CN219236379U

CN219236379U - Flexible copper-clad plate of polyimide without glue lamination

Info

Publication number: CN219236379U
Application number: CN202320004127.5U
Authority: CN
Inventors: 徐莎; 许晓进; 王洋; 范金泽; 张正浩
Original assignee: Zhongshan Allstar Electronic Materials Co ltd
Current assignee: Zhongshan Allstar Electronic Materials Co ltd
Priority date: 2023-01-03
Filing date: 2023-01-03
Publication date: 2023-06-23
Anticipated expiration: 2033-01-03

Abstract

The utility model provides a non-adhesive laminated polyimide flexible copper-clad plate, which comprises the following components: and the thermoplastic bonding layer is provided with two copper foils oppositely arranged on the thermoplastic bonding layer. The thickness of the polyimide dielectric layer is widened from 50 mu m to 200 mu m by using a thermoplastic polyimide high-temperature processable bonding principle in different lamination modes, the thickness of the copper-clad plate can be adjusted by changing the quantity of the thermoplastic polyimide or the thickness of the thermoplastic polyimide, and meanwhile, the finished copper-clad plate has good peeling strength, tensile strength, elongation, dimensional stability and thermal stress, and the manufactured copper-clad plate can be applied in more environments, has reinforced toughness and is not easy to break.

Description

Flexible copper-clad plate of polyimide without glue lamination

Technical Field

The utility model relates to the field of flexible copper clad laminates, in particular to a glue-free laminated polyimide flexible copper clad laminate.

Background

The flexible copper clad laminate (Flexible Copper Clad Laminate, FCCL for short) has the characteristics of light weight, thinness, high heat resistance and flexibility, so that the FPC using the flexible copper clad laminate as a substrate material is widely used in electronic equipment, consumer electronics and electronic communication products. Along with the progress of science and technology, miniaturization and high precision requirements of electronic products are higher and higher, the polyimide flexible copper clad laminate can be repeatedly bent besides the electric connection, insulation and mechanical support functions of a common copper clad laminate, and the flexible printed circuit board made of the flexible copper clad laminate can enable wiring to be more reasonable, save installation space and meet the requirements of the electronic products on lighter, thinner, shorter and smaller.

In order to meet the requirements of medical treatment, industrial control, security protection, vehicle-mounted, communication electronics and aerospace field equipment for being lighter, thinner and smaller, a rigid-flex board is generated. The soft and hard combined board has the characteristics of FPC and PCB, so that the PCB can reduce the use volume of the PCB, save the internal space of the product, maintain the high integration level of the circuit board product and greatly help to improve the performance of the product.

The thickness of the adhesive-free polyimide layer of the common polyimide flexible copper-clad plate in the market at present is limited to be within 50 mu m (containing), the thickness can not be increased upwards any more, the application environment is limited, and the polyimide flexible copper-clad plate is easy to break.

For example, a Chinese patent with publication number of CN212949595U discloses a heat-dissipating flexible polyimide copper-clad plate. However, the thickness of the copper-clad plate body (1) in the prior art has the problems described above, and the thickness of the copper-clad plate body (1) cannot be adjusted in production or processing, and is fixed.

Disclosure of Invention

In order to solve the problems, the utility model provides a non-adhesive laminated polyimide flexible copper clad laminate for a higher thickness, which is used for solving the problems in the prior art.

In order to achieve the above object, the utility model provides a polyimide flexible copper clad laminate without adhesive lamination, comprising: a thermoplastic adhesive layer;

two copper foils oppositely arranged on the thermoplastic bonding layer;

the thermoplastic bonding layer comprises any one of the following structures:

-the thermoplastic adhesive layer comprises four thermoplastic polyimides which are mutually laminated, and the thickness of the four thermoplastic polyimides is the same;

-said thermoplastic adhesive layer comprises three thermoplastic polyimides arranged one above the other, the thickness of the three thermoplastic polyimides being different;

-said thermoplastic adhesive layer comprises two thermoplastic polyimides arranged one above the other, the thickness of the two thermoplastic polyimides being different.

Further, the thickness of the thermoplastic polyimide is 25 μm and 50 μm;

the plurality of thermoplastic polyimides having different thicknesses may be arranged arbitrarily as follows:

-one of said thermoplastic polyimides having a thickness of 25 μm is located between two of said thermoplastic polyimides having a thickness of 50 μm;

-a thickness of 25 μm of said thermoplastic polyimide is located above or below a thickness of 50 μm of said thermoplastic polyimide.

Further, a protective film adhered to both of the copper foils is also included.

Further, the copper foil has a copper tooth Rz value of 0.7 to 2.8 μm and a copper foil thickness of 6 to 70 μm.

Compared with the prior art, the utility model has the beneficial effects that: the thickness of the polyimide dielectric layer is widened from 50 mu m to 200 mu m by using a thermoplastic polyimide high-temperature processable bonding principle in different lamination modes, the thickness of the copper-clad plate can be adjusted by changing the quantity of the thermoplastic polyimide or the thickness of the thermoplastic polyimide, and meanwhile, the finished copper-clad plate has good peeling strength, tensile strength, elongation, dimensional stability and thermal stress, and the manufactured copper-clad plate can be applied in more environments, has reinforced toughness and is not easy to break.

For a better understanding and implementation, the present utility model is described in detail below with reference to the drawings.

Drawings

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a schematic plan view of the present utility model; the method comprises the steps of carrying out a first treatment on the surface of the

FIG. 3 is a schematic overall plan view of a second embodiment of the present utility model;

fig. 4 is an overall plan view of a third embodiment of the present utility model.

In the figure: 1. a protective film; 2. copper foil; 3. thermoplastic polyimide.

Detailed Description

For a clearer understanding of technical features, objects and effects of the present utility model, a specific embodiment of the present utility model will be described with reference to the accompanying drawings, but the scope of the present utility model is not limited to the following.

Example 1

Referring to fig. 1 to 4, a polyimide flexible copper clad laminate without lamination includes: a protective film 1, a copper foil 2 and a thermoplastic polyimide 3.

The thermoplastic polyimide 3 is provided with 4 layers, is mutually laminated and arranged to form a thermoplastic bonding layer, the thickness of each layer of thermoplastic polyimide 3 is 50 mu m, the copper foil 2 is provided with two layers, the two layers of the thermoplastic polyimide are oppositely arranged on two sides of the thermoplastic bonding layer, and the two layers of the protective films 1 are respectively and oppositely bonded on the two copper foils 2.

After baking 4 layers of 50 μm thick space NVT at a constant temperature of 100℃for 6 hours, a thermoplastic adhesive layer was formed, and a copper foil 2 was hot-pressed on the thermoplastic adhesive layer. After the processing, the protective film 1, the copper foil and the thermoplastic polyimide 3 jointly form the adhesive-free laminated polyimide flexible copper-clad plate with the thickness of 200 mu m.

The equal-pressure-equalizing type double steel belts are laminated at high temperature as follows:

sequence number	Material
		Layer
1	Protective film
		Layer
2	Copper foil
		Layer
3	50μm NVT
		Layer 4	50μm NVT
Layer 5	50μm NVT
		Layer 6	50μm NVT
Layer 7	Copper foil
		Layer 8	Protective film

According to the technical scheme provided by the utility model, the thickness of the polyimide dielectric layer is widened from 50 mu m to 200 mu m by using a thermoplastic polyimide high-temperature processable bonding principle in different lamination modes, and the manufactured copper plate can be applied in more environments, has reinforced toughness and is not easy to break.

Preferably: the water content of the laminated polyimide film is reduced to below 1% by a baking mode before lamination.

Preferably: the copper teeth Rz value of the copper foil is 0.7-2.8 mu m, and the thickness of the copper foil is 6-70 mu m.

Preferably: in the hot pressing process, an equal-pressure-equalizing double-steel-belt machine is adopted for high-temperature hot pressing preparation, and at least 8 sending shafts are needed for a pressing sending end, wherein 2 sending shafts are used for sending protective films, 2 sending shafts are used for sending copper foils, and the remaining 4 sending shafts are used for sending polyimide composite films according to polyimide lamination thickness requirements.

Example 2

Based on example 1 above

Referring to fig. 1 to 4, a polyimide flexible copper clad laminate without lamination includes: a protective film 1, a copper foil 2 and a thermoplastic polyimide 3. The difference from example 1 is that in this example, the thermoplastic adhesive layer consists of three thermoplastic polyimides 3.

Of which two thermoplastic polyimide layers 3 have a thickness of 50 μm and one thermoplastic polyimide layer 3 has a thickness of 25 μm. 1 roll of 25 μm thick space NVT and 2 rolls of 50 μm thick space NVT were baked at a constant temperature of 100deg.C for 6 hours to synthesize a thermoplastic adhesive layer. Wherein the positions between the thermoplastic polyimide 3 having a thickness of 50 μm and the thermoplastic polyimide 3 having a thickness of 25 μm can be arbitrarily combined, for example, the thermoplastic polyimide 3 having a thickness of 25 μm can be placed between two layers of thermoplastic polyimide 3 having a thickness of 50 μm.

The copper foil 2 is hot pressed on the thermoplastic bonding layer, the protective film 1 is bonded on the copper foil 2, and the three components mutually form the adhesive-free laminated polyimide flexible copper clad laminate with the thickness of 125 mu m.

sequence number	Material
		Layer
1	Protective film
		Layer
2	Copper foil
		Layer
3	50μm NVT
		Layer 4	25μm NVT
Layer 5	50μm NVT
		Layer 6	Copper foil
Layer 7	Protective film

According to the technical scheme provided by the utility model, in the embodiment, the thickness of the manufactured product is changed by using fewer thermoplastic polyimide 3 or thermoplastic polyimide 3 with different thickness for hot melting.

Example 3

Based on the above examples 1 and 2

Referring to fig. 1 to 4, a polyimide flexible copper clad laminate without lamination includes: a protective film 1, a copper foil 2 and a thermoplastic polyimide 3. The difference from example 1 and example 2 is that in this example, the thermoplastic adhesive layer is composed of two thermoplastic polyimide layers 3.

The thickness of the two thermoplastic polyimides 3 was 25 μm and 50 μm, respectively. The 25 μm thick astronomical portion NVT and 50 μm thick astronomical portion NVT were baked at a constant temperature of 100deg.C for 6 hours to form a thermoplastic adhesive layer.

The copper foil 2 is hot pressed on the thermoplastic bonding layer, the protective film 1 is bonded on the copper foil 2, and the three components mutually form the non-adhesive laminated polyimide flexible copper clad laminate with the thickness of 75 mu m.

sequence number	Material
		Layer
1	Protective film
		Layer
2	Copper foil
		Layer
3	25μm NVT
		Layer 4	50μm NVT
Layer 5	Copper foil
		Layer 6	Protective film

Example 4

Based on the above examples 1 and 2 and example 3

Referring to fig. 1 to 4, a polyimide flexible copper clad laminate without lamination includes: a protective film 1, a copper foil 2 and a thermoplastic polyimide 3. The difference from the above embodiments is that in the present embodiment, the thermoplastic adhesive layer is composed of two thermoplastic polyimide layers 3.

The thickness of the two thermoplastic polyimide layers 3 is 50 μm, and the two 50 μm thick space NVT layers are baked at a constant temperature of 100 ℃ for 6 hours to form a thermoplastic bonding layer.

The copper foil 2 is hot pressed on the thermoplastic bonding layer, the protective film 1 is bonded on the copper foil 2, and the three are mutually combined into the adhesive-free laminated polyimide flexible copper-clad plate with the thickness of 100 mu m.

sequence number	Material
		Layer
1	Protective film
		Layer
2	Copper foil
		Layer
3	50μm NVT
		Layer 4	50μm NVT
Layer 5	Copper foil
		Layer 6	Protective film

The adhesive-free laminated flexible copper-clad plate materials prepared in the examples and the comparative examples are subjected to performance tests such as peel strength, tensile strength, elongation, dimensional stability, thermal stress and the like by adopting a test method of industrial IPC-TM-650, and the test results are shown in the following table:

according to the technical scheme provided by the utility model, from the above embodiments, the thickness of the copper-adjusting plate can be finished by only changing the quantity of the thermoplastic polyimide 3 or the thickness of the thermoplastic polyimide 3, and meanwhile, the finished copper plate has better peeling strength, tensile strength, elongation, dimensional stability and thermal stress.

The foregoing disclosure is merely illustrative of the preferred embodiments of the present utility model and is not intended to limit the scope of the claims herein, as equivalent changes may be made in the claims herein without departing from the scope of the utility model.

Claims

1. The utility model provides a no glued laminated polyimide flexible copper clad laminate which characterized in that includes:

a thermoplastic adhesive layer;

two copper foils (2) disposed opposite each other on the thermoplastic adhesive layer;

the thermoplastic bonding layer comprises any one of the following structures:

-the thermoplastic adhesive layer comprises four thermoplastic polyimides (3) arranged on top of each other, the four thermoplastic polyimides (3) having the same thickness;

-the thermoplastic adhesive layer comprises three thermoplastic polyimides (3) arranged one above the other, the thickness of the three thermoplastic polyimides (3) being different;

-the thermoplastic adhesive layer comprises two thermoplastic polyimides (3) arranged one above the other, the thickness of the two thermoplastic polyimides (3) being different.

2. The adhesive-free laminated polyimide flexible copper clad laminate according to claim 1, wherein: the thickness of the thermoplastic polyimide (3) is 25 μm and 50 μm.

3. The adhesive-free laminated polyimide flexible copper clad laminate according to any of claims 1 or 2, characterized in that: the plurality of thermoplastic polyimides (3) having different thicknesses may be arranged arbitrarily as follows:

-one of said thermoplastic polyimides (3) with a thickness of 25 μm is located between two of said thermoplastic polyimides (3) with a thickness of 50 μm;

-a thickness of 25 μm of said thermoplastic polyimide (3) is located above or below a thickness of 50 μm of said thermoplastic polyimide (3).

4. The adhesive-free laminated polyimide flexible copper clad laminate according to claim 1, wherein: the copper foil also comprises a protective film (1) adhered to the two copper foils (2).

5. The adhesive-free laminated polyimide flexible copper clad laminate according to claim 1, wherein: the copper teeth Rz value of the copper foil (2) is 0.7-2.8 mu m, and the thickness of the copper foil (2) is 6-70 mu m.