JPH03209792A - Both-side metal-cladded flexible printed circuit board and manufacture thereof - Google Patents
Both-side metal-cladded flexible printed circuit board and manufacture thereofInfo
- Publication number
- JPH03209792A JPH03209792A JP424590A JP424590A JPH03209792A JP H03209792 A JPH03209792 A JP H03209792A JP 424590 A JP424590 A JP 424590A JP 424590 A JP424590 A JP 424590A JP H03209792 A JPH03209792 A JP H03209792A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- flexible printed
- polyimide film
- printed wiring
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 45
- 230000001070 adhesive effect Effects 0.000 claims abstract description 43
- 229920001721 polyimide Polymers 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000011888 foil Substances 0.000 claims abstract description 18
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 4
- 239000004677 Nylon Substances 0.000 claims 1
- 239000003522 acrylic cement Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 229920001778 nylon Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 abstract description 7
- 229920000620 organic polymer Polymers 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- WVDDGKGOMKODPV-UHFFFAOYSA-N benzyl alcohol Substances OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はフレキシブル印刷配線基板に利用され、特に、
両面金属張りフレキシブル印刷配線基板に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is utilized for flexible printed wiring boards, and in particular,
This invention relates to a double-sided metal-clad flexible printed wiring board.
本発明は、両面金属張りフレキシブル印刷配線基板にお
いて、
構造を無接着剤の２層構造片面金属張りフ１／キシプル
印刷配線基板−接着剤−２層構造片面金属張りフレキシ
ブル印刷配線基板とすることにより、製造方法の簡単化
と特性の向上を図ったものである。The present invention provides a double-sided metal-clad flexible printed circuit board having the following structure: an adhesive-free, two-layer structure, one-sided metal-clad flexible printed wiring board-adhesive-two-layer structure. , which aims to simplify the manufacturing method and improve the characteristics.
従来の両面金属張りフレキシブル印刷配線基板は、第２
図の模式的断面図にその一例を示すように、構造が、金
属箔１−接着剤３−ポリイミドフィルム２−接着剤３−
金属箔１の５層構造となっている。Conventional double-sided metal-clad flexible printed wiring boards
As shown in the schematic cross-sectional view of the figure, the structure is: metal foil 1-adhesive 3-polyimide film 2-adhesive 3-
It has a five-layer structure of metal foil 1.
通常、この従来の両面金属張りフレキシブル印刷配線基
板の製造方法は、例えば、プラスチックフィルムどして
ポリイミドフィルムを用い、ポリイミドフィルムまたは
金属箔に接着剤を塗布乾燥後貼り合わせ、片面金属張り
フレキシブル印刷配線基板を製造した後、さらに次の工
程で、再度ポリイミドフィルムの他の面に接着剤を塗布
し乾燥後貼り合わせて製造される。Normally, this conventional method for manufacturing double-sided metal-clad flexible printed circuit boards involves, for example, using a polyimide film instead of a plastic film, applying an adhesive to the polyimide film or metal foil, drying, and then bonding the single-sided metal-clad flexible printed wiring board. After manufacturing the substrate, the next step is to apply an adhesive again to the other side of the polyimide film, dry it, and then bond it together.
ところで、最近、フレキシブル印刷配線基板は、通信機
器、民生機器および産業機器等に極めて広範囲にわたり
使用され、これら機器における実装方法の簡略化、小型
化、高信頼性化および高機能化が進むにつれて、フレキ
シブル印刷配線基板に対する要求は極めて厳しいものが
ある。これに対して従来の両面金属張りフレキシブル印
刷配線基板は、前述のように接着剤を介して金属箔とポ
リイミドフィルムとを一体化しであるために、使用する
際、金属箔を取り除いたエツチング面には、接着剤が露
出し、ポリイミドの特徴よりも接着剤の特徴が出やすく
なり、耐熱性、電気的特性、耐溶剤性および難燃性等が
低下する欠点がある。また、両面金属張りフレキシブル
印刷配線基板の製造にあたっては、その製造工程が複雑
化する欠点がある。Incidentally, recently, flexible printed wiring boards have been used in a wide range of communication equipment, consumer equipment, industrial equipment, etc., and as the mounting methods of these equipment have become simpler, smaller, more reliable, and more sophisticated, There are extremely strict requirements for flexible printed wiring boards. On the other hand, conventional double-sided metal-clad flexible printed wiring boards integrate metal foil and polyimide film through an adhesive as described above, so when used, the etched surface with the metal foil removed is This has the disadvantage that the adhesive is exposed, the characteristics of the adhesive are more likely to be exhibited than those of polyimide, and the heat resistance, electrical properties, solvent resistance, flame retardance, etc. are deteriorated. Further, in manufacturing a double-sided metal-clad flexible printed wiring board, there is a drawback that the manufacturing process becomes complicated.
また接着剤を用いずに両面板の長尺品を作成することは
、イミド樹脂生成時に縮合反応により水が発生し、ふ（
れやはがれが生じて、両面銅張り板の製造はきわめて困
難である欠点がある。In addition, creating long double-sided boards without using adhesives is a problem because water is generated due to condensation reaction during the production of imide resin.
It has the disadvantage that it is extremely difficult to manufacture double-sided copper-clad plates due to the occurrence of cracking and peeling.
本発明の目的は、前記の欠点を除去することにより、特
性を向上させかつ製造工程を簡単にできる両面金属張り
フレキシブル印刷配線基板およびその製造方法を提供す
ることにある。An object of the present invention is to provide a double-sided metal-clad flexible printed wiring board and a method for manufacturing the same, which can improve characteristics and simplify the manufacturing process by eliminating the above-mentioned drawbacks.
本発明は、前述の問題点を解決するために鋭意研究を行
い、第１図の模式的断面図にその一例を示すように、金
属箔１とポリイミドフィルム２とが接着剤を介さずに一
体化されている２層構造片面金属張りフレキシブル印刷
配線基板４および５を用いて、ポリイミドフィルム２の
面を相対して有機高分子からなる接着剤３を介して貼り
合わせることにより目的とする両面金属張りフレキシブ
ル印刷配線基板が製造できることを見出した。このよう
にして製造された両面金属張りフレキシブル印刷配線基
板は、耐熱性、電気的特性、耐溶剤性および難燃性にす
ぐれ、フレキシブル印刷配線基板として要求される緒特
性は全て満足する。また、製造工程も一工程のワニス塗
布乾燥貼り合わせて製造でき、非常に簡便である。In order to solve the above-mentioned problems, the present invention has been made through intensive research, and as shown in the schematic cross-sectional view of FIG. By using two-layer structure single-sided metal-clad flexible printed circuit boards 4 and 5, which have been developed in the industry, the surfaces of the polyimide film 2 are bonded together via an adhesive 3 made of an organic polymer to form the desired double-sided metal. It has been discovered that a stretched flexible printed wiring board can be manufactured. The double-sided metal-clad flexible printed wiring board produced in this manner has excellent heat resistance, electrical properties, solvent resistance, and flame retardancy, and satisfies all the mechanical properties required for a flexible printed wiring board. Furthermore, the manufacturing process is very simple, as it can be manufactured by applying varnish, drying, and bonding in one step.
すなわち、本発明の両面金属張りフレキシブル印刷配線
基板は、両面に金属箔を有する両面金属張りフレキシブ
ル印刷配線基板において、構造が、金属箔−ポリイミド
フィルム−接着剤−ポリイミドフィルム−金属箔の５層
構造であることを特徴とする。That is, the double-sided metal-clad flexible printed wiring board of the present invention is a double-sided metal-clad flexible printed wiring board having metal foil on both sides, and has a five-layer structure of metal foil-polyimide film-adhesive-polyimide film-metal foil. It is characterized by
また、本発明の両面金属張りフレキシブル印刷配線基板
の製造方法は、ポリイミドフィルムに金属箔が接着され
た２層構造片面金属張りフレキシブル印刷配線基板２枚
の前記ポリイミドフィルムどうしを接着剤を用いて接着
することを特徴とする。Further, the method for manufacturing a double-sided metal-clad flexible printed wiring board of the present invention includes bonding two polyimide films of two-layer single-sided metal-clad flexible printed wiring boards each having a metal foil adhered to a polyimide film using an adhesive. It is characterized by
本発明におけるポリイミドフィルムの接着方法には、接
着剤の無い２層構造片面金属張りフレキシブル印刷配線
基板のポリイミドフィルム面の接着力を増加するために
、ポリイミドフィルム面をアルカリエツチングのように
処理されであるもの、またはプラズマ処理、マット処理
さらには、１〜７μ口のアンカーコート処理しであるも
のなどについても有効である。The method for adhering polyimide films in the present invention includes treating the polyimide film surface with alkali etching in order to increase the adhesive strength of the polyimide film surface of the two-layer structure single-sided metal-clad flexible printed circuit board without an adhesive. It is also effective for those that have been subjected to plasma treatment, matte treatment, and even anchor coat treatment of 1 to 7 μm.
本発明に用いられる接着剤は、カルボキシル基含有アク
リルニトリル共重合体−エポキシ樹脂系、カルボキシル
基含有エチレンアクリル共重合体−エポキシ樹脂系、ポ
リアミド−エポキシ樹脂系、ポリエステル−エポキシ樹
脂系、アクリルニトリルブタジェンゴム系、ブチラール
樹脂系、フッソ樹脂系およびシリコーン樹脂系等、なら
びにこれらの樹脂と硬化剤とを含む組成物からなるもの
であり、これらの接着剤組成物には、必要に応じて、充
填剤、難燃剤および添加剤等を配合することができる。The adhesive used in the present invention is a carboxyl group-containing acrylonitrile copolymer-epoxy resin system, a carboxyl group-containing ethylene acrylic copolymer-epoxy resin system, a polyamide-epoxy resin system, a polyester-epoxy resin system, an acrylonitrile but These adhesive compositions are made of adhesives such as Gen rubber, butyral resin, fluorocarbon resin, silicone resin, etc., as well as compositions containing these resins and curing agents. additives, flame retardants, additives, etc. can be blended.
以上のように本発明に用いられる接着剤は、有機高分子
接着剤であれば特に制限のあるものではない。As described above, the adhesive used in the present invention is not particularly limited as long as it is an organic polymer adhesive.
本発明の構造をもつ両面金属張りフレキシブル印刷配線
基板は、中間層である例えばポリイミドフィルムとポリ
イミドフィルムとが接着剤を介して一体化されており、
金属箔とポリイミドフィルム間には接着剤が無いために
、接着剤の影響は受けずにポリイミドフィルムの特徴が
そのままフレキシブル印刷配線基板の特徴となる。すな
わち、耐熱性、特に熱時気中におけるビール強度の劣化
が著しく少ない。またマイグレーション等の電気的特性
に非常に優れ、さらに、ハンダ性および難燃性にも優れ
た両面金属張りフレキシブル印刷配線基板を製造するこ
とが可能となる。さらに、この製造方法は、２枚の２層
構造片面金属張りフレキシブル印刷配線基板を接着剤で
接着するだけでよいので、製造工程を簡単化することが
可能となる。The double-sided metal-clad flexible printed wiring board having the structure of the present invention has an intermediate layer, for example, a polyimide film and a polyimide film, which are integrated through an adhesive.
Since there is no adhesive between the metal foil and the polyimide film, the characteristics of the polyimide film become the characteristics of the flexible printed wiring board without being affected by the adhesive. That is, heat resistance, especially beer strength in hot air, deteriorates significantly less. Furthermore, it is possible to produce a double-sided metal-clad flexible printed wiring board that has excellent electrical properties such as migration, and also has excellent solderability and flame retardancy. Furthermore, this manufacturing method simplifies the manufacturing process because it is only necessary to bond two two-layered single-sided metal-clad flexible printed circuit boards with an adhesive.
以下、本発明の実施例について説明するが、本発明はこ
れらに限定されるものではない。Examples of the present invention will be described below, but the present invention is not limited thereto.
実施例１
カルボキシル基含有エチレンアクリル共重合体−エポキ
シ樹脂系樹脂および硬化剤からなる接着剤を、濃度４０
％の接着剤溶液に調整した。次に、この接着剤溶液を、
塗布乾燥後の厚さが１５μ０になるように、接着剤の無
いポリイミドフィルムと銅箔とからなる２層構造片面金
属張りフレキシブル印刷配線基板に塗布し、１２０℃で
１０分間乾燥した。Example 1 An adhesive consisting of a carboxyl group-containing ethylene acrylic copolymer-epoxy resin and a curing agent was prepared at a concentration of 40
% adhesive solution. Next, add this adhesive solution to
The coating was applied to a two-layer structure single-sided metal-clad flexible printed wiring board consisting of an adhesive-free polyimide film and copper foil so that the thickness after coating and drying was 15μ0, and the coating was dried at 120° C. for 10 minutes.
その後、この２層構造片面金属張りフレキシブル印刷配
線基板のポリイミドフィルム面が接１側になるように積
層し、１６０℃、６０分、４０ｋｇ／ｃｒ＋＋”の条件
でプレス接着し、加熱アフターキュアーさせ、両面金属
張りフレキシブル印刷配線基板を作成した。After that, the polyimide film side of this two-layer structure single-sided metal-clad flexible printed wiring board is laminated so that the first side is the contact side, press bonded at 160 ° C. for 60 minutes, 40 kg/cr++'', and heated after-cured. A double-sided metal-clad flexible printed wiring board was created.
実施例２
カルボキシル基含有アクリルニトリルブタジェン共重合
体−エポキシ樹脂系樹脂、硬化剤および充填剤からなる
接着剤を、固型分１５％になるようにメチルエチルケト
ン：キシレン＝１：１溶液に混合溶解して接着剤溶液を
調整した。そして、この接着剤溶液を用い、実施例１と
同様にして両面金属張りフレキシブル印刷配線基板を作
成した。Example 2 An adhesive consisting of a carboxyl group-containing acrylonitrile butadiene copolymer-epoxy resin, a curing agent, and a filler was mixed and dissolved in a 1:1 solution of methyl ethyl ketone and xylene so that the solid content was 15%. The adhesive solution was prepared by Then, using this adhesive solution, a double-sided metal-clad flexible printed wiring board was created in the same manner as in Example 1.
実施例３
ポリアミド−エポキシ樹脂および硬化剤からなる接着剤
を固型分２０％になるように、メタノールベンジルアル
コール溶液に混合溶解して接着剤溶液を調整した。そし
て、この接着剤溶液を用い、実施例１と同様にして両面
金属張りフレキシブル印刷配線基板を作成した。Example 3 An adhesive solution was prepared by mixing and dissolving an adhesive consisting of a polyamide-epoxy resin and a curing agent in a methanol-benzyl alcohol solution so that the solid content was 20%. Then, using this adhesive solution, a double-sided metal-clad flexible printed wiring board was created in the same manner as in Example 1.
比較例１．２．３
実施例１．２および３の接着剤をそれぞれ厚さ２５μｌ
のポリイミドフィルムの表裏両面に塗布し、１２０℃で
１０分間乾燥した。その後、厚さ３５μｍの電解銅箔を
、ポリイミドフィルムの両面に積層し、１６０℃、６０
分、４０ｋｇ／Ｃｍ２の条件でプレス接着し、その後加
熱アフターキュアーさせ、両面金属張りフレキシブル印
刷配線基板を作成した。Comparative Example 1.2.3 Adhesives from Examples 1.2 and 3 were each used at a thickness of 25 μl.
It was applied to both the front and back sides of a polyimide film and dried at 120°C for 10 minutes. After that, electrolytic copper foil with a thickness of 35 μm was laminated on both sides of the polyimide film, and
Press bonding was carried out under the conditions of 40 kg/cm2 for 30 minutes, followed by heat after-curing to produce a double-sided metal-clad flexible printed wiring board.
前記のようにして得られた各試料について、銅箔引き剥
がし強度、熱時気中銅箔引き剥がし強度、はんだ耐熱性
、マイグレーションおよび難燃性について試験を行った
。結果は第２表に示すとおりで、実施例は比較例に比べ
て、特に、熱時気中引き剥がし強度が強く、さらに、マ
イグレーションおよび難燃性はすべて合格で、極めてよ
い特性を示した。なお、第１表は接着剤の配合の詳細を
示したものである。Each sample obtained as described above was tested for copper foil peel strength, hot air copper foil peel strength, solder heat resistance, migration, and flame retardancy. The results are shown in Table 2, and the examples showed particularly high peel strength in hot air compared to the comparative examples, and also passed the migration and flame retardance tests, showing extremely good properties. Note that Table 1 shows details of the formulation of the adhesive.
（以下本頁余白）
〔発明の効果〕
以上説明したように、本発明によれば、接着剤の無い２
層構造片面金属張りフレキシブル印刷配線基板を、接着
剤を用いてポリイミドフィルム面を相対して接着するこ
とにより、熱時気中での銅箔引き剥がし強度の低下が著
しく小さく、マイグレーションおよび難燃性にも優れた
両面金属張りフレキシブル印刷配線基板を簡単に得るこ
とができ、その効果は大である。(Hereinafter, the margin of this page) [Effects of the invention] As explained above, according to the present invention, two
By bonding the polyimide film side of the layered single-sided metal-clad flexible printed wiring board with adhesive, the drop in peel strength of the copper foil in hot air is extremely small, and migration and flame retardant properties are achieved. It is possible to easily obtain an excellent double-sided metal-clad flexible printed wiring board, and its effects are great.
第１図は本発明の両面金属張りフレキシブル印刷配線基
板の一例の構造を示す模式的断面図。
第２図は従来の両面金属張りフレキシブル印刷配線基板
の一例の構造を示す模式的断面図。
１・・・金属箔、２・・・ポリイミドフィルム、３・・
・接着剤、４．５・・・２層構造片面金属張りフレキシ
ブル印刷配線基板。FIG. 1 is a schematic cross-sectional view showing the structure of an example of the double-sided metal-clad flexible printed wiring board of the present invention. FIG. 2 is a schematic cross-sectional view showing the structure of an example of a conventional double-sided metal-clad flexible printed wiring board. 1... Metal foil, 2... Polyimide film, 3...
・Adhesive, 4.5...Two-layer structure single-sided metal-clad flexible printed wiring board.
Claims (3)
刷配線基板において、 構造が金属箔−ポリイミドフィルム−接着剤−ポリイミ
ドフィルム−金属箔の５層構造であることを特徴とする
両面金属張りフレキシブル印刷配線基板。1. A double-sided metal-clad flexible printed wiring board having metal foil on both sides, characterized in that the structure is a five-layer structure of metal foil, polyimide film, adhesive, polyimide film, and metal foil.
イロン系接着剤、熱硬化型カルボキシル基含有アクリル
ニトリル共重合体、熱硬化型エポキシ樹脂系接着剤、フ
ッ素樹脂、あるいはシリコーン樹脂を含む有機高分子接
着剤である請求項１記載の両面金属張りフレキシブル印
刷配線基板。2. The adhesive is a thermosetting acrylic adhesive, a thermosetting nylon adhesive, a thermosetting carboxyl group-containing acrylonitrile copolymer, a thermosetting epoxy resin adhesive, a fluororesin, or an organic resin containing a silicone resin. The double-sided metal-clad flexible printed wiring board according to claim 1, which is a polymer adhesive.
片面金属張りフレキシブル印刷配線基板２枚の前記ポリ
イミドフィルムどうしを接着剤を用いて接着する両面金
属張りフレキシブル印刷配線基板の製造方法。3. A method for manufacturing a double-sided metal-clad flexible printed wiring board, which comprises bonding two polyimide films of two layers, each having a metal foil adhered to a polyimide film, to each other using an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP424590A JPH03209792A (en) | 1990-01-11 | 1990-01-11 | Both-side metal-cladded flexible printed circuit board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP424590A JPH03209792A (en) | 1990-01-11 | 1990-01-11 | Both-side metal-cladded flexible printed circuit board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03209792A true JPH03209792A (en) | 1991-09-12 |
Family
ID=11579159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP424590A Pending JPH03209792A (en) | 1990-01-11 | 1990-01-11 | Both-side metal-cladded flexible printed circuit board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03209792A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1667501A1 (en) * | 2003-09-10 | 2006-06-07 | Unitika Ltd. | Substrate for flexible printed wiring board and method for manufacturing same |
| JP2011014727A (en) * | 2009-07-02 | 2011-01-20 | Mitsui Mining & Smelting Co Ltd | Copper foil with composite resin layer, method of manufacturing the same, and method of manufacturing flexible double-sided copper clad laminate and solid molding printed wiring board |
| JP2012106491A (en) * | 2010-10-25 | 2012-06-07 | Daikin Industries Ltd | Metal-clad laminate, method of manufacturing the same, and flexible printed circuit board |
| KR20150003243A (en) * | 2012-04-10 | 2015-01-08 | 랜 테크니컬 서비스 가부시키가이샤 | Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate |
| JP2022041804A (en) * | 2020-09-01 | 2022-03-11 | 佳勝科技股▲ふん▼有限公司 | Composite substrate method for manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5683098A (en) * | 1979-12-11 | 1981-07-07 | Matsushita Electric Ind Co Ltd | Bothhside metallic foil stretcher for printed circuit |
| JPS6265394A (en) * | 1985-09-17 | 1987-03-24 | 旭化成株式会社 | Flexible circuit board |
| JPS62208690A (en) * | 1985-10-31 | 1987-09-12 | 三井東圧化学株式会社 | Flexible printed circuit and manufacture of the same |
-
1990
- 1990-01-11 JP JP424590A patent/JPH03209792A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5683098A (en) * | 1979-12-11 | 1981-07-07 | Matsushita Electric Ind Co Ltd | Bothhside metallic foil stretcher for printed circuit |
| JPS6265394A (en) * | 1985-09-17 | 1987-03-24 | 旭化成株式会社 | Flexible circuit board |
| JPS62208690A (en) * | 1985-10-31 | 1987-09-12 | 三井東圧化学株式会社 | Flexible printed circuit and manufacture of the same |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1667501A1 (en) * | 2003-09-10 | 2006-06-07 | Unitika Ltd. | Substrate for flexible printed wiring board and method for manufacturing same |
| EP1667501A4 (en) * | 2003-09-10 | 2010-01-06 | Unitika Ltd | Substrate for flexible printed wiring board and method for manufacturing same |
| JP2011014727A (en) * | 2009-07-02 | 2011-01-20 | Mitsui Mining & Smelting Co Ltd | Copper foil with composite resin layer, method of manufacturing the same, and method of manufacturing flexible double-sided copper clad laminate and solid molding printed wiring board |
| JP2012106491A (en) * | 2010-10-25 | 2012-06-07 | Daikin Industries Ltd | Metal-clad laminate, method of manufacturing the same, and flexible printed circuit board |
| KR20150003243A (en) * | 2012-04-10 | 2015-01-08 | 랜 테크니컬 서비스 가부시키가이샤 | Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate |
| JP2022041804A (en) * | 2020-09-01 | 2022-03-11 | 佳勝科技股▲ふん▼有限公司 | Composite substrate method for manufacturing the same |
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