CN103458607A - Extinction stiffening plate used for printed circuit board - Google Patents
Extinction stiffening plate used for printed circuit board Download PDFInfo
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- CN103458607A CN103458607A CN2012101817754A CN201210181775A CN103458607A CN 103458607 A CN103458607 A CN 103458607A CN 2012101817754 A CN2012101817754 A CN 2012101817754A CN 201210181775 A CN201210181775 A CN 201210181775A CN 103458607 A CN103458607 A CN 103458607A
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- circuit board
- stiffening plate
- layer
- printed circuit
- polyimide
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Abstract
The invention discloses an extinction stiffening plate used for a printed circuit board. The extinction stiffening plate used for the printed circuit board comprises a black polyimide film, a polyimide composite film and an adhesive layer, wherein the polyimide composite film is arranged between the black polyimide film and the adhesive layer, the polyimide composite film comprises at least one polyimide layer and an adhesion agent layer formed between the black polyimide film and the polyimide composite film, and the sum of the thickness of the black polyimide film and the thickness of the polyimide composite film is 3-9mil. After being attached to the printed circuit board, the extinction stiffening plate has the advantages of being capable of reducing warping height and shielding a circuit. The extinction stiffening plate used for the printed circuit board is especially suitable for consumer electronics with protective circuit patterns.
Description
Technical field
The present invention relates to a kind of stiffening plate for printed circuit board (PCB), specifically relate to a kind of delustring stiffening plate with reinforcement and screening effect.
Background technology
The polyimide resin thermal stability is high and have excellent insulating properties, mechanical strength and resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As the insulating barrier for flexible printed wiring board (Flexible Printed Circuit), or further for electronic building brick, the reinforcement purposes of printed circuit board (PCB) for example.
Polyimide film has been widely used in electronic material, and wherein, racemization photosensitiveness black polyamide thin film also is widely used in electronic material.In printed circuit board (PCB) polyimides stiffening plate used, generally can divide into the polyimides stiffening plate of individual layer slab or combined type.The polyimides stiffening plate of combined type, the polyimides plate structure of I257898 Taiwan patent announcement for example, it is to form the combined type polyimide plate of different-thickness with the thermmohardening solid of the polyimide plate of 2 Mills (mil) and different-thickness, yet, the problem that this combined type polyimide plate meets with in application, be to be limited to the thickness of polyimide plate cost and composite membrane, and can't cover the circuit layout pattern and be easy to be plagiarized by the same trade.In addition, because polyimide composite film is obtain by the combination of polyimide plate and adhesion agent layer, but its two thermal expansion coefficient difference often causes pasting to flexible circuit board for the composite membrane of reinforcement, the phenomenon of generation warpage.
Therefore, still need to develop a kind of circuit layout of covering effect that has, and pasting to flexible printed wiring board, be difficult for producing the delustring stiffening plate of warping phenomenon.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of stiffening plate of the delustring for printed circuit board (PCB), should there is the circuit layout of covering effect for delustring stiffening plate of printed circuit board (PCB), and be difficult for producing warping phenomenon pasting to flexible printed wiring board.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of stiffening plate of the delustring for printed circuit board (PCB), be provided with black polyamide film, polyimide composite film and adhesion layer, described polyimide composite film is folded between described black polyamide film and adhesion layer, described polyimide composite film comprises at least one strata imide layer, and there is adhesion agent layer between described black polyamide film and described polyimide composite film, wherein, the thickness summation of described black polyamide film and described polyimide composite film is 3 mil to 9 mil.
The thickness of described black polyamide film is 0.5mil to 2 mil.
Described polyimide composite film comprises at least two strata imide layer, and is formed with adhesion agent layer between adjacent polyimide layer.
The thickness of described polyimide layer is 1 mil to 2 mil.
The thickness of each described adhesion agent layer is 10 microns to 40 microns.
Each described adhesion agent layer is the adhesion agent layer that contains epoxy resin and colouring agent.
Described colouring agent is black colorant.
By weight percentage, the content of described black colorant accounts for 3% to 15% of described epoxy resin solid content.
Described black colorant is at least one in black pigment, carbon dust and carbon nanotube.
Also comprise fit on described adhesion layer lateral surface from the shape layer.
The invention has the beneficial effects as follows: black polyamide film of the present invention has the racemization photosensitiveness, be conducive to the protective circuit pattern, and the adhesion agent layer that is formed at the adhesion agent layer between each polyimide layer in polyimide composite film and is formed between black polyamide film and polyimide composite film comprises black colorant, can make the circuit pattern screening effect better, without increasing operation, can reach best circuit screening effect, and the present invention can be by controlling the thickness of black polyamide film and polyimide layer, to reduce, polyimide composite film is pasted to the depth of camber after circuit board.
The accompanying drawing explanation
The stiffening plate of the delustring for the printed circuit board (PCB) structural representation that Fig. 1 is the embodiment of the present invention 1;
The stiffening plate of the delustring for the printed circuit board (PCB) structural representation that Fig. 2 is the embodiment of the present invention 2.
Embodiment
Below, by specific instantiation explanation the specific embodiment of the present invention, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can other different mode be implemented, and, under not departing from disclosed category, can give different modifications and change that is.
Embodiment 1: a kind of stiffening plate of the delustring for printed circuit board (PCB) as shown in Figure 1, is provided with black polyamide film 11, polyimide composite film 10 and adhesion layer 14; Polyimide composite film 10 is formed on this black polyamide film 11, and this polyimide composite film 10 comprises at least one deck or multilayer polyimide layer 12 and adhesion agent layer 13; These adhesion layer 14 use so that this delustring stiffening plate attach on printed circuit board (PCB), this adhesion layer 14 is formed on this polyimide composite film 10, this polyimide composite film 10 is folded between this adhesion layer 14 and black polyamide film 11, wherein, the thickness summation Z of this black polyamide film 11 and polyimide composite film 10 is between between 3 to 9 mil.
Embodiment 2: a kind of stiffening plate of the delustring for printed circuit board (PCB) as shown in Figure 2, is provided with black polyamide film 21, polyimide composite film 20 and adhesion layer 24; Polyimide composite film 20 is formed on this black polyamide film 21, and this polyimide composite film 20 comprises at least one deck or multilayer polyimide layer 22 and adhesion agent layer 23; Adhesion layer 24 is formed on this polyimide composite film 20, and this polyimide composite film 20 is folded between this adhesion layer 24 and black polyamide film 21; Also comprise release film 25, fractal film 25 is formed on these adhesion layer 24 outer surfaces, this adhesion layer 24 is folded between this fractal film 25 and polyimide composite film 20, and wherein, the thickness summation Z ' of this black polyamide film 21 and polyimide composite film 20 is between between 3 to 9 mil.
In the embodiment of the present invention 1 and 2, this polyimide composite film comprises the multilayer polyimide layer and is formed at the respectively adhesion agent layer between this polyimide layer, in addition, adhesion agent layer also is formed between this black polyamide film and polyimide composite film, and this adhesion agent layer comprises epoxy resin and colouring agent.
In polyimide composite film of the present invention, respectively the thickness of this polyimide layer usually between between 1 to 2 mil, and is preferably between between 1.5 to 2 mil; And respectively the thickness of this adhesion agent layer normally between 10 to 40 microns.
The thickness of the black polyamide film that the present invention is used, normally between between 0.5 to 2 mil, and is preferably between between 1.5 to 2 mil.
In addition, utilization of the present invention makes the symmetry of the thickness of black polyamide film and polyimide layer, to reduce, polyimide composite film is pasted to the depth of camber after circuit board.In concrete application, that the thickness summation Z of black polyamide film and polyimide composite film is adjusted between between 3 to 9 mil, wherein, be preferably adjustment and make the thickness of black polyamide film and polyimide layer suitable, and the thickness of adhesion agent layer is to determine according to the Z value.
During concrete enforcement, when the thickness summation Z of black polyamide film and polyimide composite film is 3 mil, making the thickness of black polyamide film is 1mil, and to make polyimide layer be adjusted into 1 layer and thickness be 1mil; When thickness summation Z is 4, making the thickness of black polyamide film is 2mil, and to make polyimide layer be adjusted into 1 layer and thickness be 1mil; When thickness summation Z is 5, the thickness that makes the black polyamide film is between 1.5 to 2mil, and to adjust polyimide layer be 1 layer or 2 layers; When thickness summation Z is 6, the capable of regulating polyimide layer is 2 layers or 3 layers; When thickness summation Z is 7, the capable of regulating polyimide layer is 2 layers or 3 layers; When thickness summation Z is 8, the capable of regulating polyimide layer is 2 layers, 3 layers or 4 layers; When thickness summation Z is 9, the capable of regulating polyimide layer is 3 layers or 4 layers.According to the black polyamide film of adjusting racemization photosensitiveness of the present invention and the thickness symmetry of polyimide layer, can reduce polyimide composite film is pasted to the depth of camber to circuit board.
Colouring agent as adhesion agent layer of the present invention, for example can use black colorant, wherein, this black colorant is selected from the atrament of black pigment, carbon dust or carbon nanotube, and the content of this black colorant generally accounts for 3 to 15%(weight of this epoxy resin solid content), be preferably 4 to 8%(weight).Because racemization photosensitiveness black polyamide film and black adhesion agent layer present low-refraction and black hues, therefore the outer surface of delustring stiffening plate of the present invention has the cloudy surface characteristic, be particularly suitable for the printed circuit board (PCB) that covers the circuit pattern demand.
The kind of black polyamide film used in the present invention and polyimide layer is not particularly limited, and is preferably the not halogen-containing polyimide material of use, and better is to use to have from stickiness and not halogen-containing polyimide material.
The present invention can make by following step for the delustring stiffening plate of printed circuit board (PCB): at first, surface-coated one deck thermmohardening black solid at a racemization photosensitiveness black polyamide film, after being placed in the baking oven heat drying, with hot roller and another polyimide layer pressing, by that analogy, to the thickness of required polyimide composite film; Then, slaking 1 hour under the condition of 180 ℃; Finally, the adhesion layer in the surface-coated of this polyimide composite film as epoxy resin and so on, be formed for the delustring stiffening plate sample of printed circuit board (PCB).
Further, in order to keep the stickiness of this adhesion layer, be beneficial to follow-up be bonding on circuit board or the use of other pressure programmings, as shown in Figure 2, can be at outer surface laminating one deck release liners or the release film of this adhesion layer.
Accordingly; the present invention is that the polyimide composite film that utilizes the black polyamide film of specific thicknesses and contain black colorant forms the delustring stiffening plate; this delustring stiffening plate has advantages of the circuit pattern screening effect and reduces depth of camber, especially is applicable in the consumption electronic products of protective circuit pattern.
Test case: according to the data in following table one, prepare the stiffening plate of the delustring for printed circuit board (PCB) of the present invention.In the delustring stiffening plate of test case 1 to 7 of the present invention, include the black polyamide film, and the black adhesion agent layer in polyimide composite film comprises epoxy resin and black pigment, carbon dust or rice carbon dust how.
In addition, then prepare reference examples 1 to 7 sample (prior art), the delustring stiffening plate of this reference examples sample is only to use general polyimide film and adhesion layer, but not black polyamide film and black adhesion agent layer, all the other are all the same with test case.
The pure glue (trade name D3430) that the stiffening plate of test case and reference examples sample is all used Sony Corporation to produce.Then, stiffening plate is cut into to the size of 25 cm * 25 cm, and under 180 ℃ of conditions, be pressure bonded on the 3-Layer double-surface flexible copper foil substrate of 74.5 ± 1 um, carry out slaking with 160 ℃ of conditions again, again each sample is placed on smooth flat, after standing 20 minutes, measures the depth of camber (centimetre) of four corners, carry out the flatness test, result is embedded in table one.
Table one
As shown in table one result, at thickness summation Z under identical condition, compared to the stiffening plate sample that does not use black polyamide film and black adhesion agent layer, the depth of camber less of delustring stiffening plate of the present invention, thereby there is preferably flatness, and, along with gross thickness increases, flatness is more obvious.
Above-mentioned specification and embodiment are only illustrative principle of the present invention and effect thereof, but not for limiting this.The scope of the present invention, should be as listed as claims.
Claims (10)
1. the stiffening plate of the delustring for printed circuit board (PCB), it is characterized in that: be provided with black polyamide film, polyimide composite film and adhesion layer, described polyimide composite film is folded between described black polyamide film and adhesion layer, described polyimide composite film comprises at least one strata imide layer, and there is adhesion agent layer between described black polyamide film and described polyimide composite film, wherein, the thickness summation of described black polyamide film and described polyimide composite film is 3 mil to 9 mil.
2. the stiffening plate of the delustring for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: the thickness of described black polyamide film is 0.5mil to 2 mil.
3. the stiffening plate of the delustring for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: described polyimide composite film comprises at least two strata imide layer, and is formed with adhesion agent layer between adjacent polyimide layer.
4. the stiffening plate of the delustring for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: the thickness of described polyimide layer is 1 mil to 2 mil.
5. the stiffening plate of the delustring for printed circuit board (PCB) as described as claim 1 or 3, it is characterized in that: the thickness of each described adhesion agent layer is 10 microns to 40 microns.
6. the stiffening plate of the delustring for printed circuit board (PCB) as described as claim 1 or 3, it is characterized in that: each described adhesion agent layer is the adhesion agent layer that contains epoxy resin and colouring agent.
7. the stiffening plate of the delustring for printed circuit board (PCB) as claimed in claim 6, it is characterized in that: described colouring agent is black colorant.
8. the stiffening plate of the delustring for printed circuit board (PCB) as claimed in claim 7, it is characterized in that: by weight percentage, the content of described black colorant accounts for 3% to 15% of described epoxy resin solid content.
9. the stiffening plate of the delustring for printed circuit board (PCB) as claimed in claim 7, it is characterized in that: described black colorant is at least one in black pigment, carbon dust and carbon nanotube.
10. the stiffening plate of the delustring for printed circuit board (PCB) as claimed in claim 1 is characterized in that: also comprise fit on described adhesion layer lateral surface from the shape layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101817754A CN103458607A (en) | 2012-06-05 | 2012-06-05 | Extinction stiffening plate used for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101817754A CN103458607A (en) | 2012-06-05 | 2012-06-05 | Extinction stiffening plate used for printed circuit board |
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| CN103458607A true CN103458607A (en) | 2013-12-18 |
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| CN2012101817754A Pending CN103458607A (en) | 2012-06-05 | 2012-06-05 | Extinction stiffening plate used for printed circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103747612A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Champagne metal reinforcement sheet and preparation method thereof |
| CN106457800A (en) * | 2014-06-12 | 2017-02-22 | 东洋油墨Sc控股株式会社 | Resin composition, layered product, and process for producing layered product |
| CN106536184A (en) * | 2014-07-22 | 2017-03-22 | 东洋油墨Sc控股株式会社 | Laminate and production method for same |
| JP2020131686A (en) * | 2019-02-26 | 2020-08-31 | Dic株式会社 | Black polyimide adhesive tape |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20040142191A1 (en) * | 2003-01-14 | 2004-07-22 | Thinflex Corporation | Opaque polyimide coverlay |
| CN101665013A (en) * | 2009-09-15 | 2010-03-10 | 律胜科技（苏州）有限公司 | Polyimide film with defilade property and application and preparation method thereof |
| CN102143646A (en) * | 2010-01-28 | 2011-08-03 | 昆山雅森电子材料科技有限公司 | Stiffening plate for printed circuit board |
| CN202652692U (en) * | 2012-06-05 | 2013-01-02 | 昆山雅森电子材料科技有限公司 | Dulling and reinforcing plate used for printed circuit board |
-
2012
- 2012-06-05 CN CN2012101817754A patent/CN103458607A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040142191A1 (en) * | 2003-01-14 | 2004-07-22 | Thinflex Corporation | Opaque polyimide coverlay |
| CN101665013A (en) * | 2009-09-15 | 2010-03-10 | 律胜科技（苏州）有限公司 | Polyimide film with defilade property and application and preparation method thereof |
| CN102143646A (en) * | 2010-01-28 | 2011-08-03 | 昆山雅森电子材料科技有限公司 | Stiffening plate for printed circuit board |
| CN202652692U (en) * | 2012-06-05 | 2013-01-02 | 昆山雅森电子材料科技有限公司 | Dulling and reinforcing plate used for printed circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103747612A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Champagne metal reinforcement sheet and preparation method thereof |
| CN103747612B (en) * | 2013-12-31 | 2018-12-25 | 苏州中拓专利运营管理有限公司 | A kind of Champagne metal reinforcement sheet and preparation method thereof |
| CN106457800A (en) * | 2014-06-12 | 2017-02-22 | 东洋油墨Sc控股株式会社 | Resin composition, layered product, and process for producing layered product |
| CN106536184A (en) * | 2014-07-22 | 2017-03-22 | 东洋油墨Sc控股株式会社 | Laminate and production method for same |
| JP2020131686A (en) * | 2019-02-26 | 2020-08-31 | Dic株式会社 | Black polyimide adhesive tape |
| JP7263836B2 (en) | 2019-02-26 | 2023-04-25 | Dic株式会社 | black polyimide adhesive tape |
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Application publication date: 20131218 |
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