JPS6367143A - Thermosetting resin film laminate - Google Patents
Thermosetting resin film laminateInfo
- Publication number
- JPS6367143A JPS6367143A JP61212950A JP21295086A JPS6367143A JP S6367143 A JPS6367143 A JP S6367143A JP 61212950 A JP61212950 A JP 61212950A JP 21295086 A JP21295086 A JP 21295086A JP S6367143 A JPS6367143 A JP S6367143A
- Authority
- JP
- Japan
- Prior art keywords
- film
- thermosetting resin
- resin film
- present
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims description 56
- 239000011347 resin Substances 0.000 title claims description 56
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 31
- 239000010408 film Substances 0.000 claims description 74
- 239000003822 epoxy resin Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 239000013039 cover film Substances 0.000 claims description 7
- 229920005672 polyolefin resin Polymers 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 229920002681 hypalon Polymers 0.000 description 11
- 239000000976 ink Substances 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000012787 coverlay film Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000010292 electrical insulation Methods 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000003578 releasing effect Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000008141 laxative Substances 0.000 description 1
- 230000002475 laxative effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 239000011088 parchment paper Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は熱硬化性樹脂フィルム積層体に関するものであ
る。さらに詳しくは、樹脂フィルム層をプリント配線板
に貼合せ加熱圧着によジ耐熱性絶縁階を形成するだめの
熱硬化性樹脂フィルム積層体に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a thermosetting resin film laminate. More specifically, the present invention relates to a thermosetting resin film laminate in which a heat-resistant insulation layer is formed by bonding a resin film layer to a printed wiring board and heat-pressing it.
近年、電子機器工業界の小型化、軽量化、信頼性向上の
要求に応えて、フレキシブルプリント回路板が、各種機
器に用いられている。In recent years, flexible printed circuit boards have been used in various types of equipment in response to demands for smaller size, lighter weight, and improved reliability in the electronic equipment industry.
周知の通り、プリント配線板に部品を実装する際半田付
けが必要であるが、この半田付けに際して半田不要部分
を耐熱性絶縁性被膜で被覆し、露出部分に選択的に半田
付けを行う必要がある。またこの耐熱性絶縁性被膜は半
田付は後の導体回路を外的環境から保護するための永久
保護膜の役目も果している。フレキシブル印刷配線板の
場合。As is well known, soldering is required when mounting components on a printed wiring board, but when soldering, it is necessary to cover the parts that do not require soldering with a heat-resistant insulating film and selectively solder the exposed parts. be. This heat-resistant insulating film also serves as a permanent protective film to protect the conductor circuit after soldering from the external environment. For flexible printed wiring boards.
この耐熱性絶縁性被膜として、耐熱性フィルムのカバー
・レイ・フィルムを使用するか、可焼性のンルダー・レ
ジスト・インキを用いるのが一般的である。しかし現在
半田耐熱性のあるカバー・レイ・フィルムすなわちポリ
イミド・フィルムを用いたカバー・レイ・フィルムは極
めて高価であ広また耐湿性に欠けるという欠点がある。As this heat-resistant insulating film, it is common to use a heat-resistant cover lay film or a burnable resist ink. However, current solder heat resistant cover lay films, ie cover lay films using polyimide films, have the drawbacks of being extremely expensive and lacking widespread moisture resistance.
一方ポリエチレンテレフタレートフイルムを用いた力／
＜−・レイ・フィルムは安価ではあるが耐熱性に欠け、
半田付けが困難である。またソルダー・レジスト・イン
キの場合、印刷方法がスクリーン印刷によるため、ピン
ホールが発生しやすく信頼性に欠けるという欠点があり
、特に溶剤型ソルダー・レジスト・インキではこの傾向
がつよく信頼性をあげるためには、何度も印刷しなけれ
ばならない。最近では溶剤を含まない紫外線硬化型ソル
ダー・レジスト・インキも開発されているが、可焼性の
点で必ずしも十分でないのが現状である。On the other hand, the force using polyethylene terephthalate film/
＜-・Ray film is cheap but lacks heat resistance,
Difficult to solder. In addition, in the case of solder resist ink, the printing method is screen printing, which has the disadvantage of being prone to pinholes and lacking in reliability.This tendency is particularly strong in solvent-based solder resist inks, which increases reliability. must be printed many times. Recently, UV-curable solder resist inks that do not contain solvents have been developed, but at present they are not necessarily sufficient in terms of flammability.
一方、最近では上記カバー・レイ・フィルムやソルダー
・レジスト・インキに代わって１Ｍ光によりパターン形
成可能で且つ耐熱性も付与された所謂ソルダー・レジス
ト用ドライフィルムも提案されているが可焼性、半田耐
熱性の点でまだ十分なものではない。On the other hand, recently, a so-called dry film for solder resist, which can be patterned with 1M light and has heat resistance, has been proposed in place of the cover lay film and solder resist ink. It is still not sufficient in terms of solder heat resistance.
上述の様に現在知られているフレキシブル印刷配線板用
の絶縁性被膜はポリイミドフィルムベースの場合の耐湿
性１価格、ポリエステルフィルムペースの場合の耐熱性
、ソルダー・レジスト・インクの場合の信頼性の乏しさ
く主にピンホール。As mentioned above, the currently known insulating coatings for flexible printed circuit boards are: polyimide film based on moisture resistance, low price on polyester film paste, heat resistance on solder resist ink, and reliability on solder resist ink. Poor, mainly pinholes.
厚さが薄いことによる）、可焼性、感光性フィルムの場
合の可焼性、設備の新設（露光、現像）など、いずれも
欠点を抱えている。All of them have drawbacks, such as their thinness), scorchability, scorchability in the case of photosensitive films, and the need for new equipment (exposure, development).
本発明者らはこれら欠点を改善するものとして。The present inventors aim to improve these drawbacks.
先に熱硬化性樹脂フィルム積層体を提案した（特開昭６
Ｏ−１８０８３６）。この方法は可撓性、半田耐熱性等
に優れ、従来の欠点の多くを改善できるものであったが
、加工性、保存性に解決すべき問題点が認められた。ま
た電気絶縁性も一層の向上が望１れている。We first proposed a thermosetting resin film laminate (Japanese Unexamined Patent Publication No.
O-180836). Although this method has excellent flexibility, soldering heat resistance, etc., and can improve many of the drawbacks of the conventional method, it was recognized that there were problems in workability and storage stability that needed to be resolved. Furthermore, further improvement in electrical insulation is desired.
本発明者らは上記の欠点のない、カバー・レイ材料とし
ての要求性能をパツンス良く兼ね備えた新しいタイプの
カバーレイ材料を提供しようとするものである。The present inventors have attempted to provide a new type of coverlay material that does not have the above-mentioned drawbacks and has excellent performance required for a coverlay material.
本発明の熱硬化性樹脂フィルム層および離型性フィルム
からなる２Ｍ又は離型性カバーフィルム。A 2M or releasable cover film comprising a thermosetting resin film layer and a releasable film of the present invention.
熱硬化性樹脂フィルム層および離型性フィルムの３層か
ら成る積層体であり、該熱硬化性樹脂フィルムがクロル
スルホン化オレフィン４ＨＩｊ （ａ） 、エポキシ樹
脂（ｂ）、エポキシ樹脂硬化剤（硬化触媒とか硬化促進
剤と呼ばれるものを含む）（ｃ）を含有しくａ） ／
（ｂ）が重量比で２０／８０〜８０／２０゜（ｃ） ／
（ｂ）が０．５／１００〜１００／１００の範囲にあ
る熱硬化性樹脂フィルム積層体である。It is a laminate consisting of three layers: a thermosetting resin film layer and a releasable film. and curing accelerators) (c) a) /
(b) has a weight ratio of 20/80 to 80/20° (c) /
(b) is a thermosetting resin film laminate in the range of 0.5/100 to 100/100.
本発明の熱硬化性樹脂フィルム積層体は従来のカバー・
レイ・フィルムと異なり、ポリイミドフィルムのような
高価な耐熱性フィルムを使用していないため極めて安価
であり、また耐熱性絶縁性被膜の形成に印刷法を用いな
いためソルダー・レジスト・インキのようなピンホール
の発生もない。The thermosetting resin film laminate of the present invention is similar to the conventional cover and
Unlike Ray Film, it is extremely inexpensive because it does not use an expensive heat-resistant film such as polyimide film, and it does not use printing methods to form a heat-resistant insulating film, so it is not used like solder resist ink. No pinholes occur.
本発明の熱硬化性レジスト・フィルム積Ｊ一体を用いて
形成した耐熱性絶縁性被膜は半田耐熱性に優れ、半田も
ぐり現象が認められないばかりでなく。The heat-resistant insulating film formed using the thermosetting resist-film integral J of the present invention has excellent solder heat resistance, and not only does the solder sink phenomenon not occur.
電気絶縁性、耐湿性、可焼性に優れる九め特にフレキシ
ブル配線板の永久保護膜として有用である。It has excellent electrical insulation, moisture resistance, and flammability, and is particularly useful as a permanent protective film for flexible wiring boards.
本発明の熱硬化性樹脂フィルム積層体は離型性フィルム
の離型性面上に熱硬化性樹脂フィルム層を設けた２層構
造または該熱硬化性樹脂フィルム層の上に、さらに離型
性カバーフィルムを設けた３層構造からなる。従って従
来のポリイミド（あるいはポリエステル）フィルムカバ
ーレイｌ］いる加工設備が利用でき、設備を新設しなく
てもよい。The thermosetting resin film laminate of the present invention has a two-layer structure in which a thermosetting resin film layer is provided on the releasing surface of a releasing film, or a thermosetting resin film layer is further provided with releasing properties on the thermosetting resin film layer. It consists of a three-layer structure with a cover film. Therefore, conventional processing equipment for polyimide (or polyester) film coverlays can be used, and new equipment does not need to be installed.
本発明で使用するＭ型性フィルムまたはＳＩｉ型性カバ
ー・フィルムとは１本発明の熱硬化性樹脂フィルム層と
剥離可能なフィルムであればよく１例エバポリエチレン
、ＰＶＡ、ＣＭＣなどのアンカーコートをしたクラフト
紙、シリコン系離型剤。The M type film or SIi type cover film used in the present invention may be any film that can be peeled off from the thermosetting resin film layer of the present invention. Craft paper, silicone mold release agent.
弗累系離型剤で処理したグラシン紙、パーチメント紙な
どで代表される離型紙、離型剤処理したポリエチレンテ
レフタレートフィルム、ポリプロビレンフ、（／ｌ／ｌ
／ムクエチレンフィルム、ナイロンフィルムなど１合成
樹脂フィルムである。Release paper such as glassine paper and parchment paper treated with a fluorocarbon release agent, polyethylene terephthalate film treated with a release agent, polypropylene, (/l/l)
/1 Synthetic resin films such as solid ethylene film and nylon film.
本発明で使用するクロルスルホン化ポリオレフィン樹脂
としては、クロルスルホン化ポリエチレン樹脂（商品名
ハイパロン２０番、３０番、４０番など）がある。クロ
７レスルホン化ポリオレフイー 〇 −
ン樹脂は２０〜６０重量％、好ましくは２０〜３５重量
％の塩素および塩化スルホニＭとして０．８〜１．７重
量％、好ましくは１．０〜１．６重量％の硫黄を含む。Examples of the chlorosulfonated polyolefin resin used in the present invention include chlorosulfonated polyethylene resins (trade names: Hypalon No. 20, Hypalon No. 30, No. 40, etc.). The chlorine 7-resulfonated polyolefin resin contains 20-60% by weight, preferably 20-35% by weight of chlorine and 0.8-1.7% by weight as sulfony chloride M, preferably 1.0-1.6% by weight. Contains % sulfur.
クロルスルホン化ポリオレフィンはクロルスルホン化ポ
リプロピレン、エチレンと装置のプロピレン又は他のオ
レフィンとのクロルスルホン化した共重合体等も挙げる
ことが出来るＯ本発明で使用するエポキシ樹脂としては
、ビスフェノールＡ型エポキシ樹脂１例えば商品名エビ
コー ト８２８，１００１，１００４．１００７．１０
１０など、フェノ−Ｍノボラック型エポキシ樹脂１例え
ばエピコート１５４など、臭素化ビスフェノールＡ型エ
ポキシ樹脂（商品名工ボトートＹＤＢ−４００などつ。Examples of chlorosulfonated polyolefins include chlorosulfonated polypropylene, chlorosulfonated copolymers of ethylene and propylene or other olefins, etc.Epoxy resins used in the present invention include bisphenol A type epoxy resins. 1 For example, product name Ebicoat 828, 1001, 1004.1007.10
Pheno-M novolac type epoxy resins such as No. 10; Brominated bisphenol A type epoxy resins such as Epicoat 154 (trade name: Meiko Bototo YDB-400, etc.);
臭素化フェノールノボフック型エポキシ樹８＆ （ｉ品
名グレンＳなど）の他、公知のエポキシ樹脂が使用可能
である。In addition to brominated phenol novohook type epoxy resin 8& (product name: Glen S, etc.), known epoxy resins can be used.
本発明で使用されるエポキシ樹脂硬化剤（ｃ）としては
、トリエタノールアミン、トリエチレンナトフミンなど
のアミン系硬化剤、ポリアミド系硬化剤、テトラヒドロ
無水フｐ ）Ｉ／酸、無水フタル酸などの酸無水物系硬
化剤、２−エチル−４−メチルイミダゾ−／ｖ、４−メ
チルイミダゾールナトのイミダゾール系硬化剤が代表例
として挙げられる。Examples of the epoxy resin curing agent (c) used in the present invention include amine-based curing agents such as triethanolamine and triethylene nathumine, polyamide-based curing agents, tetrahydroanhydride (P) I/acid, and phthalic anhydride. Typical examples include acid anhydride curing agents and imidazole curing agents such as 2-ethyl-4-methylimidazo-/v and 4-methylimidazole.
勿論上記以外の公知のエポキシ樹脂硬化剤が使用できる
ことは言うまでもない。Of course, it goes without saying that known epoxy resin curing agents other than those mentioned above can be used.
本発明の熱硬化性樹脂フィルム積層体において、熱硬化
性樹脂フィルム層は上記のクロルスルホン化ポリオレフ
ィン樹脂（ａ） 、エポキシ樹ｇｌ （ｂ） 。In the thermosetting resin film laminate of the present invention, the thermosetting resin film layer comprises the above-mentioned chlorosulfonated polyolefin resin (a) and epoxy resin GL (b).
エポキシ樹脂硬化剤（ｃ）を含有し、 （ａ） ／ （
ｂ）が重振比で２０／８０〜８０／２０ 、 （ｃ）
／ （ｂ）が０．５／１００〜１００／１００の範囲に
あることが必要である。（ａ） ／ （ｂ）が重址比で
２０／８０未満であると可撓性に劣り、８０／２０を超
えると半田耐熱性に欠ける。またエポキシ樹脂硬化剤（
ｃ）は必須であり、 （ｃ） ／ （ｂ）が０．５／
１００〜１００／１００の範囲にあることが必要である
。（ｃ） ／ （ｂ）が０．５／１００未満では、エポ
キシ樹脂の硬化反応が進行し難いため、加熱圧着に長時
間が必要であるのみならず、十分な硬化が得られず、半
田耐熱性に欠け１本発明の目的（＋−達成することがで
きない。また（ｃ） ／ （ｂ）が１００／１００を超
えるとエポキシ樹脂の性質が損われ接着性が低下する。Contains an epoxy resin curing agent (c), (a) / (
b) is the gravity ratio of 20/80 to 80/20, (c)
/(b) is required to be in the range of 0.5/100 to 100/100. If the ratio (a)/(b) is less than 20/80, the flexibility will be poor, and if it exceeds 80/20, the soldering heat resistance will be poor. Also, epoxy resin curing agent (
c) is mandatory, and (c) / (b) is 0.5/
It needs to be in the range of 100 to 100/100. If (c) / (b) is less than 0.5/100, it is difficult for the curing reaction of the epoxy resin to proceed, which not only requires a long time for heat and pressure bonding, but also prevents sufficient curing, resulting in poor solder heat resistance. If the ratio (c)/(b) exceeds 100/100, the properties of the epoxy resin will be impaired and the adhesiveness will be reduced.
該樹＾旨層には本発明の目的を損わない範囲において、
無機充填剤１Ｍ色剤、揺質剤１表面平滑剤、消泡剤、増
粘剤などの配合剤、全固型分に対し２０重量％以下の他
の樹脂を配合してもよい。The tree layer contains, within the range that does not impair the purpose of the present invention,
Compounding agents such as an inorganic filler 1M coloring agent, a laxative 1 a surface smoothing agent, an antifoaming agent, and a thickener, and other resins in an amount of 20% by weight or less based on the total solid content may be blended.
本発明の熱硬化性樹脂フィルム積層体を製造する方法は
特に制限されないが１例えば上記した樹脂成分を溶剤に
溶解した樹脂溶液を通常の塗布方法、例ｔはバーコーテ
ィング、ロールコーチインク、タイレクトロールコーテ
ィング、グラビアコーティングなどの塗布方法を用いて
、前記離型性フィルムの離型性面上に塗布し乾燥して製
造され、場合によっては離型性カバー・フィルムを上記
樹脂層上に離型性面を重ねラミネートして製造される。The method for producing the thermosetting resin film laminate of the present invention is not particularly limited, but 1. For example, a resin solution prepared by dissolving the above-mentioned resin components in a solvent is applied by a conventional coating method, such as bar coating, roll coach ink, direct coating, etc. It is manufactured by coating the releasable surface of the releasable film using a coating method such as roll coating or gravure coating and drying it, and in some cases, releasing the releasable cover film onto the resin layer. Manufactured by laminating the two sides together.
樹脂層の乾燥後の厚みは５μ〜２００μ、好ましくは１
５μ〜１００μが適当である。The thickness of the resin layer after drying is 5μ to 200μ, preferably 1
5μ to 100μ is appropriate.
本発明の＠層体は離型性フィルムまたは／および離型性
カバーフィルムを剥離して樹脂フィルム層をプリント配
線板上に貼合せ、加熱圧着により耐熱性絶縁層を形成す
る。In the @layer body of the present invention, the releasable film and/or the releasable cover film are peeled off, the resin film layer is laminated onto a printed wiring board, and a heat-resistant insulating layer is formed by heat-pressing.
本発明の樹脂フィルム積層体を使用して、プリント配＃
ｉ板と他の基材との間に耐熱性絶縁層を形成する場合に
は、本発明の熱硬化性樹脂フィルム積層体の離型性フィ
ルムまたは／および離型性カバーフイ７レムを剥離して
から樹脂フィルム層を一方の基材に貼合せ、さらに他の
基材を貼合せた後。Print layout using the resin film laminate of the present invention
When forming a heat-resistant insulating layer between the i-board and another base material, the releasable film and/or releasable cover film 7 rem of the thermosetting resin film laminate of the present invention is peeled off. After laminating the resin film layer to one base material, and then laminating the other base material.
前記の条件下で加熱圧着すればよい。本発明の熱硬化性
樹脂フィルム積層体にパンチング、裁断などの機械的加
工を施した後、 Ｉ！ｉｌ紀した工程で加熱圧着できる
ことは言うまでもない。Heat and pressure bonding may be carried out under the above conditions. After mechanical processing such as punching and cutting is performed on the thermosetting resin film laminate of the present invention, I! Needless to say, heat and pressure bonding can be carried out using an advanced process.
本発明の熱硬化性樹脂フイｌレム＠層体は、従来のカバ
ー・レイ・フィルムと異なり、ポリイミドフィルムのよ
うな高価な耐熱性フィルムを使用していないため極めて
安価であジ、また耐熱性絶縁性被膜の形成に印刷法を用
いないためソルダー・レジスト・インキのようなピンホ
ールの発生もない。また本発明の熱硬化性樹脂フィルム
＠層体は。Unlike conventional cover lay films, the thermosetting resin film@layer body of the present invention does not use expensive heat-resistant films such as polyimide films, so it is extremely inexpensive and heat-resistant. Since no printing method is used to form the insulating film, there is no pinhole formation unlike with solder resist ink. Moreover, the thermosetting resin film@layer body of the present invention is as follows.
従来のカバー・レイ・フィルムの貼合せ工程をそのまま
踏襲できるため、ソルダーレジスト用ドライフィルムの
ような設備の新設が不要であり生産コストの低減に効果
的である。さらに本発明の熱硬化性樹脂フィルム積層体
を用いて形成した耐熱性絶縁性被膜は半田耐熱性に優れ
、半田もぐり現象が認められないばかりでなく、電気絶
縁性、耐湿性、可焼性に優れるため、特にフレキシブル
配線板の永久保護膜として有用である。Since the conventional cover lay film lamination process can be followed, there is no need to install new equipment such as dry film for solder resist, which is effective in reducing production costs. Furthermore, the heat-resistant insulating film formed using the thermosetting resin film laminate of the present invention not only has excellent solder heat resistance and no solder sinking phenomenon, but also has excellent electrical insulation, moisture resistance, and flammability. Because of its excellent properties, it is particularly useful as a permanent protective film for flexible wiring boards.
本発明の熱硬化性樹脂フィルム積層体は上記の特徴を生
かして、フレキシブルプリント配線板の永久保護膜の他
、フレキシブル基板とリジッド板の接着、リジッド板の
ソ／レダーレジストなどの用途に使用できる。By taking advantage of the above characteristics, the thermosetting resin film laminate of the present invention can be used for applications such as a permanent protective film for flexible printed wiring boards, adhesion between flexible substrates and rigid boards, and solder/ruder resist for rigid boards. .
本発明を更に具体的に説明するために、次に実施例を挙
げるが、勿論これらの実施例に本発明は何ら限定される
ものではない。EXAMPLES In order to explain the present invention more specifically, Examples are given below, but the present invention is of course not limited to these Examples in any way.
実施例１゜
離型性ポリエチレンテレフタレートフィルム５０μｍ（
ａ森工業＠５０Ｅ−Ｅ３Ｂ）上に下記樹脂溶液Ａを乾燥
後の膜厚が６０μｍになる様に塗布し、１２０℃で５分
間、乾燥させた後、離型紙（藤森工業■８０ＨＢ−ＣＩ
Ｏ）の離型面と貼υ合わセ（ロール温度４０℃でロール
ラミネーション）。Example 1゜Releasable polyethylene terephthalate film 50 μm (
a Mori Kogyo@50E-E3B) was coated with the following resin solution A so that the film thickness after drying was 60 μm, dried at 120°C for 5 minutes, and then coated with release paper (Fujimori Kogyo 80HB-CI)
O) is laminated with the mold release surface (roll lamination at a roll temperature of 40°C).
本発明の熱硬化性樹脂フィルム積層体を得た。A thermosetting resin film laminate of the present invention was obtained.
得られた熱硬化性樹脂フィルム積層体の離型紙を剥離し
た後、回路形成したポリイミドフィルムベースのフレキ
シブルプリント配線板の回路面に樹脂フィルム層を以下
の加工条件で貼ジ合わせた。After peeling off the release paper of the obtained thermosetting resin film laminate, a resin film layer was bonded to the circuit surface of a circuit-formed polyimide film-based flexible printed wiring board under the following processing conditions.
加工条件 ■ ９５℃、ｓｗ／７でロールラミネーション。Processing conditions ■ Roll lamination at 95℃, SW/7.
■ １２０℃、３０梅／ｄ、１０分間ヒートプレス。■Heat press at 120℃, 30ume/d, 10 minutes.
■ 離型性フィルムを剥し１５０℃で１時間アフターキ
ュアー。■ Peel off the release film and after-cure at 150℃ for 1 hour.
以上の様にしてフレキシブルプリント配線板上に永久保
護膜全形成した。その評価結果を表１に示す。As described above, a permanent protective film was completely formed on the flexible printed wiring board. The evaluation results are shown in Table 1.
樹脂溶液Ａ
クロルスルホン化ポリエチレンＷ脂１１．５ ｔ（商品
名：ハイパロン２０（昭和電工・シュポン■）塩素含有
Ｎ２９重量％、硫黄含有量１．２５５重量％）エポキシ
樹脂 １７．３ ｆ
（商品名ｊエピコート１５４（油化シェルエポキシ■）
）テトラヒドロ無水フタ／ｌ’酸２．９ ｆ２−エチル
−４−メチルイミダゾール ０．６９ ｆトル
エン
１９．７ Ｆｌ、２−二塩化エタン
４４．９ Ｆ実施例２゜
樹脂溶液Ａの代りに樹脂溶液Ｂを用いた以外、実施例１
と全く同様にして永久保護膜を形成したポリイミドフィ
ルムベースフレキＶ ｆ 、Ｉｔ／プリント配線板を作
成し評価した。結果を表１に示す。Resin solution A Chlorosulfonated polyethylene W resin 11.5 t (Product name: Hypalon 20 (Showa Denko, Shupon ■) Chlorine content N 29% by weight, sulfur content 1.255% by weight) Epoxy resin 17.3 f
(Product name: J Epicote 154 (oiled shell epoxy)
) Tetrahydro anhydride/l' acid 2.9 f2-ethyl-4-methylimidazole 0.69 f toluene
19.7 Fl, 2-ethane dichloride
44.9 F Example 2゜Example 1 except that resin solution B was used instead of resin solution A.
A polyimide film-based flexible V f , It/printed wiring board on which a permanent protective film was formed was prepared and evaluated in exactly the same manner as described above. The results are shown in Table 1.
樹脂溶液Ｂ
クロルスルホン化ポリエチレン樹脂８．６ ｔ（商品名
：ハイパロン２０（昭和電工・シュポン■つ）エポキシ
樹脂 ２０．２ ｆ（
商品名：エポトートＹＤＢ４００（東部化成■））テト
ラヒドロ無水フタ／Ｌ’酸 ２
．９２２−エチ）ｖ−４−メチルイミダゾール
０．８１ ？トルエン
１９．７ ｒ１．２−二塩化エタ
ン ４４．９ ｆ比較例１および２
樹脂溶液Ａの代わりに比較例１では樹脂溶液Ｃ１比較例
２では樹脂溶液りを用いた以外、実施例１と全く同様に
して永久保護膜を形成したポリイミドフィルムベースフ
レキシブルプリント配線板を作成し評価した。結果を表
１に示す。Resin solution B Chlorosulfonated polyethylene resin 8.6 t (Product name: Hypalon 20 (Showa Denko, Shpon)) Epoxy resin 20.2 f (
Product name: Epotote YDB400 (Tobu Kasei)) Tetrahydro anhydrous lid/L' acid 2
．． 922-ethy)v-4-methylimidazole
0.81? toluene
19.7 r1.2-Ethane dichloride 44.9 f Comparative Examples 1 and 2 Exactly the same as Example 1 except that instead of resin solution A, resin solution C was used in Comparative Example 1 and resin solution C was used in Comparative Example 2. A polyimide film-based flexible printed wiring board with a permanent protective film formed thereon was fabricated and evaluated. The results are shown in Table 1.
樹脂溶液Ｃ
クロルスルホン化ポリエチレンｆｌｌＪｉ
４．３ ｆ（＠品名：ハイパロン２０（昭和電工
・シュポン＠））エポキシ樹脂
２４．５ ｒＣＭ名：エビコー）１５４（油
化シェルエポキシ■））テトラヒドロ無水フタル酸
２．９ｔ２−ｘｆｔｖ−４−ｊチル
イミダゾ−／’ ０．９８９トルエン
１９．７ ｆｌ
、２−二塩化エタン ４４
．９ ｆ樹脂溶液Ｄ
クロルスルホン化ポリエチレンＪｉＨ＆
２４．５ ｙ（商品名：ハイパロン２０（昭和電工・
シュポン■））エポキシ樹脂
４．３２（商品名：エボトートＹＤＢ４０
０ （東部化成■））テトラヒドロ無水フタルｅ
２．９ ｆ２−エチル−４−メチ
ルイミダゾール ０．１７ Ｆトルエン
１９．７ ｒｌ
、２−二塩化エタン ４４
．９１表 １
表１中の試験法
電気絶縁抵抗 導体幅、導体聞咎１．Ｑｓｍ、長さ２５
顛の櫛型パターン使用。Resin solution C chlorosulfonated polyethylene fllJi
4.3 f (@Product name: Hypalon 20 (Showa Denko, Shupon@)) Epoxy resin
24.5 rCM name: Ebiko) 154 (Oilized shell epoxy)) Tetrahydrophthalic anhydride
2.9t2-xftv-4-j thylimidazo-/' 0.989 toluene
19.7fl
, 2-ethane dichloride 44
．． 9 f Resin solution D Chlorosulfonated polyethylene JiH&
24.5 y (Product name: Hypalon 20 (Showa Denko)
Shupon ■)) Epoxy resin
4.32 (Product name: Evotote YDB40
0 (Tobu Kasei)) Tetrahydrophthalic anhydride e
2.9 f2-ethyl-4-methylimidazole 0.17 F toluene
19.7 rl
, 2-ethane dichloride 44
．． 91 Table 1 Test method in Table 1 Electrical insulation resistance Conductor width, conductor measurement 1. Qsm, length 25
Uses a comb-shaped pattern.
ＤＣ５００Ｖ印加１分後の絶縁紙 抗を測定。Insulating paper after 1 minute of DC500V application Measure resistance.
半田耐熱性 ＪＩＳ Ｃ６４８１
耐 折 性 ＪＩＳ Ｐ８１１５． 但しＲ
＝ ０．８ｎ、荷重５００？、基材幅１５
寵、導体幅２．Ｏｆｆ’（試料のサン
プリングは基材長手方向に平行
に行う〕
接 着 性 ＪＩＳ ＤＯ２０２（但し、銅張板
の銅箔シャイン面に対して）
実施例３および比較例３
実施例１と同様の方法によって＠記樹脂溶液Ａと下記樹
脂溶液Ｅから本発明および比較例の熱硬化性樹脂フィル
ム積層体を得た。得られた積層体を２０℃で１日′Ｊ？
よび３０日間保存後、実施例１と同様の方法に二って、
フレキシブルプリント配線板上に、永久保護膜を形成し
た。その評価結果を表２に示す。Soldering heat resistance JIS C6481 Folding resistance JIS P8115. However, R
= 0.8n, load 500? , base material width 15 mm, conductor width 2. Off' (Sampling is done parallel to the longitudinal direction of the base material) Adhesion JIS DO202 (However, to the copper foil shine surface of the copper clad board) Example 3 and Comparative Example 3 Same method as Example 1 Thermosetting resin film laminates of the present invention and comparative examples were obtained from resin solution A described below and resin solution E described below.The obtained laminates were incubated at 20°C for 1 day.
and after storage for 30 days, in the same manner as in Example 1,
A permanent protective film was formed on the flexible printed wiring board. The evaluation results are shown in Table 2.
樹脂溶液Ｅ
アクリロニトリル−ブタジェン共重合体 ４０重
量部、 〔商品名： Ｎ１ｐｏｌ １００１ Ｂ
（日本ゼオン■製）〕エポキシ樹脂
６０重量部〔商品名：エピコート１５４
（油化シェルエポキシ■）〕エポギシ碩化剤
２−エチル−４−メチルイミダゾール １．８重
量部テトラヒドロ無水フタル酸 １０
重量部溶剤：メチルエチルケトン １
６５ｉｉｔｉ表 ２
〔発明の効果〕
実施例１，２から１本発明の熱硬化性樹脂フィルム積層
体はフレキシブルプリント配線板のカッ（−レイ（水久
保＠膜）形成に使用可能なことがわかる。比較例１，２
はクロルスルホン化ポリオレフイン４ｉ１月旨（ａ）１
エポキシ樹１１１ｉ（ｂ）が（ａ） ／ （ｂ）−２０
／８０〜８０／２０の範囲にある必要性を示している。Resin solution E Acrylonitrile-butadiene copolymer 40 parts by weight [Product name: N1pol 1001 B
(Made by Nippon Zeon ■) Epoxy resin
60 parts by weight [Product name: Epicote 154
(Oilized shell epoxy)] Epoxy sifting agent 2-ethyl-4-methylimidazole 1.8 parts by weight Tetrahydrophthalic anhydride 10
Part by weight Solvent: Methyl ethyl ketone 1
65iiti Table 2 [Effects of the Invention] Examples 1 and 2 to 1 show that the thermosetting resin film laminate of the present invention can be used to form a layer of a flexible printed wiring board. Comparative examples 1 and 2
is chlorosulfonated polyolefin 4i January (a) 1
Epoxy tree 111i(b) is (a)/(b)-20
/80 to 80/20.
また、実施例３から１本発明は加工性、保存性が改善さ
れ、電気絶縁性にも一層優れていることがわかる。Furthermore, it can be seen that Examples 3 to 1 of the present invention have improved processability and storage stability, and are even more excellent in electrical insulation properties.
Claims (1)
２層または離型性カバーフィルム、熱硬化性樹脂フィル
ム層および離型性フィルムの３層からなる積層体であり
、該熱硬化性樹脂フィルム層がクロルスルホン化ポリオ
レフィン樹脂（ａ）、エポキシ樹脂（ｂ）、エポキシ樹
脂硬化剤（ｃ）を含有し、（ａ）／（ｂ）が重量比で２
０／８０〜８０／２０、（ｃ）／（ｂ）が０．５／１０
０〜１００／１００の範囲にある熱硬化性樹脂フィルム
積層体。A laminate consisting of two layers consisting of a thermosetting resin film layer and a releasable film or three layers of a releasable cover film, a thermosetting resin film layer and a releasable film, and the thermosetting resin film layer contains a chlorosulfonated polyolefin resin (a), an epoxy resin (b), and an epoxy resin curing agent (c), and the weight ratio of (a)/(b) is 2.
0/80 to 80/20, (c)/(b) 0.5/10
A thermosetting resin film laminate in the range of 0 to 100/100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61212950A JPS6367143A (en) | 1986-09-09 | 1986-09-09 | Thermosetting resin film laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61212950A JPS6367143A (en) | 1986-09-09 | 1986-09-09 | Thermosetting resin film laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367143A true JPS6367143A (en) | 1988-03-25 |
Family
ID=16630980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61212950A Pending JPS6367143A (en) | 1986-09-09 | 1986-09-09 | Thermosetting resin film laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367143A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02178042A (en) * | 1988-12-28 | 1990-07-11 | Somar Corp | Thermosetting resin film |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180836A (en) * | 1984-02-28 | 1985-09-14 | 東洋紡績株式会社 | Thermo-setting resin film laminate |
| JPS61100446A (en) * | 1984-10-22 | 1986-05-19 | 東洋紡績株式会社 | Flexible printed wiring board |
-
1986
- 1986-09-09 JP JP61212950A patent/JPS6367143A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180836A (en) * | 1984-02-28 | 1985-09-14 | 東洋紡績株式会社 | Thermo-setting resin film laminate |
| JPS61100446A (en) * | 1984-10-22 | 1986-05-19 | 東洋紡績株式会社 | Flexible printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02178042A (en) * | 1988-12-28 | 1990-07-11 | Somar Corp | Thermosetting resin film |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6268070B1 (en) | Laminate for multi-layer printed circuit | |
| US5674611A (en) | Adhesive for copper foils and an adhesive-applied copper foil | |
| JP4788255B2 (en) | Resin composition, coverlay film using the same, and metal-clad laminate | |
| JP4411876B2 (en) | Adhesive composition for semiconductor device, adhesive sheet and coverlay film using the same, and copper-clad polyimide film | |
| JPS6367143A (en) | Thermosetting resin film laminate | |
| JP2809059B2 (en) | Coverlay | |
| JP2007112848A (en) | Resin composition and cover-lay film and metal-clad laminate each using the same | |
| JP2722402B2 (en) | Adhesive composition for flexible printed circuit boards | |
| JPH0553628B2 (en) | ||
| JPH10173342A (en) | Multilayer flexible rigid wiring board and production thereof | |
| JPH0529399A (en) | Tape for tab | |
| JPH07126585A (en) | Cover lay film | |
| JP3490226B2 (en) | Heat resistant coverlay film | |
| JP4665414B2 (en) | Adhesive composition for semiconductor device and coverlay film, adhesive sheet, copper-clad polyimide film using the same | |
| JPH03209792A (en) | Both-side metal-cladded flexible printed circuit board and manufacture thereof | |
| JPH0328285A (en) | Flame-retardant adhesive and flame-retardant coverlay film | |
| JPH07154068A (en) | Adhesive sheet and production thereof, metal based wiring board employing adhesive sheet and production thereof | |
| KR101860981B1 (en) | Manufacturing method of coverlay film and manufacturing method of flexible printed circuit board | |
| JP2835797B2 (en) | TAB tape | |
| JPH05259228A (en) | Tape for tab | |
| JPH06216521A (en) | Adhesive composition for flexible printed circuit board | |
| JPH05299823A (en) | Coverlay film | |
| JPH06236906A (en) | Adhesive tape for semiconductor | |
| JPH05347477A (en) | Adhesive composition for flexible printed circuit substrate | |
| JPS62112393A (en) | Circuit substrate |