CN214004511U

CN214004511U - Double-sided self-adhesive high-temperature bearing film

Info

Publication number: CN214004511U
Application number: CN202023207577.XU
Authority: CN
Inventors: 吴济华; 杨天智
Original assignee: Zhuhai Yixin Material Technology Co Ltd
Current assignee: Zhuhai Yixin Material Technology Co Ltd
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2021-08-20
Anticipated expiration: 2030-12-28

Abstract

The utility model relates to a two-sided autohension high temperature carrier film, play the first layer from type guard action that sets gradually from the top down from the type membrane, play the second floor adhesive layer of bonding and guard action, play the third layer substrate layer that keeps the size stability effect when supporting with high temperature, play and mend the fourth layer buffer layer that tasts and alleviate both sides substrate layer stress difference effect, play the fifth layer substrate layer that keeps the size stability effect when supporting with high temperature, play the sixth layer adhesive layer of bonding and guard action and play the seventh layer from type guard action from the type membrane. The utility model discloses two-sided autohension high temperature carrier film can solve both sides flexible copper-clad plate substrate perfectly because of there being the circuit region and not having the poor mutual interference problem that forms extrusion and internal stress inconsistent of circuit region thickness, and the full flow operation of adaptable multiple thickness and different specification flexibility copper-clad plate substrate has advantages such as high temperature resistant, no cull and viscidity are moderate simultaneously.

Description

Double-sided self-adhesive high-temperature bearing film

[ technical field ] A method for producing a semiconductor device

The present invention relates to a layered product, and more particularly to a layered product made of synthetic resin, and more particularly to a high temperature carrier film structure for printed circuit boards that requires high temperature resistance.

[ background of the invention ]

With the rapid development of the electronic circuit industry, the flexible printed circuit (FPC for short) is applied more and more widely to the terminal electronic products. In recent years, consumer electronic products such as smart phones and wearable devices are growing very rapidly, automobile automation, networking and electromotion also greatly stimulate the vehicle-mounted market demand, and products are developing towards the direction of portability and miniaturization. Because of the difference in material properties, the conventional Printed Circuit Board (PCB) has not been able to meet the product requirements, and those skilled in the art are always seeking breakthrough in material and process, among which FPC, as the most favored technology, is becoming the main connecting accessory of electronic equipment.

The processing substrate material of the Flexible circuit board (FPC) is a Flexible Copper Clad Laminate (FCCL, also called as FCCL for short, and the Chinese is also called as a Flexible Copper Clad Laminate), the Flexible Copper Clad Laminate (FCCL) is a Copper Clad Laminate formed by bonding a polyester film, a polyimide film and other Flexible insulating materials on one side or two sides with a Copper foil through certain process treatment, the thickness of the Copper Clad Laminate is relatively thin, the taking or transferring in the manufacturing process is extremely inconvenient, and damage and wrinkles are easily caused by stress action or improper operation in the manufacturing process; in order to solve the technical problems, a single-sided carrier film is mostly used in the industry for supporting and protecting a Flexible Copper Clad Laminate (FCCL), and the Flexible Copper Clad Laminate (FCCL) supported and protected by the carrier film can be kept flat and smooth all the time in the processes of pressing, curing, gold immersion and the like, is prevented from being bent, is convenient to take and uniform in manufacturing quality, and greatly improves the qualification rate and the product quality.

With the rapid development of intelligent electronics, the market has an increasingly large demand for Flexible Printed Circuit (FPC). However, the manufacturing capacity of the existing single panel is far from the market's large demand for flexible circuit boards (FPC). Therefore, how to improve the yield under the existing production conditions is the first problem to be solved urgently by various Flexible Printed Circuit (FPC) manufacturers at present. In addition to increasing the production line and enlarging the production scale, the production mode of fixing two Flexible Copper Clad Laminates (FCCL) up and down by using a double-sided carrier film and simultaneously performing operation is widely concerned. At present, the production mode of using the double-sided carrier film in China is not mature, on one hand, the specifications of flexible printed circuit boards (FPCs) are different, the parameters of the manufacturing process are different, and a single double-sided carrier film cannot adapt to the difference application process of the whole-flow operation; on the other hand, the production mode of fixing two Flexible Copper Clad Laminates (FCCL) up and down is adopted, the problem of mutual interference of inconsistent extrusion and internal stress caused by the thickness difference of a circuit area and a non-circuit area of the Flexible Copper Clad Laminates (FCCL) on two sides exists, and the separation of a bearing film and a PI (polyimide or polyester film) layer of the Flexible Copper Clad Laminates (FCCL) is easily caused in the heating process.

[ Utility model ] content

The to-be-solved technical problem lies in avoiding the weak point of above-mentioned prior art and providing a two-sided autohension high temperature carrier film, can solve both sides flexible copper-clad plate (FCCL) substrate perfectly because of there being the circuit region and not having the poor mutual interference problem that forms extrusion and internal stress inconsistent of circuit region thickness, the full flow operation of adaptable multiple thickness and different specification flexible copper-clad plate (FCCL) substrate has advantages such as high temperature resistant, no cull and viscidity are moderate simultaneously.

The utility model provides a technical scheme that technical problem adopted is:

the utility model provides a two-sided autohension high temperature carrier film, the first layer that plays from the type guard action that sets gradually from the top down leaves the type membrane, play the second layer adhesive layer of bonding and guard action, play the third layer substrate layer that keeps the size stability effect when supporting with high temperature, play and taste and alleviate the fourth layer buffer layer of both sides substrate layer stress difference effect, play the fifth layer substrate layer that keeps the size stability effect when supporting with high temperature, play the sixth layer adhesive layer of bonding and guard action and play the seventh layer of leaving the type membrane from the type guard action.

The surface tension values of the upper surface and the lower surface of the third base material layer and the fifth base material layer are both greater than 44 dyn/cm; and at the temperature of 180 ℃, the heat shrinkage rates MD and TD of the third base material layer and the fifth base material layer are both less than 2.0%.

The thickness of the first layer of release film and the thickness of the seventh layer of release film are both 12-200 mu m; the thickness of the second layer of adhesive layer and the thickness of the sixth layer of adhesive layer are both 2-50 mu m; the thickness of the third substrate layer and the thickness of the fifth substrate layer are both 8-100 mu m.

Compared with the prior art, the utility model discloses two-sided autohension high temperature carrier film's beneficial effect lies in:

the utility model discloses a two three layer construction's high temperature carrier film forms seven layer construction's two-sided autohension high temperature carrier film after connecting with the help of fourth layer buffer layer, first layer is from the type membrane, second floor adhesive layer and third layer substrate layer are a three layer construction, seventh layer is from the type membrane, sixth layer adhesive layer and fifth layer substrate layer are another three layer construction, they bond together through fourth layer buffer layer and form two-sided autohension high temperature carrier film, can be used for two flexible circuit boards simultaneously, can perfectly solve both sides flexible copper clad laminate substrate because of there is circuit region and there is not circuit region thickness difference to form the mutual interference problem that extrudees and internal stress are inconsistent, can adapt to the whole flow operation of multiple thickness and different specification flexible copper clad laminate substrate simultaneously;

the second, third and fifth substrate layers can play a supporting role in the manufacture procedure of the flexible circuit board, and simultaneously can reduce the influence of internal stress generated by thermal shrinkage in the high-temperature laminating manufacture procedure of the flexible circuit board, and maintain certain dimensional stability at high temperature;

in the manufacturing process of the flexible circuit board, the upper surface of the second layer of adhesive layer and the lower surface of the sixth layer of adhesive layer can be well attached to one side of the PI film of the flexible copper-clad board substrate, and the PI film can be easily peeled off from the surface of the PI film after high-temperature pressing, gold melting and other processes, so that no adhesive pollution is generated;

the fourth buffer layer not only connects the two high-temperature bearing films with three-layer structures into a whole, but also has certain plasticity under a high-temperature environment, so that the stress difference of the base material layers at two sides can be compensated and relieved, and the second adhesive layer and the sixth adhesive layer are prevented from being layered with the flexible copper-clad plate due to different local thermal expansion and cold contraction stresses;

fifthly, the first release film and the seventh release film can protect the second adhesive layer and the sixth adhesive layer, so that the second adhesive layer and the sixth adhesive layer are not polluted and are convenient to use and operate in the transportation and storage processes, and when the flexible printed circuit board (FPC) is used, the first release film and the seventh release film are only required to be peeled off and then used in the manufacture procedure of the FPC.

To sum up, the utility model discloses two-sided autohension high temperature carrier film can solve both sides flexible copper-clad plate (FCCL) substrate perfectly because of there being the circuit region and not having the poor mutual interference problem that forms extrusion and internal stress inconsistent of circuit region thickness, the full flow operation of the flexible copper-clad plate (FCCL) substrate of adaptable multiple thickness and different specifications simultaneously has advantages such as high temperature resistant, no cull and viscidity are moderate.

[ description of the drawings ]

Fig. 1 is a schematic front-view of the front projection of the double-sided self-adhesive high-temperature carrier film of the present invention.

[ detailed description ] embodiments

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1, a two-sided autohension high temperature carrier film for on flexible circuit board (FPC), especially be used for on two flexible circuit board (FPC) simultaneously, two-sided autohension high temperature carrier film includes from the top down sets gradually play from the first layer of type guard action from type membrane 10, play the second layer adhesive layer 20 of bonding and guard action, play and support and keep the third layer substrate layer 30 of size stability effect when high temperature, play and compensate tasting and alleviate the fourth layer buffer layer 40 of both sides substrate layer stress difference effect, play and keep the fifth layer substrate layer 50 of size stability effect when high temperature, play the sixth layer adhesive layer 60 of bonding and guard action and play the seventh layer of type guard action from type membrane 70.

Referring to fig. 1, the third substrate layer 30 and the fifth substrate layer 50 are bonded together by the fourth buffer layer 40; the second layer of adhesive 20 and the sixth layer of adhesive 60 are respectively coated and bonded on the upper surface of the third substrate layer 30 and the lower surface of the fifth substrate layer 50; the first release film 10 and the seventh release film 70 are respectively attached to the upper surface of the second adhesive layer 20 and the lower surface of the sixth adhesive layer 60 by a film attaching process. The high temperature of the utility model means that the temperature is 160-230 ℃.

Referring to fig. 1, the materials of the third substrate layer 30 and the fifth substrate layer 50 each include one or a combination of two of polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyimide (PI), polyether ether ketone (PEEK), Polytetrafluoroethylene (PTFE), polytetramethylene adipamide (PA 46), nylon 4T (PA 4T), polyhexamethylene terephthalamide (PA 6T), nylon 9T (PA 9T), and fluorinated ethylene propylene copolymer (FEP); PA46 also known as polyamide 46, commonly known as nylon 46; the third substrate layer 30 and the fifth substrate layer 50 are subjected to high temperature resistance treatment, and the heat shrinkage rates MD (mechanical stretching direction) and TD (direction perpendicular to stretching) of the third substrate layer 30 and the fifth substrate layer 50 are both less than 2.0% at the temperature of 180 ℃; the third substrate layer 30 and the fifth substrate layer 50 are bonded and enhanced by single-sided corona, double-sided corona or surface coating, so that the surface tension values of the upper surface and the lower surface of the third substrate layer are both larger than 44dyn/cm (dyne/cm); the thickness of the third substrate layer 30 and the thickness of the fifth substrate layer 50 are both 8-100 μm (micrometer), and preferably, the thickness of the third substrate layer 30 and the thickness of the fifth substrate layer 50 are both 12-35 μm (micrometer). In the flexible circuit board (FPC) process, third layer substrate layer 30 and fifth layer substrate layer 50 can play the supporting role, simultaneously in flexible circuit board (FPC) high temperature pressfitting process, can reduce because of the internal stress influence that the thermal contraction produced, keep certain dimensional stability when the high temperature.

Referring to fig. 1, the fourth buffer layer 40 is made of one or more of polyacrylate pressure-sensitive adhesive, polyacrylate hot-melt pressure-sensitive adhesive, silicone pressure-sensitive adhesive, epoxy adhesive, and polyurethane pressure-sensitive adhesive as a main material, and an additive is added to enhance the temperature resistance, adhesion, and creep property, so that the buffer layer has certain plasticity in a high-temperature environment, can compensate and relieve the stress difference between the two side substrate layers, and avoids the delamination between the second adhesive layer 20 and the sixth adhesive layer 60 and the Flexible Copper Clad Laminate (FCCL) caused by the difference in local thermal expansion and cold contraction stress; the additive comprises one or more of epoxy type curing agent, isocyanate, amino resin curing agent, phenolic resin, triethylene diamine, melamine and aziridine; according to the mass parts, the main material accounts for 97.0-99.8%, and the additive accounts for 0.2-3.0%; the thickness of the fourth buffer layer 40 is 5-50 μm (micrometer), and preferably, the thickness of the fourth buffer layer 40 is 20-40 μm (micrometer).

Referring to fig. 1, the materials of the second adhesive layer 20 and the sixth adhesive layer 60 both include one or more combinations of polyacrylate pressure-sensitive adhesive, polyacrylate hot-melt pressure-sensitive adhesive, silicone pressure-sensitive adhesive, epoxy adhesive, and polyurethane pressure-sensitive adhesive as a main material, and additives are added to perform additive modification to enhance temperature resistance, adhesion, and chemical resistance, so that the adhesive is not prone to generating residual glue in a high-temperature environment, and is not prone to embrittlement and debonding in a gold-dissolving process, and the additives include one or more combinations of epoxy type curing agent, isocyanate, amino resin curing agent, phenolic resin, triethylene diamine, melamine, and aziridine; according to the mass parts, the main material accounts for 97.0-99.8%, and the additive accounts for 0.2-3.0%; the thicknesses of the second layer of adhesive layer 20 and the sixth layer of adhesive layer 60 are both 2-50 micrometers (micrometers), and preferably, the thicknesses of the second layer of adhesive layer 20 and the sixth layer of adhesive layer 60 are both 5-20 micrometers (micrometers). The main functions of the second layer of adhesive layer 20 and the sixth layer of adhesive layer 60 are that in the process of manufacturing a Flexible Printed Circuit (FPC), the upper surface of the second layer of adhesive layer 20 and the lower surface of the sixth layer of adhesive layer 60 can be well attached to one side of a PI film of a Flexible Copper Clad Laminate (FCCL) substrate, and after the processes of high-temperature pressing, gold melting and the like, the PI film can be easily peeled off from the surface of the PI film without adhesive pollution.

Referring to fig. 1, the materials of the first and

seventh release films

10 and 70 each include polyethylene terephthalate (PET), Polyethylene (PE), or polypropylene (PP); the thickness of the first layer of release film 10 and the thickness of the seventh layer of release film 70 are both 12-200 micrometers (micrometers), and preferably, the thickness of the first layer of release film 10 and the thickness of the seventh layer of release film 70 are both 15-80 micrometers (micrometers). The main function of the first layer release film 10 and the seventh layer release film 70 is to protect the second layer adhesive layer 20 and the sixth layer adhesive layer 60, in the transportation and storage process, to prevent the second layer adhesive layer 20 and the sixth layer adhesive layer 60 from being polluted and convenient to use, the utility model discloses the double-sided self-adhesive high-temperature carrier film needs to be peeled off the first layer release film 10 and the seventh layer release film 70 when in use, and then be reused in the flexible circuit board (FPC) process.

Referring to fig. 1, the double-sided self-adhesive high-temperature carrier film of the present invention is actually a seven-layer double-sided self-adhesive high-temperature carrier film formed by two three-layer high-temperature carrier films after the fourth buffer layer 40, the first release film 10, the second adhesive layer 20 and the third substrate layer 30 are a three-layer structure, the seventh release film 70, the sixth adhesive layer 60 and the fifth substrate layer 50 are another three-layer structure, and they are bonded together by the fourth buffer layer 40 to form the double-sided self-adhesive high-temperature carrier film, which can be used on two flexible circuit boards (FPCs) simultaneously, can perfectly solve the problem of mutual interference between the two Flexible Copper Clad Laminate (FCCL) substrates due to the difference between the thickness of the circuit area and the thickness of the circuit area, and can adapt to the full-process operation of Flexible Copper Clad Laminate (FCCL) substrates with various thicknesses and different specifications, has the advantages of high temperature resistance, no residual glue, moderate viscosity and the like.

Referring to fig. 1, the double-sided self-adhesive high-temperature carrier film of the present invention can adopt the following manufacturing method, including the following steps:

step A, selecting a high-temperature-resistant PET substrate as a third substrate layer 30, wherein the substrate of the third substrate layer 30 is subjected to high-temperature-resistant treatment, and the heat shrinkage rate MD (mechanical stretching direction) and TD (direction perpendicular to stretching) of the third substrate layer 30 are both smaller than 1.5% at the temperature of 180 ℃; the base material of the third base material layer 30 is subjected to double-sided corona, so that the surface tension values of the upper surface and the lower surface of the base material reach 49 dyn/cm; the thickness of the third substrate layer 30 is 19 μm (micrometers);

selecting polyacrylate pressure-sensitive adhesive with better temperature resistance as a main body, adding isocyanate for addition modification to form a second adhesive layer 20, wherein the polyacrylate pressure-sensitive adhesive accounts for 99.0% and the isocyanate accounts for 1.0% in parts by mass; the second adhesive layer 20 has a thickness of 10 μm (micrometers);

selecting a PET (polyethylene terephthalate) base material as a first layer of release film 10, wherein the thickness of the first layer of release film 10 is 30 micrometers (micrometers);

and coating the second-layer adhesive layer 20 on the upper surface of the third-layer base material layer 30, baking and drying at 130 ℃ for 3 minutes, and attaching the first-layer release film 10 on the upper surface of the second-layer adhesive layer 20 through a film attaching process.

Step B, selecting a high-temperature-resistant PET (polyethylene terephthalate) base material as a fifth base material layer 50, subjecting the base material of the fifth base material layer 50 to high-temperature-resistant treatment, and enabling the heat shrinkage rate MD (mechanical stretching direction) and TD (direction perpendicular to stretching) of the fifth base material layer 50 to be less than 1.5% at the temperature of 180 ℃; the base material of the fifth base material layer 50 is subjected to double-sided corona, so that the surface tension values of the upper surface and the lower surface of the base material reach 49 dyn/cm; the thickness of the fifth substrate layer 50 is 19 μm (micrometers);

selecting polyacrylate pressure-sensitive adhesive with better temperature resistance as a main body, adding isocyanate for addition modification to form a sixth adhesive layer 60, wherein the polyacrylate pressure-sensitive adhesive accounts for 99.0% and the isocyanate accounts for 1.0% in parts by mass; the thickness of the sixth adhesive layer 60 is 10 μm (micrometers);

selecting a PET substrate as a seventh release film 70, wherein the thickness of the seventh release film 70 is 30 micrometers (micrometers);

and coating the sixth adhesive layer 60 on the lower surface of the fifth base material layer 50, baking and drying at 130 ℃ for 3 minutes, and attaching the seventh release film 70 on the lower surface of the sixth adhesive layer 60 by a film attaching process.

Step C, selecting polyacrylate pressure-sensitive adhesive with good temperature resistance as a main body, adding isocyanate for addition modification to form a fourth buffer layer 40, wherein the polyacrylate pressure-sensitive adhesive accounts for 98.8% and the isocyanate accounts for 1.2% in parts by mass; the fourth buffer layer 40 has a thickness of 30 μm (micrometers);

coating the fourth buffer layer 40 on the lower surface of the third substrate layer 30 having the three-layer structure formed in the step a, baking and drying the coated layer at 130 ℃ for 3 minutes, and then attaching the lower surface of the fourth buffer layer 40 to the upper surface of the fifth substrate layer 50 having the three-layer structure formed in the step B.

Step D, curing: and C, placing the double-sided self-adhesive high-temperature bearing film with the seven-layer structure formed in the step C into a room temperature environment with the temperature of 25 ℃ for storage for 168 hours, or placing the double-sided self-adhesive high-temperature bearing film into a curing room with the temperature of 45 ℃ for storage for 48 hours, and finally obtaining the completely cured double-sided self-adhesive high-temperature bearing film with the seven-layer structure.

At the temperature of 23 ℃, the utility model discloses the peeling strength of two-sided self-adhesive high temperature carrier film and steel sheet is between 5 ~ 30gf/inch, and the peeling strength with the PI membrane is between 5 ~ 30 gf/inch. The utility model discloses toast 60 minutes under 160 ℃ behind the second floor adhesive layer 20 and the sixth floor adhesive layer 60 laminating PI membrane of two-sided autohension high temperature carrier film, peel force is between 20 ~ 200 gf/inch after the cooling, and there is not the cull after peeling off, also does not have foreign matter impurity remaining.

The double-sided self-adhesive high-temperature bearing film is specially provided for the whole-flow operation of the FPC, and the application of the double-sided self-adhesive high-temperature bearing film can help FPC manufacturers to improve productivity; the problem of mutual interference of inconsistent extrusion and internal stress caused by the thickness difference of a circuit area and a non-circuit area of Flexible Copper Clad Laminate (FCCL) base materials at two sides can be perfectly solved, and the method can adapt to the whole-process operation of Flexible Copper Clad Laminate (FCCL) base materials with various thicknesses and different specifications; through verification, the double-sided self-adhesive high-temperature bearing film has good affinity with the surface of the copper or PI substrate and moderate adhesive force; roasting for about one hour under a high-temperature environment, such as 160-230 ℃, without shrinkage, delamination and bubble generation; after the processes of pressing, exposing, developing, acid washing and gold dissolving, the utility model discloses double-sided self-adhesive high-temperature carrier film is not crisp, is not lost and is glued, easily peels off, does not have the incomplete glue after peeling off, does not have the advantage such as foreign object is remaining and the FPC board does not upwarp.

The above-mentioned embodiments only represent the preferred embodiments of the present invention, and the description thereof is more specific and detailed, but it is not understood to limit the scope of the invention, it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention, therefore, all the equivalent changes and modifications made with the scope of the claims of the present invention shall belong to the coverage of the claims of the present invention.

Claims

1. The utility model provides a two-sided autohension high temperature carrier film which characterized in that:

the laminated film comprises a first layer release film (10) which is arranged from top to bottom in sequence and has the release protection effect, a second layer adhesive layer (20) which has the adhesion and protection effects, a third layer base material layer (30) which has the functions of supporting and keeping the dimensional stability at high temperature, a fourth layer buffer layer (40) which has the functions of compensating and relieving the stress difference of the base material layers at two sides, a fifth layer base material layer (50) which has the functions of supporting and keeping the dimensional stability at high temperature, a sixth layer adhesive layer (60) which has the adhesion and protection effects and a seventh layer release film (70) which has the release protection effects.

2. The double-sided self-adhesive high-temperature carrier film according to claim 1, characterized in that:

the surface tension values of the upper surface and the lower surface of the third base material layer (30) and the fifth base material layer (50) are both greater than 44 dyn/cm; the third substrate layer (30) and the fifth substrate layer (50) both have a heat shrinkage ratio MD and TD of less than 2.0% at a temperature of 180 ℃.

3. The double-sided self-adhesive high-temperature carrier film according to claim 1 or 2, characterized in that:

the thickness of the first release film (10) and the thickness of the seventh release film (70) are both 12-200 mu m; the thickness of the second layer of adhesive layer (20) and the thickness of the sixth layer of adhesive layer (60) are both 2-50 micrometers; the thickness of the third substrate layer (30) and the thickness of the fifth substrate layer (50) are both 8-100 micrometers; the thickness of the fourth buffer layer (40) is 5-50 mu m.