CN204674123U - The copper-clad plate of a kind of two-layered medium non-gel flexible - Google Patents
The copper-clad plate of a kind of two-layered medium non-gel flexible Download PDFInfo
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- CN204674123U CN204674123U CN201520330948.3U CN201520330948U CN204674123U CN 204674123 U CN204674123 U CN 204674123U CN 201520330948 U CN201520330948 U CN 201520330948U CN 204674123 U CN204674123 U CN 204674123U
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Abstract
The utility model discloses the copper-clad plate of a kind of two-layered medium non-gel flexible, be made up of the first Copper Foil be arranged in parallel, the second Copper Foil and the insulating barrier between the first Copper Foil and the second Copper Foil, described insulating barrier comprises thermoplastic polyimide layer and polyimide structures film.It is little that the utility model has thickness compared with the copper-clad plate of prior art, and preparation technology is simple, and processing cost is low, dimensional stability and the good advantage of heat-resisting quantity.
Description
Technical field
The utility model relates to a kind of double side flexible copper coated board, particularly relates to one and has the copper-clad plate of two-layered medium non-gel flexible.
Background technology
Flexibility coat copper plate (Flexible Copper Clad Laminate, abbreviation FCCL) refer at insulating substrate (Kapton, polyester film or poly-naphthalene ester film etc.) on can the laminar composite of alternating bending coated with a kind of of Copper Foil, the flexible print wiring board (FPCB) made with it, electronic equipment can be met light, thin, short, littleization requirement, main application is as follows: computer peripheral and display, aircraft instrument, navigation positional device, oil exploration equipment, track instrument sought by guided missile, artificial satellite, space shuttle and space ship, police radio walkie talkie, field camera and digital camera, medical electronics product, wiring board bus bar bus.
Conventional flex copper-clad plate, by manufacturing process and product structure classification, can be divided into three-layer process flexibility coat copper plate (3-Layer FCCL has been also called glue flexibility coat copper plate) and two-layer method flexibility coat copper plate (2-Layer FCCL is also called non-gel flexible copper-clad plate).
Three-layer process flexibility coat copper plate is made up of copper foil layer, adhesive layer (epoxy adhesive, acrylate adhesive or polyester adhesive etc.) and insulating basement membrane layer (structural membrane), and insulating basement membrane and Copper Foil are bonded together by adhesive.The adhesive of three stratotype flexibility coat copper plates directly contacts with Copper Foil, after Copper Foil etching, adhesive will be directly exposed in air, and thus the heat resistance of adhesive, heat-resistant aging, anti-flammability and chemical resistance etc. all will directly affect the performances such as the heat resistance of sheet material, heat-resistant aging, anti-flammability and chemical resistance.Therefore, three stratotype flexibility coat copper plates are very high to the performance requirement of adhesive, not only require to have high pliability, but also require to have high heat resistance, anti-flammability and chemically-resistant etc.
Two-layer method flexibility coat copper plate is made up of copper foil layer and polyimide insulative dielectric layer, because it adopts all very excellent polyimide material of mechanical property, electrical property and heat resistance in recent years achieving fast development as dielectric layer.The polyimides that can be used for FCCL production at present mainly contains crosslinked polyimide (also known as Thermocurable polyimide), linear polyimides (mainly comprising TPI) and polyimide structures film etc.Thermocurable polyimide does not melt insoluble high molecular polymer, there is good mechanical property, electrical property and heat resistance, flexibility coat copper plate can be made to have good dimensional stability, and there is high-fire resistance, but the peel strength of itself and Copper Foil is lower, be difficult to be used alone, its fragility is large, cannot meet downstream FPC processing technology to the requirement of FCCL flexibility; TPI is compared with Thermocurable polyimide, generally fusible, flexible large, and in copper-clad plate processing, can make adhesive and use, can give copper-clad plate flexibility, but its coefficient of expansion is high, the dimensional stability of copper-clad plate shrinkage factor made is excessive simultaneously; And polyimides (PI) structural membrane is while possessing the good mechanical property of thermosetting polyimides, electrical property and heat resistance, because its vitrification point is high, fusing point is higher than its decomposition temperature, heat not melting, there is good flexibility simultaneously, dimensional stability and heat-resisting quantity good, good for FCCL dimensional stability in Downstream processing.The glue-free product of existing market using polyimides as insulating medium layer mainly contains with Japanese KANEKA Co., Ltd and nippon KCC as representing Copper Foil (Cu)/TPI (TPI)/Thermocurable polyimide/TPI (TPI)/Copper Foil (Cu) structure of producer and (Cu)/thermosetting PI resin bed/thermoplasticity PI resin bed/thermosetting PI resin bed/Copper Foil (Cu) structure that is representative with Taiwan Tai Hong company (CN201114989Y), Taiwan Xin Yang company (CN 1929716A).The first structural insulation dielectric layer is TPI (TPI)/Thermocurable polyimide/TPI (TPI), the two-layer TPI in these structure both sides is disposed adjacent with Copper Foil, the coefficient of expansion of TPI is large, adopt two-layer TPI structure, layering plate bursting is easily there is, the problem of product size stability low grade during Downstream processing in process; The second structural insulation dielectric layer is Thermocurable polyimide/TPI (TPI)/Thermocurable polyimide, the thickness of its thermoset polyimide layer is generally more than 12 microns, and have double-deck solidity polyimides, thermoset polyimide layer is thicker, sheet material manufacture difficulty is larger, when Thermocurable polyimide thickness is more than 20 microns, sheet material easily produces bubble and curling in coating and imidization.Above-mentioned its structure essence of two kinds of non-gel flexible copper-clad plates is 5 Rotating fields, and thickness is large, complex process, and manufacture difficulty is large, and cost is high.
It is CN102848642A that State Intellectual Property Office discloses a kind of publication number on January 2nd, 2013, name is called the patent of invention of " two layers of method double side flexible copper coated board and preparation method thereof ", a kind of two layers of method double side flexible copper coated board of this disclosure of the invention comprise: the first Copper Foil, the second Copper Foil and the insulating barrier be located between this first, second Copper Foil, described insulating barrier comprises the first thermoset polyimide resin layer and the second thermoset polyimide resin layer.The dielectric layer of this invention is two-layer, although contrast traditional non-gel flexible copper-clad plate to decrease a Rotating fields, but the fragility of Thermocurable polyimide is large, copper-clad plate obtained so almost loses flexibility, in the FPC process of downstream, can not meet downstream FPC processing technology to the requirement of FCCL flexibility, practicality is little.
It is CN104325774A that State Intellectual Property Office discloses a kind of publication number on February 4th, 2015, name is called the patent of invention of " a kind of preparation methods of two layers of gum-free double side flexible copper coated board ", and this disclosure of the invention is a kind of, and " two layers of gum-free double side flexible copper coated board are made up of thermoset polyimide layer, thermoplastic polyimide layer and two-layer Copper Foil." dielectric layer of this invention is two-layer; although contrast traditional non-gel flexible copper-clad plate to decrease a Rotating fields; in patent right book preparation method; " at the upper covering top layer Copper Foil of thermoplastic polyimide layer, at 350 DEG C, under the condition of 40Mpa, lamination 10 min, obtains two layers of gum-free double side flexible copper coated board ".Materials and process that the present invention adopts, its pressing-in temp is up to 350 DEG C, high to equipment requirement, and energy consumption is high, is unfavorable for industrializing implementation.
The polyimides that can be used for FCCL production at present mainly contains crosslinked polyimide (also known as Thermocurable polyimide), linear polyimides (mainly comprising TPI) and polyimide structures film etc.Thermocurable polyimide does not melt insoluble high molecular polymer, there is good mechanical property, electrical property and heat resistance, flexibility coat copper plate can be made to have good dimensional stability, and there is high-fire resistance, but the peel strength of itself and Copper Foil is lower, be difficult to be used alone, its fragility is large, cannot meet downstream FPC processing technology to the requirement of FCCL flexibility; TPI is compared with Thermocurable polyimide, generally fusible, flexible large, and in copper-clad plate processing, can make adhesive and use, can give copper-clad plate flexibility, but its coefficient of expansion is high, the dimensional stability of copper-clad plate shrinkage factor made is excessive simultaneously; And polyimides (PI) structural membrane is while possessing the good mechanical property of thermosetting polyimides, electrical property and heat resistance, because its vitrification point is high, fusing point is higher than its decomposition temperature, heat not melting, there is again good flexibility simultaneously, dimensional stability and heat-resisting quantity good, good for FCCL dimensional stability in Downstream processing.
Utility model content
The purpose of this utility model is to provide the copper-clad plate of a kind of two-layered medium non-gel flexible, can overcome in prior art, when medium between Copper Foil is two-layer Thermocurable polyimide, the problem of non-gel flexible copper-clad plate fragility, and dielectric layer is when being PI/TPI glue/PI and TPI glue/PI/TPI glue, copper-clad plate range of application is wide not, and processing temperature is high, the problem that cost is high.Of the present utility model have excellent combination property around property copper-clad plate, and processing cost is low, thinner, can realize the needs of thin-type electronic product, thus expand the advantage of product applications.
In order to realize foregoing invention object, the technical solution of the utility model is as follows:
The copper-clad plate of a kind of two-layered medium non-gel flexible, is made up of the first Copper Foil be arranged in parallel, the second Copper Foil and the insulating barrier between the first Copper Foil and the second Copper Foil, it is characterized in that: described insulating barrier comprises thermoplastic polyimide layer and polyimide structures film.
In order to realize the utility model better, the first described Copper Foil, the thickness of the second Copper Foil are 7 ~ 70 μm, more preferably 12 ~ 35 μm.
Described thermoplastic polyimide layer is produced by rubbing method, and its thickness is 1 ~ 30 μm, more preferably 3 ~ 7 μm.
Described polyimide structures film is produced by rubbing method by polyamic acid, and after being coated on copper foil surface, under low temperature, imidizate forms, and its thickness is 5 ~ 25 μm.
The first described Copper Foil, the second Copper Foil are electrolytic copper foil or rolled copper foil.
Further preferably, the first described Copper Foil, the second Copper Foil are electrolytic copper foil, in copper-clad plate of the present invention, and the good conductivity of electrolytic copper foil, and there is copper tooth due to electrolytic copper foil surface, rough, therefore its cementability is good, peel strength is high.
The beneficial effects of the utility model:
1, flexibility coat copper plate of the present utility model is made up of different materials, copper foil layer, thermoplastic polyimide layer, polyimide structures film respectively, thermoplastic polyimide layer does adhesive in the utility model, it is flexible, vitrification point is low, with traditional adhesive as compared with epoxy resin, after avoiding etching, adhesive-layer exposes in atmosphere, affects the heat resistance of sheet material, anti-flammability and chemical resistance; Polyimide structures film does structure sheaf in the utility model, because although TPI is flexible, but its dimensional stability and temperature tolerance bad, and polyimide structures film has higher vitrification point, effectively can improve dimensional stability and the heat-resisting quantity of post-production; In flexibility coat copper plate dielectric layer of the present utility model, thermoplastic polyimide layer is placed between polyimide structures film and the second Copper Foil, compared with the copper-clad plate being Copper Foil/PI/TPI/PI/ Copper Foil with structure, decrease one deck PI insulating barrier, thickness of copper-clad plate is reduced, simplify technique, reduce the cost of material, expand its scope of application; Compared with the copper-clad plate being Copper Foil/PI/ PI/ Copper Foil with structure, improve the flexibility of copper-clad plate, and improve the cementability between insulating barrier and Copper Foil, to meet the processing technology of downstream flexible PCB (FPC), thus expand the range of application of product; Another TPI and polyimide structures film are the material of same system, and boundary layer merges better, and dimensionally stable, in the recombination process in later stage, ensure that copper foil surface is smooth, outward appearance, excellent performance.
2, the coating of TPI and the coating of polyimide structures film all preferably adopt rubbing method to apply, and rubbing method is produced compared with laminating, galvanoplastic, has the advantage that efficiency is high, precision controlling is accurate, cost is low.
3, the preferred Copper Foil of the utility model is electrolytic copper foil, the good conductivity of electrolytic copper foil, and there is copper tooth due to electrolytic copper foil surface, rough, therefore its cementability, for in non-gel flexible copper-clad plate of the present utility model, the adhesive force of dielectric layer and Copper Foil can be increased, thus improve the stability of product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model
Wherein, 1-first Copper Foil, 2-thermoplastic polyimide layer, 3-polyimide structures film, 4-second Copper Foil.
Detailed description of the invention
The preparation method of the utility model copper-clad plate is as follows:
Embodiment 1
The copper-clad plate of a kind of two-layered medium non-gel flexible, be made up of the first Copper Foil 1, second Copper Foil 4 be arranged in parallel and the insulating barrier between the first Copper Foil 1 and the second Copper Foil 4, it is characterized in that: described insulating barrier comprises thermoplastic polyimide layer 2 and polyimide structures film 3.
In the present embodiment, the thickness of the first Copper Foil 1, second Copper Foil 4 is 7 μm; Thermoplastic polyimide layer 2 is produced by rubbing method, and its thickness is 3 μm; Polyimide structures film 3 is produced by rubbing method by polyamic acid, and after being coated on copper foil surface, under low temperature, imidizate forms, and its thickness is 5 μm; First Copper Foil 1 and the second Copper Foil 4 are electrolytic copper foil, in copper-clad plate of the present invention, and the good conductivity of electrolytic copper foil, and there is copper tooth due to electrolytic copper foil surface, rough, therefore its cementability is good, peel strength is high.
The gross thickness of the copper-clad plate of the present embodiment is 22 μm, is mainly used in the high electronic product of thickness requirement as fields such as mobile phones.
Embodiment 2
The copper-clad plate of a kind of two-layered medium non-gel flexible, be made up of the first Copper Foil 1, second Copper Foil 4 be arranged in parallel and the insulating barrier between the first Copper Foil 1 and the second Copper Foil 4, it is characterized in that: described insulating barrier comprises thermoplastic polyimide layer 2 and polyimide structures film 3.
In the present embodiment, the thickness of the first Copper Foil 1, second Copper Foil 4 is 12 μm; Thermoplastic polyimide layer 2 is produced by rubbing method, and its thickness is 30 μm; Polyimide structures film 3 is produced by rubbing method by polyamic acid, and after being coated on copper foil surface, under low temperature, imidizate forms, and its thickness is 10 μm; First Copper Foil 1 and the second Copper Foil 4 are rolled copper foil, and the gross thickness of the copper-clad plate of the present embodiment is 64 μm.
Embodiment 3
The copper-clad plate of a kind of two-layered medium non-gel flexible, be made up of the first Copper Foil 1, second Copper Foil 4 be arranged in parallel and the insulating barrier between the first Copper Foil 1 and the second Copper Foil 4, it is characterized in that: described insulating barrier comprises thermoplastic polyimide layer 2 and polyimide structures film 3.
In the present embodiment, the thickness of the first Copper Foil 1, second Copper Foil 4 is 35 μm; Thermoplastic polyimide layer 2 is produced by rubbing method, and its thickness is 7 μm; Polyimide structures film 3 is produced by rubbing method by polyamic acid, and after being coated on copper foil surface, under low temperature, imidizate forms, and its thickness is 15 μm; First Copper Foil 1 and the second Copper Foil 4 are electrolytic copper foil, in copper-clad plate of the present invention, and the good conductivity of electrolytic copper foil, and there is copper tooth due to electrolytic copper foil surface, rough, therefore its cementability is good, peel strength is high.
The gross thickness of the copper-clad plate of the present embodiment is 92 μm.
Embodiment 4
The copper-clad plate of a kind of two-layered medium non-gel flexible, be made up of the first Copper Foil 1, second Copper Foil 4 be arranged in parallel and the insulating barrier between the first Copper Foil 1 and the second Copper Foil 4, described insulating barrier comprises thermoplastic polyimide layer 2 and polyimide structures film 3.
In the present embodiment, the thickness of the first Copper Foil 1, second Copper Foil 4 is 70 μm; Thermoplastic polyimide layer 2 is produced by rubbing method, and its thickness is 30 μm; Polyimide structures film 3 is produced by rubbing method by polyamic acid, and after being coated on copper foil surface, under low temperature, imidizate forms, and its thickness is 25 μm; First Copper Foil 1 and the second Copper Foil 4 are electrolytic copper foil, in copper-clad plate of the present invention, and the good conductivity of electrolytic copper foil, and there is copper tooth due to electrolytic copper foil surface, rough, therefore its cementability is good, peel strength is high.
The gross thickness of the copper-clad plate of the present embodiment is 195 μm.
Embodiment 5
The copper-clad plate of a kind of two-layered medium non-gel flexible, be made up of the first Copper Foil 1, second Copper Foil 4 be arranged in parallel and the insulating barrier between the first Copper Foil 1 and the second Copper Foil 4, it is characterized in that: described insulating barrier comprises thermoplastic polyimide layer 2 and polyimide structures film 3.
In the present embodiment, the thickness of the first Copper Foil 1, second Copper Foil 4 is 30 μm; Thermoplastic polyimide layer 2 is produced by rubbing method, and its thickness is 20 μm; Polyimide structures film 3 is produced by rubbing method by polyamic acid, and after being coated on copper foil surface, under low temperature, imidizate forms, and its thickness is 15 μm; First Copper Foil 1 and the second Copper Foil 4 are electrolytic copper foil, in copper-clad plate of the present invention, and the good conductivity of electrolytic copper foil, and there is copper tooth due to electrolytic copper foil surface, rough, therefore its cementability is good, peel strength is high.
The gross thickness of the copper-clad plate of the present embodiment is 95 μm.
The preparation method of the utility model copper-clad plate is as follows:
(1) the first required Copper Foil, the second Copper Foil and TPI, polyimide structures film is got out;
(2) polyamide coating acid solution on the second Copper Foil, through oven for drying, bake out temperature is 320 ~ 330 DEG C, forms polyimide structures film except after desolventizing on Copper Foil;
(3) carry out polarization process to the one side of the polyimide structures film of the double-deck single sided board that step (2) is formed, processing mode has plasma, chemical attack, corona etc.;
(4) the coated on one side TPI of the polyimide structures film of the single sided board formed in step (3), through oven for drying, bake out temperature is 170 ~ 200 DEG C;
(5) alignd with the first Copper Foil by the single sided board being coated with polyimide structures film and thermoplastic polyimide layer that step (4) obtains, carry out pressing by pressing machine, pressing-in temp is 120 ~ 220 DEG C, and after pressing, cooling obtains double side flexible copper coated board.
According to IPC-TM-650 detection method, embodiment 1 ~ 5 testing result is as table 1:
Table 1
Claims (8)
1. two-layered medium non-gel flexible copper-clad plate, be made up of the first Copper Foil (1) be arranged in parallel, the second Copper Foil (4) and the insulating barrier between the first Copper Foil (1) and the second Copper Foil (4), it is characterized in that: described insulating barrier comprises thermoplastic polyimide layer (2) and polyimide structures film (3).
2. two-layered medium non-gel flexible copper-clad plate as claimed in claim 1, is characterized in that: described the first Copper Foil (1), the thickness of the second Copper Foil (4) are 7 ~ 70 μm.
3. two-layered medium non-gel flexible copper-clad plate as claimed in claim 2, is characterized in that: described the first Copper Foil (1), the thickness of the second Copper Foil (4) are 12 ~ 35 μm.
4. two-layered medium non-gel flexible copper-clad plate as claimed in claim 1, is characterized in that: described thermoplastic polyimide layer (2) is produced by rubbing method, and its thickness is 1 ~ 30 μm.
5. two-layered medium non-gel flexible copper-clad plate as claimed in claim 4, is characterized in that: the thickness of described thermoplastic polyimide layer (2) is 3 ~ 7 μm.
6. two-layered medium non-gel flexible copper-clad plate as claimed in claim 1, described polyimide structures film (3) is produced by rubbing method by polyamic acid, and its thickness is 5 ~ 25 μm.
7. two-layered medium non-gel flexible copper-clad plate as claimed in claim 1, described the first Copper Foil (1), the second Copper Foil (4) are electrolytic copper foil or rolled copper foil.
8. two-layered medium non-gel flexible copper-clad plate as claimed in claim 7, described the first Copper Foil (1), the second Copper Foil (4) are electrolytic copper foil.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520330948.3U CN204674123U (en) | 2015-05-21 | 2015-05-21 | The copper-clad plate of a kind of two-layered medium non-gel flexible |
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| CN201520330948.3U CN204674123U (en) | 2015-05-21 | 2015-05-21 | The copper-clad plate of a kind of two-layered medium non-gel flexible |
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| CN204674123U true CN204674123U (en) | 2015-09-30 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104859223A (en) * | 2015-05-21 | 2015-08-26 | 成都多吉昌新材料有限公司 | Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers |
| CN114379174A (en) * | 2020-10-21 | 2022-04-22 | 湖北奥马电子科技有限公司 | Single-sided soft copper-clad plate |
-
2015
- 2015-05-21 CN CN201520330948.3U patent/CN204674123U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104859223A (en) * | 2015-05-21 | 2015-08-26 | 成都多吉昌新材料有限公司 | Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers |
| CN114379174A (en) * | 2020-10-21 | 2022-04-22 | 湖北奥马电子科技有限公司 | Single-sided soft copper-clad plate |
| CN114379174B (en) * | 2020-10-21 | 2023-10-20 | 湖北奥马电子科技有限公司 | Single-sided soft copper-clad plate |
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Address after: High tech Zone Gaopeng road in Chengdu city of Sichuan province 610015 5 building A No. 601 Patentee after: Chengdu Changji new material Limited by Share Ltd Address before: High tech Zone Gaopeng road in Chengdu city of Sichuan province 610015 5 building A No. 601 Patentee before: Chengdu Do-itc New Material Co., Ltd. |