JPH0553628B2 - - Google Patents
Info
- Publication number
- JPH0553628B2 JPH0553628B2 JP59037487A JP3748784A JPH0553628B2 JP H0553628 B2 JPH0553628 B2 JP H0553628B2 JP 59037487 A JP59037487 A JP 59037487A JP 3748784 A JP3748784 A JP 3748784A JP H0553628 B2 JPH0553628 B2 JP H0553628B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- present
- resin film
- heat
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010408 film Substances 0.000 claims description 70
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 229920001187 thermosetting polymer Polymers 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 21
- 229920000647 polyepoxide Polymers 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 8
- 239000013039 cover film Substances 0.000 claims description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 17
- -1 polyethylene terephthalate Polymers 0.000 description 9
- 238000005476 soldering Methods 0.000 description 9
- 239000012787 coverlay film Substances 0.000 description 8
- 239000000976 ink Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000011088 parchment paper Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
本発明は熱硬化性樹脂フイルム積層体に関する
ものである。さらに詳しくは、樹脂フイルム層を
プリント配線板に貼合せ加熱圧着により耐熱性絶
縁層を形成するための熱硬化性樹脂フイルム積層
体に関するものである。
最近、コンピユーター、通信機器、OA機器、
家電製品に代表されるエレクトロニクス産業の発
展はめざましく、これに伴つてこれらの電子機器
に使用されるプリント配線板も高精度化、高密度
化、低コスト化、高信頼性などの要求がますます
高まつてきている。このプリント配線用基板とし
てはガラス−エポキシ銅張積層板に代表される硬
質基板と、ポリイミドフイルム銅張板に代表され
るフレキシブル基板があるが、小型化、軽量化、
立体配線等が可能であることから近年後者のフレ
キシブル基板の需要が著しく伸びてきている。
周知の通り、プリント配線板に部品を実装する
際半田付けが必要であるが、この半田付けに際し
て半田不要部分を耐熱性絶縁性被膜で被覆し、露
出部分に選択的に半田付けを行う必要がある。ま
たこの耐熱性絶縁性被膜は半田付けの後の導体回
路を外的環境から保護するための永久保護膜の役
目を果している。フレキシブル印刷配線板の場
合、この耐熱性絶縁性被膜として、耐熱性フイル
ムのカバー・レイ・フイルムを使用するか、可撓
性のソルダー・レジスト・インキを用いるのが一
般的である。しかし現在半田耐熱性のあるカバ
ー・レイ・フイルムすなわちポリイミド・フイル
ムを用いたカバー・レイ・フイルムは極めて高価
であり、また耐湿性に欠けるという欠点がある。
一方ポリエチレンテレフタレートフイルムを用い
たカバー・レイ・フイルムは安価ではあるが耐熱
性に欠け、半田付けが困難である。またソルダ
ー・レジスト・インキの場合、印刷方法がスクリ
ーン印刷によるため、ピンホールが発生しやすく
信頼性に欠けるという欠点があり、特に溶剤型ソ
ルダー・レジスト・インキではこの傾向がつよく
信頼性をあげるためには、何度も印刷しなければ
ならない。最近では溶剤を含まない紫外線硬化型
ソルダー・レジスト・インキも開発されている
が、可撓性の点で必ずしも十分でないのが現状で
ある。
一方、最近では上記カバー・レイ・フイルムや
ソルダー・レジスト・インキに代わつて、露光に
よりパターン形成可能で活つ耐熱性も付与された
所謂ソルダー・レジスト用ドライフイルムも提案
されているが可撓性、半田耐熱性の点でまだ十分
なものではない。
本発明者らはこのような業界の強い要望に応え
るべく鋭意研究を重ねた結果、従来のカバー・レ
イ・フイルムやソルダー・レジスト・インキ等に
代わる耐熱性樹脂フイルム積層体を見出し本発明
に到達した。
即ち本発明は離型性カバーフイルム、熱硬化性
樹脂フイルム層および離型性フイルムの3層から
なる積層体であり、該樹脂フイルム層はアクリロ
ニトリル−ブタジエン共重合体(a)、エポキシ樹脂
(b)、エポキシ樹脂硬化剤(c)を含有し、(a)/(b)が重
量比で20/80〜80/20、(c)/(b)が0.5/100〜
100/100および(a)のアクリロニトリル/ブタジエ
ンが5/95〜50/50の範囲にある熱硬化性樹脂フ
イルム積層体である。
本発明の熱硬化性樹脂フイルム積層体は従来の
カバー・レイ・フイルムと異なり、ポリイミドフ
イルムのような高価な耐熱性フイルムを使用して
いないため極めて安価であり、また耐熱性絶縁性
被膜の形成に印刷法を用いないためソルダー・レ
ジスト・インキのようなピンホールの発生もな
い。本発明の熱硬化性レジスト・フイルム積層体
を用いて形成した耐熱性絶縁性被膜は半田耐熱誠
に優れ、半田もぐり現象が認められないばかりで
なく、電気絶縁性、耐湿性、可撓性に優れるため
特にフレキシブル配線板の永久保護膜として有用
である。
本発明の熱硬化性樹脂フイルム積層体は離型性
フイルムの離型性面上に熱硬化性樹脂フイルム層
を設け、該熱硬化性樹脂フイルム層の上に、さら
に離型性カバーフイルムを設けた3層構造からな
る。
本発明で使用する離型性フイルムおよび離型性
カバー・フイルムとは、本発明の熱硬化性樹脂フ
イルム層と剥離可能なフイルムであればよく、例
えばポリエチレン、PVA、CMCなどのアンカー
コートをしたクラフト紙、シリコン系離型剤、弗
素系離型剤で処理したグラシン紙、パーチメント
紙などで代表される離型紙、離型剤処理したポリ
エチレンテレフタレートフイルム、ポリプロピレ
ンフイルム、ポリエチレンフイルム、ナイロンフ
イルムなど合成樹脂フイルムである。
本発明の熱硬化性樹脂フイルム層はアクリロニ
トリル−ブタジエン共重合体(a)、エポキシ樹脂
(b)、エポキシ樹脂硬化剤(c)を含有する。
本発明で使用するアクリロニトリル−ブタジエ
ン共重合体(a)とはアクリロニトリルとブタジエン
の共重合体であり、アクリロニトリルを5〜50重
量%含有する。また該アクリロニトリル−ブタジ
エン共重合体中に例えば末端にカルボキシル基、
アミノ基、水酸基などの反応性有機基を含有して
もよい。
本発明で使用するエポキシ樹脂としては、ビス
フエノールA型エポキシ樹脂、例えば商品名エピ
コート828、1001、1004、1007、1010など、フエ
ノールノボラツク型エポキシ樹脂、例えばエピコ
ート154など、臭素化ビスフエノールA型エポキ
シ樹脂、商品名エポトートYOB−400などの他、
公知のエポキシ樹脂が使用可能である。
本発明で使用されるエポキシ樹脂硬化剤(c)とし
ては、トリエタノールアミン、トリエチレンテト
ラミンなどのアミン系硬化剤、ポリアミド系硬化
剤、テトラヒドロ無水フタル酸、無水フタル酸な
どの酸無水物系硬化剤、2−エチル−4−メチル
イミダゾール、4−メチルイミダゾールなどのイ
ミダゾール系硬化剤が代表例として挙げられる。
勿論上記以外の公知のエポキシ樹脂硬化剤が使用
できることは言うまでもない。
本発明の熱硬化性樹脂フイルム積層体におい
て、熱硬化性樹脂フイルム層は上記したアクリロ
ニトリル−ブタジエン共重合体(a)、エポキシ樹脂
(b)、エポキシ樹脂硬化剤(c)を含有し、(a)/(b)が重
量比で20/80〜80/20、(c)/(b)が0.5/100〜
100/100および(a)のアクリロニトリル/ブタジエ
ンが5/95〜50/50の範囲にあることが必要であ
る。(a)/(b)が重量比で20/80未満であると可撓性
に劣り、80/20を超えると半田耐熱性に欠け、ア
クリロニトリル/ブタジエンが5/95〜50/50の
範囲を外れると半田耐熱性と可撓性の両立が困難
となる。またエポキシ樹脂硬化剤(c)は必須であ
り、(c)/(b)が0.5/100〜100/100の範囲にあるこ
とが必要である。(c)/(b)が0.5/100未満では、エ
ポキシ樹脂の硬化反応が進行し難いため、加熱圧
着に長時間が必要であるのみならず、十分な硬化
が得られず、半田耐熱性に欠け、本発明の目的を
達成することができない。また(c)/(b)が100/100
を超えるとエポキシ樹脂の性質が損われ接着性が
低下する。該樹脂層には本発明の目的を損わない
範囲において、無機充填剤、着色剤、揺変剤、表
面平滑剤、消泡剤、増粘剤などの配合剤全固型分
に対し20重量%以下の他の樹脂を配合してもよ
い。
本発明の熱硬化性樹脂フイルム積層体を製造す
る方法は特に制限されないが、例えば上記した樹
脂成分を溶剤に溶解した樹脂溶液を通常の塗布方
法、例えばバーコーテイング、ロールコーテイン
グ、ダイレクトロールコーテイング、ゲラビアコ
ーテイングなどの塗布方法を用いて、前記離型性
フイルムの離型性面上に塗布し乾燥して製造さ
れ、場合によつては離型性カバー・フイルムを上
記樹脂層上に離型性面を重ねラミネートして製造
される。樹脂層の乾燥後の厚みは5μ〜200μ、好
ましくは15μ〜100μが適当である。
本発明の積層体は離型性フイルムおよび離型性
カバーフイルムを剥離して樹脂フイルム層をプリ
ント配線板上に貼合せ、加熱圧着により耐熱性絶
縁層を形成する。
本発明の樹脂フイルム積層体を使用して、プリ
ント配線板と他の基材との間に耐熱性絶縁層を形
成する場合には、本発明の熱硬化性樹脂フイルム
積層体の離型性フイルムまたは/および離型性カ
バーフイルムを剥離してから樹脂フイルム層を一
方の基材に貼合せ、さらに他の基材を貼合せた
後、前記の条件下で加熱圧着すればよい。本発明
の熱硬化樹脂フイルム積層体にパンチング、裁断
などの機械的加工を施した後、前記した工程で加
熱圧着できることは言うまでもない。
本発明の熱硬化性樹脂フイルム積層体は、従来
のカバー・レイ・フイルムと異なり、ポリイミド
フイルムのような高価な耐熱性フイルムを使用し
ていないため極めて安価であり、また耐熱性絶縁
性被膜の形成に印刷法を用いないためソルダー・
レジスト・インキのようなピンホールの発生もな
い。また本発明の熱硬化性樹脂フイルム積層体
は、従来のカバー・レイ・フイルムの貼合せ工程
をそのまま踏襲できるため、ソルダーレジスト用
ドライフイルムのような設備の新設が不要であり
生産コストの低減に効果的である。さらに本発明
の熱硬化性樹脂フイルム積層体を用いて形成した
耐熱性絶縁性被膜は半田耐熱性に優れ、半田もぐ
り現象が認められないばかりでなく、電気絶縁
性、耐湿性、可撓性に優れるため、特にフレキシ
ブル配線板の永久保護膜として有用である。
本発明の熱硬化性樹脂フイルム積層体は上記の
特徴を生かして、フレキシブルプリント配線板の
永久保護膜の他、フレキシブル基板とリジツド板
の接着、リジツド板のソルダーレジストなどの用
途に使用できる。
本発明を更に具体的に説明するために、次に実
施例を挙げるが、勿論これらの実施例に本発明は
何ら限定されるものではない。
実施例 1
離型性ポリエチレンテレフタレートフイルム
(東洋紡績(株)製E−1513厚み125μm)上に下記組
成の樹脂溶液を乾燥膜厚50μmになるように塗布
し、100℃で5分間乾燥させた後、離型紙(本洲
製紙(株)製80X−532DW)の離型面と貼合せて本
発明の熱硬化性樹脂フイルム積層体を得た。
得られた熱硬化性樹脂フイルム積層体の離型紙
を剥離した後、回路形成したポリイミドフイル
ム・フレキシブルプリント配線板に樹脂フイルム
層を90℃の加熱ロールを用いて貼合せた後、150
℃で30分間圧力50Kg/cm2で加熱圧着させた。次い
で、離型性ポリエチレンテレフタレートフイルム
を剥して、フレキシブルプリント配線板上に永久
保護膜を形成した。その結果を第1表に示す。
樹脂溶液組成
アクリロニトリル−ブタジエン共重合体〔商品
名:Nipol1001B(日本ゼオン(株)製〕 40重量部
エポキシ樹脂〔商品名:エピコート154(油化シ
エルエポキシ(株))〕 60重量部
エポキシ樹脂硬化剤 2−エチル−4−メチル
イミダゾール 1.8重量部
テトラヒドロ無水フタル酸 10重量部
溶 剤
メチルエチルケトン 165重量部
The present invention relates to a thermosetting resin film laminate. More specifically, the present invention relates to a thermosetting resin film laminate for forming a heat-resistant insulating layer by bonding a resin film layer to a printed wiring board and heat-pressing it. Recently, computers, communication equipment, OA equipment,
The electronics industry, represented by home appliances, is developing at a remarkable rate, and along with this, the printed wiring boards used in these electronic devices are also required to have higher precision, higher density, lower cost, and higher reliability. It's increasing. There are two types of printed wiring boards: rigid boards such as glass-epoxy copper-clad laminates and flexible boards such as polyimide film copper-clad laminates.
Demand for the latter type of flexible substrates has increased significantly in recent years because three-dimensional wiring is possible. As is well known, soldering is required when mounting components on a printed wiring board, but when soldering, it is necessary to cover the parts that do not require soldering with a heat-resistant insulating film and selectively solder the exposed parts. be. This heat-resistant insulating film also serves as a permanent protective film to protect the conductive circuit from the external environment after soldering. In the case of flexible printed wiring boards, it is common to use a heat-resistant cover lay film or a flexible solder resist ink as the heat-resistant insulating film. However, at present, cover-lay films that are resistant to soldering heat, ie, cover-lay films that use polyimide films, are extremely expensive and have the disadvantage of lacking moisture resistance.
On the other hand, cover lay films using polyethylene terephthalate film are inexpensive but lack heat resistance and are difficult to solder. In addition, in the case of solder resist ink, the printing method is screen printing, which has the disadvantage of being prone to pinholes and lacking in reliability.This tendency is particularly strong in solvent-based solder resist inks, which increases reliability. must be printed many times. Recently, UV-curable solder resist inks that do not contain solvents have been developed, but at present they are not always sufficiently flexible. On the other hand, recently, in place of the cover lay film and solder resist ink, a so-called dry film for solder resist has been proposed, which can be patterned by exposure and has effective heat resistance. However, the soldering heat resistance is still insufficient. As a result of intensive research to meet the strong demands of the industry, the present inventors discovered a heat-resistant resin film laminate to replace conventional cover lay films, solder resists, inks, etc., and arrived at the present invention. did. That is, the present invention is a laminate consisting of three layers: a releasable cover film, a thermosetting resin film layer, and a releasable film, and the resin film layer is composed of an acrylonitrile-butadiene copolymer (a) and an epoxy resin.
(b), contains an epoxy resin curing agent (c), weight ratio of (a)/(b) is 20/80 to 80/20, and (c)/(b) is 0.5/100 to
This is a thermosetting resin film laminate in which the ratio of acrylonitrile/butadiene (100/100) and (a) is in the range of 5/95 to 50/50. Unlike conventional cover lay films, the thermosetting resin film laminate of the present invention is extremely inexpensive because it does not use an expensive heat-resistant film such as polyimide film, and it also forms a heat-resistant insulating film. Since no printing method is used, there are no pinholes like solder resist ink. The heat-resistant insulating film formed using the thermosetting resist film laminate of the present invention not only has excellent solder heat resistance and no solder sink phenomenon, but also has excellent electrical insulation, moisture resistance, and flexibility. Therefore, it is particularly useful as a permanent protective film for flexible wiring boards. In the thermosetting resin film laminate of the present invention, a thermosetting resin film layer is provided on the releasing surface of the releasing film, and a releasing cover film is further provided on the thermosetting resin film layer. It consists of a three-layer structure. The releasable film and releasable cover film used in the present invention may be any film that can be peeled off from the thermosetting resin film layer of the present invention, such as a film coated with an anchor coat of polyethylene, PVA, CMC, etc. Kraft paper, release paper such as glassine paper and parchment paper treated with silicone mold release agent or fluorine mold release agent, and synthetic resins such as polyethylene terephthalate film, polypropylene film, polyethylene film, nylon film, etc. treated with mold release agent. It's a film. The thermosetting resin film layer of the present invention is made of acrylonitrile-butadiene copolymer (a) and an epoxy resin.
(b) and epoxy resin curing agent (c). The acrylonitrile-butadiene copolymer (a) used in the present invention is a copolymer of acrylonitrile and butadiene, and contains 5 to 50% by weight of acrylonitrile. Further, in the acrylonitrile-butadiene copolymer, for example, a carboxyl group at the terminal,
It may contain reactive organic groups such as amino groups and hydroxyl groups. The epoxy resins used in the present invention include bisphenol A type epoxy resins such as the trade name Epicote 828, 1001, 1004, 1007, and 1010, phenol novolak type epoxy resins such as Epicote 154, and brominated bisphenol A type epoxy resins. In addition to epoxy resin, product name Epototo YOB-400, etc.
Known epoxy resins can be used. The epoxy resin curing agent (c) used in the present invention includes amine curing agents such as triethanolamine and triethylenetetramine, polyamide curing agents, and acid anhydride curing agents such as tetrahydrophthalic anhydride and phthalic anhydride. Typical examples include imidazole curing agents such as 2-ethyl-4-methylimidazole and 4-methylimidazole.
Of course, it goes without saying that known epoxy resin curing agents other than those mentioned above can be used. In the thermosetting resin film laminate of the present invention, the thermosetting resin film layer is made of the above-mentioned acrylonitrile-butadiene copolymer (a), epoxy resin
(b), contains an epoxy resin curing agent (c), weight ratio of (a)/(b) is 20/80 to 80/20, and (c)/(b) is 0.5/100 to
100/100 and (a) acrylonitrile/butadiene is required to be in the range of 5/95 to 50/50. If the weight ratio of (a)/(b) is less than 20/80, the flexibility will be poor; if it exceeds 80/20, the soldering heat resistance will be poor; If it comes off, it becomes difficult to achieve both soldering heat resistance and flexibility. Further, the epoxy resin curing agent (c) is essential, and it is necessary that (c)/(b) be in the range of 0.5/100 to 100/100. If (c)/(b) is less than 0.5/100, it is difficult for the curing reaction of the epoxy resin to proceed, which not only requires a long time to heat and press, but also prevents sufficient curing, resulting in poor soldering heat resistance. Therefore, the purpose of the present invention cannot be achieved. Also, (c)/(b) is 100/100
If it exceeds this, the properties of the epoxy resin will be impaired and the adhesiveness will be reduced. The resin layer contains 20% by weight of compounding agents such as inorganic fillers, colorants, thixotropic agents, surface smoothing agents, antifoaming agents, and thickeners based on the total solid content within a range that does not impair the purpose of the present invention. % or less of other resins may be blended. The method for producing the thermosetting resin film laminate of the present invention is not particularly limited. It is manufactured by coating the releasable side of the releasable film using a coating method such as via coating and drying it, and in some cases, a releasable cover film is applied onto the resin layer with the releasable surface. Manufactured by laminating the sides together. The appropriate thickness of the resin layer after drying is 5μ to 200μ, preferably 15μ to 100μ. In the laminate of the present invention, a releasable film and a releasable cover film are peeled off, a resin film layer is laminated onto a printed wiring board, and a heat-resistant insulating layer is formed by heat-pressing. When using the resin film laminate of the present invention to form a heat-resistant insulating layer between a printed wiring board and another base material, the release film of the thermosetting resin film laminate of the present invention may be used. Or/and after peeling off the releasable cover film, the resin film layer may be laminated to one base material, the other base material may be further laminated, and then the resin film layer may be bonded under heat and pressure under the above-mentioned conditions. It goes without saying that after the thermosetting resin film laminate of the present invention has been subjected to mechanical processing such as punching and cutting, it can be heat-pressed in the above-described steps. Unlike conventional cover lay films, the thermosetting resin film laminate of the present invention is extremely inexpensive because it does not use an expensive heat-resistant film such as polyimide film, and it also has a heat-resistant insulating film. Since no printing method is used for formation, solder and
There are no pinholes like resist ink. In addition, the thermosetting resin film laminate of the present invention can follow the conventional cover/lay/film bonding process as it is, so there is no need to install new equipment such as dry film for solder resist, reducing production costs. Effective. Furthermore, the heat-resistant insulating film formed using the thermosetting resin film laminate of the present invention not only has excellent solder heat resistance and no solder sinking phenomenon, but also has excellent electrical insulation, moisture resistance, and flexibility. Because of its excellent properties, it is particularly useful as a permanent protective film for flexible wiring boards. Taking advantage of the above characteristics, the thermosetting resin film laminate of the present invention can be used for purposes such as permanent protective films for flexible printed wiring boards, adhesion between flexible substrates and rigid boards, and solder resists for rigid boards. EXAMPLES In order to explain the present invention more specifically, Examples are given below, but the present invention is of course not limited to these Examples in any way. Example 1 A resin solution having the following composition was applied onto a releasable polyethylene terephthalate film (E-1513 manufactured by Toyobo Co., Ltd., thickness 125 μm) to a dry film thickness of 50 μm, and after drying at 100° C. for 5 minutes. , and the release surface of a release paper (80X-532DW manufactured by Honsu Paper Co., Ltd.) was laminated to obtain a thermosetting resin film laminate of the present invention. After peeling off the release paper of the obtained thermosetting resin film laminate, the resin film layer was laminated onto the circuit-formed polyimide film flexible printed wiring board using a heated roll at 90°C.
Heat and pressure bonding was carried out at a pressure of 50 kg/cm 2 at ℃ for 30 minutes. Next, the releasable polyethylene terephthalate film was peeled off to form a permanent protective film on the flexible printed wiring board. The results are shown in Table 1. Resin solution composition Acrylonitrile-butadiene copolymer [Product name: Nipol 1001B (Nippon Zeon Co., Ltd.)] 40 parts by weight Epoxy resin [Product name: Epicoat 154 (Yuka Ciel Epoxy Co., Ltd.)] 60 parts by weight Epoxy resin curing agent 2-Ethyl-4-methylimidazole 1.8 parts by weight Tetrahydrophthalic anhydride 10 parts by weight Solvent Methyl ethyl ketone 165 parts by weight
【表】
実施例 2
実施例1で得られた本発明の熱硬化性樹脂フイ
ルム積層体の離型紙を剥し、樹脂フイルム層を90
℃の加熱ロールを用いて1.2mm厚ガラスエポキシ
積層板に貼合せ、次いで離型性ポリエチレンテレ
フタレートフイルムを剥して、さらにポリイミ
ド・フレキシブルプリント配線板の回路面に同一
条件下で貼合せた後、170℃で30Kg/cm2の圧力下
20分間プレスしたところ両者は強固に接着した。
この性能を第2表に示す。[Table] Example 2 The release paper of the thermosetting resin film laminate of the present invention obtained in Example 1 was peeled off, and the resin film layer was
It was laminated to a 1.2 mm thick glass epoxy laminate using a heated roll at 170°C, then the releasable polyethylene terephthalate film was peeled off, and it was further laminated to the circuit surface of a polyimide flexible printed wiring board under the same conditions. Under pressure of 30Kg/ cm2 at °C
After pressing for 20 minutes, both were firmly adhered.
This performance is shown in Table 2.
【表】【table】
Claims (1)
ム層および離型性フイルムの3層からなる積層体
であり、該樹脂フイルム層はアクリロニトリル−
ブタジエン共重合体(a)、エポキシ樹脂(b)、エポキ
シ樹脂硬化剤(c)を含有し、(a)/(b)が重量比で20/
80〜80/20、(c)/(b)が0.5/100〜100/100および
(a)のアクリロニトリル/ブタジエンが5/95〜
50/50の範囲にある熱硬化性樹脂フイルム積層
体。1 A laminate consisting of three layers: a releasable cover film, a thermosetting resin film layer, and a releasable film, and the resin film layer is made of acrylonitrile-
Contains a butadiene copolymer (a), an epoxy resin (b), and an epoxy resin curing agent (c), with a weight ratio of (a)/(b) of 20/
80~80/20, (c)/(b) is 0.5/100~100/100 and
Acrylonitrile/butadiene in (a) is 5/95~
Thermosetting resin film laminate in the 50/50 range.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3748784A JPS60180836A (en) | 1984-02-28 | 1984-02-28 | Thermo-setting resin film laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3748784A JPS60180836A (en) | 1984-02-28 | 1984-02-28 | Thermo-setting resin film laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60180836A JPS60180836A (en) | 1985-09-14 |
JPH0553628B2 true JPH0553628B2 (en) | 1993-08-10 |
Family
ID=12498875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3748784A Granted JPS60180836A (en) | 1984-02-28 | 1984-02-28 | Thermo-setting resin film laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60180836A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6367143A (en) * | 1986-09-09 | 1988-03-25 | 東洋紡績株式会社 | Thermosetting resin film laminate |
JPS6369640A (en) * | 1986-09-11 | 1988-03-29 | 東洋紡績株式会社 | Thermosetting resin film laminate |
JPH02177599A (en) * | 1988-12-28 | 1990-07-10 | Somar Corp | Formation of insulating layer and electromagnetic shielding of printed wiring board |
JPH0379477U (en) * | 1989-12-01 | 1991-08-13 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53121070A (en) * | 1977-03-31 | 1978-10-23 | Matsushita Electric Works Ltd | Manufacture of bases for chemical plating |
JPS58108788A (en) * | 1981-12-23 | 1983-06-28 | 東芝ケミカル株式会社 | Method of coating flexible circuit board |
-
1984
- 1984-02-28 JP JP3748784A patent/JPS60180836A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53121070A (en) * | 1977-03-31 | 1978-10-23 | Matsushita Electric Works Ltd | Manufacture of bases for chemical plating |
JPS58108788A (en) * | 1981-12-23 | 1983-06-28 | 東芝ケミカル株式会社 | Method of coating flexible circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS60180836A (en) | 1985-09-14 |
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