CN101422979A - Polyimide composite film - Google Patents
Polyimide composite film Download PDFInfo
- Publication number
- CN101422979A CN101422979A CNA2007101675856A CN200710167585A CN101422979A CN 101422979 A CN101422979 A CN 101422979A CN A2007101675856 A CNA2007101675856 A CN A2007101675856A CN 200710167585 A CN200710167585 A CN 200710167585A CN 101422979 A CN101422979 A CN 101422979A
- Authority
- CN
- China
- Prior art keywords
- polyimide
- thickness
- composite film
- film
- polyimide composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a polyimide complex film, containing a plurality of layers of polyimide films and an adhesive coating formed among the polyimide films, wherein, the total thickness Z of the polyimide complex film conforms with the following formula (I): mX plus nY is equal to Z (I), m stands for the number of layers of the polyimide films; n stands for the number of layers of adhesive coatings; X stands for the thickness of each polyimide film and ranges from 0.5 to 1.5mil; and Y stands for the thickness of the adhesive coating and is determined according to a specific Z value. The complex film is formed by using the polyimide films with the thickness between 0.5 and 1.5mil as well as the adhesive coating. A polyimide complex film with specific thickness can be formed by adjusting the layer number of the polyimide films and the thickness of the adhesive coating according to requirements. The polyimide complex film has the advantages of low cost and high flatness and is especially applicable to the reinforcement process of flexible printed wiring boards.
Description
Technical field
The present invention relates to a kind of polyimide composite film, especially relate to a kind of polyimide composite film with strengthening action.
Background technology
The polyimide resin heat endurance is high and have excellent insulating properties, mechanical strength, reach resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As be used for the insulating barrier of flexible printed wiring board (Flexible Printed Circuit), perhaps be used for the electronics spare part further, for example the reinforcement purposes of printed circuit board (PCB).
Kapton has been widely used in electronic material, wherein, the polyimides stiffening plate that printed circuit board (PCB) is used, generally can divide into the polyimides stiffening plate of individual layer slab or combined type, and the stiffening plate of combined type, as the disclosed polyimides plate structure of TaiWan, China patent I257898, it is for forming the combined type polyimide plate that gross thickness is respectively 5mil, 7mil, 8mil and 9mil with the polyimide plate of 2 Mills (mil) and the heat curing adhesive of different-thickness, to save the use cost of polyimides.Yet the combined type polyimide plate suffers from flatness on using not good, easily produces problems such as warping phenomenon, and its reason is that the uniformity of material gross thickness is not good, when being used for stiffening plate thereafter, easily influences soft board process operations and finished product yield.
Therefore, still need a kind of thickness evenness good and have a polyimide composite film of high flatness.
Summary of the invention
In view of the above problems, main purpose of the present invention is to provide a kind of polyimide composite film cheaply.
Another object of the present invention provides a kind of polyimide composite film with high flatness.
Another purpose of the present invention provides a kind of stiffening plate with high flatness.
In order to reach above-mentioned and other purpose, the invention provides a kind of polyimide composite film, comprise multilayer polyimide film; And the adhesive layer that between this polyimide film, forms; Wherein, the gross thickness Z of this polyimide composite film meets following formula (I):
mX+nY＝Z (I)
In the formula, m represents the polyimide film number of plies in this composite membrane; N represents the adhesive layer number of plies in this composite membrane; X represents the thickness of each polyimide film, and in 0.5 to 1.5mil scope; And Y represents the thickness of adhesive layer, and Y decides according to specific Z value.This polyimide composite film is to utilize the polyimide film of thickness 0.5 to 1.5mil and adhesive layer to form, can optionally adjust the number of plies of polyimide film and the thickness of adhesive layer, formation has the polyimide composite film of specific thicknesses, have advantage low-cost and high flatness, be particularly suitable for the reinforcement processing procedure of flexible printed wiring board processing.
On the other hand, the present invention provides a kind of stiffening plate that is used as again, comprises the polyimide film and the formed polyimide composite film of adhesive layer that utilize thickness 0.5 to 1.5mil, and the pure glue that forms on this polyimide composite film surface.This stiffening plate has excellent electric and processing characteristics, is particularly suitable for the soft board procedure for processing, and strengthening action is provided.
Description of drawings
Fig. 1 shows polyimide composite film structure of the present invention;
Fig. 2 is the thickness evenness test result of polyimide composite film test specimen of the present invention and known polyimide composite film control sample; And
Fig. 3 is the flatness test result of test specimen of the present invention and known specimen.
The specific embodiment
Fig. 1 shows polyimide composite film 100 of the present invention, comprises multilayer polyimide film 101; And the adhesive layer 102 that between this polyimide film, forms.This polyimide film 101 respectively has thickness X, and this X is in 0.5 to 1.5mil scope, preferably in 0.75 to 1.25mil scope; In a preferred instantiation, each polyimide film in this composite membrane has the thickness of 1mil.
In the polyimide composite film of the present invention, the gross thickness of visual this composite membrane needs, according to polyimide film number of stories m and the adhesive layer number of plies n in formula (I) the adjustment composite membrane, and the thickness Y of each adhesive layer, form gross thickness and be about 3 to 15mil, or the above polyimide composite film of 15mil
mX+nY＝Z (I)。
In this polyimide composite film, employed polyimide film and adhesive kind are also without particular limitation, and the not halogen-containing adhesive of preferred use more preferably uses to have from stickiness and not halogen-containing adhesive.
First instantiation
In this instantiation, use polyimide film and the 1mil heat curing adhesive of two layer thickness 1mil, form the polyimide composite film of gross thickness 3mil.At first, at the heat curing adhesive of the about 1mil of first polyimide film of 1mil surface coating one layer thickness, place the baking oven heat drying after, by the second polyimide film pressing of hot roller and another thickness 1mil.Then, slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample one of gross thickness 3mil.
Second instantiation
In this instantiation, use polyimide film and the 0.5mil heat curing adhesive of threeply degree 1mil, form the polyimide composite film of gross thickness 4mil.At first,, use the polyimide film of two layer thickness 1mil earlier, change heat curing adhesive into 0.5mil, form first polyimide composite film of thickness 2.5mil according to first instantiation.Then, at the heat curing adhesive of the about 0.5mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, close by the 3rd polyimides mould of hot roller and another thickness 1mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample two of gross thickness 4mil.
The 3rd instantiation
In this instantiation, use polyimide film and the 1mil heat curing adhesive of four layer thickness 1mil, form the polyimide composite film of gross thickness 5mil.At first,, use the polyimide film of two layer thickness 1mil earlier, form first polyimide composite film of thickness 3mil according to first instantiation.Then, at the heat curing adhesive of the about 1mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, close by the 3rd polyimides mould of hot roller and another thickness 1mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample three of gross thickness 5mil.
The 4th instantiation
In this instantiation, use polyimide film and 0.66 to the 0.67mil heat curing adhesive of four layer thickness 1mil, form the polyimide composite film of gross thickness 6mil.At first, according to first instantiation, the polyimide film that each uses two layer thickness 1mil changes heat curing adhesive into 0.67mil, forms first polyimide composite film and second polyimide composite film that two thickness are 2.67mil.Then, at the heat curing adhesive of the about 0.66mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, by the second polyimide composite film pressing of hot roller and another thickness 2.67mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample four of gross thickness 6mil.
The 5th instantiation
In this instantiation, use polyimide film and the 1mil heat curing adhesive of four layer thickness 1mil, form the polyimide composite film of gross thickness 7mil.At first, according to first instantiation, each uses the polyimide film of two layer thickness 1mil, forms first polyimide composite film and second polyimide composite film that two thickness are 3mil.Then, at the heat curing adhesive of the about 1mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, by the hot roller and the second polyimide composite film pressing.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample five of gross thickness 7mil.
The 6th instantiation
In this instantiation, use polyimide film and the 0.75mil heat curing adhesive of five layer thickness 1mil, form the polyimide composite film of gross thickness 8mil.At first, according to first instantiation, the polyimide film that each uses two layer thickness 1mil changes heat curing adhesive into 0.75mil, forms first polyimide composite film and second polyimide composite film that two thickness are 2.75mil.Then, at the heat curing adhesive of the about 0.75mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, by the 3rd polyimides composite membrane of hot roller and second polyimide composite film pressing formation thickness 6.25mil.At the heat curing adhesive of the about 0.75mil of the 3rd polyimides composite membrane surface coating one layer thickness, place the baking oven heat drying after, by the polyimide film pressing of hot roller and thickness 1mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample six of gross thickness 8mil.
The 7th instantiation
In this instantiation, use polyimide film and the 1mil heat curing adhesive of five layer thickness 1mil, form the polyimide composite film of gross thickness 9mil.At first, according to first instantiation, each uses the polyimide film of two layer thickness 1mil, forms first polyimide composite film and second polyimide composite film that two thickness are 3mil.Then, at the heat curing adhesive of the about 1mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, by the 3rd polyimides composite membrane of hot roller and second polyimide composite film pressing formation thickness 7mil.At the heat curing adhesive of the about 1mil of the 3rd polyimides composite membrane surface coating one layer thickness, place the baking oven heat drying after, by the polyimide film pressing of hot roller and thickness 1mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample seven of gross thickness 9mil.
The 8th instantiation
In this instantiation, use polyimide film and the 0.8mil heat curing adhesive of six layer thickness 1mil, form the polyimide composite film of gross thickness 10mil.At first, according to first instantiation, the polyimide film that each uses two layer thickness 1mil changes heat curing adhesive into 0.8mil, form three thickness be 2.8mil first, second, with the 3rd polyimides composite membrane.Then, at the heat curing adhesive of the about 0.8mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, by the polyimide composite film of hot roller and second polyimide composite film pressing formation thickness 6.4mil.At the heat curing adhesive of the about 0.8mil of the polyimide composite film of this 6.4mil surface coating one layer thickness, place the baking oven heat drying after, by the 3rd polyimides composite membrane pressing of hot roller and thickness 2.8mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample eight of gross thickness 10mil.
The 9th instantiation
In this instantiation, use polyimide film and the 1mil heat curing adhesive of six layer thickness 1mil, form the polyimide composite film of gross thickness 11mil.At first, according to first instantiation, each uses the polyimide film of two layer thickness 1mil, form three thickness be 3mil first, second, with the 3rd polyimides composite membrane.Then, at the heat curing adhesive of the about 1mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, by the polyimide composite film of hot roller and second polyimide composite film pressing formation thickness 7mil.At the heat curing adhesive of the about 1mil of the polyimide composite film of this 7mil surface coating one layer thickness, place the baking oven heat drying after, by the 3rd polyimides composite membrane pressing of hot roller and thickness 3mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample nine of gross thickness 11mil.
The tenth instantiation
In this instantiation, use polyimide film and 0.83 to the 0.58mil heat curing adhesive of seven layer thickness 1mil, form the polyimide composite film of gross thickness 12mil.At first, according to second instantiation, the polyimide film that each uses threeply degree 1mil changes heat curing adhesive into 0.83mil, forms first and second polyimide composite film that two thickness are 4.66mil.Then, at the heat curing adhesive of the about 0.83mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, the polyimide composite film of the polyimide film pressing formation thickness 6.49mil by hot roller and another thickness 1mil.At the heat curing adhesive of the about 0.85mil of the polyimide composite film of this thickness 6.49mil surface coating one layer thickness, place the baking oven heat drying after, by the second polyimide composite film pressing of hot roller and thickness 4.66mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample ten of gross thickness 12mil.
The 11 instantiation
In this instantiation, use polyimide film and the 1mil heat curing adhesive of seven layer thickness 1mil, form the polyimide composite film of gross thickness 13mil.At first, according to second instantiation, each uses the polyimide film of threeply degree 1mil, forms first and second polyimide composite film that two thickness are 5mil.Then, at the heat curing adhesive of the about 1mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, the polyimide composite film of the polyimide film pressing formation thickness 7mil by hot roller and another thickness 1mil.At the heat curing adhesive of the about 1mil of the polyimide composite film of this thickness 7mil surface coating one layer thickness, place the baking oven heat drying after, by the second polyimide composite film pressing of hot roller and thickness 5mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample 11 of gross thickness 13mil.
The 12 instantiation
In this instantiation, use polyimide film and 0.857 to the 0.858mil heat curing adhesive of eight layer thickness 1mil, form the polyimide composite film of gross thickness 14mil.At first, according to the 4th instantiation, the polyimide film that each uses four layer thickness 1mil changes heat curing adhesive into 0.857mil, forms first and second polyimide composite film that two thickness are 6.571mil.Then, at the heat curing adhesive of the about 0.858mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, by the second polyimide composite film pressing of hot roller and another thickness 6.571mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample 12 of gross thickness 14mil.
The 13 instantiation
In this instantiation, use polyimide film and the 1mil heat curing adhesive of eight layer thickness 1mil, form the polyimide composite film of gross thickness 15mil.At first, according to the 4th instantiation, each uses the polyimide film of four layer thickness 1mil, forms first and second polyimide composite film that two thickness are 7mil.Then, at the heat curing adhesive of the about 1mil of this first polyimide composite film surface coating one layer thickness, place the baking oven heat drying after, by the second polyimide composite film pressing of hot roller and another thickness 7mil.Slaking is 1 hour under 180 ℃ condition, forms the polyimide composite film sample 13 of gross thickness 15mil.
The present invention is further with the explanation of following specific embodiment, scope perhaps in it should not be construed as limiting the invention in any form.
Embodiment
According to the 3rd instantiation, use Da Mai company produces the polyimide film of (trade name TH) thickness 1mil, forms the polyimide composite film test specimen of gross thickness 5mil.
Comparative example 1
Use two Da Mai companies to produce the polyimide film of (trade name TH) thickness 2mil,, form the polyimide composite film control sample of gross thickness 5mil with the adhesive layer of a layer thickness 1mil.
Getting 20 respectively forms according to embodiment 1, the polyimide composite film test specimen of gross thickness 5mil (125 μ m), and according to comparative example 1 form the polyimide composite film control sample of gross thickness 5mil (125 μ m), carry out thickness measuring, with outcome record in table 1.The result of conversion tolerance as shown in Figure 2.
Table 1
| Sample number into |
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| The test specimen thickness of embodiment 1 (μ m) | 124.6 | 123.7 | 125.4 | 124.6 | 126.8 | 125.9 | 127.2 | 127.1 | 125.7 | 124.5 |
| The control sample thickness of comparative example 1 (μ m) | 126.8 | 127.2 | 123.9 | 127.8 | 127.7 | 124.6 | 122.5 | 127.6 | 122.4 | 123.8 |
| Sample number into spectrum | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18 | 19 | 20 |
| The test specimen thickness of embodiment 1 (μ m) | 123.9 | 124.7 | 125.2 | 126.4 | 127.2 | 125.6 | 123.9 | 124.3 | 126.7 | 127.1 |
| The control sample thickness of comparative example 1 (μ m) | 121.9 | 127.4 | 123.8 | 121.7 | 123.4 | 128.5 | 129.2 | 127.8 | 128.4 | 123.1 |
Table 1 shows with the result of Fig. 2, with regard to the polyimide composite film of same overall thickness, the formed polyimide composite film test specimen of the polyimide film of used thickness 0.5 to 1.5mil of the present invention and adhesive layer, its thickness deviation is all in the scope of 125 ± 3 μ m.In comparison, the formed polyimide composite film control sample of the polyimide film of prior art method used thickness 2mil, its thickness deviation then are 125 ± 5 μ m.Hence one can see that, and under the identical condition of gross thickness, polyimide composite film of the present invention obviously has preferable uniformity, and when the gross thickness of composite membrane increased, the difference of its thickness evenness was more remarkable.Therefore, polyimide composite film of the present invention has more excellent thickness evenness except that having cost advantage, more can meet the demand of FPC reinforcement processing procedure.
Embodiment 2a-2d
According to the 3rd instantiation, use SKC company to produce polyimide film (the trade name IF70 of thickness 1mil respectively, thermal coefficient of expansion 16ppm/ ℃), Kaneka company produces polyimide film (the trade name NPI of thickness 1mil, thermal coefficient of expansion 16ppm/ ℃), Tamide company produces polyimide film (the trade name TH of thickness 1mil, thermal coefficient of expansion 45ppm/ ℃) and Local company produce the polyimide film (thermal coefficient of expansion 55ppm/ ℃) of thickness 1mil, form the polyimide composite film of gross thickness 5mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains test specimen 2a-2d in 1 hour.
Embodiment 3a-3d
According to the 7th instantiation, use SKC company to produce polyimide film (the trade name IF70 of thickness 1mil respectively, thermal coefficient of expansion 16ppm/ ℃), Kaneka company produces polyimide film (the trade name NPI of thickness 1mil, thermal coefficient of expansion 16ppm/ ℃), Tamide company produces polyimide film (the trade name TH of thickness 1mil, thermal coefficient of expansion 45ppm/ ℃) and Local company produce the polyimide film (thermal coefficient of expansion 55ppm/ ℃) of thickness 1mil, form the polyimide composite film of gross thickness 9mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains test specimen 3a-3d in 1 hour.
Embodiment 4a-4d
According to the 9th instantiation, use SKC company to produce polyimide film (the trade name IF70 of thickness 1mil respectively, thermal coefficient of expansion 16ppm/ ℃), Kaneka company produces polyimide film (the trade name NPI of thickness 1mil, thermal coefficient of expansion 16ppm/ ℃), Tamide company produces polyimide film (the trade name TH of thickness 1mil, thermal coefficient of expansion 45ppm/ ℃) and Local company produce the polyimide film (thermal coefficient of expansion 55ppm/ ℃) of thickness 1mil, form the polyimide composite film of gross thickness 11mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains test specimen 4a-4d in 1 hour.
Embodiment 5a-5d
According to the 13 instantiation, use SKC company to produce polyimide film (the trade name IF70 of thickness 1mil respectively, thermal coefficient of expansion 16ppm/ ℃), Kaneka company produces polyimide film (the trade name NPI of thickness 1mil, thermal coefficient of expansion 16ppm/ ℃), Tamide company produces polyimide film (the trade name TH of thickness 1mil, thermal coefficient of expansion 45ppm/ ℃) and Local company produce the polyimide film (thermal coefficient of expansion 55ppm/ ℃) of thickness 1mil, form the polyimide composite film of gross thickness 15mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains test specimen 5a-5d in 1 hour.
Comparative example 2a
Use two SKC companies to produce the polyimide film (trade name IF70, thermal coefficient of expansion 16ppm/ ℃) of thickness 2mil and the adhesive layer of a layer thickness 1mil, form the polyimide composite film of gross thickness 5mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains control sample 2a in 1 hour.
Comparative example 2b-2d
Repeat comparative example 2a, polyimide film (the trade name IF70 that uses SKC company to be produced respectively, thermal coefficient of expansion 16ppm/ ℃), polyimide film (the trade name NPI that produced of Kaneka company, thermal coefficient of expansion 16ppm/ ℃), polyimide film (the trade name TH that produced of Tamide company, thermal coefficient of expansion 45ppm/ ℃) and the polyimide film (thermal coefficient of expansion 55ppm/ ℃) produced of Local company, form the polyimide composite film of gross thickness 5mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains control sample 2b-2d in 1 hour.
Comparative example 3a
Use two SKC companies to produce polyimide film (the trade name IF70 of thickness 2mil, thermal coefficient of expansion 16ppm/ ℃), two SKC companies produce polyimide film (the trade name IF70 of thickness 1mil, thermal coefficient of expansion 16ppm/ ℃) and the adhesive layer of threeply degree 1mil, form the polyimide composite film of gross thickness 9mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains control sample 3a in 1 hour.
Comparative example 3b-3d
Repeat comparative example 3a, polyimide film (the trade name IF70 that uses SKC company to be produced respectively, thermal coefficient of expansion 16ppm/ ℃), polyimide film (the trade name NPI that produced of Kaneka company, thermal coefficient of expansion 16ppm/ ℃), polyimide film (the trade name TH that produced of Tamide company, thermal coefficient of expansion 45ppm/ ℃) and the polyimide film (thermal coefficient of expansion 55ppm/ ℃) produced of Local company, form the polyimide composite film of gross thickness 9mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains control sample 3b-3d in 1 hour.
Comparative example 4a
Use four SKC companies to produce the polyimide film (trade name IF70, thermal coefficient of expansion 16ppm/ ℃) of thickness 2mil and the adhesive layer of threeply degree 1mil, form the polyimide composite film of gross thickness 11mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains control sample 4a in 1 hour.
Comparative example 4b-4d
Repeat comparative example 4a, polyimide film (the trade name IF70 that uses SKC company to be produced respectively, thermal coefficient of expansion 16ppm/ ℃), polyimide film (the trade name NPI that produced of Kaneka company, thermal coefficient of expansion 16ppm/ ℃), polyimide film (the trade name TH that produced of Tamide company, thermal coefficient of expansion 45ppm/ ℃) and the polyimide film (thermal coefficient of expansion 55ppm/ ℃) produced of Local company, form the polyimide composite film of gross thickness 11mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains control sample 4b-4d in 1 hour.
Comparative example 5a
Use five SKC companies to produce the polyimide film (trade name IF70, thermal coefficient of expansion 16ppm/ ℃) of thickness 2mil and the adhesive layer of threeply degree 1.25mil (31.25 μ m), form the polyimide composite film of gross thickness 15mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains control sample 5a in 1 hour.
Comparative example 5b-5d
Repeat comparative example 5a, polyimide film (the trade name IF70 that uses SKC company to be produced respectively, thermal coefficient of expansion 16ppm/ ℃), polyimide film (the trade name NPI that produced of Kaneka company, thermal coefficient of expansion 16ppm/ ℃), polyimide film (the trade name TH that produced of Tamide company, thermal coefficient of expansion 45ppm/ ℃) and the polyimide film (thermal coefficient of expansion 55ppm/ ℃) produced of Local company, form the polyimide composite film of gross thickness 15mil.The pure glue (trade name D3430) that Sony Corporation produced is pasted to this polyimide composite film surface, make stiffening plate.Then, this stiffening plate is cut into the size of 15cm * 25cm, presses operating condition soon: 180 ℃ of temperature, pressure 100Kgf/cm
2, precompressed 10sec; The real pressure under the 60sec is pressure bonded on the polyimides soft board base material, again with 160 ℃, carries out slaking, and obtains control sample 5b-5d in 1 hour.
Test case 2
Each specimen and control sample are placed on the smooth flat, leave standstill 20 minutes after, measure the depth of camber (centimetre) of four corners, carry out flatness and test, be recorded in table 2, the result as shown in Figure 3.
Table 2
| Sample number into spectrum | 2a | 2b | 2c | 2d | 3a | 3b | 3c | 3d |
| Specimen | 1.2 | 1 | 1.4 | 8 | 0.6 | 0.8 | 1.2 | 8.5 |
| Control sample | 1.8 | 1.6 | 5.5 | 13 | 1.7 | 1.8 | 7 | 13.5 |
| Sample number into spectrum | 4a | 4b | 4c | 4d | 5a | 5b | 5c | 5d |
| Specimen | 0.6 | 0.6 | 1.4 | 7.9 | 0.4 | 0.7 | 1.5 | 7.2 |
| Control sample | 1.8 | 1.8 | 7.5 | 12 | 1.8 | 2 | 8.5 | 14 |
Show with Fig. 3 result according to table 2, under the identical condition of gross thickness, compared to the formed control sample of the polyimide film of known used thickness 2mil, the polyimide film of used thickness 0.5 to 1.5mil of the present invention is relative less with the depth of camber of the formed test specimen of adhesive layer, thereby has a preferable flatness, and along with gross thickness increases, the difference of flatness is more obvious.On the other hand, under the identical condition of gross thickness, use the high polyimides film production specimen of the present invention of thermal coefficient of expansion, the improvement of its flatness is more remarkable.
Therefore, polyimide composite film of the present invention and the formed stiffening plate of this composite membrane except that having high-peeling strength, scolding tin hear resistance and ageing resistance, have more cost advantage, and, be particularly suitable for the reinforcement processing procedure of soft board processing further with the thickness evenness and the flatness of excellence.
Above-mentioned specification and embodiment only are illustrative principle of the present invention and effect thereof, but not are used to limit the present invention.The scope of the present invention, claim is listed as described later.
Claims (10)
1, a kind of polyimide composite film comprises:
Multilayer polyimide film; And
The adhesive layer that between this polyimide film, forms; Wherein, the gross thickness Z of this polyimide composite film meets following formula (I):
mX+nY＝Z(I)
In the formula, m represents the polyimide film number of plies in the composite membrane; N represents the adhesive layer number of plies in the composite membrane; X represents the thickness of each polyimide film, and in 0.5 to 1.5mil scope; And Y represents the thickness of adhesive layer respectively, and this Y decides according to specific Z value.
2, polyimide composite film as claimed in claim 1, wherein, this X is 1mil.
3, polyimide composite film as claimed in claim 1, wherein, this Z be 3 and m be 2.
4, polyimide composite film as claimed in claim 1, wherein, this Z is 4 to 5, and this m is 3.
5, polyimide composite film as claimed in claim 1, wherein, this Z is 6 to 7, and this m is 4.
6, polyimide composite film as claimed in claim 1, wherein, this Z is 8 to 9, and this m is 5.
7, polyimide composite film as claimed in claim 1, wherein, this Z is 10 to 11, and this m is 6.
8, polyimide composite film as claimed in claim 1, wherein, this Z is 12 to 13, and this m is 7.
9, polyimide composite film as claimed in claim 1, wherein, this Z is 14 to 15, and this m is 8.
10, a kind of stiffening plate comprises as each described polyimide composite film in 1 to 9 of the claim the and the pure glue that forms on this polyimide composite film surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101675856A CN101422979A (en) | 2007-10-29 | 2007-10-29 | Polyimide composite film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101675856A CN101422979A (en) | 2007-10-29 | 2007-10-29 | Polyimide composite film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101422979A true CN101422979A (en) | 2009-05-06 |
Family
ID=40613950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101675856A Pending CN101422979A (en) | 2007-10-29 | 2007-10-29 | Polyimide composite film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101422979A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950856A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Polyimide composite film for printed circuit boards |
| CN112888184A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method with marking line and manufacturing method of flexible circuit board |
| CN112888170A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board |
| WO2021120191A1 (en) * | 2019-12-20 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Polyimide composite metal plate |
| WO2021120116A1 (en) * | 2019-12-19 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Flexible polyimide plate |
-
2007
- 2007-10-29 CN CNA2007101675856A patent/CN101422979A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950856A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Polyimide composite film for printed circuit boards |
| CN102950856B (en) * | 2011-08-26 | 2014-10-29 | 昆山雅森电子材料科技有限公司 | Polyimide composite film for printed circuit boards |
| WO2021120116A1 (en) * | 2019-12-19 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Flexible polyimide plate |
| WO2021120191A1 (en) * | 2019-12-20 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Polyimide composite metal plate |
| CN112888184A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method with marking line and manufacturing method of flexible circuit board |
| CN112888170A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8536460B2 (en) | Composite double-sided copper foil substrates and flexible printed circuit board structures using the same | |
| CN102630126B (en) | Compound double-side copper clad laminate and manufacturing method thereof | |
| CN102143646B (en) | Stiffening plate for printed circuit board | |
| CN101422979A (en) | Polyimide composite film | |
| CN102794962A (en) | Composite double-sided copper foil substrate and manufacturing method thereof | |
| CN101151946B (en) | Multi-layer laminate and flexible copper-clad laminated substrate production method | |
| TWI430883B (en) | Heat resistance followed by sheet | |
| CN111642068A (en) | RCC substrate and multi-layer laminated flexible board | |
| CN201494071U (en) | Polyimide composite film for printed circuit board | |
| CN109219513A (en) | The manufacturing method of flexible metal clad laminate plywood | |
| CN102118915B (en) | Double-side copper foil substrate and manufacturing method thereof | |
| CN202773177U (en) | Copper foil substrate having composite type structure | |
| CN202242153U (en) | Polyimide composite film for printed circuit board | |
| JP2006339661A (en) | Manufacturing method of multilayer bonding sheet and flexible double-sided metal-clad laminate | |
| CN103796419B (en) | Extinction black stiffening plate for printed circuit board (PCB) | |
| CN203126052U (en) | Composite double-sided copper foil substrate | |
| CN110650597B (en) | Circuit board, manufacturing method thereof and electronic equipment | |
| CN202889773U (en) | Matte black reinforcement plate for printed circuit board | |
| CN202782009U (en) | Composite double-sided copper clad laminate | |
| CN102950856B (en) | Polyimide composite film for printed circuit boards | |
| CN201657483U (en) | Reinforcement plate for printed circuit board | |
| TWM525600U (en) | Reinforcing plates | |
| JP2002326308A (en) | Heat-resistant flexible laminated sheet and method for manufacturing the same | |
| CN219236379U (en) | Flexible copper-clad plate of polyimide without glue lamination | |
| CN204408744U (en) | Use in printed circuit board extinction black stiffening plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: KUNSHAN YASHEN ELECTRON MATERIAL SCIENCE CO., LTD. Free format text: FORMER OWNER: ASIA ELECTRIC WORKS CO., LTD. Effective date: 20090814 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20090814 Address after: 169, Huangpu Road, Kunshan Economic Development Zone, Jiangsu, China: 215300 Applicant after: Asia Electronic Materials Co., Ltd. Address before: Taiwan Hsinchu County Chinese jhubei City, 676 Zhonghua Road No. 18 Lane 4 Building Applicant before: Asia Electronic Material Co., Ltd. |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090506 |