CN207772540U - LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and FPC - Google Patents
LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and FPC Download PDFInfo
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- CN207772540U CN207772540U CN201820021774.6U CN201820021774U CN207772540U CN 207772540 U CN207772540 U CN 207772540U CN 201820021774 U CN201820021774 U CN 201820021774U CN 207772540 U CN207772540 U CN 207772540U
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Abstract
The utility model discloses a kind of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminates, including the first and second copper foil layer and the positioned there between first extremely low dielectric glue-line and at least one layer of dielectric polymers, the Rz values of the inner surface of the first and second copper foil layers are 0.1 1.0 μm；Dielectric polymers are at least one of the first LCP polymeric layers or the first fluorine system polymer layer；First extremely low dielectric glue-line refers to that Dk values are 2.0 3.5, and Df values are 0.002 0.010 glue-line；First polyimide layer refers to the dielectric polymers of Dk values 2.20 3.50 and Df values 0.002 0.010.The Double-sided copper clad laminate and FPC of the utility model are not only electrically good, and have shorter advantage, processing procedure process, low thermal coefficient of expansion, the dk/df performances stablized under high temperature humidity environment, ultralow water absorption rate, good UV Laser drills ability, the suitable High Density Packaging of low bounce-back power and splendid mechanical performance with cost.
Description
Technical field
The utility model is related to FPC (flexible circuit board) technical field, more particularly to a kind of Double-sided copper clad laminates.
Background technology
With developing by leaps and bounds for information technology, to meet, signal transmission high-frequency high-speed, heat dissipation heat conduction is rapid and gives birth to
Minimization of cost is produced, various forms of mixed pressure structure multiple sliding covers and application are in the ascendant.Printed circuit board is electronic product
In indispensable material, and with consumer electrical product demand growth, the demand for printed circuit board is also all with day
Increase.Due to flexible printed wiring board (FPC, Flexible Printed Circuit) have flexibility and can three-dimensional space match
The characteristics such as line are extensive at present in the case where technicalization electronic product emphasizes light and short, flexibility, high-frequency development trend
Appliance computer and its peripheral equipment, communication product and consumer electrical product etc..
In high frequency field, radio infrastructure needs to provide sufficiently low Insertion Loss, can just effectively improve energy utilization rate.With
5G communications, millimeter wave, acceleration high-frequency high-speed FPC/PCB (printed circuit board) the demand business arriving of space flight military project, with big number
Risen according to emerging industries such as, Internet of Things and mobile internet terminal it is universal, rapidly process, transmit information, become communication and go
Industry emphasis.In communication field, the following 5G networks ratio 4G possesses the more bandwidth of high speed, more dense micro-base station construction, and network speed is more
Soon.Internet of Things and high in the clouds operation and the demand of new wideband communication every from generation to generation, Developing High-speed server and more high transmission speed
Mobile phone have become the trend in market.In general, FPC/PCB is main bottleneck in entire transmission process, if shortcoming is good
Design and electrically good associated materials, by significant delays transmission speed or signal is caused to lose.This just carries circuit board material
Very high requirement is gone out.In addition, mainly used high frequency plank is mainly LCP (liquid crystal polymer) plate, PTFE to current industry
(polytetrafluoroethylene (PTFE)) fiberboard, however also limited by process technique, the requirement to manufacturing equipment is high and needs in higher temperatures
Environment (>280 DEG C) under can just operate, also result in its membrane thickness unevenness therewith, film thickness unevenness can cause the impedance of circuit board
Value control is not easy, and high-temperature laminating processing procedure, and LCP or PTFE can be caused, which to squeeze, influences copper-plated conduction, forms open circuit, Jin Erzao
Bad at reliability, reliability declines；In addition, fast press apparatus cannot be used by being encountered by again, lead to processing difficulties；In addition exist
SMT (surface mount) high temperature process or other FPC processing procedures, such as when bending, strong acid and strong base liquid processing procedure, Bonding strength is insufficient,
Yield is caused to decline.Although and other resinae films are without the above problem, and it is bad etc. to face electrical bad or mechanical strength
The problems such as.
Utility model content
Signal integrity is most important when being transmitted for high-frequency high-speed, and the factor of influence is mainly copper foil layer and insulation polymerization
Nitride layer base material, Double-sided copper clad laminate are mainly made of multilayer insulation polymeric layer and copper foil layer as the raw material of FPC/PCB plates.
The performance of Double-sided copper clad laminate is largely dependent on selection and copper foil surface roughness and the crystalline substance of lower dk/df resin layers
The selection of grillages row.
In order to solve the above-mentioned technical problem, the utility model provides a kind of LCP or fluorine system polymer high frequency high-transmission is double
The Double-sided copper clad laminate of face copper clad laminate, the utility model is not only electrically good, and has the copper foil layer of low roughness, structure
Composition is simple, cost has shorter advantage, processing procedure process, low thermal coefficient of expansion, the dk/df stablized under high temperature humidity environment
Energy, ultralow water absorption rate, good UV Laser drills ability, low bounce-back power are suitble to High Density Packaging and splendid mechanical performance.
In order to solve the above technical problems, the technical solution that the utility model uses is：The utility model provides one
Kind of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate, including the first copper foil layer, the second copper foil layer and positioned at described
The first extremely low dielectric glue-line between first copper foil layer and second copper foil layer and at least one layer of dielectric polymers, described the
One copper foil layer and second copper foil layer be all proximate to dielectric polymers one side be inner surface, first copper foil layer it is interior
The Rz values on surface are 0.1-1.0 μm, and the Rz values of the inner surface of second copper foil layer are 0.1-1.0 μm；
Each dielectric polymers all include in the first dielectric polymers and the second dielectric polymers at least
One kind, and an at least dielectric polymers are the first dielectric polymers, first dielectric polymers polymerize for the first LCP
At least one of nitride layer or the first fluorine system polymer layer, second dielectric polymers are the first polyimide layer；
The first extremely low dielectric glue-line refers to that Dk values are 2.0-3.50, and Df values are the glue-line of 0.002-0.010；
First polyimide layer refers to the dielectric polymers of Dk values 2.20-3.50 and Df values 0.002-0.010；
The overall thickness of the Double-sided copper clad laminate is 9-220 μm；Wherein, first copper foil layer and second copper foil layer
Thickness be 1-35 μm；The thickness of the first extremely low dielectric glue-line is 2-50 μm；The thickness of each dielectric polymers
Degree is 5-50 μm.
It further says, the fluorine system polymer in the first fluorine system polymer layer is selected from polytetrafluoroethylene (PTFE), polyvinylidene fluoride
Alkene, vinyl fluoride and vinyl ether co-polymer, the copolymer of tetrafluoroethene and ethylene, polytrifluorochloroethylene and ethylene copolymer, four
Vinyl fluoride, hexafluoropropene and vinylidene fluoride copolymers, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, polytrifluorochloroethylene,
Polyvinyl chloride, tetrafluoroethene-hexafluoropropylene copolymer, ethylene-fluoride copolymers and hexafluoropropylene (HFP)/tetrafluoroethylene (TFE)-trifluoro second
At least one of alkene copolymer.
It further says, the first extremely low dielectric glue-line is the thermoset polyimide layer containing polyimides.
It further says, the Double-sided copper clad laminate is one kind in following three structure：
The first, the Double-sided copper clad laminate is from top to bottom successively by the first copper foil layer, the first dielectric polymers, first
Extremely low dielectric glue-line, the first dielectric polymers and the second copper foil layer composition；
Second, the Double-sided copper clad laminate is from top to bottom successively by the first copper foil layer, the first dielectric polymers, first
Extremely low dielectric glue-line, the second dielectric polymers and the second copper foil layer composition；
The third, the Double-sided copper clad laminate is from top to bottom successively by the first copper foil layer, the first dielectric polymers, first
Extremely low dielectric glue-line and the second copper foil layer composition；
The overall thickness of first copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line and the second copper foil layer
It is 9-170 μm.
The utility model additionally provides a kind of with the LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate
FPC, the FPC includes FRCC and the Double-sided copper clad laminate, and the FRCC is mutually pressed with the Double-sided copper clad laminate, described
FRCC includes third copper foil layer, the second extremely low dielectric glue-line and third dielectric polymers positioned there between, and described
The one side that three copper foil layers are contacted with the third dielectric polymers is inner surface, the Rz values of the inner surface of the third copper foil layer
It is 0.1-1.0 μm.
It further says, one kind during the FPC is following six in structure defines FRCC and is pressed on the two-sided copper foil base
The top of plate：
The first, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and second extremely low Jie
Electric glue-line, the third dielectric polymers are the 2nd LCP polymeric layers or the second fluorine system polymer layer；The two-sided copper foil base
Plate is followed successively by the first copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line, the first dielectric polymers from top to bottom
With the second copper foil layer；
Second, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and second extremely low Jie
Electric glue-line, the third dielectric polymers are the 2nd LCP polymeric layers or the second fluorine system polymer layer；The two-sided copper foil base
Plate be followed successively by from top to bottom the first copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line, the first polyimide layer and
Second copper foil layer；
The third, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and second extremely low Jie
Electric glue-line, the third dielectric polymers are the 2nd LCP polymeric layers or the second fluorine system polymer layer；The two-sided copper foil base
Plate is followed successively by the first copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line and the second copper foil layer from top to bottom；
4th kind, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and second extremely low Jie
Electric glue-line, the third dielectric polymers are the second polyimide layer；The Double-sided copper clad laminate is followed successively by from top to bottom
One copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line, the first dielectric polymers and the second copper foil layer；
5th kind, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and second extremely low Jie
Electric glue-line, the third dielectric polymers are the second polyimide layer；The Double-sided copper clad laminate is followed successively by from top to bottom
One copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line, the first polyimide layer and the second copper foil layer；
6th kind, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and second extremely low Jie
Electric glue-line, the third dielectric polymers are the second polyimide layer；The Double-sided copper clad laminate is followed successively by from top to bottom
One copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line and the second copper foil layer.
The utility model has the beneficial effects that：
One, the double-side copper foil baseplate structure of the utility model is reasonable, can reduce FPC factories processing procedure process, not only electrically good,
And with low roughness copper foil, low thermal coefficient of expansion, the dk/df performances stablized under high temperature humidity environment, ultralow water absorption rate
And splendid mechanical performance, good flexibility, soldering resistance are high, Bonding strength is good, operational good, and can low temperature into
Row presses, and can use fast pressure equipment, and FPC can be made to have splendid flatness after pressing, and radium-shine suitable for UV is less than 100
The small-bore processing of micron, uniform film thickness when pressing, impedance control is good, is suitable for 5G smartphones, Applewatch etc.
Wearable device；
Two, the FPC of the utility model includes the first, second, and third copper foil layer, as the FPC with three layers of copper foil layer,
It is reasonable for structure, and the FPC of the utility model is pressed by FRCC and Double-sided copper clad laminate, the FPC after pressing has three layers of copper
Layers of foil, wherein third copper foil layer and the second copper foil layer are the copper foil layer in outside, need high temperature (260 ° or so) soldering and carry member
Device, thus to the two peel strength it is more demanding (>0.7kgf/cm), and the first copper foil layer be positioned at intermediate internal layer copper foil layer,
Also referred to as signal line copper foil layer is mainly used for that circuit is connected, and needs not move through SMT or other high temperature process and carries component, therefore right
The requirement of the peel strength of first copper foil layer and the second extremely low dielectric glue-line is relatively low, only needs>0.5kgf/cm, traditional idea
In think that copper foil layer in FPC and other layers of Bonding strength are the bigger the better (at least in a certain range always>0.7kgf/cm),
It is less susceptible to layering to fall off, the Rz values that big Bonding strength generally requires copper foil layer are larger, separately due to the signal transmission of copper foil layer
There is kelvin effect in the process, to realize high frequency high-transmission, then need the Rz values of copper foil layer the smaller the better, therefore big Bonding strength
There are contradictions between high frequency high-transmission, and the FPC of the utility model is high since the first copper foil layer needs not move through SMT or other
Warm processing procedure carries component, therefore relatively low to the requirement of the peel strength of the first copper foil layer and the second extremely low dielectric glue-line, only needs>
0.5kgf/cm, therefore the first copper foil layer can select that Rz values are lower, electrically more preferable, the lower copper foil layer of insertion loss, and
The high frequency high-transmission of FPC is not influenced；
Three, the dielectric polymers of the Double-sided copper clad laminate of the utility model include that the first dielectric polymers and second are exhausted
At least one of edge polymeric layer, and the first dielectric polymers are the first LCP polymeric layers or the first fluorine system polymer layer
At least one of, it is relatively low by the dielectric constant and dielectric loss of LCP polymeric layers or fluorine system polymer layer so that this reality
Not only have outstanding heat resistance, peel strength and anti-flammability, its dielectric of more outstanding behaviours normal with novel Double-sided copper clad laminate
The dielectric constant of the flexibility coat copper plate of number than in the prior art is low, is suitable for making the flexible printing electricity of high-frequency high-speed application field
Road plate；And fluorine system polymer layer has ultralow hygroscopicity, performance is stablized after water suction, has preferable electric property, can drop significantly
The plate bursting risk of low multi-layer board and Rigid Flex reduces signal and transmits insertion loss；
Four, the Rz values of the FPC of the utility model is used third copper foil layer, the first copper foil layer and the second copper foil layer compared with
It is low, there is kelvin effect in signals transmission, since copper foil surface roughness is relatively low, crystallization is fine and smooth, and surface is preferable,
Thus signal can realize high-speed transfer, while extremely low dielectric glue-line has Dk/Df performances that are relatively low and stablizing, can reduce signal biography
Loss during defeated, further increases signal transmission quality, and it is rapid to be entirely capable of competent FPC high-frequency high-speeds, heat dissipation heat conduction
And the needs of cost minimization development；
Five, the first extremely low dielectric glue-line in the utility model refers to that Dk values are 2.0-3.5, and Df values are 0.002-
0.010 glue-line, lower and stable under high temperature humidity environment Dk/Df values so that FRCC and Double-sided copper clad laminate are suitable
The FPC that the utility model is made in low temperature (being less than 180 DEG C) quick pressing is closed, technique processability is strong, and to making apparatus requirement
It is low, and then production cost is reduced, equipment operation and processability are superior to existing LCP substrates and PTFE fiber plate；More preferably
, due to being suitble to low temperature pressing, greatly reduce the risk that circuit aoxidizes during preparing FPC；
Six, the first of the utility model the extremely low dielectric glue-line can be the thermoset polyimide layer containing polyimides, adopt
With the structure of thermoset polyimide layer collocation dielectric polymers, the Double-sided copper clad laminate of the utility model is compared to traditional
Epoxy resin product, be more suitable for downstream industry small-bore (<100 μm) the radium-shine processing of UV, it is not easy to cause through-hole (PTH,
Plating Through Hole) or hole inside contract, uniform film thickness when pressing, impedance control is good, be not only suitable for singly using compared with
The processing method of the machine drilling of large aperture, Technological adaptability are stronger；
Seven, the Double-sided copper clad laminate in the utility model has lower bounce, only LCP compared with common LCP plates
The half or so of plate bounce is suitble to downstream High Density Packaging processing procedure；
Eight, the Double-sided copper clad laminate of the utility model can have the first polyimide layer, the utility model to have ultralow
Water absorption rate, after water suction performance stablize, have preferable electric property, the plate bursting of multi-layer board and Rigid Flex can be substantially reduced
Risk reduces signal and transmits insertion loss；
Nine, also with thermal expansivity, high and splendid mechanical performance of good, good flexibility, soldering resistance etc. is excellent for the utility model
Point, and the Bonding strength of extremely low dielectric glue-line is good；
Ten, current Bond Ply (adhesive sheet) products need to remove the release layer then upper copper of pressing in downstream industry use
Layers of foil, using the Double-sided copper clad laminate of this structure, structure composition is simple, can save the manufacturing procedure in downstream；Cost is relatively low
It is honest and clean.
The above description is merely an outline of the technical solution of the present invention for the utility model, in order to better understand this
The technological means of utility model, and can be implemented in accordance with the contents of the specification, below with the preferred embodiment of the utility model
And attached drawing is coordinated to be described in detail as after.
Description of the drawings
Fig. 1 is the structural schematic diagram of the embodiment 1 of the utility model；
Fig. 2 is the structural schematic diagram of the embodiment 2 of the utility model；
Fig. 3 is the structural schematic diagram of the embodiment 3 of the utility model；
Fig. 4 is the structural schematic diagram of the embodiment 4 of the utility model；
Fig. 5 is the structural schematic diagram of the embodiment 5 of the utility model；
Fig. 6 is the structural schematic diagram of the embodiment 6 of the utility model；
Fig. 7 is the structural schematic diagram of the embodiment 7 of the utility model；
Fig. 8 is the structural schematic diagram of the embodiment 8 of the utility model；
Fig. 9 is the structural schematic diagram of the embodiment 9 of the utility model；
Figure 10 is the structural schematic diagram of the embodiment 10 of the utility model；
Figure 11 is the structural schematic diagram of the embodiment 11 of the utility model；
Figure 12 is the structural schematic diagram of the embodiment 12 of the utility model；
Each section label is as follows in attached drawing：
Double-sided copper clad laminate 100, the first copper foil layer 101, the second copper foil layer 102, the first extremely low dielectric glue-line 103, first
Dielectric polymers 104, the second dielectric polymers 105, third copper foil layer 201, the second extremely low dielectric glue-line 202, the 2nd LCP
Polymeric layer or the second fluorine system polymer layer 203 and the second polyimide layer 204.
Specific implementation mode
Illustrate that specific embodiment of the present utility model, those skilled in the art can below by way of particular specific embodiment
The advantages of the utility model is understood by content disclosed in the present specification easily and effect.The utility model can also it is other not
Same mode is practiced, that is, under the scope of revealed without departing substantially from the utility model, can give different modification and change.
" first, second " in the utility model etc. is only used for distinguishing, is not intended to limit the scope of protection of the utility model.
A kind of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate, including the first copper foil layer 101, the second copper foil
Layer 102 and the first extremely low dielectric glue-line 103 and at least one between first copper foil layer and second copper foil layer
The one side that layer dielectric polymers, first copper foil layer and second copper foil layer are all proximate to dielectric polymers is interior table
The Rz values in face, the inner surface of first copper foil layer are 0.1-1.0 μm, and the Rz values of the inner surface of second copper foil layer are 0.1-
1.0μm；
Each dielectric polymers all include in the first dielectric polymers 104 and the second dielectric polymers 105
At least one, and an at least dielectric polymers be the first dielectric polymers, first dielectric polymers be first
At least one of LCP polymeric layers or the first fluorine system polymer layer, second dielectric polymers are the first polyimides
Layer；
The first extremely low dielectric glue-line refers to that Dk (dielectric constant) value is 2.0-3.5 (10GHz), and Df (dielectric losses
The factor) value be 0.002-0.010 (10GHz) glue-line；
First polyimide layer refers to Dk values 2.20-3.50 (10GHz) and Df values 0.002-0.010 (10GHz)
Dielectric polymers；
The overall thickness of the Double-sided copper clad laminate is 9-220 μm；Wherein, first copper foil layer and second copper foil layer
Thickness be 1-35 μm；The thickness of the first extremely low dielectric glue-line is 2-50 μm；The thickness of each dielectric polymers
Degree is 5-50 μm.
Fluorine system polymer in the first fluorine system polymer layer is selected from polytetrafluoroethylene (PTFE) (PTFE), Kynoar
(PVDF), copolymer (ETFE), the polytrifluorochloroethylene of vinyl fluoride and vinyl ether co-polymer (FEVE), tetrafluoroethene and ethylene
With ethylene copolymer (ECTFE), tetrafluoroethene, hexafluoropropene and vinylidene fluoride copolymers (THV), tetrafluoroethylene-perfluoro alkyl
Vinyl ether co-polymer (PFA), polytrifluorochloroethylene (PCTFF), polyvinyl chloride (PVF), tetrafluoroethene-hexafluoropropylene copolymer
(FEP), at least one in ethylene-fluoride copolymers (ETF) and hexafluoropropylene (HFP)/tetrafluoroethylene (TFE)-trifluoro-ethylene copolymer (TFB)
Kind.
The first extremely low dielectric glue-line is the thermoset polyimide layer containing polyimides.
Embodiment 1：A kind of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate, as shown in Figure 1, described double
Face copper clad laminate is from top to bottom successively by the first copper foil layer 101, the first dielectric polymers 104, the first extremely low dielectric glue-line
103, the first dielectric polymers 104 and the second copper foil layer 102 composition.
In the present embodiment, it is preferred that the thickness of first copper foil layer and second copper foil layer is 6-18 μm；It is described
The thickness of extremely low dielectric glue-line is 10-50 μm；The thickness of first dielectric polymers is 12.5-25 μm.
First copper foil layer and second copper foil layer are all rolled copper foil layer (RA/HA/HAV2) or electrodeposited copper foil layer
(ED)。
Embodiment 2：A kind of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate, as shown in Fig. 2, structure with
Embodiment 1 is similar, the difference is that：The Double-sided copper clad laminate is exhausted by the first copper foil layer 101, first successively from top to bottom
Edge polymeric layer 104, the first extremely low dielectric glue-line 103, the second dielectric polymers 105 and the second copper foil layer 102 composition.
Embodiment 3：A kind of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate, as shown in figure 3, structure with
Embodiment 1 is similar, the difference is that：The Double-sided copper clad laminate is exhausted by the first copper foil layer 101, first successively from top to bottom
Edge polymeric layer 104,103 and second copper foil layer 102 of the first extremely low dielectric glue-line composition.
The overall thickness of first copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line and the second copper foil layer
It is 9-170 μm.
Embodiment 4：A kind of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate, as shown in figure 4, structure with
Embodiment 1 is similar, the difference is that：The Double-sided copper clad laminate is gathered by the first copper foil layer 101, first successively from top to bottom
Imide layer 105, the first extremely low dielectric glue-line 103, the first polyimide layer 105 and the second copper foil layer 102 composition.
A kind of FPC with the Double-sided copper clad laminate, the FPC include FRCC 200 and the Double-sided copper clad laminate
100, the FRCC is mutually pressed with the Double-sided copper clad laminate, and the FRCC includes third copper foil layer 201, the second extremely low dielectric glue
Layer 202 and third dielectric polymers positioned there between, the third copper foil layer and the third dielectric polymers
The one side of contact is inner surface, and the Rz values of the inner surface of the third copper foil layer are 0.1-1.0 μm.
Embodiment 5：:A kind of FPC defines the top that FRCC is pressed on the Double-sided copper clad laminate, as shown in figure 5, institute
FRCC is stated to be followed successively by from top to bottom：Third copper foil layer 201, third dielectric polymers and the second extremely low dielectric glue-line 202, it is described
Third dielectric polymers are the 2nd LCP polymeric layers or the second fluorine system polymer layer 203；The Double-sided copper clad laminate on to
Under be followed successively by the first copper foil layer 101, the first dielectric polymers 104, the first extremely low dielectric glue-line 103, the first insulating polymer
Layer 104 and the second copper foil layer 102.
Embodiment 6：A kind of FPC, as shown in fig. 6, structure is similar with embodiment 5, the difference is that：The FRCC
It is followed successively by from top to bottom：Third copper foil layer 201, third dielectric polymers and the second extremely low dielectric glue-line 202, the third are exhausted
Edge polymeric layer is the 2nd LCP polymeric layers or the second fluorine system polymer layer 203；The Double-sided copper clad laminate is from top to bottom successively
For the first copper foil layer 101, the first dielectric polymers 104, the first extremely low dielectric glue-line 103, the first polyimide layer 105 and
Two copper foil layers 102.
Embodiment 7：A kind of FPC, as shown in fig. 7, structure is similar with embodiment 5, the difference is that：The FRCC
It is followed successively by from top to bottom：Third copper foil layer 201, third dielectric polymers and the second extremely low dielectric glue-line 202, the third are exhausted
Edge polymeric layer is the 2nd LCP polymeric layers or the second fluorine system polymer layer 203；The Double-sided copper clad laminate is from top to bottom successively
For the first copper foil layer 101, the first dielectric polymers 104,103 and second copper foil layer 102 of the first extremely low dielectric glue-line.
Embodiment 8：A kind of FPC, as shown in figure 8, structure is similar with embodiment 5, the difference is that：The FRCC
It is followed successively by from top to bottom：Third copper foil 201, third dielectric polymers and the second extremely low dielectric glue-line 202, the third insulation
Polymeric layer is the second polyimide layer 204；The Double-sided copper clad laminate is followed successively by the first copper foil layer 101, first from top to bottom
Dielectric polymers 104, the first extremely low dielectric glue-line 103, the first dielectric polymers 104 and the second copper foil layer 102.
Embodiment 9：A kind of FPC, as shown in figure 9, structure is similar with embodiment 5, the difference is that：The FRCC
It is followed successively by from top to bottom：Third copper foil 201, third dielectric polymers and the second extremely low dielectric glue-line 202, the third insulation
Polymeric layer is the second polyimide layer 204；The Double-sided copper clad laminate is followed successively by the first copper foil layer 101, first from top to bottom
Dielectric polymers 104, the first extremely low dielectric glue-line 103, the first polyimide layer 105 and the second copper foil layer 102.
Embodiment 10：A kind of FPC, as shown in Figure 10, structure are similar with embodiment 5, the difference is that：It is described
FRCC is followed successively by from top to bottom：Third copper foil 201, third dielectric polymers and the second extremely low dielectric glue-line 202, the third
Dielectric polymers are the second polyimide layer 204；The Double-sided copper clad laminate be followed successively by from top to bottom the first copper foil layer 101,
First dielectric polymers 104,103 and second copper foil layer 102 of the first extremely low dielectric glue-line.
Embodiment 11：A kind of FPC, as shown in Figure 10, structure are similar with embodiment 5, the difference is that：It is described
FRCC is followed successively by from top to bottom：Third copper foil layer 201, third dielectric polymers and the second extremely low dielectric glue-line 202, described
Three dielectric polymers are the 2nd LCP polymeric layers or the second fluorine system polymer layer 203；The Double-sided copper clad laminate is from top to bottom
It is followed successively by the first copper foil layer 101, the first polyimide layer 105, the first extremely low dielectric glue-line 103,105 and of the first polyimide layer
Second copper foil layer 102.
Embodiment 12：A kind of FPC, as shown in Figure 10, structure are similar with embodiment 5, the difference is that：It is described
FRCC is followed successively by from top to bottom：Third copper foil 201, third dielectric polymers and the second extremely low dielectric glue-line 202, the third
Dielectric polymers are the second polyimide layer 204；The Double-sided copper clad laminate be followed successively by from top to bottom the first copper foil layer 101,
First polyimide layer 105, the first extremely low dielectric glue-line 103, the first polyimide layer 105 and the second copper foil layer 102.
It is that the embodiment 1 of the utility model arrives the specific embodiment of embodiment 4 below, refers to Tables 1 and 2 institute
Show.
Table 1:
The embodiment 1 of the utility model carries out base to the specific embodiment of embodiment 4 and the LCP plates of the prior art
This performance compares, as the following table 2 records.
Table 2：
Note：1, embodiment 1 arrives the embodiment that embodiment 4 is embodiment 1；Embodiment 5 and 6 is the implementation of embodiment 2
Example；Embodiment 9 and the embodiment that embodiment 10 is embodiment 3；Embodiment 7 and the embodiment that embodiment 8 is embodiment 4.
2, the test method of Tables 1 and 2 performance indicator executes《Soft board assembles important item test philosophy》(TPCA-F-002).
As shown in Table 2, the Double-sided copper clad laminate of the utility model has splendid performance, therefore LCP or fluorine system polymer
High frequency high-transmission Double-sided copper clad laminate has splendid high-speed transfer, low thermal coefficient of expansion, stablizes under high temperature humidity environment
Dk/df performances, ultralow water absorption rate, good UV laser drillings ability, be suitble to the low bounce-back power of High Density Packaging and splendid
Mechanical performance.
The utility model be better than LCP films and common PI types Bond Sheet (bonding sheet), be suitable for 5G smartphones,
The wearable devices such as Apple watch (smartwatch).
The FPC of embodiment 5 to embodiment 12 includes the first, second, and third copper foil layer, as has three layers of copper foil
The FPC of layer, it is reasonable for structure, and the FPC of the utility model is pressed by FRCC and Double-sided copper clad laminate, the FPC tools after pressing
There are three layers of copper foil layer, wherein third copper foil layer and the second copper foil layer is the copper foil layer in outside, needs high temperature (260 ° or so) soldering
And carry component, therefore to the two peel strength it is more demanding (>0.7kgf/cm), and the first copper foil layer be positioned at centre in
Layer copper foil layer, also referred to as signal line copper foil layer are mainly used for that circuit is connected, and need not move through SMT or other high temperature process and carry member
Device, thus it is relatively low to the requirement of the peel strength of the first copper foil layer and the second extremely low dielectric glue-line, only need>0.5kgf/cm is passed
Think that the Bonding strength of the copper foil layer in FPC and other layers is the bigger the better (at least in a certain range in the idea of system always>
0.7kgf/cm), it is less susceptible to layering to fall off, the Rz values that big Bonding strength generally requires copper foil layer are larger, separately due to copper foil layer
Signals transmission in have kelvin effect, to realize high frequency high-transmission, then need the Rz values of copper foil layer the smaller the better, thus greatly
Bonding strength and high frequency high-transmission between there are contradictions, and the FPC of the utility model is needed not move through due to the first copper foil layer
SMT or other high temperature process carry component, therefore to the peel strength of the first copper foil layer and the second extremely low dielectric glue-line requirement compared with
It is low, only need>0.5kgf/cm, therefore the first copper foil layer can select that Rz values are lower, electrically more preferable, insertion loss is lower
Copper foil layer, and the high frequency high-transmission of FPC is not influenced.
The above description is only the embodiments of the present invention, and it does not limit the scope of the patent of the present invention, every
Equivalent structure made based on the specification and figures of the utility model is applied directly or indirectly in other relevant technologies
Field is equally included in the patent within the scope of the utility model.
Claims (6)
1. a kind of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate (100), it is characterised in that：Including the first copper foil
Layer (101), the second copper foil layer (102) and first extremely low Jie between first copper foil layer and second copper foil layer
Electric glue-line (103) and at least one layer of dielectric polymers, first copper foil layer and second copper foil layer are all proximate to insulate
The one side of polymeric layer is inner surface, and the Rz values of the inner surface of first copper foil layer are 0.1-1.0 μm, second copper foil layer
Inner surface Rz values be 0.1-1.0 μm；
Each dielectric polymers all include in the first dielectric polymers (104) and the second dielectric polymers (105)
At least one, and an at least dielectric polymers be the first dielectric polymers, first dielectric polymers be first
At least one of LCP polymeric layers or the first fluorine system polymer layer, second dielectric polymers are the first polyimides
Layer；
The first extremely low dielectric glue-line refers to that Dk values are 2.0-3.50, and Df values are the glue-line of 0.002-0.010；
First polyimide layer refers to the dielectric polymers of Dk values 2.20-3.50 and Df values 0.002-0.010；
The overall thickness of the Double-sided copper clad laminate is 9-220 μm；Wherein, the thickness of first copper foil layer and second copper foil layer
Degree is 1-35 μm；The thickness of the first extremely low dielectric glue-line is 2-50 μm；The thickness of each dielectric polymers is equal
It is 5-50 μm.
2. LCP according to claim 1 or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate, it is characterised in that：Institute
The thickness for stating the first copper foil layer and second copper foil layer is 6-18 μm；The thickness of the extremely low dielectric glue-line is 10-50 μm；
The thickness of first dielectric polymers is 12.5-25 μm.
3. LCP according to claim 1 or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate, it is characterised in that：Institute
It is the thermoset polyimide layer containing polyimides to state the first extremely low dielectric glue-line.
4. LCP according to claim 1 or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate, it is characterised in that：Institute
It is one kind in following three structure to state Double-sided copper clad laminate：
The first, the Double-sided copper clad laminate is from top to bottom successively by the first copper foil layer, the first dielectric polymers, first extremely low
Dielectric glue-line, the first dielectric polymers and the second copper foil layer composition；
Second, the Double-sided copper clad laminate is from top to bottom successively by the first copper foil layer, the first dielectric polymers, first extremely low
Dielectric glue-line, the second dielectric polymers and the second copper foil layer composition；
The third, the Double-sided copper clad laminate is from top to bottom successively by the first copper foil layer, the first dielectric polymers, first extremely low
Dielectric glue-line and the second copper foil layer composition；
First copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line and the second copper foil layer overall thickness be 9-
170μm。
5. a kind of FPC of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate with described in claim 4, special
Sign is：The FPC includes FRCC (200) and the Double-sided copper clad laminate (100), the FRCC and the Double-sided copper clad laminate
It mutually presses, the FRCC includes third copper foil layer (201), the second extremely low dielectric glue-line (202) and positioned there between the
Three dielectric polymers, the one side that the third copper foil layer is contacted with the third dielectric polymers are inner surface, described the
The Rz values of the inner surface of three copper foil layers are 0.1-1.0 μm.
6. a kind of FPC of LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate with described in claim 5, special
Sign is：One kind during the FPC is following six in structure defining the top that FRCC is pressed on the Double-sided copper clad laminate：
The first, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and the second extremely low dielectric glue
Layer, the third dielectric polymers are the 2nd LCP polymeric layers or the second fluorine system polymer layer (203)；The two-sided copper foil
Substrate is followed successively by the first copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line, the first insulating polymer from top to bottom
Layer and the second copper foil layer；
Second, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and the second extremely low dielectric glue
Layer, the third dielectric polymers are the 2nd LCP polymeric layers or the second fluorine system polymer layer；The Double-sided copper clad laminate from
Top to bottm is followed successively by the first copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line, the first polyimide layer and second
Copper foil layer；
The third, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and the second extremely low dielectric glue
Layer, the third dielectric polymers are the 2nd LCP polymeric layers or the second fluorine system polymer layer；The Double-sided copper clad laminate from
Top to bottm is followed successively by the first copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line and the second copper foil layer；
4th kind, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and the second extremely low dielectric glue
Layer, the third dielectric polymers are the second polyimide layer (204)；The Double-sided copper clad laminate is followed successively by from top to bottom
One copper foil layer, the first dielectric polymers, the first extremely low dielectric glue-line, the first dielectric polymers and the second copper foil layer；
5th kind, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and the second extremely low dielectric glue
Layer, the third dielectric polymers are the second polyimide layer；The Double-sided copper clad laminate is followed successively by the first bronze medal from top to bottom
Layers of foil, the first dielectric polymers, the first extremely low dielectric glue-line, the first polyimide layer and the second copper foil layer；
6th kind, the FRCC is followed successively by from top to bottom：Third copper foil layer, third dielectric polymers and the second extremely low dielectric glue
Layer, the third dielectric polymers are the second polyimide layer；The Double-sided copper clad laminate is followed successively by the first bronze medal from top to bottom
Layers of foil, the first dielectric polymers, the first extremely low dielectric glue-line and the second copper foil layer.
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| CN201820021774.6U CN207772540U (en) | 2018-01-08 | 2018-01-08 | LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and FPC |
| TW107127094A TWI722309B (en) | 2018-01-08 | 2018-08-03 | High-frequency high-transmission double-sided copper foil substrate, composite material for flexible printed circuit board and production method thereof |
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|---|---|---|---|
| CN201820021774.6U CN207772540U (en) | 2018-01-08 | 2018-01-08 | LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and FPC |
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| CN207772540U true CN207772540U (en) | 2018-08-28 |
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| CN108045022A (en) * | 2018-01-08 | 2018-05-18 | 昆山雅森电子材料科技有限公司 | LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and FPC |
| CN112153806A (en) * | 2019-06-28 | 2020-12-29 | 连展科技（深圳）有限公司 | Flexible circuit board |
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| CN108045022A (en) * | 2018-01-08 | 2018-05-18 | 昆山雅森电子材料科技有限公司 | LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and FPC |
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| CN112153806A (en) * | 2019-06-28 | 2020-12-29 | 连展科技（深圳）有限公司 | Flexible circuit board |
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