CN213648983U - Flexible copper foil base material with multilayer composite structure - Google Patents
Flexible copper foil base material with multilayer composite structure Download PDFInfo
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- CN213648983U CN213648983U CN202022414961.0U CN202022414961U CN213648983U CN 213648983 U CN213648983 U CN 213648983U CN 202022414961 U CN202022414961 U CN 202022414961U CN 213648983 U CN213648983 U CN 213648983U
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Abstract
The utility model discloses a flexible copper foil substrate with a multilayer composite structure, which comprises a first copper foil layer, a first polyimide resin layer, a second polyimide resin layer, a bonding layer and a second copper foil layer; the first polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 15-40 ppm/K; the second polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 1-20 ppm/K; the thickness of the first polyimide resin layer is 1-13 mu m; the thickness of the second polyimide resin layer is 8-25 mu m; the thickness of the first copper foil layer is 7-70 mu m; the thickness of the second copper foil layer is 7-70 mu m; the thickness of the adhesive layer is 5 to 25 μm. The utility model discloses a this kind of mode obtains a high heat resistance, high dimensional stability, high reliability, low bounce, low-cost two-sided copper foil substrate.
Description
Technical Field
The utility model belongs to the technical field of printed circuit board, especially, relate to a flexible copper foil substrate with multilayer composite construction.
Background
At present, electronic systems are developed toward slimness, compactness, high heat resistance, multi-functionality, high density, high reliability and low cost, so that the selection of the copper foil substrate is an important factor for achieving the purpose.
At present, a copper foil substrate applied to a flexible copper foil circuit board is mainly formed by arranging Thermoplastic Polyimide (TPI) on thermosetting Polyimide (PI) and then pressing a copper foil at a high temperature by a special thermoplastic polyimide film prepared in a co-extrusion mode. The technology of the special thermoplastic polyimide film is limited by the relatively mature suppliers in the U.S. and Japan, the cost is high, and the high-temperature pressing method requires high production equipment and low yield in the process, so that the cost of the copper foil substrate manufactured by the method is high. In addition, the limitation of the thickness of the TPI arranged up and down also ensures that the copper foil roughness of the flexible copper foil substrate cannot be too high and the lamination is difficult, so the corresponding cost of the finally obtained flexible copper foil circuit board can be increased.
Another method for manufacturing copper foil substrate of flexible copper foil circuit board is to coat epoxy resin adhesive on polyimide film to make adhesive type single-sided copper foil or double-sided copper foil substrate. The method has the advantages of easy manufacture of a single panel, no need of using a high-temperature pressing method and corresponding equipment, low material cost, no limitation and the like, but the basic characteristics of the copper foil substrate manufactured by the method cannot well meet the existing requirements of the industry, and the copper foil substrate manufactured by matching a special thermoplastic polyimide film in the mainstream of the industry with the high-temperature pressing method is difficult to be looked at in terms of heat resistance, thinning, reliability, size stability and the like.
The taiwan patents TW M377823U1, TW M421878U1, TW M416963U1, TW M443362U1 disclose a composite double-sided copper foil substrate structure, which generally comprises coating polyimide varnish on a copper foil by a coating method, baking the coated copper foil, imidizing the coated copper foil to form a single-sided copper foil substrate, and then coating an adhesive agent and laminating a second-sided copper foil at a low temperature to form a double-sided copper foil substrate. However, the dimensional stability of the polyimide film is still different from that of the copper foil substrate made of the special thermoplastic polyimide film and the high temperature pressing method.
The utility model discloses it is this kind of size stability with the copper foil substrate of polyimide varnish coating on copper foil that the discovery was earlier said is influenced by the Coefficient of Thermal Expansion (CTE) of polyimide varnish at to a great extent, and the less CTE can make size stability more good, and how to make the CTE of coated polyimide varnish littleer and not lose comprehensive properties such as bonding force with the copper foil, mechanical strength, resistance to chemicals and become a bottleneck.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem who mainly solves provides a flexible copper foil substrate with multilayer composite construction, adopts the higher polyimide varnish of partial coating CTE that is close to the copper side, behind the lower polyimide varnish of partial coating CTE in the middle, the imide becomes semi-manufactured goods and coats the adhesion agent again in order to laminate the copper foil, obtains a high heat resistance, high dimensional stability, high reliability, low bounce, low-cost two-sided copper foil substrate through this kind of mode.
In order to solve the technical problem, the utility model discloses a technical scheme be: a flexible copper foil substrate with a multilayer composite structure sequentially comprises a first copper foil layer, a first polyimide resin layer, a second polyimide resin layer, a bonding layer and a second copper foil layer;
the first polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 15-40 ppm/K;
the second polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 1-20 ppm/K;
the thickness of the first polyimide resin layer is 1-13 mu m;
the thickness of the second polyimide resin layer is 8-25 mu m;
the thickness of the first copper foil layer is 7-70 mu m;
the thickness of the second copper foil layer is 7-70 mu m;
the thickness of the adhesive layer is 5 to 25 μm.
Further, the first polyimide resin layer and the first copper foil layer constitute a stacked structure having an adhesion force >0.7 kgf/cm.
Further, the polyimide varnish layer is a polyimide resin layer having an imide bond in a resin skeleton.
Further, the adhesive layer is a resin layer containing one of an epoxy resin, an acrylic resin, a urethane resin, a silicone rubber resin, a parylene resin, a bismaleimide resin, and a polyimide resin.
Further, the first copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
Further, the second copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
The beneficial effects of the utility model are that following several points have at least:
1. the utility model adopts the mode of coating polyimide varnish on the copper foil, imidizing, coating adhesive and pressing to manufacture the composite copper foil substrate, compared with the technical proposal of adopting thermoplastic polyimide and copper foil to form the copper foil substrate in the mode of high-temperature pressing, the production process of the utility model does not need high-temperature pressing and corresponding equipment, therefore, the utility model has the advantages of low production cost and high process yield;
2. the CTE of the first polyimide resin layer of the utility model is 15-40 ppm/K; the CTE of the second polyimide resin layer is 1-20 ppm/K, a polyimide varnish layer with high CTE is coated on the part close to the copper side, and a polyimide varnish layer with low CTE is coated on the middle part, so that the heat resistance, the size stability and the reliability of the copper foil substrate are improved.
3. The whole structure of the utility model has the rebound force of 2.2 g-3.0 g, and has low rebound force;
4. the whole structure of the utility model is repeatedly bent after etching a specified circuit, the bending times are 3888-4988 times, and the bending resistance is better;
5. the size stability grade of the whole structure of the utility model reaches within fifteen or even within three thousand, and the size stability of the whole structure is better.
Drawings
Fig. 1 is a schematic structural view of a composite copper foil substrate of the present invention;
FIG. 2 is a schematic diagram of a prior art glueless substrate;
FIG. 3 is a schematic diagram of a composite substrate according to the prior art;
the parts in the drawings are marked as follows:
composite copper foil substrate 100
A first copper foil layer 101, a first polyimide layer 102, a second polyimide layer 103, an adhesive layer 104, and a second copper foil layer 105;
non-glue base material 200
A first copper foil layer 201, a special thermoplastic polyimide film 202, and a second copper foil layer 203;
A first copper foil layer 301, a polyimide layer 302, an adhesion layer 303, and a second copper foil layer 304.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Example (b): a flexible copper foil substrate having a multilayer composite structure, as shown in FIG. 1, comprises a first copper foil layer 101, a first polyimide resin layer 102, a second polyimide resin layer 103, an adhesive layer 104 and a second copper foil layer 105 in this order;
the first polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 15-40 ppm/K;
the second polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 1-20 ppm/K;
the thickness of the first polyimide resin layer is 1-13 mu m;
the thickness of the second polyimide resin layer is 8-25 mu m;
the thickness of the first copper foil layer is 7-70 mu m;
the thickness of the second copper foil layer is 7-70 mu m;
the thickness of the adhesive layer is 5 to 25 μm.
The first polyimide resin layer and the first copper foil layer constitute a stacked structure having an adhesion force >0.7 kgf/cm.
The polyimide varnish layer is a polyimide resin layer with an imide bond in a resin framework.
The polyimide varnish layer is a polyimide resin layer with at least one of polyimide, polyimide imide, polyimide ester and polybenzimidazole in a resin framework.
The adhesive layer is a resin layer containing at least one of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, poly-p-xylylene resin, bismaleimide resin, and polyimide resin. Preferably, the adhesive layer is a thermosetting polyimide resin layer, and the polyimide accounts for 40-95% of the adhesive layer.
The first copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
The second copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
The preparation method of the flexible copper foil substrate with the multilayer composite structure comprises the following steps:
s1: coating the first polyimide resin layer and the second polyimide resin layer on one side of the first copper foil layer together, and drying to perform imidization to form a single-sided copper foil substrate;
s2: forming an adhesive layer on the polyimide surface of the single-sided copper clad laminate of S1 by a coating method or a transfer method so that the adhesive layer is in a semi-cured state;
s3: preparing a second copper foil layer, attaching the second copper foil layer to the adhesive layer of the finished product S2, pressing the second copper foil layer and the adhesive layer to tightly connect the second copper foil layer and the finished product S2, and then baking to completely cure the adhesive layer to obtain a double-sided copper foil substrate.
Embodiment 1-embodiment 4 are the composite copper foil substrate 100 of the present invention, which has a structure that: a copper foil layer, a first polyimide layer, a second polyimide layer, an adhesion layer and a copper foil layer; comparative example 1 is a commercially available adhesive-free base material 200, as shown in fig. 2, which has the following structure: a first copper foil layer 201 (thickness of 12 μm, CTE of 18ppm/K), a special thermoplastic polyimide film 202 (thickness of 25 μm, CTE of 18ppm/K), and a second copper foil layer 203 (thickness of 12 μm, CTE of 18 ppm/K); comparative example 2 is a composite substrate 300 of the prior art, as shown in fig. 3, the structure thereof is sequentially as follows: copper foil layer 301, first polyimide layer 302, adhesion layer 303, and copper foil layer 304.
The copper foils of examples 1 to 4, comparative examples 1 and 2 were made of 1/3Oz (12 μm) Nikko electrolytic copper foil JXEFL-V2; the polyimide layer of comparative example 1 was a special thermoplastic polyimide film, which was NPI of KANEKA; the polyimide layer of comparative example 2 was a polyimide varnish layer containing imide bonds. Examples 1 to 4 and comparative example 2 each had a composition in which the adhesive layer was an adhesive resin layer mainly composed of a thermosetting polyimide resin, and the adhesive layer contained 70 weight percent of a polyimide resin, 15 weight percent of a flame retardant and 15 weight percent of an epoxy resin, based on the total weight of the respective layers.
Specific stacking structures of examples 1 to 4 and comparative example 2 are shown in table 1.
Table 1:
the basic performance of the examples of the present invention was compared with that of the prior art copper foil substrate, and is described in table 2 below:
table 2:
the MIT test of the present invention is a test in which an etched line is a 0.1mm line, a 12 μm dupont PI (model: KN) +15 μm epoxy adhesive cover film is used, and a fixture with R ═ 0.38 is used to shake the film at 135 ° left and right. Other tests are detailed in the IPC-TM-650 test standard of the International electronic industry Association or the TPCA-F-002 test standard of the Taiwan Circuit Board Association, both of which are test standards and specifications of PCB and related industries, and thus are not described herein.
As can be seen from the experimental results in table 2, the present invention has excellent mechanical properties, adhesion, flexibility, dimensional stability, reliability and heat resistance, and has a better bending property and a better performance in dimensional stability than comparative example 1, wherein the dimensional stability is close to the grade of fifteen or even ten thousand.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the same principle as the present invention.
Claims (6)
1. A flexible copper foil substrate having a multilayer composite structure, characterized in that: the laminated copper foil comprises a first copper foil layer, a first polyimide resin layer, a second polyimide resin layer, a bonding layer and a second copper foil layer in sequence;
the first polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 15-40 ppm/K;
the second polyimide resin layer is a thermosetting polyimide varnish layer with CTE of 1-20 ppm/K;
the thickness of the first polyimide resin layer is 1-13 mu m;
the thickness of the second polyimide resin layer is 8-25 mu m;
the thickness of the first copper foil layer is 7-70 mu m;
the thickness of the second copper foil layer is 7-70 mu m;
the thickness of the adhesive layer is 5 to 25 μm.
2. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the first polyimide resin layer and the first copper foil layer constitute a stacked structure having an adhesion force >0.7 kgf/cm.
3. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the polyimide varnish layer is a polyimide resin layer with an imide bond in a resin framework.
4. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the adhesive layer is a resin layer containing one of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, poly-p-xylylene resin, bismaleimide resin, and polyimide resin.
5. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the first copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
6. The flexible copper foil substrate with a multilayer composite structure according to claim 1, characterized in that: the second copper foil layer is an electrolytic copper foil layer or a rolled copper foil layer.
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| CN202022414961.0U CN213648983U (en) | 2020-10-27 | 2020-10-27 | Flexible copper foil base material with multilayer composite structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114474895A (en) * | 2020-10-27 | 2022-05-13 | 昆山雅森电子材料科技有限公司 | Flexible copper foil base material with multilayer composite structure and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114474895A (en) * | 2020-10-27 | 2022-05-13 | 昆山雅森电子材料科技有限公司 | Flexible copper foil base material with multilayer composite structure and preparation method thereof |
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