CN206525025U - A kind of full polyimide type pliability copper-clad base plate and surface-mounted integrated circuit - Google Patents
A kind of full polyimide type pliability copper-clad base plate and surface-mounted integrated circuit Download PDFInfo
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- CN206525025U CN206525025U CN201720266595.4U CN201720266595U CN206525025U CN 206525025 U CN206525025 U CN 206525025U CN 201720266595 U CN201720266595 U CN 201720266595U CN 206525025 U CN206525025 U CN 206525025U
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Abstract
The utility model is related to copper coated foil plate and surface-mounted integrated circuit field, more particularly to a kind of full polyimide type pliability copper-clad base plate and surface-mounted integrated circuit.Its technical scheme：A kind of full polyimide type pliability copper-clad base plate or surface-mounted integrated circuit, including FCCL soleplates, if FCCL soleplates include dried layer FCCL units, if being coated with TPI between dried layer FCCL units；When product is surface-mounted integrated circuit, the outer surface of FCCL soleplates is disposed with hardboard connection glue-line and the copper foil with via hole from inside to outside, and hardboard connection glue-line includes the overlay film TPI set gradually from inside to outside and the TPI PP with via hole.The utility model is full polyimide structures, and reliability and stability are high；Not the problem of surface-mounted integrated circuit does not need cover layer, processing difficulties.
Description
Technical field
The utility model is related to copper coated foil plate and surface-mounted integrated circuit field, more particularly to a kind of full polyimide type pliability
Copper-clad base plate and surface-mounted integrated circuit.
Background technology
Polyimide material is the high polymer material of a kind of high intensity and high-fire resistance, and 500 DEG C can be resistant in a short time
High temperature, and can be used for a long time below 300 DEG C.While the rigid structure of polyimides assigns its premium properties, also cause it
With infusibility, slightly solubility, therefore its moulding processability is poor.
Flexibility coat copper plate (FCCL) is flex circuit application (FPC) substrate, mainly there is three layers of flexibility coat copper plate (3L-FCCL)
With two layers of two kinds of flexibility coat copper plate (2F-FCCL).Three layers of copper-clad plate are typically led to by Kapton or polyester film with copper foil
Cross after adhesive bond hot pressing and solidify afterwards and be made.Two layers of flexibility coat copper plate is only made up of Kapton and copper foil, is prepared
2007, No.1, p.5-7 technique has rubbing method, three kinds of pressing method and sputtering method (Liu Shengpeng, copper-clad plate information).In recent years, with
And developed using the electronic product of flex circuit application (FPC) towards the direction of high density and miniaturization, more frivolous two layers is scratched
The demand of property copper-clad plate is greatly increased.Clear 61-275325 disclosed in being gone through in Japan for 1986 is earliest on two layers of method
FCCL patent.The patent is directly coated on copper foil with polyimide resin (PI) copolymer, then prepares coating through hot imidization
Type two layers of polyimide flexibility coat copper plate.Because rubbing method 2L-FCCL equipment investments are low, production technology is relatively easy, in 2L-
The initial stage of FCCL development is more universal.
In the prior art, when producing pliability copper-clad base plate, two layers or three layers of FCCL units are bonded using epoxy glue
Get up, form 4 layers or 6 layers of softpanel structure.When producing surface-mounted integrated circuit, glue is used as using epoxy glue between two layers of FCCL unit
Stick, and be coated with bilayer PP glue in outer layer FCCL cell surfaces and reserve conducting hole site, then the copper foil with via hole is pressed
On PP glue, cover layer is finally inlayed in via hole, multilayer Rigid Flex is formed.It is mono- using epoxy glue as two layers of FCCL
Product heat resistance after adhesive between member is poor, and thermal coefficient of expansion is big, and acid and alkali-resistance erosiveness is weak, causes product integrally may be used
It is poor by property and stability.When producing Rigid Flex, it is necessary to inlay cover layer, work flow is longer, and efficiency is very low, cost
Height, yield is low.
Utility model content
The utility model overcome the deficiencies in the prior art there is provided a kind of full polyimide structures, do not need cover layer
Pliability copper-clad base plate and surface-mounted integrated circuit, solve existing pliability copper-clad base plate and surface-mounted integrated circuit reliability and stability
The problem of difference, processing difficulties.
To solve above-mentioned technical problem, the utility model uses following technical scheme：
A kind of full polyimide type pliability copper-clad base plate, including FCCL soleplates, if FCCL soleplates include dried layer
FCCL units, if being coated with adhesive between dried layer FCCL units；If the adhesive being coated between dried layer FCCL units is TPI,
The FCCL units include copper foil, PI, the copper foil set gradually from top to bottom.
As preferred scheme of the present utility model, the FCCL soleplates include two layers of FCCL unit or three layers of FCCL are mono-
Member.
As preferred scheme of the present utility model, the FCCL soleplates include one layer of FCCL unit or two layers of FCCL is mono-
Member, the outer surface of FCCL soleplates is disposed with TPI and copper foil from inside to outside.
A kind of full polyimide type surface-mounted integrated circuit, including FCCL soleplates, if FCCL soleplates are mono- including dried layer FCCL
Member, if being coated with adhesive between dried layer FCCL units, the outer surface of FCCL soleplates is disposed with hardboard company from inside to outside
Connect glue-line and the copper foil with via hole；Characterized in that, if the adhesive being coated between dried layer FCCL units is TPI, hardboard connects
Connecing glue-line includes the overlay film TPI that sets gradually from inside to outside and the TPI-PP with via hole.
As preferred scheme of the present utility model, the FCCL soleplates include one layer of FCCL unit or two layers of FCCL is mono-
Member.
As preferred scheme of the present utility model, the FCCL soleplates include one layer of FCCL unit, FCCL soleplates with
TPI and copper foil are disposed with from inside to outside between overlay film TPI.
As preferred scheme of the present utility model, the FCCL units include copper foil, PI, the copper set gradually from top to bottom
Paper tinsel.
Compared with prior art, the beneficial effects of the utility model are：
If the 1, the adhesive that pliability copper-clad base plate of the present utility model is coated between dried layer FCCL units is TPI, make
Obtaining the pliability copper-clad base plate has full polyimide structures.Polyimide modified TPI materials not only possess PI in itself
It is high heat-resisting, the characteristics of good stability of the dimension, while can be processed after improvement directly within 200 degree, as between multi-layer sheet
Connecting material is used, so that the reliability of whole multilayer soft board is significantly improved.
2nd, when FCCL soleplates include two layers of FCCL unit or three layers of FCCL units, and it is coated between FCCL units
TPI, so that original class formation pliability copper-clad base plate resistance to overturning and reliability are improved.
3rd, during the outer surface pressing copper foil of FCCL soleplates, the class formation is integrally also improved as adhesive using TPI glue
Pliability copper-clad base plate heat resistance and thermal coefficient of expansion all accordingly improve.
4th, in surface-mounted integrated circuit of the present utility model, if the adhesive being coated between dried layer FCCL units is TPI, and
Overlay film TPI is coated with successively from inside to outside between FCCL soleplates and outermost layer copper foil and leaves the TPI-PP of via hole so that
The surface-mounted integrated circuit has full polyimide structures, significantly improves the reliability of whole surface-mounted integrated circuit.Overlay film TPI is using complete
The coating method of covering, is provided simultaneously with the function of cover layer and connection glue, greatly reduces the flow of its processing, improve production efficiency
And yield, reduce the production cost of product.
5th, when FCCL soleplates include one layer of FCCL unit or two layers of FCCL unit, and it is coated between FCCL units
TPI, so that such original structure assembly circuit board resistance to overturning and reliability are improved.
6th, during the outer surface pressing copper foil of FCCL soleplates, the class formation is integrally also improved as adhesive using TPI glue
Surface-mounted integrated circuit heat resistance and thermal coefficient of expansion all accordingly improve.
7th, FCCL units include copper foil, PI, the copper foil set gradually from top to bottom, and PI sheets are as polyimide structures.
Brief description of the drawings
Fig. 1 is the structural representation of the pliability copper-clad base plate with two layers of FCCL unit；
Fig. 2 is the structural representation of the pliability copper-clad base plate with three layers of FCCL units；
Fig. 3 is the structural representation for the pliability copper-clad base plate that copper is covered with individual layer FCCL units and surface；
Fig. 4 is the structural representation for the pliability copper-clad base plate that copper is covered with two layers of FCCL unit and surface；
Fig. 5 is the surface-mounted integrated circuit with individual layer FCCL units；
Fig. 6 is the surface-mounted integrated circuit with two layers of FCCL unit；
Fig. 7 is the surface-mounted integrated circuit that individual layer FCCL units and FCCL cell surfaces cover copper；
Fig. 8 is the structural representation of FCCL units.
In figure, 1-FCCL units, 2-TPI, 3- copper foils, 4-PI, 5- overlay films TPI, 6-TPI-PP.
Embodiment
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only to explain this
Utility model, is not used to limit the utility model.
Embodiment one
A kind of full polyimide type pliability copper-clad base plate, including FCCL soleplates, if FCCL soleplates include dried layer
FCCL units 1, if being coated with adhesive between dried layer FCCL units 1；If the adhesive being coated between dried layer FCCL units 1 is
TPI2, the FCCL units 1 include copper foil 3, PI4, the copper foil 3 set gradually from top to bottom.Pliability of the present utility model is covered
If the adhesive that copper base is coated between dried layer FCCL units 1 is TPI2 so that the pliability copper-clad base plate has full polyamides
Imine structure.The characteristics of polyimide modified TPI materials not only possess PI high heat-resisting in itself, good stability of the dimension, together
It can process, be used as the connecting material between multi-layer sheet directly within 200 degree after Shi Gailiang, so that whole multilayer is soft
The reliability of plate is significantly improved.
Embodiment two
On the basis of embodiment one, as depicted in figs. 1 and 2, the FCCL soleplates include two layers of FCCL unit 1 or three
Layer FCCL units 1.When FCCL soleplates include two layers of FCCL unit 1 or three layers of FCCL units 1, and between FCCL units 1
TPI2 is coated with, so that original class formation pliability copper-clad base plate resistance to overturning and reliability are improved.
Embodiment three
On the basis of embodiment one, as shown in Figure 3 and Figure 4, the FCCL soleplates include one layer of FCCL unit 1 or two
Layer FCCL units 1, the outer surface of FCCL soleplates is disposed with TPI2 and copper foil 3 from inside to outside.The appearance of FCCL soleplates
When face pressure closes copper foil 3, the pliability copper-clad base plate heat resistance and heat of the class formation are integrally also improved as adhesive using TPI2
The coefficient of expansion is all accordingly improved.
Example IV
A kind of full polyimide type surface-mounted integrated circuit, including FCCL soleplates, if FCCL soleplates are mono- including dried layer FCCL
Member 1, if being coated with adhesive between dried layer FCCL units 1, the outer surface of FCCL soleplates is disposed with hardboard from inside to outside
Connect glue-line and the copper foil 3 with via hole；If the adhesive being coated between dried layer FCCL units 1 is TPI2, hardboard connection glue-line
TPI-PP6 including the overlay film TPI5 set gradually from inside to outside and with via hole.In surface-mounted integrated circuit of the present utility model, if
The adhesive being coated between dried layer FCCL units 1 be between TPI2, and FCCL soleplates and outermost layer copper foil 3 from inside to outside according to
The secondary TPI-PP6 for being coated with overlay film TPI5 and leaving via hole so that the surface-mounted integrated circuit has full polyimide structures, makes whole
The reliability of individual surface-mounted integrated circuit is significantly improved.Overlay film TPI5 uses the coating method of all standing, is provided simultaneously with cover layer and company
The function of glue is connect, greatly reduces the flow of its processing, production efficiency and yield is improved, the production cost of product is reduced.
Embodiment five
On the basis of example IV, as shown in Figure 5 and Figure 6, the FCCL soleplates include one layer of FCCL unit 1 or two
Layer FCCL units 1.When FCCL soleplates include one layer of FCCL unit 1 or two layers of FCCL unit 1, and between FCCL units 1
TPI2 is coated with, so that such original structure assembly circuit board resistance to overturning and reliability are improved.
Embodiment six
On the basis of example IV, as shown in fig. 7, the FCCL soleplates include one layer of FCCL unit 1, FCCL bases
TPI2 and copper foil 3 are disposed between plate and overlay film TPI5 from inside to outside.During the outer surface pressing copper foil 3 of FCCL soleplates,
Also using TPI2 as adhesive, the surface-mounted integrated circuit heat resistance and thermal coefficient of expansion for integrally improving the class formation are all accordingly carried
It is high.
Embodiment seven
On the basis of example IV to six any one, as shown in figure 8, the FCCL units 1 include from top to bottom according to
Copper foil 3, PI4, the copper foil 3 of secondary setting, PI sheets do not change product overall permanence as polyimide structures.
Claims (7)
1. a kind of full polyimide type pliability copper-clad base plate, including FCCL soleplates, if FCCL soleplates include dried layer FCCL
Unit (1), if being coated with adhesive between dried layer FCCL units (1)；If characterized in that, being applied between dried layer FCCL units (1)
The adhesive of cloth is TPI (2), and the FCCL units (1) include copper foil (3), PI (4), the copper foil set gradually from top to bottom
(3)。
2. a kind of full polyimide type pliability copper-clad base plate according to claim 1, it is characterised in that the FCCL bases
Plinth plate includes two layers of FCCL unit (1) or three layers of FCCL units (1).
3. a kind of full polyimide type pliability copper-clad base plate according to claim 1, it is characterised in that the FCCL bases
Plinth plate includes one layer of FCCL unit (1) or two layers of FCCL unit (1), and the outer surface of FCCL soleplates is disposed with from inside to outside
TPI (2) and copper foil (3).
4. a kind of full polyimide type surface-mounted integrated circuit, including FCCL soleplates, if FCCL soleplates include dried layer FCCL units
(1), if being coated with adhesive between dried layer FCCL units (1), the outer surface of FCCL soleplates is disposed with firmly from inside to outside
Plate connects glue-line and the copper foil (3) with via hole；If characterized in that, the adhesive being coated between dried layer FCCL units (1) is
TPI (2), hardboard connection glue-line includes the overlay film TPI (5) set gradually from inside to outside and the TPI-PP (6) with via hole.
5. a kind of full polyimide type surface-mounted integrated circuit according to claim 4, it is characterised in that the FCCL soleplates
Including one layer of FCCL unit (1) or two layers of FCCL unit (1).
6. a kind of full polyimide type surface-mounted integrated circuit according to claim 4, it is characterised in that the FCCL soleplates
Including one layer of FCCL unit (1), TPI (2) and copper foil are disposed between FCCL soleplates and overlay film TPI (5) from inside to outside
(3)。
7. a kind of full polyimide type surface-mounted integrated circuit according to claim 4~6 any one, it is characterised in that institute
State copper foil (3), PI (4), copper foil (3) that FCCL units (1) include setting gradually from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720266595.4U CN206525025U (en) | 2017-03-20 | 2017-03-20 | A kind of full polyimide type pliability copper-clad base plate and surface-mounted integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720266595.4U CN206525025U (en) | 2017-03-20 | 2017-03-20 | A kind of full polyimide type pliability copper-clad base plate and surface-mounted integrated circuit |
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| Publication Number | Publication Date |
|---|---|
| CN206525025U true CN206525025U (en) | 2017-09-26 |
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| CN201720266595.4U Active CN206525025U (en) | 2017-03-20 | 2017-03-20 | A kind of full polyimide type pliability copper-clad base plate and surface-mounted integrated circuit |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658957A (en) * | 2017-03-20 | 2017-05-10 | 成都多吉昌新材料股份有限公司 | All-polyimide type flexible copper clad laminate base plate and integrated circuit board |
| CN109068472A (en) * | 2018-08-24 | 2018-12-21 | 武汉恒泰通技术有限公司 | A kind of double-faced flexible soft board and its assembling jig |
-
2017
- 2017-03-20 CN CN201720266595.4U patent/CN206525025U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658957A (en) * | 2017-03-20 | 2017-05-10 | 成都多吉昌新材料股份有限公司 | All-polyimide type flexible copper clad laminate base plate and integrated circuit board |
| CN109068472A (en) * | 2018-08-24 | 2018-12-21 | 武汉恒泰通技术有限公司 | A kind of double-faced flexible soft board and its assembling jig |
| CN109068472B (en) * | 2018-08-24 | 2020-10-30 | 武汉恒泰通技术有限公司 | Double-sided flexible soft board and assembly fixture thereof |
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