CN108045022B - LCP (liquid crystal display) or fluorine polymer high-frequency high-transmission double-sided copper foil substrate and FPC (flexible printed circuit) - Google Patents
LCP (liquid crystal display) or fluorine polymer high-frequency high-transmission double-sided copper foil substrate and FPC (flexible printed circuit) Download PDFInfo
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- CN108045022B CN108045022B CN201810013815.1A CN201810013815A CN108045022B CN 108045022 B CN108045022 B CN 108045022B CN 201810013815 A CN201810013815 A CN 201810013815A CN 108045022 B CN108045022 B CN 108045022B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 298
- 239000011889 copper foil Substances 0.000 title claims abstract description 296
- 229920000642 polymer Polymers 0.000 title claims abstract description 218
- 239000000758 substrate Substances 0.000 title claims abstract description 89
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910052731 fluorine Inorganic materials 0.000 title claims abstract description 46
- 239000011737 fluorine Substances 0.000 title claims abstract description 46
- 239000004973 liquid crystal related substance Substances 0.000 title description 2
- 239000010410 layer Substances 0.000 claims abstract description 462
- 239000012790 adhesive layer Substances 0.000 claims abstract description 82
- 229920001721 polyimide Polymers 0.000 claims abstract description 51
- 239000004642 Polyimide Substances 0.000 claims abstract description 48
- 238000010521 absorption reaction Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 24
- 229920001577 copolymer Polymers 0.000 claims description 23
- 238000001723 curing Methods 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 11
- -1 polytetrafluoroethylene Polymers 0.000 claims description 9
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 5
- 239000005977 Ethylene Substances 0.000 claims description 5
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 239000002033 PVDF binder Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920002313 fluoropolymer Polymers 0.000 claims description 4
- 239000004811 fluoropolymer Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 3
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 claims description 2
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims description 2
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000005553 drilling Methods 0.000 abstract description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 33
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 16
- 238000000576 coating method Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 230000008054 signal transmission Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000002952 polymeric resin Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Abstract
The invention discloses a high-frequency high-transmission double-sided copper foil substrate of LCP or fluorine polymer, which comprises a first copper foil layer, a second copper foil layer, a first extremely low dielectric adhesive layer and at least one insulating polymer layer, wherein the first extremely low dielectric adhesive layer and the at least one insulating polymer layer are positioned between the first copper foil layer and the second copper foil layer, and the Rz value of the inner surfaces of the first copper foil layer and the second copper foil layer is 0.1-1.0 mu m; the insulating polymer layer is at least one of a first LCP polymer layer or a first fluorine-based polymer layer; the first extremely low dielectric adhesive layer is an adhesive layer with Dk value of 2.0-3.5 and Df value of 0.002-0.010; the first polyimide layer refers to an insulating polymer layer having a Dk value of 2.20 to 3.50 and a Df value of 0.002 to 0.010. The double-sided copper foil substrate and the FPC have good electrical property, low cost, short manufacturing procedure, low thermal expansion coefficient, stable dk/df performance under high temperature and humidity environment, ultra-low water absorption, good UV laser drilling capability, low rebound force and suitability for high-density assembly and excellent mechanical property.
Description
Technical Field
The invention relates to the technical field of FPC (flexible circuit board) and preparation thereof, in particular to a double-sided copper foil substrate.
Background
With the rapid development of information technology, various mixed-pressure structure multilayer board designs and applications are in progress in order to meet the requirements of high frequency and high speed of signal transmission, rapid heat dissipation and heat conduction and minimum production cost. Printed circuit boards are an indispensable material in electronic products, and as consumer electronic products demand increases, so does the demand for printed circuit boards. Because of the flexibility and three-dimensional wiring characteristics of flexible printed circuit boards (fpcs, flexible Printed Circuit), the flexible printed circuit boards are widely used in computers, peripheral devices, communication products, consumer electronics, and the like.
In the high frequency domain, the wireless infrastructure needs to provide a sufficiently low insertion loss to effectively improve the energy utilization rate. With the coming of 5G communication, millimeter wave and aerospace military accelerating high-frequency high-speed FPC/PCB (printed circuit board) demand service, with the rising of emerging industries such as big data, internet of things and the like and the popularization of mobile interconnection terminals, the method for rapidly processing and transmitting information becomes an important point in the communication industry. In the field of communication, a 5G network has higher bandwidth and denser micro base station construction than a 4G network in the future, and the network speed is faster. The demands of internet of things and cloud computing as well as broadband communication of new generations, and the development of high-speed servers and mobile phones with higher transmission speeds have become a trend in the market. Generally, FPC/PCB is a major bottleneck in the whole transmission process, and if there is a lack of good design and electrical properties of related materials, the transmission speed will be seriously delayed or signal loss will be caused. This places high demands on the circuit board material. In addition, the high-frequency plates mainly used in the current industry are mainly LCP (liquid crystal polymer) plates and PTFE (polytetrafluoroethylene) fiber plates, but are limited by the processing technology, so that the requirements on manufacturing equipment are high, the operation can be performed only in a relatively high-temperature environment (> 280 ℃), the uneven film thickness is caused, the impedance value of a circuit board is not easy to control due to the uneven film thickness, the conductivity of copper plating is affected due to the extrusion of LCP or PTFE in the high-temperature pressing process, the circuit is broken, the reliability is poor, and the reliability is lowered; in addition, the quick press equipment cannot be used, so that the processing is difficult; in addition, in the SMT (surface mount technology) high temperature process or other FPC process, such as bending, strong acid and alkali liquor process, the adhesion strength is insufficient, resulting in the reduction of yield. While other resin-based films have no such problems, they suffer from poor electrical properties or poor mechanical strength.
Disclosure of Invention
The signal integrity is critical for high-frequency and high-speed transmission, and the influencing factors are mainly copper foil layers and insulating polymer layer base materials, and the double-sided copper foil base board serving as a raw material of the FPC/PCB board mainly comprises a plurality of insulating polymer layers and copper foil layers. The performance of double sided copper foil substrates is largely dependent on the choice of lower dk/df resin layer and the choice of copper foil surface roughness and lattice arrangement.
In order to solve the technical problems, the invention provides the LCP or fluorine polymer high-frequency high-transmission double-sided copper foil substrate, which has good electrical property, a copper foil layer with low roughness, simple structure composition, advantages in cost, shorter manufacturing process, low thermal expansion coefficient, stable dk/df performance in a high-temperature and high-humidity environment, ultra-low water absorption, good UV laser drilling capability, low rebound force, suitability for high-density assembly and excellent mechanical property; in addition, the current technology of the coating method can only coat the thickness of about 50 μm at most, and the manufacturing method of the invention can easily obtain thick films of more than 100 μm.
In order to solve the technical problems, the invention adopts a technical scheme that: the invention provides an LCP or fluorine polymer high-frequency high-transmission double-sided copper foil substrate, which comprises a first copper foil layer, a second copper foil layer, a first extremely low dielectric adhesive layer and at least one insulating polymer layer, wherein the first extremely low dielectric adhesive layer and the at least one insulating polymer layer are positioned between the first copper foil layer and the second copper foil layer, one surface of each of the first copper foil layer and the second copper foil layer, which is close to the insulating polymer layer, is an inner surface, the Rz value of the inner surface of the first copper foil layer is 0.1-1.0 mu m, and the Rz value of the inner surface of the second copper foil layer is 0.1-1.0 mu m;
Each insulating polymer layer comprises at least one of a first insulating polymer layer and a second insulating polymer layer, wherein the at least one insulating polymer layer is a first insulating polymer layer, the first insulating polymer layer is at least one of a first LCP polymer layer or a first fluorine-based polymer layer, and the second insulating polymer layer is a first polyimide layer;
The first extremely low dielectric adhesive layer is an adhesive layer with a Dk value of 2.0-3.50 and a Df value of 0.002-0.010;
The first polyimide layer is an insulating polymer layer with Dk value of 2.20-3.50 and Df value of 0.002-0.010;
The total thickness of the double-sided copper foil substrate is 9-220 mu m; wherein the thickness of the first copper foil layer and the second copper foil layer is 1-35 mu m; the thickness of the first extremely low dielectric adhesive layer is 2-50 mu m; the thickness of each insulating polymer layer is 5-50 μm.
Further, the fluorine-based polymer in the first fluorine-based polymer layer is at least one selected from polytetrafluoroethylene, polyvinylidene fluoride, a copolymer of vinyl fluoride and vinyl ether, a copolymer of tetrafluoroethylene and ethylene, a copolymer of polytrifluoroethylene and ethylene, tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride, a copolymer of tetrafluoroethylene-perfluoroalkyl vinyl ether, polytrifluoroethylene, polyvinyl chloride, tetrafluoroethylene-hexafluoropropylene copolymer, an ethylene-vinyl fluoride copolymer, and a copolymer of tetrafluoroethylene-hexafluoropropylene-trifluoroethylene.
Further, the overall water absorption of the stacked structure formed by the first copper foil layer, the second copper foil layer, the first extremely low dielectric adhesive layer and the insulating polymer layer is 0.01-1.5%.
Further, the adhesive strength between the first very low dielectric glue layer and the second copper foil layer, between the first very low dielectric glue layer and the insulating polymer layer, between the insulating polymer layer and the first copper foil layer, and between the insulating polymer layer and the second copper foil layer is >0.7kgf/cm.
Further, the resin material of the first extremely low dielectric glue layer is at least one of fluorine resin, epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin and polyimide resin.
Further, the first very low dielectric glue layer is a thermosetting polyimide layer containing polyimide, and the content of the polyimide is 40-95% of the total solid content of the first very low dielectric glue layer.
Further, the double-sided copper foil substrate is one of the following three structures:
the first double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first very low dielectric adhesive layer, a first insulating polymer layer and a second copper foil layer from top to bottom;
the second type of double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first very low dielectric adhesive layer, a second insulating polymer layer and a second copper foil layer from top to bottom;
the third type of double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer and a second copper foil layer from top to bottom;
the first copper foil layer, the first insulating polymer layer, the first very low dielectric glue layer and the second copper foil layer have a total thickness of 9-170 μm.
The invention also provides an FPC with the LCP or fluorine polymer high-frequency high-transmission double-sided copper foil substrate, the FPC comprises an FRCC and the double-sided copper foil substrate, the FRCC and the double-sided copper foil substrate are pressed together, the FRCC comprises a third copper foil layer, a second electrode low dielectric adhesive layer and a third insulating polymer layer positioned between the FRCC and the FRCC, one surface of the third copper foil layer, which is contacted with the third insulating polymer layer, is an inner surface, and the Rz value of the inner surface of the third copper foil layer is 0.1-1.0 mu m.
Further, the FPC is one of the following six structures, and the FRCC is defined to be pressed on the upper side of the double-sided copper foil substrate:
The first kind of FRCC from the top down is: the second copper foil layer, the second insulating polymer layer and the second low dielectric adhesive layer, wherein the second insulating polymer layer is a second LCP polymer layer or a second fluorine-based polymer layer; the double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer, a first insulating polymer layer and a second copper foil layer from top to bottom;
The second type of FRCC is from top to bottom: the second copper foil layer, the second insulating polymer layer and the second low dielectric adhesive layer, wherein the second insulating polymer layer is a second LCP polymer layer or a second fluorine-based polymer layer; the double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer, a first polyimide layer and a second copper foil layer from top to bottom;
The third kind of FRCC is from top to bottom: the second copper foil layer, the second insulating polymer layer and the second low dielectric adhesive layer, wherein the second insulating polymer layer is a second LCP polymer layer or a second fluorine-based polymer layer; the double-sided copper foil substrate is sequentially provided with a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer and a second copper foil layer from top to bottom;
Fourth, FRCC from the top down is in proper order: the second insulating polymer layer is a second polyimide layer; the double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer, a first insulating polymer layer and a second copper foil layer from top to bottom;
Fifth, FRCC from top to bottom is in proper order: the second insulating polymer layer is a second polyimide layer; the double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer, a first polyimide layer and a second copper foil layer from top to bottom;
The sixth kind of FRCC from top to bottom is: the second insulating polymer layer is a second polyimide layer; the double-sided copper foil substrate comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer and a second copper foil layer from top to bottom in sequence.
The invention also provides a preparation method of the FPC, which comprises the steps of pre-pressing, pressing and curing the FRCC and the double-sided copper foil substrate, wherein the pre-pressing time is 10-30s, the molding time is 120-180s, the molding pressure is 90-110kgf/cm 2, the pressing temperature is 185+/-10 ℃, the curing temperature is 165-175 ℃, and the curing time is 50-70min.
The beneficial effects of the invention are as follows:
1. The double-sided copper foil substrate disclosed by the invention has a reasonable structure, can reduce the manufacturing procedures of FPC factories, is good in electrical property, has low-roughness copper foil, low thermal expansion coefficient, stable dk/df performance in a high-temperature and high-humidity environment, ultra-low water absorption, excellent mechanical property, excellent flexibility, high soldering resistance, excellent adhesive strength and good operability, can be pressed at a low temperature, can use quick-press equipment, can enable FPC to have excellent flatness after being pressed, is suitable for small-aperture processing of UV laser less than 100 microns, has uniform film thickness during pressing, is good in impedance control, and is suitable for wearable equipment such as 5G smart phones and APPLE WATCH;
2. The FPC of the invention comprises a first copper foil layer, a second copper foil layer and a third copper foil layer, namely the FPC with three copper foil layers, has reasonable structure, is formed by laminating an FRCC and a double-sided copper foil substrate, and has three copper foil layers after lamination, wherein the third copper foil layer and the second copper foil layer are copper foil layers on the outer side, and are required to be soldered at high temperature (about 260 degrees) and are provided with components, so that the requirements on the peeling strength of the third copper foil layer and the second copper foil layer are higher (> 0.7 kgf/cm), the first copper foil layer is an inner copper foil layer positioned in the middle, also called a signal line copper foil layer, and is mainly used for conducting circuits, the components are not required to be carried through SMT or other high-temperature processes, so that the peeling strength requirements on the first copper foil layer and the second low-dielectric glue layer are lower, and only the peeling strength of >0.5kgf/cm are required, in the traditional concept, the larger the bonding strength of the copper foil layer in the FPC and other layers is in a certain range, the better the bonding strength is (at least more than 0.7 kgf/cm), the less the delamination and falling off are, the larger the bonding strength is, the larger the Rz value of the copper foil layer is generally required, in addition, the smaller the Rz value of the copper foil layer is required to realize high-frequency high transmission due to the skin effect in the signal transmission process of the copper foil layer, the better the Rz value of the copper foil layer is required to realize, so that the contradiction exists between the larger bonding strength and the high-frequency high transmission, and the FPC has the advantages that the first copper foil layer does not need to carry components through SMT or other high-temperature processes, the peeling strength requirement on the first copper foil layer and the second low-dielectric adhesive layer is lower, and only more than 0.5kgf/cm is required, so that the first copper foil layer can select the copper foil layer with lower Rz value, better electrical property and lower insertion loss and does not influence the high-frequency transmission of the FPC;
3. The insulating polymer layer of the double-sided copper foil substrate comprises at least one of a first insulating polymer layer and a second insulating polymer layer, the first insulating polymer layer is at least one of a first LCP polymer layer or a first fluorine-based polymer layer, and the dielectric constant and dielectric loss of the LCP polymer layer or the fluorine-based polymer layer are relatively low, so that the double-sided copper foil substrate has excellent heat resistance, peeling strength and flame retardance, has lower dielectric constant than that of a flexible copper clad laminate in the prior art, and is suitable for manufacturing flexible printed circuit boards in the high-frequency high-speed application field; the fluorine-based polymer layer has ultra-low hygroscopicity, stable performance after water absorption and better electrical performance, and can greatly reduce the board explosion risk of the multilayer board and the soft and hard combined board and reduce the signal transmission insertion loss;
4. The third copper foil layer, the first copper foil layer and the second copper foil layer adopted by the FPC are low in Rz value, and have skin effect in the signal transmission process, and the surface roughness of the copper foil is low, the crystallization is fine and smooth, the surface flatness is good, so that signals can be transmitted at high speed, meanwhile, the extremely low dielectric adhesive layer has low and stable Dk/Df performance, the loss in the signal transmission process can be reduced, the signal transmission quality is further improved, and the FPC can completely meet the requirements of high-frequency high-speed FPC, rapid heat dissipation and heat conduction and minimum production cost development;
5. The first extremely low dielectric adhesive layer is an adhesive layer with a Dk value of 2.0-3.5 and a Df value of 0.002-0.010, and the Dk/Df value is lower and stable under a high temperature and humidity environment, so that the FRCC and the double-sided copper foil substrate are suitable for being rapidly pressed at a low temperature (lower than 180 ℃) to prepare the FPC, the process processability is strong, the requirement on manufacturing equipment is low, the production cost is further reduced, and the equipment operability and the processability are superior to those of the existing LCP substrate and PTFE fiber plate; more preferably, the method is suitable for low-temperature lamination, so that the risk of oxidation of the circuit in the FPC preparation process is greatly reduced;
6. The first extremely low dielectric adhesive layer can be a thermosetting polyimide layer containing polyimide, the content of polyimide is 40-95% of the total solid content of the first extremely low dielectric adhesive layer, and the structure of the thermosetting polyimide layer matched with an insulating polymer layer is adopted, so that compared with the traditional epoxy resin series product, the double-sided copper foil substrate is more suitable for small-aperture (< 100 mu m) UV laser processing in downstream industry, is not easy to cause shrinkage of through holes (PTH, plating Through Hole) or holes, has uniform film thickness during lamination, has good impedance control, is not only suitable for a processing mode of mechanical drilling with larger aperture, and has stronger process adaptability;
7. Compared with the common LCP plate, the double-sided copper foil substrate has lower rebound force which is only about half of the rebound force of the LCP plate, and is suitable for downstream high-density assembly process;
8. The double-sided copper foil substrate can be provided with the first polyimide layer, and the formula of the first extremely low dielectric adhesive layer can contain polyimide series, so that the overall water absorption rate of the double-sided copper foil substrate is 0.01-1.5%, and the double-sided copper foil substrate is stable in performance after water absorption due to extremely low water absorption rate, has better electrical performance, can greatly reduce the bursting risk of a multilayer board and a soft and hard combined board, and reduces the signal transmission insertion loss;
9. the invention also has the advantages of good thermal expansion, good flexibility, high soldering resistance, excellent mechanical property and the like, and the adhesive strength of the extremely low dielectric adhesive layer is good, and the adhesive strength is more than 0.7kgf/cm;
10. The current Bond Ply (adhesive sheet) product is used in downstream industry, a release layer is required to be stripped and then a copper foil layer is pressed, and the double-sided copper foil substrate with the structure is used, so that the structure is simple in composition, and downstream processing procedures can be saved; the cost is relatively low.
The foregoing description of the invention is merely an overview of the technical solutions of the present invention, and may be implemented according to the content of the specification, in which the following detailed description of the preferred embodiments of the present invention is given with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of embodiment 1 of the present invention;
Fig. 2 is a schematic structural view of embodiment 2 of the present invention;
fig. 3 is a schematic structural view of embodiment 3 of the present invention;
fig. 4 is a schematic structural view of embodiment 4 of the present invention;
fig. 5 is a schematic structural view of embodiment 5 of the present invention;
Fig. 6 is a schematic structural view of embodiment 6 of the present invention;
fig. 7 is a schematic structural view of embodiment 7 of the present invention;
fig. 8 is a schematic structural view of embodiment 8 of the present invention;
fig. 9 is a schematic structural view of embodiment 9 of the present invention;
Fig. 10 is a schematic structural view of embodiment 10 of the present invention;
fig. 11 is a schematic structural view of embodiment 11 of the present invention;
Fig. 12 is a schematic structural view of embodiment 12 of the present invention;
The parts in the drawings are marked as follows:
The double sided copper foil substrate 100, the first copper foil layer 101, the second copper foil layer 102, the first very low dielectric glue layer 103, the first insulating polymer layer 104, the second insulating polymer layer 105, the third copper foil layer 201, the second low dielectric glue layer 202, the second LCP polymer layer or the second fluoropolymer layer 203, and the second polyimide layer 204.
Detailed Description
The following specific embodiments of the invention are described in order to provide those skilled in the art with an understanding of the present disclosure. The invention may be embodied in other different forms, i.e., modified and changed without departing from the scope of the invention.
The "first, second", etc. in the present invention are only for distinction and do not limit the scope of the present invention.
The high-frequency high-transmission double-sided copper foil substrate comprises a first copper foil layer 101, a second copper foil layer 102, a first extremely low dielectric adhesive layer 103 and at least one insulating polymer layer, wherein the first extremely low dielectric adhesive layer 103 and the at least one insulating polymer layer are arranged between the first copper foil layer and the second copper foil layer, one surface of each of the first copper foil layer and the second copper foil layer, which is close to the insulating polymer layer, is an inner surface, the Rz value of the inner surface of the first copper foil layer is 0.1-1.0 mu m, and the Rz value of the inner surface of the second copper foil layer is 0.1-1.0 mu m;
Each of the insulating polymer layers comprises at least one of a first insulating polymer layer 104 and a second insulating polymer layer 105, and the at least one insulating polymer layer is a first insulating polymer layer, the first insulating polymer layer is at least one of a first LCP polymer layer or a first fluoropolymer layer, and the second insulating polymer layer is a first polyimide layer;
The first extremely low dielectric adhesive layer is an adhesive layer with Dk (dielectric constant) value of 2.0-3.5 (10 GHz) and Df (dielectric loss factor) value of 0.002-0.010 (10 GHz);
the first polyimide layer is an insulating polymer layer with Dk value of 2.20-3.50 (10 GHz) and Df value of 0.002-0.010 (10 GHz);
The total thickness of the double-sided copper foil substrate is 9-220 mu m; wherein the thickness of the first copper foil layer and the second copper foil layer is 1-35 mu m; the thickness of the first extremely low dielectric adhesive layer is 2-50 mu m; the thickness of each insulating polymer layer is 5-50 μm.
The fluorine-based polymer in the first fluorine-based polymer layer is at least one selected from Polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), a copolymer of vinyl fluoride and vinyl ether (FEVE), a copolymer of tetrafluoroethylene and ethylene (ETFE), a copolymer of polytrifluoroethylene and ethylene (ECTFE), a copolymer of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride (THV), a copolymer of tetrafluoroethylene-perfluoroalkyl vinyl ether (PFA), polytrifluoroethylene (PCTFF), polyvinyl chloride (PVF), a copolymer of tetrafluoroethylene-hexafluoropropylene (FEP), a copolymer of ethylene-vinyl fluoride (ETF), and a copolymer of tetrafluoroethylene-hexafluoropropylene-Trifluoroethylene (TFB).
The overall water absorption rate of the stacked structure formed by the first copper foil layer, the second copper foil layer, the first extremely low dielectric adhesive layer and the insulating polymer layer is 0.01-1.5%.
The adhesive strength between the first very low dielectric adhesive layer and the second copper foil layer, between the first very low dielectric adhesive layer and the insulating polymer layer, between the insulating polymer layer and the first copper foil layer, and between the insulating polymer layer and the second copper foil layer is >0.7kgf/cm.
The resin material of the first extremely low dielectric glue layer is at least one of fluorine resin, epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin and polyimide resin.
The first very low dielectric glue layer is a thermosetting polyimide layer containing polyimide, and the content of the polyimide is 40-95% of the total solid content of the first very low dielectric glue layer.
Embodiment 1: as shown in fig. 1, the double-sided copper foil substrate with LCP or fluorine polymer high frequency and high transmission is sequentially composed of a first copper foil layer 101, a first insulating polymer layer 104, a first very low dielectric adhesive layer 103, a first insulating polymer layer 104 and a second copper foil layer 102 from top to bottom.
In this embodiment, preferably, the thicknesses of the first copper foil layer and the second copper foil layer are both 6-18 μm; the thickness of the extremely low dielectric adhesive layer is 10-50 mu m; the thickness of the first insulating polymer layer is 12.5-25 μm.
The first copper foil layer and the second copper foil layer are both a rolled copper foil layer (RA/HA/HAV 2) or an electrolytic copper foil layer (ED).
In this embodiment, the preparation method of the double-sided copper foil substrate is performed according to the following steps:
coating LCP polymer or fluorine polymer resin on one surface of a first copper foil layer, removing solvent at 60-100 ℃, and reacting at 300 ℃ for 10hr to generate a first insulating polymer layer;
Coating the extremely low dielectric adhesive on the surface of the first insulating polymer layer, and drying to obtain a first extremely low dielectric adhesive layer;
Coating LCP polymer or fluorine polymer resin on one surface of the second copper foil layer, removing the solvent at 60-100 ℃, and reacting at 300 ℃ for 10hr to generate another first insulating polymer layer;
fourthly, pressing the surface of the first extremely low dielectric adhesive layer prepared in the second step on the outer surface of the first insulating polymer layer prepared in the third step;
and fifthly, winding and curing to obtain a finished product.
In the preparation method of the double-sided copper foil substrate, the pre-pressing time is 10-30s, the molding time is 120-180s, the molding pressure is 90-110kgf/cm 2, the lamination temperature is 185+/-10 ℃, the curing temperature is 165-175 ℃, and the curing time is 50-70min.
Embodiment 2: the LCP or fluorine-based polymer high-frequency high-transmission double-sided copper foil substrate, as shown in fig. 2, has a structure similar to that of embodiment 1, except that: the double-sided copper foil substrate is composed of a first copper foil layer 101, a first insulating polymer layer 104, a first very low dielectric adhesive layer 103, a second insulating polymer layer 105 and a second copper foil layer 102 in sequence from top to bottom.
In this embodiment, the preparation method of the double-sided copper foil substrate is performed according to the following steps:
Coating LCP polymer or fluorine polymer resin on one surface of a first copper foil layer, removing solvent at 60-100 ℃, and reacting at 300 ℃ for 10hr to obtain the first insulating polymer layer;
coating the extremely low dielectric adhesive on the other surface of the first insulating polymer layer, and drying and pressing to obtain the first extremely low dielectric adhesive layer;
Step three, polyimide is coated on one surface of the second copper foil layer, and is dried, cured and pressed to generate the second insulating polymer layer;
Step four, pressing the surface of the first extremely low dielectric adhesive layer prepared in the step two on the outer surface of the second insulating polymer layer prepared in the step three;
and fifthly, winding and curing to obtain a finished product.
Embodiment 3: as shown in fig. 3, the LCP or fluorine-based polymer high-frequency high-transmission double-sided copper foil substrate has a structure similar to that of embodiment 1, except that: the double-sided copper foil substrate is composed of a first copper foil layer 101, a first insulating polymer layer 104, a first very low dielectric adhesive layer 103 and a second copper foil layer 102 in sequence from top to bottom.
The first copper foil layer, the first insulating polymer layer, the first very low dielectric glue layer and the second copper foil layer have a total thickness of 9-170 μm.
In this embodiment, the preparation method of the double-sided copper foil substrate is performed according to the following steps:
Coating LCP polymer or fluorine polymer resin on one surface of a first copper foil layer, removing solvent at 60-100 ℃, and reacting at 300 ℃ for 10hr to obtain the first insulating polymer layer;
coating the extremely low dielectric adhesive on the surface of the first insulating polymer layer, and drying to obtain the first extremely low dielectric adhesive layer;
Step three, pressing a second copper foil layer on the surface of the first extremely low dielectric adhesive layer;
and fifthly, winding and curing to obtain a finished product.
Embodiment 4: as shown in fig. 4, the LCP or fluorine-based polymer high-frequency high-transmission double-sided copper foil substrate has a structure similar to that of embodiment 1, except that: the double-sided copper foil substrate is composed of a first copper foil layer 101, a first polyimide layer 105, a first very low dielectric adhesive layer 103, a first polyimide layer 105 and a second copper foil layer 102 in sequence from top to bottom.
In this embodiment, the preparation method of the double-sided copper foil substrate is performed according to the following steps:
coating polyimide on one surface of the first copper foil layer, and drying, curing and pressing to generate a second insulating polymer layer;
coating the extremely low dielectric adhesive on the other surface of the first insulating polymer layer, and drying and pressing to obtain the first extremely low dielectric adhesive layer;
Step three, polyimide is coated on one surface of the second copper foil layer, and is dried, cured and pressed to generate another second insulating polymer layer;
Step four, pressing the surface of the first extremely low dielectric adhesive layer prepared in the step two on the outer surface of the second insulating polymer layer prepared in the step three;
and fifthly, winding and curing to obtain a finished product.
The FPC comprises an FRCC 200 and the double-sided copper foil substrate 100, the FRCC and the double-sided copper foil substrate are pressed together, the FRCC comprises a third copper foil layer 201, a second low dielectric adhesive layer 202 and a third insulating polymer layer positioned between the FRCC and the FRCC, one surface of the third copper foil layer, which is contacted with the third insulating polymer layer, is an inner surface, and the Rz value of the inner surface of the third copper foil layer is 0.1-1.0 mu m.
Embodiment 5: an FPC is formed by defining FRCC to be pressed on the upper side of the double-sided copper foil substrate, as shown in figure 5, the FRCC is formed by sequentially from top to bottom: a third copper foil layer 201, a third insulating polymer layer and a second low dielectric glue layer 202, wherein the third insulating polymer layer is a second LCP polymer layer or a second fluorine-based polymer layer 203; the double-sided copper foil substrate comprises a first copper foil layer 101, a first insulating polymer layer 104, a first very low dielectric adhesive layer 103, a first insulating polymer layer 104 and a second copper foil layer 102 from top to bottom.
In this embodiment, the preparation method of the FPC includes pre-pressing, pressing and curing the FRCC and the double-sided copper foil substrate, wherein the pre-pressing time is 10-30s, the molding time is 120-180s, the molding pressure is 90-110kgf/cm 2, the pressing temperature is 185+ -10 ℃, the curing temperature is 165-175 ℃, and the curing time is 50-70min.
Preferably, the molding pressure is 100kgf/cm 2, the curing temperature is 170℃and the curing time is 60 minutes.
Wherein, in the preparation method of the FRCC, the pre-pressing time is 10-20s, the molding time is 60-120s, the molding pressure is 90-110kgf/cm 2, the pressing temperature is 185+ -10 ℃, the curing temperature is 165-175 ℃, and the curing time is 50-70min.
Preferably, the molding pressure is 100kgf/cm 2, the curing temperature is 170℃and the curing time is 60 minutes.
Embodiment 6: an FPC, as shown in fig. 6, has a structure similar to that of embodiment 5, except that: the FRCC is sequentially from top to bottom: a third copper foil layer 201, a third insulating polymer layer and a second low dielectric glue layer 202, wherein the third insulating polymer layer is a second LCP polymer layer or a second fluorine-based polymer layer 203; the double-sided copper foil substrate comprises a first copper foil layer 101, a first insulating polymer layer 104, a first very low dielectric adhesive layer 103, a first polyimide layer 105 and a second copper foil layer 102 from top to bottom.
Embodiment 7: an FPC, as shown in fig. 7, has a structure similar to that of embodiment 5, except that: the FRCC is sequentially from top to bottom: a third copper foil layer 201, a third insulating polymer layer and a second low dielectric glue layer 202, wherein the third insulating polymer layer is a second LCP polymer layer or a second fluorine-based polymer layer 203; the double-sided copper foil substrate comprises a first copper foil layer 101, a first insulating polymer layer 104, a first very low dielectric adhesive layer 103 and a second copper foil layer 102 from top to bottom.
Embodiment 8: an FPC, as shown in fig. 8, has a structure similar to that of embodiment 5, except that: the FRCC is sequentially from top to bottom: a third copper foil 201, a third insulating polymer layer and a second low dielectric glue layer 202, wherein the third insulating polymer layer is a second polyimide layer 204; the double-sided copper foil substrate comprises a first copper foil layer 101, a first insulating polymer layer 104, a first very low dielectric adhesive layer 103, a first insulating polymer layer 104 and a second copper foil layer 102 from top to bottom.
Embodiment 9: an FPC, as shown in fig. 9, has a structure similar to that of embodiment 5, except that: the FRCC is sequentially from top to bottom: a third copper foil 201, a third insulating polymer layer and a second low dielectric glue layer 202, wherein the third insulating polymer layer is a second polyimide layer 204; the double-sided copper foil substrate comprises a first copper foil layer 101, a first insulating polymer layer 104, a first very low dielectric adhesive layer 103, a first polyimide layer 105 and a second copper foil layer 102 from top to bottom.
Embodiment 10: an FPC, as shown in fig. 10, has a structure similar to that of embodiment 5, except that: the FRCC is sequentially from top to bottom: a third copper foil 201, a third insulating polymer layer and a second low dielectric glue layer 202, wherein the third insulating polymer layer is a second polyimide layer 204; the double-sided copper foil substrate comprises a first copper foil layer 101, a first insulating polymer layer 104, a first very low dielectric adhesive layer 103 and a second copper foil layer 102 from top to bottom.
Embodiment 11: an FPC, as shown in fig. 10, has a structure similar to that of embodiment 5, except that: the FRCC is sequentially from top to bottom: a third copper foil layer 201, a third insulating polymer layer and a second low dielectric glue layer 202, wherein the third insulating polymer layer is a second LCP polymer layer or a second fluorine-based polymer layer 203; the double-sided copper foil substrate comprises a first copper foil layer 101, a first polyimide layer 105, a first very low dielectric adhesive layer 103, a first polyimide layer 105 and a second copper foil layer 102 from top to bottom.
Embodiment 12: an FPC, as shown in fig. 10, has a structure similar to that of embodiment 5, except that: the FRCC is sequentially from top to bottom: a third copper foil 201, a third insulating polymer layer and a second low dielectric glue layer 202, wherein the third insulating polymer layer is a second polyimide layer 204; the double-sided copper foil substrate comprises a first copper foil layer 101, a first polyimide layer 105, a first very low dielectric adhesive layer 103, a first polyimide layer 105 and a second copper foil layer 102 from top to bottom.
The following are specific examples of embodiment modes 1 to 4 of the present invention, and are shown in tables 1 and 2.
Table 1:
Specific examples of embodiments 1 to 4 of the present invention are compared with the basic properties of the LCP sheets of the prior art, as reported in table 2 below.
Table 2:
Note that: 1. examples 1 to 4 are examples of embodiment 1; examples 5 and 6 are examples of embodiment 2; examples 9 and 10 are examples of embodiment 3; examples 7 and 8 are examples of embodiment 4.
2. The test methods of the performance indexes of tables 1 and 2 were performed on the test guidelines for soft board assembly (TPCA-F-002).
As can be seen from Table 2, the double-sided copper foil substrate of the present invention has excellent properties, and therefore, the LCP or fluorine-based polymer high-frequency high-transmission double-sided copper foil substrate has excellent high-speed transmission, low thermal expansion coefficient, stable dk/df performance under high temperature and humidity environment, ultra-low water absorption, good UV laser drilling capability, low resilience suitable for high-density assembly, and excellent mechanical properties.
The invention is superior to LCP film and common PI Bond Sheet, and is suitable for wearable devices such as 5G smart phones, APPLE WATCH (smart watch) and the like.
The FPC of embodiment 5 to embodiment 12 includes first, second and third copper foil layers, namely, the FPC having three copper foil layers, has a reasonable structure, and the FPC of the present invention is formed by laminating an FRCC and a double-sided copper foil substrate, the laminated FPC has three copper foil layers, wherein the third copper foil layer and the second copper foil layer are outer copper foil layers, high temperature (about 260 °) soldering is required and components are mounted, so that the requirements on peel strength of the third copper foil layer and the second copper foil layer are higher (> 0.7 kgf/cm), the first copper foil layer is an inner copper foil layer located in the middle, also referred to as a signal line copper foil layer, and is mainly used for conducting circuits, no SMT or other high temperature processes are required, so that the peel strength requirements on the first copper foil layer and the second copper foil layer are lower, and only >0.5kgf/cm are required, in the conventional concept, the larger the bonding strength of the copper foil layer in the FPC and other layers is in a certain range, the better (at least >0.7 kgf/cm), the less prone to delamination and falling, the larger the bonding strength generally needs to be, the larger the Rz value of the copper foil layer, in addition, the smaller the Rz value of the copper foil layer is required to be, the better the smaller the Rz value of the copper foil layer is required to realize high-frequency high-transmission, so that the contradiction exists between the larger bonding strength and the high-frequency high-transmission.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures made by the description of the invention and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the scope of the invention.
Claims (7)
1. An FPC having an LCP or fluorine-based polymer high-frequency high-transmission double-sided copper foil substrate, characterized in that: the LCP or fluorine-based polymer high-frequency high-transmission double-sided copper foil substrate (100) comprises a first copper foil layer (101), a second copper foil layer (102), a first extremely low dielectric adhesive layer (103) and at least one insulating polymer layer, wherein the first and second copper foil layers are arranged between the first copper foil layer and the second copper foil layer, one surface, close to the insulating polymer layer, is an inner surface, the Rz value of the inner surface of the first copper foil layer is 0.1-1.0 mu m, and the Rz value of the inner surface of the second copper foil layer is 0.1-1.0 mu m;
Each of the insulating polymer layers comprises at least one of a first insulating polymer layer (104) and a second insulating polymer layer (105), and the at least one insulating polymer layer is a first insulating polymer layer, the first insulating polymer layer is at least one of a first LCP polymer layer or a first fluoropolymer layer, and the second insulating polymer layer is a first polyimide layer;
The first extremely low dielectric adhesive layer is an adhesive layer with a Dk value of 2.0-3.50 and a Df value of 0.002-0.010;
The first polyimide layer is an insulating polymer layer with Dk value of 2.20-3.50 and Df value of 0.002-0.010;
the total thickness of the double-sided copper foil substrate is 9-220 mu m; wherein the thickness of the first copper foil layer and the second copper foil layer is 1-35 mu m; the thickness of the first extremely low dielectric adhesive layer is 2-50 mu m; the thickness of each insulating polymer layer is 5-50 mu m;
the double-sided copper foil substrate is one of the following three structures:
the first double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first very low dielectric adhesive layer, a first insulating polymer layer and a second copper foil layer from top to bottom;
the second type of double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first very low dielectric adhesive layer, a second insulating polymer layer and a second copper foil layer from top to bottom;
the third type of double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer and a second copper foil layer from top to bottom;
the total thickness of the first copper foil layer, the first insulating polymer layer, the first extremely low dielectric adhesive layer and the second copper foil layer is 9-170 mu m;
The FPC comprises an FRCC (200) and the double-sided copper foil substrate (100), the FRCC and the double-sided copper foil substrate are pressed together, the FRCC comprises a third copper foil layer (201), a second low dielectric adhesive layer (202) and a third insulating polymer layer positioned between the FRCC and the second low dielectric adhesive layer, one surface, which is contacted with the third insulating polymer layer, of the third copper foil layer is an inner surface, and the Rz value of the inner surface of the third copper foil layer is 0.1-1.0 mu m;
The preparation method of the FPC comprises the following steps: pre-pressing, pressing and curing the FRCC and the double-sided copper foil substrate, wherein the pre-pressing time is 10-30s, the molding time is 120-180s, the molding pressure is 90-110kgf/cm 2, the pressing temperature is 185+/-10 ℃, the curing temperature is 165-175 ℃, and the curing time is 50-70min.
2. The FPC having an LCP or fluorine-based polymer high frequency high transmission double sided copper foil substrate according to claim 1, wherein: the fluorine-based polymer in the first fluorine-based polymer layer is at least one selected from polytetrafluoroethylene, polyvinylidene fluoride, a copolymer of vinyl fluoride and vinyl ether, a copolymer of tetrafluoroethylene and ethylene, a copolymer of chlorotrifluoroethylene and ethylene, a copolymer of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride, a copolymer of tetrafluoroethylene-perfluoroalkyl vinyl ether, chlorotrifluoroethylene, polyvinyl chloride, a copolymer of tetrafluoroethylene-hexafluoropropylene, a copolymer of ethylene-vinyl fluoride, and a copolymer of tetrafluoroethylene-hexafluoropropylene-trifluoroethylene.
3. The FPC having an LCP or fluorine-based polymer high frequency high transmission double sided copper foil substrate according to claim 1, wherein: the overall water absorption rate of the stacked structure formed by the first copper foil layer, the second copper foil layer, the first extremely low dielectric adhesive layer and the insulating polymer layer is 0.01-1.50%.
4. The FPC having an LCP or fluorine-based polymer high frequency high transmission double sided copper foil substrate according to claim 1, wherein: the adhesive strength between the first very low dielectric adhesive layer and the second copper foil layer, between the first very low dielectric adhesive layer and the insulating polymer layer, between the insulating polymer layer and the first copper foil layer, and between the insulating polymer layer and the second copper foil layer is >0.7kgf/cm.
5. The FPC having an LCP or fluorine-based polymer high frequency high transmission double sided copper foil substrate according to claim 1, wherein: the resin material of the first extremely low dielectric glue layer is at least one of fluorine resin, epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin and polyimide resin.
6. The FPC having an LCP or fluorine-based polymer high frequency high transmission double sided copper foil substrate according to claim 1, wherein: the first very low dielectric glue layer is a thermosetting polyimide layer containing polyimide, and the content of the polyimide is 40-95% of the total solid content of the first very low dielectric glue layer.
7. The FPC having an LCP or fluorine-based polymer high frequency high transmission double sided copper foil substrate according to claim 1, wherein: the FPC is one of the following six structures, and FRCC is defined to be pressed on the upper side of the double-sided copper foil substrate:
The first kind of FRCC from the top down is: a third copper foil layer, a third insulating polymer layer and a second low dielectric glue layer, the third insulating polymer layer being a second LCP polymer layer or a second fluoropolymer layer (203); the double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer, a first insulating polymer layer and a second copper foil layer from top to bottom;
The second type of FRCC is from top to bottom: the second copper foil layer, the second insulating polymer layer and the second low dielectric adhesive layer, wherein the second insulating polymer layer is a second LCP polymer layer or a second fluorine-based polymer layer; the double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer, a first polyimide layer and a second copper foil layer from top to bottom;
The third kind of FRCC is from top to bottom: the second copper foil layer, the second insulating polymer layer and the second low dielectric adhesive layer, wherein the second insulating polymer layer is a second LCP polymer layer or a second fluorine-based polymer layer; the double-sided copper foil substrate is sequentially provided with a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer and a second copper foil layer from top to bottom;
Fourth, FRCC from the top down is in proper order: a third copper foil layer, a third insulating polymer layer and a second low dielectric glue layer, the third insulating polymer layer being a second polyimide layer (204); the double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer, a first insulating polymer layer and a second copper foil layer from top to bottom;
Fifth, FRCC from top to bottom is in proper order: the second insulating polymer layer is a second polyimide layer; the double-sided copper foil substrate sequentially comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer, a first polyimide layer and a second copper foil layer from top to bottom;
The sixth kind of FRCC from top to bottom is: the second insulating polymer layer is a second polyimide layer; the double-sided copper foil substrate comprises a first copper foil layer, a first insulating polymer layer, a first extremely low dielectric adhesive layer and a second copper foil layer from top to bottom in sequence.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810013815.1A CN108045022B (en) | 2018-01-08 | LCP (liquid crystal display) or fluorine polymer high-frequency high-transmission double-sided copper foil substrate and FPC (flexible printed circuit) | |
| TW107127094A TWI722309B (en) | 2018-01-08 | 2018-08-03 | High-frequency high-transmission double-sided copper foil substrate, composite material for flexible printed circuit board and production method thereof |
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|---|---|---|---|
| CN201810013815.1A CN108045022B (en) | 2018-01-08 | LCP (liquid crystal display) or fluorine polymer high-frequency high-transmission double-sided copper foil substrate and FPC (flexible printed circuit) |
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| CN108045022A CN108045022A (en) | 2018-05-18 |
| CN108045022B true CN108045022B (en) | 2024-04-19 |
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