CN112123891A - PCB cover plate and preparation method thereof - Google Patents
PCB cover plate and preparation method thereof Download PDFInfo
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- CN112123891A CN112123891A CN202011171643.4A CN202011171643A CN112123891A CN 112123891 A CN112123891 A CN 112123891A CN 202011171643 A CN202011171643 A CN 202011171643A CN 112123891 A CN112123891 A CN 112123891A
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- aluminum foil
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- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 110
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 110
- 239000011888 foil Substances 0.000 claims abstract description 103
- 238000010030 laminating Methods 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 24
- 238000007731 hot pressing Methods 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000002131 composite material Substances 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims abstract description 7
- 239000000123 paper Substances 0.000 claims description 133
- 239000002655 kraft paper Substances 0.000 claims description 13
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 9
- 239000005011 phenolic resin Substances 0.000 claims description 9
- 229920001568 phenolic resin Polymers 0.000 claims description 9
- 229920001131 Pulp (paper) Polymers 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 8
- 239000011087 paperboard Substances 0.000 claims description 7
- 239000011086 glassine Substances 0.000 claims description 6
- 239000011111 cardboard Substances 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 238000005553 drilling Methods 0.000 abstract description 22
- 238000000576 coating method Methods 0.000 abstract description 19
- 239000011248 coating agent Substances 0.000 abstract description 14
- 238000004381 surface treatment Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract description 6
- 238000003825 pressing Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 239000007888 film coating Substances 0.000 description 7
- 238000009501 film coating Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 5
- 238000002791 soaking Methods 0.000 description 5
- 239000005030 aluminium foil Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/12—Coating on the layer surface on paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a PCB cover plate and a preparation method thereof, wherein the preparation method comprises the following steps: sequentially laminating an aluminum foil, laminating paper and a resin medium layer from bottom to top to form a composite lamination, wherein the contact surface of the laminating paper and the aluminum foil is a laminating surface; and carrying out hot-pressing treatment on the composite laminated layer to obtain the PCB cover plate. The laminated paper is adopted to directly replace the existing aluminum foil bonding medium layer, aluminum foil surface treatment and aluminum foil glue coating are not needed, the cost is directly reduced by 50-80%, meanwhile, the coating process of the aluminum foil bonding medium layer is omitted, and the overall cost of the single-sided aluminum foil-coated cover plate is greatly reduced. The preparation method of the PCB cover plate provided by the invention not only maintains the structural advantages and excellent drilling performance of the single-sided aluminum foil-coated cover plate, but also further reduces the cost, saves the coating procedure of coating the aluminum foil with the bonding medium layer, and thus improves the production efficiency of the PCB cover plate.
Description
Technical Field
The invention relates to the technical field of PCB drilling, in particular to a PCB cover plate and a preparation method thereof.
Background
The cover plate is a material which is placed on a substitute processing plate when a Printed Circuit Board (PCB) is mechanically drilled so as to meet the requirements of a processing technology. The cover plate has the main effects of protecting the surface of the PCB, protecting the surface of the circuit board from being scratched or scratched, inhibiting the exiguous burrs on the surface of the circuit board and improving the drilling precision.
The PCB back drilling technology generally adopts a high-frequency electronic induction principle drilling machine to carry out drilling back drilling processing, and the drilling depth of the design drilling is calculated by utilizing a high-frequency electronic conduction loop to enable the tip of a drilling needle to contact a cover plate (conductor) or a PCB. Commonly used back-drilled cover plates include cold punching plates and aluminum plates, single-sided aluminum foil-clad cover plates, single-sided copper foil-clad cover plates, composite paper aluminum plate cover plates, coated aluminum plates and the like, for example, the back-drilled aluminum foil cover plate is reported in the related prior art CN 201910830239.4; CN201911210966.7 reports back-drilled composite decking; patents CN201710829142.2, CN201910438606.6, CN201410839756.5, CN201420855415.2, etc. report single-sided aluminum foil-covered cover plates; CN201620794765.1 reports a back-drilled cover plate of coated aluminum sheet.
The single-sided aluminum foil-coated cover plate has excellent positioning precision and depth control precision, becomes one of mainstream back-drilling cover plate products, and is widely applied to back-drilling and drilling at high and medium ends. With the development of 5G, the PCB back drilling technology and the market demand are rapidly developed, and the demand of back drilling cover plates is rapidly increased. Although the existing single-sided aluminum foil-coated cover plate has better performance, the cost is higher, and the cover plate is not easy to recycle and is not beneficial to environment-friendly production.
Therefore, the prior art is still to be improved.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a PCB cover plate and a preparation method thereof, and aims to solve the problems of complex production process and high cost of the existing single-sided aluminum foil-coated cover plate.
The technical scheme of the invention is as follows:
a preparation method of a PCB cover plate comprises the following steps:
sequentially laminating an aluminum foil, laminating paper and a resin medium layer from bottom to top to form a composite lamination, wherein the contact surface of the laminating paper and the aluminum foil is a laminating surface;
and carrying out hot-pressing treatment on the composite laminated layer to obtain the PCB cover plate.
The preparation method of the PCB cover plate comprises the following steps of:
dipping paper in phenolic resin or urea resin and baking to form a prepreg;
and taking one prepreg as a resin medium layer or stacking at least two prepregs as the resin medium layer.
The preparation method of the PCB cover plate comprises the step of preparing 50-350g/m of paper2The wood pulp paper, the balance paper, the kraft paper, the recycled paper or the cardboard.
The preparation method of the PCB cover plate comprises the step of preparing 35-450g/m of laminating paper2And one of glassine paper, kraft paper, paperboard or coated paper.
The preparation method of the PCB cover plate comprises the following steps of preparing the laminated paper with the thickness of 150-2The coated paper is one of glassine paper, kraft paper, paperboard or coated paper, and the coated gram weight of the coated paper is 10-35g/m2。
The preparation method of the PCB cover plate comprises the steps that the film spraying surface of the film spraying paper is a smooth surface, and the film spraying paper is polyethylene film spraying paper.
The preparation method of the PCB cover plate comprises the step of preparing the PCB cover plate, wherein the thickness of the aluminum foil is 5-50 um.
The manufacturing method of the PCB cover plate comprises the step of forming the PCB cover plate, wherein the thickness of the PCB cover plate is 0.2-0.5 mm.
The preparation method of the PCB cover plate comprises the step of carrying out hot pressing treatment on the composite lamination, wherein the hot pressing temperature is 120-180 ℃, the hot pressing pressure is 20-50MPa, and the hot pressing time is 30-90 min.
A PCB cover plate is manufactured by the manufacturing method of the PCB cover plate.
Has the advantages that: the PCB cover plate is compounded by the resin medium layer, the laminating paper and the aluminum foil, wherein the resin medium layer is composed of a single sheet or a plurality of sheets of prepreg prepared by baking urea-formaldehyde resin or phenolic resin impregnated paper, is used for improving the surface hardness, the smoothness and the smoothness, is easy to drill a drill bit, has good positioning effect and better processing and positioning precision, and can also enable the product to obtain better appearance and color; the laminating surface of the laminating paper can be well bonded with the aluminum foil at high temperature, and the laminating paper is adopted to replace aluminum foil surface treatment and aluminum foil glue with higher cost, so that the cost is favorably reduced. Compared with the existing single-sided aluminum foil-coated cover plate technology, the laminated paper is adopted to directly replace the existing aluminum foil bonding medium layer, aluminum foil surface treatment and aluminum foil glue coating are not needed, the laminated paper uniformly bonds the paper and the aluminum foil under the hot-pressing condition, the pressing appearance of the aluminum foil can be well controlled, and the problem of bubbles is avoided. Compared with the existing aluminum foil bonding medium layer of the single-side coated aluminum foil cover plate, the cost is directly reduced by 50% -80% by replacing the laminating paper, meanwhile, the coating process of the aluminum foil bonding medium layer is omitted, and the overall cost of the single-side coated aluminum foil cover plate is greatly reduced. The preparation method of the PCB cover plate provided by the embodiment not only keeps the structural advantages and excellent drilling performance of the single-sided aluminum foil-coated cover plate, but also further reduces the cost, saves the coating procedure of coating the aluminum foil with the bonding medium layer, and thus improves the production efficiency of the PCB cover plate.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a PCB cover according to a preferred embodiment of the present invention.
Detailed Description
The present invention provides a PCB cover plate and a method for manufacturing the same, and the present invention is further described in detail below in order to make the objects, technical solutions, and effects of the present invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, fig. 1 is a flowchart illustrating a method for manufacturing a PCB cover plate according to a preferred embodiment of the present invention, as shown in the figure, the method includes the following steps:
s10, sequentially laminating an aluminum foil, laminating paper and a resin medium layer from bottom to top to form a composite lamination, wherein the contact surface of the laminating paper and the aluminum foil is a laminating surface;
and S20, carrying out hot-pressing treatment on the composite laminated layer to obtain the PCB cover plate.
In this embodiment, the PCB cover plate is composed of a resin medium layer, a laminating paper and an aluminum foil, wherein the resin medium layer is composed of a single sheet or a plurality of sheets of prepreg prepared by baking urea-formaldehyde resin or phenolic resin impregnated paper, and the resin medium layer is used for improving the surface hardness, smoothness and smoothness of the PCB cover plate, facilitating drilling, having good positioning effect and better processing and positioning accuracy, and simultaneously enabling the product to obtain better appearance and color; the laminating surface of the laminating paper in the embodiment can be well bonded with the aluminum foil under the hot-pressing treatment, and the laminating paper is adopted to replace the aluminum foil surface treatment and the aluminum foil adhesive with higher cost, so that the cost is favorably reduced. Compared with the existing single-sided aluminum foil-coated cover plate technology, the laminated paper is adopted to directly replace the existing aluminum foil bonding medium layer, aluminum foil surface treatment and aluminum foil glue coating are not needed, the laminated paper is used for uniformly bonding the paper and the aluminum foil under the hot-pressing condition, the pressing appearance of the aluminum foil can be well controlled, and the problem of bubbles is solved. Compared with the existing aluminum foil bonding medium layer of the single-side coated aluminum foil cover plate, the cost is directly reduced by 50% -80% by replacing the laminating paper, meanwhile, the coating process of the aluminum foil bonding medium layer is omitted, and the overall cost of the single-side coated aluminum foil cover plate is greatly reduced. The preparation method of the PCB cover plate provided by the embodiment not only keeps the structural advantages and excellent drilling performance of the single-sided aluminum foil-coated cover plate, but also further reduces the cost, saves the coating procedure of coating the aluminum foil with the bonding medium layer, and thus improves the production efficiency of the PCB cover plate.
In some embodiments, the preparing of the resin medium layer comprises: dipping paper in phenolic resin or urea resin and baking to form a prepreg; and taking one prepreg as a resin medium layer or stacking at least two prepregs as the resin medium layer.
In this embodiment, the paper is 50 to 350g/m2But is not limited to, wood pulp paper, balanced paper, kraft paper, recycled paper, or cardboard; the paper is soaked in phenolic resin or urea resin and is baked to form a prepreg, and one or more prepregs are stacked to serve as the resin medium layer. The resin medium layer is used as the part which is firstly contacted by the drill point when the PCB is drilled, and the resin medium layer needs to have better surface hardness, smoothness and smoothness, is convenient for a drill bit to enter the drill, has good positioning effect and better processing and positioning precision.
In some embodiments, the laminated paper is 35-450g/m2But is not limited to, glassine paper, kraft paper, cardboard, or coated paper. In this embodiment, the laminating paper may be single-sided laminating paper or double-sided laminating paper, and when the laminating paper is single-sided laminating paper, the laminating surface of the laminating paper is the surface of the aluminum foil in contact with the laminating paper, so that the laminating paper and the aluminum foil can be uniformly bonded during hot-pressing treatment, the pressing appearance of the aluminum foil can be well controlled, and the problem of bubbles is avoided; when the laminating paper is double-sided laminating paper, the aluminum foil can be laminated with any one side of the double-sided laminating paper. Compared with the existing aluminum foil bonding medium layer of the single-sided aluminum foil-coated cover plate, the laminating paper is adopted to replace the bonding medium layer on the aluminum foil, the cost is directly reduced by 50% -80%, meanwhile, the coating process of the aluminum foil bonding medium layer is omitted, and the overall cost of the single-sided aluminum foil-coated cover plate is greatly reduced. Therefore, the preparation method of the PCB cover plate provided by the embodiment not only maintains the structural advantages and excellent drilling performance of the single-sided aluminum foil-coated cover plate, but also further reduces the cost, saves the coating procedure of coating the aluminum foil with the bonding medium layer, and thus improves the production efficiency of the PCB cover plate.
In some embodiments, when the laminated paper is double-sided laminated paper, a plurality of core papers may be further disposed between the laminated paper and the resin medium layer to adjust the thickness of the PCB cover plate. In this embodiment, the core paper is a conventional fiber paper, including but not limited to bleached wood pulp paper, balanced paper, kraft paper, recycled paper, cardboard, and the like, having a grammage in the range of 50-350 g.
In some specific embodiments, the laminated paper is 150-450g/m2The coated paper is one of glassine paper, kraft paper, paperboard or coated paper, and the coated gram weight of the coated paper is 10-35g/m2。
In some specific embodiments, the film coating surface of the film coated paper is a smooth surface, and the film coated paper is polyethylene film coated paper. Specifically, the paper type and the gram weight of the laminating paper are screened in a matching way according to the thickness of the resin medium layer and the total cover plate thickness control requirement, the cover plate quality and drilling performance control requirement and the cost control requirement. The paper is usually selected from single-side film coating paper, or double-side film coating can be adopted according to requirements, and the gram weight range of the other-side film coating is also 10-35gm2. The film coating surface of the film coating paper is coated with the smooth surface of the film coating paper preferentially, so that the surface control of the aluminum foil is facilitated.
In some specific embodiments, in order to ensure the bonding effect of the aluminum foil and the surface appearance control of the aluminum foil, the gram weight of the lamination surface of the lamination paper is preferably 15-25gm2。
In some embodiments, the aluminum foil has a thickness of 5-50 um.
In some embodiments, the PCB cover plate has a thickness of 0.2-0.5 mm.
In some embodiments, in the step of performing the hot pressing treatment on the composite laminated layer, the hot pressing temperature is 120-. This embodiment can let drench membrane paper and the even bonding of aluminium foil under the hot pressing condition through above-mentioned hot pressing parameter setting, and control aluminium foil suppression appearance that can be better to do not produce the bubble problem.
In some embodiments, the invention also provides a PCB cover plate, which is manufactured by the method for manufacturing the PCB cover plate.
The PCB cover plate and the method for manufacturing the same according to the present invention are further explained by the following embodiments:
example 1
Taking a sheet of 85g of balance paper and a sheet of 130g of bleached wood pulp paper, respectively soaking the balance paper and the bleached wood pulp paper in urea resin to prepare a prepreg, laminating 200g of single-sided kraft laminated paper (15g of laminated film) with 18 mu m aluminum foil, and pressing the laminated paper and the 18 mu m aluminum foil at high temperature of 140 ℃ and high pressure of 35MPa for 60min to prepare the single-sided aluminum foil-coated cover plate, wherein the total thickness of the cover plate is 0.410 mm.
Example 2
Taking an 85g balance paper and a 130g bleached wood pulp paper, respectively soaking the balance paper and the bleached wood pulp paper in phenolic resin to prepare prepregs, laminating 200g single-sided kraft-coated paper (15g coated) with 18um aluminum foil, and pressing at the high temperature of 170 ℃ and the high pressure of 35MPa for 60min to prepare the single-sided aluminum foil-coated cover plate, wherein the total thickness of the cover plate is 0.403 mm.
Example 3
Taking a sheet of 70g of balance paper and a sheet of 130g of recycled paper, respectively soaking the balance paper and the recycled paper in urea-formaldehyde resin to prepare a prepreg, overlapping 230g of American cow-card laminating paper (25g of laminating) with 18um aluminum foil, and pressing at the high temperature of 140 ℃ and the high pressure of 35MPa for 60min to prepare the single-sided aluminum foil-coated cover plate, wherein the total thickness of the cover plate is 0.422 mm.
Example 4
Taking a piece of balance paper 70g and a piece of recycled paper 130g, respectively soaking phenolic resin to prepare a prepreg, laminating 230g of American cow-card laminating paper (25g of laminating) with an aluminum foil 18um, and pressing at the high temperature of 170 ℃ and the high pressure of 35MPa for 60min to prepare the single-sided aluminum foil-coated cover plate, wherein the total thickness of the cover plate is 0.415 mm.
Example 5
A70 g balance paper is dipped in urea resin to prepare a prepreg, 350g gray paperboard (25g laminated film) is laminated with 18um aluminum foil, and the single-sided aluminum foil-coated cover plate is prepared by pressing at the high temperature of 140 ℃ and the high pressure of 35MPa for 60min, wherein the total thickness of the cover plate is 0.314 mm.
Example 6
Taking a piece of 85g of balance paper and a piece of 160g of recycled paper, respectively soaking the balance paper and the recycled paper in urea resin to prepare a prepreg, laminating 70g of kraft paper (25g of laminating paper) with 18um aluminum foil, laminating the laminated paper and the 18um aluminum foil, and pressing the laminated paper at the high temperature of 140 ℃ and the high pressure of 35MPa for 60min to prepare the single-sided aluminum foil-coated cover plate, wherein the total thickness of the cover plate is 0.317 mm.
Example 7
Taking a sheet of 85g of balance paper to be soaked in urea-formaldehyde resin to prepare a prepreg, taking a sheet of 100g of recycled paper, 200g of art paper double-sided laminating paper (25g of laminating), laminating with 18 mu m aluminum foil, and pressing at the high temperature of 140 ℃ and the high pressure of 35MPa for 60min to prepare the single-sided aluminum foil-coated cover plate, wherein the total thickness of the cover plate is 0.321 mm.
Example 8
The PCB cover plate manufactured by the above experiment is compared with the existing single-side aluminum foil-coated cover plate for back drilling tests, and the results are as follows:
from the comparison test results, the depth control precision of the PCB cover plates prepared in the embodiments 1 to 7 is equivalent to that of the existing single-sided aluminum foil-coated cover plate, the positioning precision of the PCB cover plates is equal to that of the existing single-sided aluminum foil-coated cover plate, the positioning precision of the PCB cover plates is higher than the control standard that the CPK (printed circuit board) of the PCB is more than or equal to 1.33, the requirements of customers are met, the cost of the PCB cover plates is reduced by 50 to 80 percent compared with that of the existing single-sided aluminum foil-.
To sum up, the PCB cover plate is formed by compounding the resin medium layer, the laminating paper and the aluminum foil, wherein the resin medium layer is formed by baking a single prepreg or a plurality of prepregs by urea-formaldehyde resin or phenolic resin impregnated paper, is used for improving the surface hardness, the smoothness and the smoothness, is easy to drill, has good positioning effect and better processing and positioning precision, and can ensure that the product has better appearance and color; the laminating surface of the laminating paper can be well bonded with the aluminum foil at high temperature, and the laminating paper is adopted to replace aluminum foil surface treatment and aluminum foil glue with higher cost, so that the cost is favorably reduced. Compared with the existing single-sided aluminum foil-coated cover plate technology, the laminated paper is adopted to directly replace the existing aluminum foil bonding medium layer, aluminum foil surface treatment and aluminum foil glue coating are not needed, the laminated paper uniformly bonds the paper and the aluminum foil under the hot-pressing condition, the pressing appearance of the aluminum foil can be well controlled, and the problem of bubbles is avoided. Compared with the existing aluminum foil bonding medium layer of the single-side coated aluminum foil cover plate, the cost is directly reduced by 50% -80% by replacing the laminating paper, meanwhile, the coating process of the aluminum foil bonding medium layer is omitted, and the overall cost of the single-side coated aluminum foil cover plate is greatly reduced. The preparation method of the PCB cover plate provided by the embodiment not only keeps the structural advantages and excellent drilling performance of the single-sided aluminum foil-coated cover plate, but also further reduces the cost, saves the coating procedure of coating the aluminum foil with the bonding medium layer, and thus improves the production efficiency of the PCB cover plate.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. A preparation method of a PCB cover plate is characterized by comprising the following steps:
sequentially laminating an aluminum foil, laminating paper and a resin medium layer from bottom to top to form a composite lamination, wherein the contact surface of the laminating paper and the aluminum foil is a laminating surface;
and carrying out hot-pressing treatment on the composite laminated layer to obtain the PCB cover plate.
2. The method for preparing the PCB cover plate according to claim 1, wherein the preparation of the resin medium layer comprises the following steps:
dipping paper in phenolic resin or urea resin and baking to form a prepreg;
and taking one prepreg as a resin medium layer or stacking at least two prepregs as the resin medium layer.
3. The method for manufacturing a PCB coverboard according to claim 2, wherein the paper is 50-350g/m2The wood pulp paper, the balance paper, the kraft paper, the recycled paper or the cardboard.
4. The method for preparing a PCB cover plate according to claim 1, wherein the laminating filmThe paper is 35-450g/m2And one of glassine paper, kraft paper, paperboard or coated paper.
5. The method for preparing the PCB cover plate of claim 1, wherein the laminated paper is 150-450g/m2The coated paper is one of glassine paper, kraft paper, paperboard or coated paper, and the coated gram weight of the coated paper is 10-35g/m2。
6. The method for manufacturing a PCB cover board according to claim 5, wherein the film spraying surface of the film spraying paper is a smooth surface, and the film spraying paper is polyethylene film spraying paper.
7. The method of manufacturing a PCB cover plate of claim 1, wherein the aluminum foil has a thickness of 5-50 um.
8. The method for manufacturing a PCB cover plate according to claim 1, wherein the thickness of the PCB cover plate is 0.2-0.5 mm.
9. The method for preparing the PCB cover plate of claim 1, wherein in the step of performing the hot pressing treatment on the composite laminated layer, the hot pressing temperature is 120-180 ℃, the hot pressing pressure is 20-50MPa, and the hot pressing time is 30-90 min.
10. A PCB cover plate manufactured by the method for manufacturing a PCB cover plate according to any one of claims 1 to 9.
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| CN113459610A (en) * | 2021-07-30 | 2021-10-01 | 深圳市宏宇辉科技有限公司 | Double-sided aluminum foil composite cold punching plate and preparation method and application thereof |
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Application publication date: 20201225 |