt indicated weight 130-140g/m2Wood pulp paper, soak with the resin liquid of Cardanol Modified PF Resin 12, drying makes the impregnation material of resin content nearly half (44%-46%).Glass layer 13 is impregnated with epoxy resin.
Further, impregnation wood pulp paper 11 is also impregnated with the small-molecular-weight thermosetting phenolic resin by ammonia-catalyzed, and specifically, a kind of mode is, is impregnated with Cardanol Modified PF Resin 12 and small-molecular-weight thermosetting phenolic resin by whole for every layer of impregnation wood pulp paper 11；Impregnation wood pulp paper 11 is divided into the first Dilvar zone of centre and the second Dilvar zone of both sides by another way, and the first middle Dilvar zone is impregnated with Cardanol Modified PF Resin 12, and the second Dilvar zone of both sides is impregnated with small-molecular-weight thermosetting phenolic resin.
Adhesive coated foil 2 is compound on the upper surface of refill 1, namely on the glass layer 13 of the superiors, constitutes singlesided copperclad laminate.The composite surface of adhesive coated foil 2 scribbles cyanurotriamide modified ba phenolic resin glue-line, by the ba phenolic resin glue-line that this is cyanurotriamide modified, Copper Foil hot pressing is compound on the upper surface of refill 1, also there is between refill 1 and Copper Foil cyanurotriamide modified ba phenolic resin glue-line, and binded by this glue-line.The thickness of adhesive coated foil 2 can be 10-40um.
This case has the heat resistant type paper-based copper-coated board of high-peeling strength, the impregnation wood pulp paper 11 of refill 1 adopts Cardanol Modified PF Resin 12 to impregnate, on Cardanol phenyl ring, long chain hydrocarbon groups is with double bond structure, a degree of self-polymeric reaction chain extension is carried out time modified, reactant is in phenolic resin building-up process, long-chain participates in the formation of macromolecular main chain, and the refill 1 made has good toughness and thermostability, in this thermostability substantially improving copper-clad plate and sheet material tear resistance.The use of described small-molecular-weight thermosetting phenolic resin, improves the degree of cross linking of resin cured matter, is used in combination with Cardanol Modified PF Resin 12, can improve the thermostability of copper-clad plate further, and make sheet material have excellent tear resistance.Being crisscross arranged of glass layer 13, is equally used for optimizing further heat resistance, uses in high temperature environments and is not likely to produce deformation.
Have again, cyanurotriamide modified ba phenolic resin glue-line is adopted to bind between Copper Foil and refill 1, cyanurotriamide modified ba phenolic resin crosslink density is high, highly polar group is many, it is remarkably improved thermostability and the adhesion strength of resin, in electronic product assembling process, it is not easy that the defects such as layering, foaming, Copper Foil come off occur, also improve adhesion strength, improve the peel strength of Copper Foil and improve the uniformity of peel strength, in producing for slim Copper Foil (15um, 13um) paper-based copper-coated board, achieve good economic benefit.
The foregoing is only this novel preferred embodiment, all equalizations done with this novel right change and modify, and all should belong to this novel scope of the claims.
Claims (4)
1. a heat resistant type paper-based copper-coated board with high-peeling strength, it is characterised in that: there is refill and adhesive coated foil；This refill is made up of some layers of impregnation wood pulp paper and glass layer compound, these some layers of impregnation wood pulp papers and glass layer are crisscross arranged, every layer of impregnation wood pulp paper is divided into the first Dilvar zone of centre and the second Dilvar zone of both sides, the first middle Dilvar zone is impregnated with Cardanol Modified PF Resin, and the second Dilvar zone of both sides is impregnated with small-molecular-weight thermosetting phenolic resin；Adhesive coated foil is compound on the upper surface of refill, and the composite surface of this adhesive coated foil scribbles cyanurotriamide modified ba phenolic resin glue-line.
2. a kind of heat resistant type paper-based copper-coated board with high-peeling strength as claimed in claim 1, it is characterised in that: described glass layer is provided with at least three layers, and some layers of impregnation wood pulp paper even group-division one_to_one corresponding are folded in every between two between adjacent glass fibers layer.
3. a kind of heat resistant type paper-based copper-coated board with high-peeling strength as claimed in claim 1 or 2, it is characterised in that: described glass layer is impregnated with epoxy resin.
4. a kind of heat resistant type paper-based copper-coated board with high-peeling strength as claimed in claim 1, it is characterised in that: the thickness of described adhesive coated foil is 10-40um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521061250.2U CN205364721U (en) | 2015-12-17 | 2015-12-17 | Copper -clad plate of heat -resisting type paper base with high peel strength intensity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521061250.2U CN205364721U (en) | 2015-12-17 | 2015-12-17 | Copper -clad plate of heat -resisting type paper base with high peel strength intensity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205364721U true CN205364721U (en) | 2016-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521061250.2U Expired - Fee Related CN205364721U (en) | 2015-12-17 | 2015-12-17 | Copper -clad plate of heat -resisting type paper base with high peel strength intensity |
Country Status (1)
| Country | Link |
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| CN (1) | CN205364721U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107700279A (en) * | 2017-11-07 | 2018-02-16 | 江苏福泰涂布科技股份有限公司 | A kind of moisture resistance heat-resisting leaching membrane paper |
| CN115302885A (en) * | 2022-08-10 | 2022-11-08 | 江门建滔积层板有限公司 | High-heat-resistance high-thermal-conductivity copper-clad plate and preparation method thereof |
-
2015
- 2015-12-17 CN CN201521061250.2U patent/CN205364721U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107700279A (en) * | 2017-11-07 | 2018-02-16 | 江苏福泰涂布科技股份有限公司 | A kind of moisture resistance heat-resisting leaching membrane paper |
| CN115302885A (en) * | 2022-08-10 | 2022-11-08 | 江门建滔积层板有限公司 | High-heat-resistance high-thermal-conductivity copper-clad plate and preparation method thereof |
| CN115302885B (en) * | 2022-08-10 | 2023-12-19 | 江门建滔积层板有限公司 | High-heat-resistance high-heat-conductivity copper-clad plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160706 Termination date: 20161217 |