JP2722402B2 - Adhesive composition for flexible printed circuit boards - Google Patents
Adhesive composition for flexible printed circuit boardsInfo
- Publication number
- JP2722402B2 JP2722402B2 JP64000228A JP22889A JP2722402B2 JP 2722402 B2 JP2722402 B2 JP 2722402B2 JP 64000228 A JP64000228 A JP 64000228A JP 22889 A JP22889 A JP 22889A JP 2722402 B2 JP2722402 B2 JP 2722402B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- weight
- printed circuit
- flexible printed
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、接着性、耐熱性、耐折強さに優れ、作業性
のよいフレキシブル印刷回路基板用の接着剤組成物に関
する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention provides an adhesive composition for a flexible printed circuit board which is excellent in adhesiveness, heat resistance and bending strength and has good workability. About.
（従来の技術） 近年、電子機器の小形化、軽量化、高密度化の要求は
ますます増大している。フレキシブル印刷回路基板（以
下FPC基板ともいう）は、軽量で立体的に実装できるた
め、こうした小形化・軽量化の要求には大変有利であ
る。このフレキシブル印刷回路基板には、回路の酸化防
止、屈曲性の向上等のために、カバーレイシートが積層
接着されている。このカバーレイシートの接着剤には、
接着性、耐熱性、屈曲性、電気絶縁性のほか、積層加工
時の回路埋込性、作業性、半硬化状態での保存寿命など
が要求される。これらの要求を満たす接着剤としては、
従来アクリロニトリルブタジエンゴム／フェノール樹脂
系、アクリロニトリルブタジエンゴム／エポキス樹脂
系、カルボキシ含有アクリロニトリルブタジエンゴムア
クリルゴム／エポキシ樹脂系などの接着剤が用いられて
いる。(Prior Art) In recent years, demands for smaller, lighter, and higher-density electronic devices have been increasing more and more. Flexible printed circuit boards (hereinafter also referred to as FPC boards) are lightweight and can be mounted three-dimensionally, which is extremely advantageous for such demands for miniaturization and weight reduction. A coverlay sheet is laminated and adhered to the flexible printed circuit board in order to prevent oxidation of the circuit and improve the flexibility. The adhesive for this coverlay sheet includes
In addition to adhesiveness, heat resistance, flexibility, and electrical insulation, circuit embedding during lamination, workability, and shelf life in a semi-cured state are required. Adhesives that meet these requirements include:
Conventionally, adhesives such as acrylonitrile-butadiene rubber / phenol resin, acrylonitrile-butadiene rubber / epoxy resin, and carboxy-containing acrylonitrile-butadiene rubber acrylic rubber / epoxy resin have been used.
しかしながら、アクリルニトリルブタジエンゴム、カ
ルボキシル含有アクリロニトリルブタジエンゴム等を使
用した接着剤では、回路を形成する銅がハンダ浸漬時に
熱劣化の触媒となってアクリロニトリルブタエジンゴム
を酸化劣化され、ハンダ浸漬後の接着力が著しく低下す
るという欠点がある。また、アクリルゴムを使用した接
着剤では、こうした加熱による劣化は少ないが、カバー
レイとして用いたとき、Ｂ−ステージでのベタツキが大
きく、加工工程での作業性が悪く、更にFPC用基板とし
たときの耐折性に劣るという欠点があった。However, in adhesives using acrylonitrile-butadiene rubber, carboxyl-containing acrylonitrile-butadiene rubber, etc., copper forming a circuit serves as a catalyst for thermal degradation during solder immersion, oxidizes and degrades acrylonitrile-butadiene rubber, and adheres after solder immersion. There is the disadvantage that the force is significantly reduced. Also, in the adhesive using acrylic rubber, such deterioration due to heating is small, but when used as a coverlay, stickiness on the B-stage is large, workability in the processing step is poor, and further, it is used as a substrate for FPC. There was a drawback that the folding resistance was sometimes poor.
（発明が解決しようとする課題） 本発明は、上記の欠点を解消するためになされたもの
で、接着性、特にハンダ浸漬後の接着性、耐折性に優
れ、Ｂ−ステージでのベタツキの少なくて作業性のよ
い、FPC基板用接着剤組成物を提供しようとするもので
ある。(Problems to be Solved by the Invention) The present invention has been made in order to solve the above-mentioned drawbacks, and has excellent adhesiveness, in particular, adhesiveness after solder immersion and folding resistance, and has a stickiness on a B-stage. An object of the present invention is to provide an adhesive composition for an FPC substrate which has a small amount of workability.
［発明の構成］ （課題を解決するための手段） 本発明者らは、上記の目的を達成しようと鋭意研究を
重ねた結果、合成ゴムの劣化防止剤として３−（Ｎ−サ
リチロイル）アミノ−1,2,4−トリアゾールを用いるこ
とによって、熱劣化を防止し、接着性、耐折性に優れ、
かつＢ−ステージでベタツキの少ない組成物が得られる
ことを見いだし、本発明を完成したものである。[Constitution of the Invention] (Means for Solving the Problems) The present inventors have conducted intensive studies to achieve the above object, and as a result, as a deterioration inhibitor of synthetic rubber, 3- (N-salicyloyl) amino- By using 1,2,4-triazole, preventing heat deterioration, excellent adhesiveness, excellent folding resistance,
Further, the present inventors have found that a composition with less stickiness can be obtained at the B-stage, and have completed the present invention.
すなわち、本発明は、 （Ａ） 熱硬化性樹脂 （Ｂ） 合成ゴム及び （Ｃ） 劣化防止剤として次の構造式を有する３−（Ｎ
−サリチロイル）アミノ−1,2,4−トリアゾール を必須成分として、導電性充填剤を含まず、（Ｂ）合成
ゴム100重量部に対し（Ｃ）劣化防止剤を0.1〜５重量部
配合するものであって、フレキシブル印刷回路基板にお
ける銅箔若しくは銅箔回路面を、該基板内の他の面に対
して、電気絶縁性に接着することを特徴とするフレキシ
ブル印刷回路基板用の接着剤組成物である。That is, the present invention provides 3- (N) having the following structural formula as (A) a thermosetting resin, (B) a synthetic rubber, and (C) a deterioration inhibitor.
-Salicyloyl) amino-1,2,4-triazole As an essential component, containing no conductive filler, and blending 0.1 to 5 parts by weight of a (C) deterioration inhibitor with respect to 100 parts by weight of (B) synthetic rubber. An adhesive composition for a flexible printed circuit board, characterized in that a copper foil circuit surface is electrically insulatively bonded to another surface in the substrate.
本発明に用いる（Ａ）熱硬化性樹脂としては、フェノ
ール樹脂、エポキシ樹脂、ポリエステル樹脂、ポリイミ
ド樹脂及びこれらの変性樹脂等が挙げられ、これらは単
独又は２種以上混合して使用することができる。これら
の熱硬化性樹脂は、通常溶剤に溶解して使用する。その
溶剤は熱硬化性樹脂を溶解するものであればよいが、接
着剤の塗布乾燥工程において溶剤が残留しないように沸
点150℃以下の溶剤であることが望ましい。Examples of the (A) thermosetting resin used in the present invention include a phenol resin, an epoxy resin, a polyester resin, a polyimide resin, and modified resins thereof, and these can be used alone or in combination of two or more. . These thermosetting resins are usually used after being dissolved in a solvent. The solvent may be any one that dissolves the thermosetting resin, but is desirably a solvent having a boiling point of 150 ° C. or lower so that the solvent does not remain in the step of applying and drying the adhesive.
本発明に用いる（Ｂ）合成ゴムとしては、アクリロニ
トリルブタジエンゴム及びその変性ゴムが挙げられ、そ
のアクリル含量、重合度等は特に制限されるものではな
い。具体的には、ニポール1432J,1072（日本ゼオン社
製、商品名）などが挙げられる。Examples of the synthetic rubber (B) used in the present invention include acrylonitrile butadiene rubber and its modified rubber, and the acryl content, the degree of polymerization, and the like are not particularly limited. Specific examples include Nipol 1432J and 1072 (trade names, manufactured by Zeon Corporation).
本発明に用いる（Ｃ）劣化防止剤は、次の構造式を有
する３−（Ｎ−サリチロイル）アミノ−1,2,4−トリア
ゾールである。The (C) deterioration inhibitor used in the present invention is 3- (N-salicyloyl) amino-1,2,4-triazole having the following structural formula.
具体的には、MARK CDA−１（アデカアーガス化学社
製、商品名）が挙げられる。この劣化防止剤の配合割合
は、合成ゴム100重量部に対して0.1〜５重量部配合する
ことが望ましい。その配合量が0.1重量部未満では合成
ゴムの劣化防止に効果がなく、また５重量部を超えると
その効果はそれ以上に向上せず、経済的に不利となり好
ましくない。 Specific examples include MARK CDA-1 (trade name, manufactured by Adeka Argus Chemical Co., Ltd.). It is desirable to add 0.1 to 5 parts by weight of the deterioration inhibitor to 100 parts by weight of the synthetic rubber. If the compounding amount is less than 0.1 part by weight, there is no effect in preventing the deterioration of the synthetic rubber, and if it exceeds 5 parts by weight, the effect is not further improved, which is economically disadvantageous and is not preferable.
本発明のFPC基板用接着剤組成物は、熱硬化性樹脂、
合成ゴム、及び３−（Ｎ−サリチロイル）アミノ−1,2,
4−トリアゾールを必須成分とするが、本発明の目的に
反しない限度において、必要に応じ微粉末の無機質又は
有機質の充填剤、含量等を添加配合することができる。The adhesive composition for an FPC substrate of the present invention is a thermosetting resin,
Synthetic rubber and 3- (N-salicyloyl) amino-1,2,
Although 4-triazole is an essential component, a fine powder of an inorganic or organic filler, a content, and the like can be added and blended as necessary, as long as the object of the present invention is not adversely affected.
上述した各成分をメチルエチルケトン／トルエン等の
溶剤を用いて均一に溶解して容易にFPC基板用接着剤組
成物を製造することができる。この組成物はFPC基板用
のみならず、銅張積層板の銅箔・基板の接着等にも使用
することができる。The components described above can be uniformly dissolved using a solvent such as methyl ethyl ketone / toluene to easily produce an adhesive composition for an FPC substrate. This composition can be used not only for FPC substrates, but also for bonding copper foil and substrates of copper-clad laminates.
（作用） 本発明のFPC基板用接着剤組成物は、３−（Ｎ−サリ
チロイル）アミノ−1,2,4−トリアゾールを配合したこ
とによって、ハンダ浸漬時の加熱による銅の触媒作用及
びアクリロニトリルブタジエンゴムの劣化作用を防止す
ることができる。その結果、ハンダ浸漬後の接着力の低
下を少なくすることができ、また接着成分としてアクリ
ルゴムを使用しないためＢ−ステージのベタツキが少な
く、耐折強さの優れたものとなった。(Function) The adhesive composition for an FPC board of the present invention contains 3- (N-salicyloyl) amino-1,2,4-triazole, thereby catalyzing copper by heating during immersion in solder and acrylonitrile-butadiene. It is possible to prevent the rubber from deteriorating. As a result, a decrease in the adhesive strength after solder immersion can be reduced, and since no acrylic rubber is used as an adhesive component, stickiness of the B-stage is small, and excellent bending strength is obtained.
（実施例） 次に、本発明を実施例によって具体的に説明するが、
本発明は、これらの実施例によって限定されるものでは
ない。(Examples) Next, the present invention will be specifically described with reference to Examples.
The present invention is not limited by these examples.
実施例 １ カルボキシル基含有アクリロニトリルブタジエンゴム
“ニポール1072"（日本ゼオン社製、商品名）50重量
部、臭素化エポキシ樹脂YDB-400（東都化成社製商品
名、エポキシ当量400）37重量部、フェノールノボラッ
ク樹脂BRG-558（昭和高分子社製商品名、水酸基当量10
6）13重量部、水酸化アルミニウムハイジライトＨ−43M
（昭和電工社製、商品名）18重量部、イミダゾール2E4M
Z（四国化成社製、商品名）0.2重量部、劣化防止剤MARK
CDA−１（アデカアーガス化学社製、商品名）0.5重量
部をメチルエチルケトンおよびトルエンに溶解してFPC
基板用接着剤組成物を製造した。この組成物を厚さ25μ
ｍのポリイミドフィルム“カプトン”（イー・アイ・デ
ュポン社製、商品名）にロールコーターで塗布し乾燥半
硬化して接着剤層厚さ38μｍのカバーレイ用シートを作
製した。このカバーレイシートと、サブトラクト法によ
りテストパターンを形成したフレキシブル銅張積層板と
を積層成形し、FPC基板を得た。この基板について引剥
し強さ、ハンダ処理後の引剥し強さ、耐折強さ、タック
性の試験を行ったので、その結果を第１表に示したが、
いずれも優れており本発明の効果が確認された。なお、
カバーレイシートのプレス条件はプレス圧30kg/cm2，温
度160℃，プレス時間30分間であった。Example 1 Carboxyl group-containing acrylonitrile butadiene rubber "Nipol 1072" (trade name, manufactured by Zeon Corporation) 50 parts by weight, brominated epoxy resin YDB-400 (trade name, manufactured by Toto Kasei Co., epoxy equivalent 400) 37 parts by weight, phenol Novolak resin BRG-558 (trade name, manufactured by Showa Polymer Co., Ltd., hydroxyl equivalent 10
6) 13 parts by weight, aluminum hydroxide Heidilite H-43M
(Product name, Showa Denko KK) 18 parts by weight, imidazole 2E4M
Z (manufactured by Shikoku Chemicals Co., Ltd.) 0.2 parts by weight, deterioration inhibitor MARK
0.5 part by weight of CDA-1 (trade name, manufactured by Adeka Argus Chemical Co., Ltd.) is dissolved in methyl ethyl ketone and toluene, and FPC
An adhesive composition for a substrate was produced. This composition has a thickness of 25μ
m was applied to a polyimide film "Kapton" (trade name, manufactured by E. I. Dupont) with a roll coater and dried and semi-cured to prepare a coverlay sheet having an adhesive layer thickness of 38 μm. This coverlay sheet and a flexible copper-clad laminate on which a test pattern was formed by a subtractive method were laminated and molded to obtain an FPC board. This substrate was tested for peel strength, peel strength after soldering, bending strength, and tackiness. The results are shown in Table 1.
All were excellent, and the effect of the present invention was confirmed. In addition,
The pressing conditions of the coverlay sheet were a pressing pressure of 30 kg / cm 2 , a temperature of 160 ° C., and a pressing time of 30 minutes.
実施例 ２ カルボキシル基含有アクリロニトリルブタジエンゴム
“ニポール1072"（前出）50重量部、臭素化エポキシ樹
脂YDB-400（前出）30重量部、フェノール樹脂CKM-908
（昭和高分子社製、商品名）20重量部、水酸化アルミニ
ウム“ハイジライトＨ−43M"（前出）18重量部、劣化防
止剤MARK CDA−１（前出）0.5重量部をメチルエチルケ
トン及びトルエンに溶解しFPC基板用接着剤組成物とし
た。この組成物を用いて実施例１と同様にしてFPC用基
板を得た。また実施例１と同様にして諸試験を行ったの
でその結果を第１表に示した。いずれもすぐれた特性を
示し、本発明の効果が確認された。Example 2 50 parts by weight of a carboxyl group-containing acrylonitrile butadiene rubber "Nipol 1072" (supra), 30 parts by weight of a brominated epoxy resin YDB-400 (supra), and a phenol resin CKM-908
20 parts by weight (manufactured by Showa Polymer Co., Ltd.), 18 parts by weight of aluminum hydroxide "Heidilite H-43M" (described above), and 0.5 part by weight of a deterioration inhibitor MARK CDA-1 (described above) were methyl ethyl ketone and toluene. To give an adhesive composition for an FPC substrate. An FPC substrate was obtained in the same manner as in Example 1 using this composition. Various tests were performed in the same manner as in Example 1. The results are shown in Table 1. All exhibited excellent characteristics, confirming the effects of the present invention.
比較例 １ 実施例１の組成において、劣化防止剤MARK CDA−１
（前出）を除いた以外はすべて実施例１と同一にして、
FPC用基板を得た。また実施例１と同様にして諸試験を
行い結果を得たので第１表に示した。Comparative Example 1 In the composition of Example 1, the deterioration inhibitor MARK CDA-1 was used.
Except for (described above), all were the same as in Example 1,
A substrate for FPC was obtained. Various tests were conducted in the same manner as in Example 1 to obtain the results. The results are shown in Table 1.
比較例 ２ 実施例１の組成においてカルボキシル基含有アクリロ
ニトリルブタジエンゴムの代わりにアクリルゴム“テイ
サンレジンSG-700S"（帝国化学産業社製、商品名）を用
いた以外はすべて実施例１と同一にして、FPC用基板を
得た。また実施例１と同様にして諸試験を行ったので、
その結果を第１表に示した。Comparative Example 2 The same procedure as in Example 1 was carried out except that in the composition of Example 1, an acrylic rubber "Teisan Resin SG-700S" (trade name, manufactured by Teikoku Chemical Industry Co., Ltd.) was used instead of the carboxyl group-containing acrylonitrile butadiene rubber. Thus, an FPC substrate was obtained. In addition, since various tests were performed in the same manner as in Example 1,
The results are shown in Table 1.
［発明の効果］ 以上の説明および第１表から明らかなように、本発明
のFPC基板用接着剤組成物は、接着性、特にハンダフロ
ート後の接着性、耐折性に優れ、またＢ−ステージのベ
タツキがなく作業性のよいものである。 [Effects of the Invention] As is clear from the above description and Table 1, the adhesive composition for an FPC substrate of the present invention is excellent in adhesiveness, particularly adhesiveness after solder float, folding resistance, and B- There is no stickiness on the stage and good workability.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 //(Ｃ０９Ｊ 121/00 201:00） (Ｃ０９Ｊ 109/02 201:00） (Ｃ０９Ｊ 115/00 201:00） ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification number Agency reference number FI Technical display location // (C09J 121/00 201: 00) (C09J 109/02 201: 00) (C09J 115/00) 201: 00)
Claims (2)
−サリチロイル）アミノ−1,2,4−トリアゾール を必須成分として、導電性充填剤を含まず、（Ｂ）合成
ゴム100重量部に対し（Ｃ）劣化防止剤を0.1〜５重量部
配合するものであって、フレキシブル印刷回路基板にお
ける銅箔若しくは銅箔回路面を、該基板内の他の面に対
して、電気絶縁性に接着することを特徴とするフレキシ
ブル印刷回路基板用の接着剤組成物。(A) a thermosetting resin (B) a synthetic rubber and (C) a 3- (N) compound having the following structural formula as a deterioration inhibitor:
-Salicyloyl) amino-1,2,4-triazole As an essential component, containing no conductive filler, and blending 0.1 to 5 parts by weight of a (C) deterioration inhibitor with respect to 100 parts by weight of (B) synthetic rubber. An adhesive composition for a flexible printed circuit board, wherein a copper foil circuit face is electrically insulatively bonded to another face in the board.
タジエンゴム及びその変性ゴムである特許請求の範囲第
１項記載のフレキシブル印刷回路基板用の接着剤組成
物。2. The adhesive composition for a flexible printed circuit board according to claim 1, wherein said synthetic rubber (B) is acrylonitrile butadiene rubber and its modified rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP64000228A JP2722402B2 (en) | 1989-01-04 | 1989-01-04 | Adhesive composition for flexible printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP64000228A JP2722402B2 (en) | 1989-01-04 | 1989-01-04 | Adhesive composition for flexible printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02180977A JPH02180977A (en) | 1990-07-13 |
| JP2722402B2 true JP2722402B2 (en) | 1998-03-04 |
Family
ID=11468104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP64000228A Expired - Lifetime JP2722402B2 (en) | 1989-01-04 | 1989-01-04 | Adhesive composition for flexible printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2722402B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2854639B2 (en) | 1989-12-07 | 1999-02-03 | 東芝ケミカル株式会社 | Adhesive composition for flexible printed circuit board |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0739569B2 (en) * | 1989-10-30 | 1995-05-01 | 株式会社日立製作所 | Base adhesive for electroless plating, printed circuit board using the adhesive and method for producing the same |
| US6054509A (en) * | 1997-08-28 | 2000-04-25 | Shin-Etsu Chemical Co., Ltd. | Adhesive of epoxy resin, nitrile rubbers and curing agent |
| KR20130041776A (en) * | 2010-03-31 | 2013-04-25 | 린텍 코포레이션 | Adhesive composition, adhesive sheet, and method for producing semiconductor device |
| JP6489263B2 (en) * | 2018-04-12 | 2019-03-27 | 住友ベークライト株式会社 | Resin composition for sealing and electronic component device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63178181A (en) * | 1987-01-20 | 1988-07-22 | Hitachi Chem Co Ltd | Adhesive composition |
-
1989
- 1989-01-04 JP JP64000228A patent/JP2722402B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2854639B2 (en) | 1989-12-07 | 1999-02-03 | 東芝ケミカル株式会社 | Adhesive composition for flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02180977A (en) | 1990-07-13 |
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