JPH02180977A - Adhesive composition for flexible printed circuit board - Google Patents
Adhesive composition for flexible printed circuit boardInfo
- Publication number
- JPH02180977A JPH02180977A JP22889A JP22889A JPH02180977A JP H02180977 A JPH02180977 A JP H02180977A JP 22889 A JP22889 A JP 22889A JP 22889 A JP22889 A JP 22889A JP H02180977 A JPH02180977 A JP H02180977A
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- adhesive composition
- weight
- printed circuit
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 title claims description 24
- 239000000853 adhesive Substances 0.000 title claims description 20
- 229920003051 synthetic elastomer Polymers 0.000 claims abstract description 12
- 239000005061 synthetic rubber Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- MZZYGYNZAOVRTG-UHFFFAOYSA-N 2-hydroxy-n-(1h-1,2,4-triazol-5-yl)benzamide Chemical compound OC1=CC=CC=C1C(=O)NC1=NC=NN1 MZZYGYNZAOVRTG-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920001971 elastomer Polymers 0.000 claims abstract description 5
- 239000005060 rubber Substances 0.000 claims abstract description 5
- 230000006866 deterioration Effects 0.000 claims description 13
- 229920000459 Nitrile rubber Polymers 0.000 claims description 11
- 239000003112 inhibitor Substances 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 12
- 239000002904 solvent Substances 0.000 abstract description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- 238000007654 immersion Methods 0.000 abstract description 4
- 239000011256 inorganic filler Substances 0.000 abstract description 2
- 239000012766 organic filler Substances 0.000 abstract description 2
- 239000000049 pigment Substances 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract 2
- 239000003963 antioxidant agent Substances 0.000 abstract 2
- 230000003078 antioxidant effect Effects 0.000 abstract 2
- 239000005062 Polybutadiene Substances 0.000 abstract 1
- 229920002857 polybutadiene Polymers 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 229920000800 acrylic rubber Polymers 0.000 description 4
- 229920000058 polyacrylate Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 241000156978 Erebia Species 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- -1 methyl ethyl Chemical group 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- SNTWKPAKVQFCCF-UHFFFAOYSA-N 2,3-dihydro-1h-triazole Chemical compound N1NC=CN1 SNTWKPAKVQFCCF-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 241000981595 Zoysia japonica Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- AKKYYRRXEDROIC-UHFFFAOYSA-N butane;prop-2-enenitrile Chemical compound CCCC.C=CC#N AKKYYRRXEDROIC-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
し発明の目的］
（産業上の利用分野）
本発明は、接着性、耐熱性、耐折強さに優れ、作業性の
よいフレキシブル印刷回路基板用の接着剤組成物に関す
る。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention provides an adhesive composition for flexible printed circuit boards that has excellent adhesiveness, heat resistance, and bending strength, and is easy to work with. Regarding.
（従来の技術）
近年、電子機器の小形化、軽量化、高密度化の要求はま
すます増大している。 フレキシブル印刷回路基板（以
下ＦＰＣ基板ともいう）は、軽量で立体的に実装できる
ため、こうした小形化・軽量化の要求には大変有利であ
る。 このフレキシブル印刷回路基板には、回路の酸化
防止、屈曲性の向上部のために、カバーレイシートが積
層接着されている。 このカバーレイシートの接着剤に
は、接着性、耐熱性、屈曲性、電気絶縁性のほか、積層
加工時の回路埋込性、作業性、半硬化状態での保存寿命
などが要求される。 これらの要求を満たず接着剤とし
ては、従来アクリロニトリルブクジエンゴム／フェノー
ル樹脂系、アクリロニトリルブタジェンゴム／エポキシ
樹脂系、カルボキシ含有アクリロニトリルブタジェンゴ
ムアクリルゴム／エポキシ樹脂系などの接着剤が用いら
れている。(Prior Art) In recent years, demands for electronic devices to be smaller, lighter, and more dense have been increasing. Flexible printed circuit boards (hereinafter also referred to as FPC boards) are lightweight and can be mounted three-dimensionally, so they are very advantageous in meeting these demands for smaller size and lighter weight. A coverlay sheet is laminated and bonded to this flexible printed circuit board to prevent oxidation of the circuit and improve flexibility. The adhesive for this coverlay sheet is required to have adhesive properties, heat resistance, flexibility, electrical insulation, as well as circuit embedding during lamination processing, workability, and shelf life in a semi-cured state. Conventionally, adhesives that do not meet these requirements include acrylonitrile butadiene rubber/phenol resin, acrylonitrile butadiene rubber/epoxy resin, and carboxy-containing acrylonitrile butadiene rubber acrylic rubber/epoxy resin. There is.
しかしながら、アクリルニトリルブタジェンゴム、カル
ボキシル含有アクリロニトリルブタジェンゴム等を使用
した接着剤では、回路を形成する銅がハンダ浸漬時に熱
劣化の触媒となってアクリロニトリルブタジェンゴムが
酸化劣化され、ハンダ浸漬後の接着力が著し、く低下す
るという欠点がある。 また、アクリルゴムを使用した
接着剤では、こうした加熱による劣化は少ないが、カバ
ーレイとして用いたとき、Ｂ−ステージでのベタツキが
大きく、加工工程での作業性が悪く、更にＦＰＣ用基板
基板たときの耐折性に劣るという欠点があった。However, with adhesives using acrylonitrile butadiene rubber, carboxyl-containing acrylonitrile butadiene rubber, etc., the copper that forms the circuit acts as a catalyst for thermal deterioration during solder immersion, and the acrylonitrile butadiene rubber is oxidized and deteriorated. The disadvantage is that the adhesion strength is significantly reduced. Adhesives using acrylic rubber are less susceptible to such deterioration due to heating, but when used as a coverlay, they are highly sticky at the B-stage, making workability in the processing process poor, and furthermore, when used as a coverlay, they are difficult to work with in the processing process. It had the disadvantage of poor folding durability.
（発明が解決しようとする課題）
本発明は、上記の欠点を解消するためになされたもので
、接着性、特にハンダ浸漬後の接着性、耐折性に優れ、
Ｂ−ステージでのベタツキの少なくて作業性のよい、Ｆ
ＰＣ基板用接着剤組成物を提供しようとするものである
。(Problems to be Solved by the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and has excellent adhesive properties, especially adhesive properties after being immersed in solder, and folding durability.
B-Stage F with less stickiness and good workability
The present invention aims to provide an adhesive composition for PC boards.
［発明の構成］
（課題を解決するための手段）
本発明者らは、上記の目的を達成しようと鋭意研究を重
ねた結果、合成ゴムの劣化防止剤として３−（Ｎ−サリ
チロイル）アミノ−１，２，４−）リアゾールを用いる
ことによって、熱劣化を防止し、接着性、耐折性に優れ
、かつＢ−ステージでベタツキの少ない組成物が得られ
ることを見いだし、本発明を完成したものである。[Structure of the Invention] (Means for Solving the Problems) As a result of intensive research aimed at achieving the above object, the present inventors discovered 3-(N-salicyloyl)amino- as a deterioration inhibitor for synthetic rubber. The present inventors have discovered that by using 1,2,4-) lyazole, it is possible to obtain a composition that prevents thermal deterioration, has excellent adhesiveness and folding durability, and is less sticky at the B-stage, and has completed the present invention. It is something.
すなわち、本発明は、
（Ａ）熱硬化性樹脂
（Ｂ）合成ゴム及び
（Ｃ）劣化防止剤として次の構造式を有する３−（Ｎ−
サリチロイル）アミノ−１，２，４−トリアゾール
を必須成分とし、ＣＢ）合成ゴム１００重量部に対しく
Ｃ）劣化防止剤０．１〜５１量部を配合することを特徴
とするＦＰＣ基板用棲着剤組成物である。That is, the present invention provides (A) a thermosetting resin, (B) a synthetic rubber, and (C) a deterioration inhibitor having the following structural formula: 3-(N-
1,2,4-triazole (salicyloyl) as an essential component, and C) 0.1 to 51 parts by weight of a deterioration inhibitor to 100 parts by weight of CB) synthetic rubber is blended. It is an adhesive composition.
本発明に用いる（Ａ）熱硬化性樹脂としては、フェノー
ル樹脂、エポキシ樹脂、ポリエステル樹脂、ポリイミド
樹脂及びこれらの変性樹脂等が挙げられ、これらは単独
又は２種以上混合して使用することができる。 これら
の熱硬化性樹脂は、通常溶剤に溶解して使用する。 そ
の溶剤は熱硬化性樹脂を溶解するものであればよいが、
接着剤の塗布乾燥工程において溶剤が残留しないように
沸点１５０℃以下の溶剤であることが望ましい。Examples of the thermosetting resin (A) used in the present invention include phenol resins, epoxy resins, polyester resins, polyimide resins, and modified resins thereof, and these can be used alone or in a mixture of two or more kinds. . These thermosetting resins are usually used after being dissolved in a solvent. The solvent may be one that dissolves the thermosetting resin, but
It is desirable that the solvent has a boiling point of 150° C. or lower so that no solvent remains during the adhesive coating and drying process.
本発明に用いる（Ｂ）合成ゴムとしては、アクリロニト
リルブタジェンゴム及びその変性ゴムが挙げられ、その
アクリル含量、重合度等は特に制限されるものではない
、 具体的には、二ボール１４３２Ｊ、１０７２（日本
ゼオン社製、商品名）などが挙げられる。Examples of the synthetic rubber (B) used in the present invention include acrylonitrile butadiene rubber and its modified rubber, and the acrylic content, degree of polymerization, etc. thereof are not particularly limited. Specifically, two-ball 1432J, 1072 (manufactured by Nippon Zeon Co., Ltd., trade name).
本発明に用いる（Ｃ）劣化防止剤は、次の構造式を有す
る３−（Ｎ−サリチロイル）アミノ−１，２，４−トリ
アゾールである。The deterioration inhibitor (C) used in the present invention is 3-(N-salicyloyl)amino-1,2,4-triazole having the following structural formula.
具体的には、ＭＡＲＫ ＣＤＡ−１（アデカアーガス
化学社製、商品名）が挙げられる。 この劣化防止剤の
配合割合は、合成ゴム１００重量部に対して０．１〜５
重量部置部することが望ましい。Specifically, MARK CDA-1 (manufactured by Adeka Argus Chemical Co., Ltd., trade name) may be mentioned. The blending ratio of this deterioration inhibitor is 0.1 to 5 parts by weight per 100 parts by weight of synthetic rubber.
It is desirable to use a heavy weight section.
その配合量が０．１重量部未満では合成ゴムの劣化防止
に効果がなく、また５重量部を超えるとその効果はそれ
以上に向上せず、経済的に不利となり好ましくない。If the amount is less than 0.1 part by weight, it will not be effective in preventing the deterioration of the synthetic rubber, and if it exceeds 5 parts by weight, the effect will not be further improved, which is undesirable because it is economically disadvantageous.
本発明のＦＰＣ基板用接着剤組成物は、熱硬化性樹脂、
合成ゴム、及び３−（Ｎ−サリチロイル）アミノ−１２
，４−トリアゾールを必須成分とするが、本発明の目的
に反しない限度において、必要に応じ微粉末の無機質又
は有機質の充填剤、顔料等を添加配合することができる
。The adhesive composition for FPC board of the present invention comprises a thermosetting resin,
Synthetic rubber, and 3-(N-salicyloyl)amino-12
, 4-triazole are essential components, but if necessary, finely powdered inorganic or organic fillers, pigments, etc. may be added and blended within the limits not contrary to the purpose of the present invention.
上述した各成分をメチルエチルケトン／トルエン等の溶
剤を用いて均一に溶解して容易にＦＰＣ基板用接着剤組
成物を製造することができる。An adhesive composition for an FPC board can be easily produced by uniformly dissolving each of the above-mentioned components using a solvent such as methyl ethyl ketone/toluene.
この組成物はＦＰＣ基板用のみならず、＠張積層板の銅
箔・基板の接着等にも使用することができる。This composition can be used not only for FPC boards, but also for adhesion between copper foil and boards for @-strapped laminates.
（作用）
本発明のＦＰＣ基板用接着剤組成物は、３−（Ｎ−サリ
チロイル）アミノ−１，２，４−トリアゾールを配合し
たことによって、ハンダ浸漬時の加熱による銅の触媒作
用及びアクリロニトリルブタジェンゴムの劣化作用を防
止することかできる。 その結果、ハンダ浸漬後の接着
力の低下を少なくすることができ、また接着成分として
アクリルゴムを使用しないためＢ−ステージのベタツキ
が少なく、耐折強さの優れたものとなった。(Function) By incorporating 3-(N-salicyloyl)amino-1,2,4-triazole into the adhesive composition for FPC boards of the present invention, the catalytic action of copper and the acrylonitrile butane caused by heating during solder immersion are improved. It is possible to prevent the deterioration effect of Gen rubber. As a result, it was possible to reduce the decrease in adhesive strength after immersion in solder, and since no acrylic rubber was used as an adhesive component, the B-stage was less sticky and had excellent folding strength.
（実施例）
次に、本発明を実施例によって具体的に説明するが、本
発明は、これらの実施例によって限定されるものではな
い。(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited to these examples.
実施例 １
カルボキシル基含有アクリロニトリルブタジェンゴム“
二ボール１０７２” 〈日本ゼオン社製、商品名）５０
重量部、臭素化エポキシ樹脂ＹＤＢ−４００（東部化成
社製商品名、エポキシ当量４００）３７重量部、フェノ
ールノボラック樹脂ＢＲＧ−５５８（昭和高分子社製商
品名、水酸基当量１０６）１３重量部、水酸化アルミニ
ウムハイシライトＨ−４３Ｍ（昭和電工社製、商品名）
１８重量部、イミダゾール２Ｅ４ＭＺ （四国化成社製
、商品名）０．２重量部、劣化防止剤ＭＡＲＫ ＣＤ
Ａ−１（アデカアーガス化学社製、商品名）０．５重量
部をメチルエチルゲトンおよびトルエンに溶解してＦＰ
Ｃ基板用接着剤組成物を製造した。 この組成物を厚さ
２５μｍのポリイミドフィルム“カプトン” 〈イー・
アイ・デュポン社製、商品名）にロールコータ−で塗布
し乾燥半硬化して接着剤層厚さ３８μｍのカバーレイ用
シートを作製した。 このカバーレイシートと、サブト
ラクト法によりテストパターンを形成したフレキシブル
銅張積層板とを積層成形し、ＲＰＣ基板を得な、 この
基板について引剥し強さ、ハンダ処理後の引剥し強さ、
耐折強さ、タック性の試験を行ったので、その結果を第
１表に示したが、いずれも優れており本発明め効果が確
認された。 なお、カバーレイシートのプレス条件はプ
レス圧３０ｋｇ／ｃｍ’ 、温度１６０℃、プレス時間
３０分間であった。Example 1 Carboxyl group-containing acrylonitrile butadiene rubber
Two-ball 1072” (manufactured by Nippon Zeon Co., Ltd., product name) 50
Parts by weight, 37 parts by weight of brominated epoxy resin YDB-400 (trade name, manufactured by Tobu Kasei Co., Ltd., epoxy equivalent: 400), 13 parts by weight, phenol novolac resin BRG-558 (trade name, manufactured by Showa Kobunshi Co., Ltd., hydroxyl equivalent: 106), water Aluminum oxide Hisilite H-43M (manufactured by Showa Denko, trade name)
18 parts by weight, imidazole 2E4MZ (manufactured by Shikoku Kasei Co., Ltd., trade name) 0.2 parts by weight, anti-deterioration agent MARK CD
FP by dissolving 0.5 parts by weight of A-1 (manufactured by Adeka Argus Chemical Co., Ltd., trade name) in methyl ethyl getone and toluene.
An adhesive composition for C substrate was manufactured. This composition was made into a polyimide film “Kapton” with a thickness of 25 μm.
A coverlay sheet with an adhesive layer thickness of 38 μm was prepared by applying the adhesive to I-Dupont Co., Ltd. (trade name) using a roll coater and drying and semi-curing. This coverlay sheet and a flexible copper-clad laminate on which a test pattern was formed by the subtract method were laminated and molded to obtain an RPC board.The peel strength of this board, the peel strength after soldering,
Tests were conducted on folding strength and tackiness, and the results are shown in Table 1. Both were excellent, confirming the effects of the present invention. The press conditions for the coverlay sheet were a press pressure of 30 kg/cm', a temperature of 160° C., and a press time of 30 minutes.
実施例 ２
カルボキシル基含有アクリロニトリルブタジェンゴム“
二ボール１０７２” （前出）５０重量部、臭素化エポ
キシ樹脂ＹＤＢ−４００（前出）３０重量部、フェノー
ル樹脂ＣＫＭ−９０８（昭和高分子社製、商品名）２０
重量部、水酸化アルミニウム“ハイシライトＨ−４３Ｍ
” （前出）１８重量部、劣化防止剤ＭＡＲＫ Ｃ
ＤＡ−１（前出）０．５重量部をメチルエチルゲトン及
びトルエンに溶解しＦＰＣ基板用接着剤組成物としな、
この組成物を用いて実施例１と同様にしてＦＰＣ用基
板を得た。 また実施例１と同様にして諸試験を行った
のでその結果を第１表に示した。 いずれもすぐれた特
性を示し、本発明の効果が確認された。Example 2 Carboxyl group-containing acrylonitrile butadiene rubber
Two balls 1072" (as above) 50 parts by weight, brominated epoxy resin YDB-400 (as above) 30 parts by weight, phenolic resin CKM-908 (manufactured by Showa Kobunshi Co., Ltd., trade name) 20
Part by weight, aluminum hydroxide "Hisilite H-43M"
” (previously) 18 parts by weight, anti-deterioration agent MARK C
Dissolve 0.5 parts by weight of DA-1 (mentioned above) in methyl ethyl getone and toluene to prepare an adhesive composition for FPC board,
Using this composition, an FPC substrate was obtained in the same manner as in Example 1. Further, various tests were conducted in the same manner as in Example 1, and the results are shown in Table 1. All exhibited excellent properties, confirming the effects of the present invention.
比較例 １
実施例１の組成において、劣化防止剤ＭＡＲＫＣＤＡ−
１（前出）を除いた以外はすべて実施例１と同一にして
、ＦＰＣ用基板を得た。 また実施例１と同様にして諸
試験を行い結果を得たので第、１表に示した。Comparative Example 1 In the composition of Example 1, the deterioration inhibitor MARKCDA-
An FPC board was obtained in the same manner as in Example 1 except for 1 (described above). In addition, various tests were conducted in the same manner as in Example 1, and the results are shown in Table 1.
比較例 ２
実施例１の組成においてカルボキシル基含有アクリロニ
トリルブタジェンゴムの代わりにアクリルゴム“ティサ
ンレジン９Ｇ−７００３″ （帝国化学産業社製、商品
名）を用いた以外はずべて実施例１と同一にして、ＦＰ
Ｃ用基板を得な、 また実施例１と同様にして諸試験を
行ったので、その結果を第１表に示した。Comparative Example 2 The composition of Example 1 was the same as in Example 1 except that acrylic rubber "Tisan Resin 9G-7003" (manufactured by Teikoku Kagaku Sangyo Co., Ltd., trade name) was used instead of the carboxyl group-containing acrylonitrile butadiene rubber. Te, FP
After obtaining the C substrate, various tests were conducted in the same manner as in Example 1, and the results are shown in Table 1.
第
表
（単位）
＊１ ： ＩＰＣ−ＰＣ−２４０Ｂによる。 バンダ
ーフロート柴件２６０″Ｃ２２０秒
＄２ ： Ｊ Ｉ ５−Ｐ−８１１５による。Table (Units) *1: According to IPC-PC-240B. Vanderfloat Shiba 260″C220 seconds $2: According to J I 5-P-8115.
＊３ ：Ｏ印・・・ベタツキなし ×印・・・ベタツキ
有り［発明の効果］
以上の説明および第１表から明らかなように、本発明の
ＦＰＣ基板用接着剤組成物は、接着性、特にハンダフロ
ート後の接着性、耐折性に優れ、またＢ−ステージのベ
タツキがなく作業性のよいものである。*3: O mark: No stickiness × mark: Stickiness [Effects of the invention] As is clear from the above explanation and Table 1, the adhesive composition for FPC substrates of the present invention has adhesive properties, In particular, it has excellent adhesion and folding durability after solder float, and has no stickiness on the B-stage and is easy to work with.
Claims (1)
アゾール ▲数式、化学式、表等があります▼ を必須成分とし、（Ｂ）合成ゴム１００重量部に対し（
Ｃ）劣化防止剤を０．１〜５重量部配合することを特徴
とするフレキシブル印刷回路基板用の接着剤組成物。 ２ 前記（Ｂ）合成ゴムがアクリロニトリルブタジエン
ゴム及びその変性ゴムである特許請求の範囲第１項記載
のフレキシブル印刷回路基板用の接着剤組成物。[Scope of Claims] 1 (A) thermosetting resin (B) synthetic rubber and (C) 3-(N-salicyloyl)amino-1,2,4-triazole having the following structural formula as a deterioration inhibitor▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ is an essential component, and (B) per 100 parts by weight of synthetic rubber (
C) An adhesive composition for a flexible printed circuit board, which contains 0.1 to 5 parts by weight of a deterioration inhibitor. 2. The adhesive composition for a flexible printed circuit board according to claim 1, wherein the synthetic rubber (B) is acrylonitrile butadiene rubber or a modified rubber thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP64000228A JP2722402B2 (en) | 1989-01-04 | 1989-01-04 | Adhesive composition for flexible printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP64000228A JP2722402B2 (en) | 1989-01-04 | 1989-01-04 | Adhesive composition for flexible printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02180977A true JPH02180977A (en) | 1990-07-13 |
| JP2722402B2 JP2722402B2 (en) | 1998-03-04 |
Family
ID=11468104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP64000228A Expired - Lifetime JP2722402B2 (en) | 1989-01-04 | 1989-01-04 | Adhesive composition for flexible printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2722402B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03220281A (en) * | 1989-10-30 | 1991-09-27 | Hitachi Ltd | Priming adhesive for electroless plating, printed circuit board produced therewith, and production of circuit board |
| US6054509A (en) * | 1997-08-28 | 2000-04-25 | Shin-Etsu Chemical Co., Ltd. | Adhesive of epoxy resin, nitrile rubbers and curing agent |
| WO2011125712A1 (en) * | 2010-03-31 | 2011-10-13 | リンテック株式会社 | Adhesive composition, adhesive sheet, and method for producing semiconductor device |
| JP2018115339A (en) * | 2018-04-12 | 2018-07-26 | 住友ベークライト株式会社 | Sealing resin composition and electronic component device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2854639B2 (en) | 1989-12-07 | 1999-02-03 | 東芝ケミカル株式会社 | Adhesive composition for flexible printed circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63178181A (en) * | 1987-01-20 | 1988-07-22 | Hitachi Chem Co Ltd | Adhesive composition |
-
1989
- 1989-01-04 JP JP64000228A patent/JP2722402B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63178181A (en) * | 1987-01-20 | 1988-07-22 | Hitachi Chem Co Ltd | Adhesive composition |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03220281A (en) * | 1989-10-30 | 1991-09-27 | Hitachi Ltd | Priming adhesive for electroless plating, printed circuit board produced therewith, and production of circuit board |
| US6054509A (en) * | 1997-08-28 | 2000-04-25 | Shin-Etsu Chemical Co., Ltd. | Adhesive of epoxy resin, nitrile rubbers and curing agent |
| WO2011125712A1 (en) * | 2010-03-31 | 2011-10-13 | リンテック株式会社 | Adhesive composition, adhesive sheet, and method for producing semiconductor device |
| JP2018115339A (en) * | 2018-04-12 | 2018-07-26 | 住友ベークライト株式会社 | Sealing resin composition and electronic component device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2722402B2 (en) | 1998-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6054509A (en) | Adhesive of epoxy resin, nitrile rubbers and curing agent | |
| US5674611A (en) | Adhesive for copper foils and an adhesive-applied copper foil | |
| JP2009167396A (en) | Adhesive composition, copper-clad laminate plate using the same, cover-lay film and adhesive sheet | |
| JP2008231235A (en) | Adhesive composition for semiconductor device, adhesive sheet for semiconductor device using the same, cover-lay film and copper-clad laminate | |
| JPH02180977A (en) | Adhesive composition for flexible printed circuit board | |
| JP2005015506A (en) | Adhesive composition for semiconductor device and adhesive sheet and cover lay film and copper-clad polyimide film using the same | |
| JP2008195846A (en) | Resin composition for printed circuit board, electrical insulation material with substrate, and metal-clad laminated board | |
| JP2007161811A (en) | Adhesive composition for flexible base board and flexible printed wiring board using the same | |
| JPH06330016A (en) | Adhesive composition for flexible printed circuit board | |
| JP2854639B2 (en) | Adhesive composition for flexible printed circuit board | |
| JP2650158B2 (en) | Adhesive composition for flexible printed circuit board | |
| JP4665414B2 (en) | Adhesive composition for semiconductor device and coverlay film, adhesive sheet, copper-clad polyimide film using the same | |
| JPH0552873B2 (en) | ||
| JPH08283535A (en) | Adhesive composition for flexible printed circuit board | |
| JPH0552872B2 (en) | ||
| JP3291028B2 (en) | Adhesive composition for flexible printed circuit board | |
| JPH02180978A (en) | Adhesive composition for flexible printed circuit board | |
| JP3065682B2 (en) | Flexible printed circuit board | |
| JPH0328285A (en) | Flame-retardant adhesive and flame-retardant coverlay film | |
| JP2008214560A (en) | Adhesive composition, and adhesive sheet, cover-lay film and copper-clad laminate each using the same | |
| JPH06216521A (en) | Adhesive composition for flexible printed circuit board | |
| KR20170005506A (en) | Adhesive composition for cupper clad laminate | |
| KR20090080783A (en) | Halogen-free coverlay adhesive composition and coverlay film using the same | |
| JPH05347477A (en) | Adhesive composition for flexible printed circuit substrate | |
| JPS61195115A (en) | Adhesive composition for flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081128 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091128 Year of fee payment: 12 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091128 Year of fee payment: 12 |