CN201494071U - Polyimide composite film for printed circuit board - Google Patents
Polyimide composite film for printed circuit board Download PDFInfo
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- CN201494071U CN201494071U CN2009201532378U CN200920153237U CN201494071U CN 201494071 U CN201494071 U CN 201494071U CN 2009201532378 U CN2009201532378 U CN 2009201532378U CN 200920153237 U CN200920153237 U CN 200920153237U CN 201494071 U CN201494071 U CN 201494071U
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- polyimide
- composite film
- adhesion agent
- film
- polyimide composite
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Abstract
A polyimide composite film for a printed circuit board comprises a plurality of layers of polyimide films, and adhesion agent layers formed among the polyimide films, wherein at least one adhesion agent layer comprises an additive from powdered carbon, a carbon nano-tube, and a black pigment or a mixture; the content of the additive occupies 3 wt% to 20 wt% of the adhesion agent solid content; and the total thickness Z of the polyimide composite film meets the relation of the formula (I): mX plus nY equal to Z (I), wherein m refers to the number polyimide film layers, n refers to the number of the adhesion agent layers, X refers to the thickness of a polyimide film, the length of X is 1 mil to 2 mil, and Y refers to the thickness of adhesion agent, and is determined according to a specific value. The utility model utilizes the polyimide film and/or the adhesion agent with the specific thicknesses and containing the additives to form the composite film with the screening effect, and is suitable for being used for consumer electronic products with protecting circuit patterns.
Description
Technical field
The utility model relates to a kind of polyimide composite film, particularly relates to a kind of polyimide composite film with reinforcement and screening effect.
Background technology
The polyimide resin heat endurance is high and have excellent insulating properties, mechanical strength, reach resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As be used for the insulating barrier of flexible printed wiring board (Flexible Printed Circuit), perhaps be used for electronic component further, for example the reinforcement purposes of printed circuit board (PCB).
Kapton has been widely used in electronic material, and wherein, the polyimides stiffening plate that printed circuit board (PCB) is used generally can be divided into the polyimides stiffening plate of individual layer slab or combined type.And the stiffening plate of combined type, as the disclosed polyimides plate structure of TaiWan, China patent I257898, it is the combined type polyimide plate that forms different-thickness with the thermmohardening solid of the polyimide plate of 2 Mills (mil) and different-thickness, yet, polyimide composite film is in using the problem that meets with that goes up, be to be subject to the thickness of polyimide film cost and composite membrane, can't cover the circuit layout pattern and adhesion agent layer is easy to be plagiarized by the same trade.
Therefore, still need a kind of thickness evenly and have a polyimide composite film of screening effect.
The utility model content
The purpose of this utility model provides a kind of thickness evenly and have a polyimide composite film of screening effect.
For achieving the above object, the utility model provides a kind of polyimide composite film that is used for printed circuit board (PCB), comprising: multilayer polyimide film; And be formed at adhesion agent layer between this polyimide film, its at least one deck adhesion agent layer comprise the additive that is selected from carbon dust, CNT, black pigment or its mixture, this additive content account for the solid solid content 3 to 20wt%, and the gross thickness Z of this polyimide composite film meets the relation of following formula (I):
mX+nY＝Z (I)
In the formula, m represents the polyimide film number of plies in this composite membrane; N represents the adhesion agent layer number of plies in this composite membrane; X represents the respectively thickness of this polyimide film, and X is 1 to 2mil; And Y represents the thickness of this adhesion agent layer respectively, and this Y decides according to specific Z value.
The utility model is to utilize specific thicknesses and contain the polyimide film of additive and/or the composite membrane that adhesion agent layer formation has screening effect, is particularly suitable for the consumption electronic products of holding circuit pattern.
On the other hand, the utility model provides a kind of stiffening plate again, comprises that utilizing thickness is 1 to 2mil polyimide film and the formed polyimide composite film of adhesion agent layer, and the pure glue that is formed at this polyimide composite film surface.
This stiffening plate not only has excellent electric, reinforcement and processing characteristics, has more screening effect, is particularly suitable for the soft board process for machining and manufacturing.
Description of drawings
Fig. 1 shows polyimide composite film structure of the present utility model.
The main element symbol description:
100 polyimide composite films
101 polyimide films
102,102a, 102b adhesion agent layer
The specific embodiment
Below by specific instantiation embodiment of the present utility model is described, those skilled in the art can understand advantage of the present utility model and effect easily by the content that this specification disclosed.The utility model also can other different mode be implemented, and, under the category that does not deviate from the utility model and disclosed, can give different modifications and change that is.
In this article, lightness (lightness claims the L value again) is meant the definition to the bright-dark degree of color according to International Commission on Illumination (International Commission on Illumination).Usually, white lightness is the highest, and the black lightness is minimum.
Fig. 1 shows polyimide composite film 100 of the present utility model, comprises multilayer polyimide film 101; And be formed at adhesion agent layer 102 between this polyimide film 101, its at least one deck adhesion agent layer 102a comprise the additive adhesion agent layer that is selected from carbon dust, CNT, black pigment or its mixture, additive reduces the lightness of adhesion agent layer and makes composite membrane have screening effect, in the utility model, thickness for arrange in pairs or groups this composite membrane or adhesion agent layer, this additive content account for the solid solid content 3 to 20wt%, preferable content is between 5 to 10wt%.
In one embodiment, one deck at least of this polyimide film also comprises the additive that is selected from carbon dust, CNT, black pigment or its mixture.And be the thickness of this composite membrane of collocation or polyimide film, for example, X is 1.5 to 2mil, this additive content accounts for 3 to 20wt% of polyimides solid content, and should be between 5 to 30 through the lightness of adjusted polyimide composite film 100.
In addition, also can optionally make other adhesion agent layer 102,102b contains additive as adhesion agent layer, promoting the screening effect of composite membrane again, yet, contain among the embodiment of additive in one deck adhesion agent layer only, can make composite membrane reach good covering property.
In the polyimide composite film of the present utility model, the gross thickness of visual this composite membrane needs, and adjust polyimide film number of stories m and adhesion agent layer number of plies n in the composite membrane according to formula (I), and the thickness Y of each adhesion agent layer forms the polyimide composite film of required gross thickness:
mX+nY＝Z (I)。
In this polyimide composite film, employed polyimide film and solid kind are also without particular limitation, are preferably not halogen-containing polyimide material of use and solid, and better being to use has tack and not halogen-containing solid.
In an instantiation, this Z is 3, m be 2 and X be 1mil, perhaps this Z is 4, m is 2 or 3, also can make Z is 5, and m is 2 or 3.In one embodiment, when the composite membrane gross thickness increased to 6, this m was 3 or 4.In an instantiation, this Z is 7 again, and m is 3 or 4.Preferably, when Z was 8, this m was selected from 3,4 or 5.In another instantiation, this Z is 9, and m is 4 or 5.In the utility model, the thickness of polyimide film is to 2mil between 1, preferably can use 1 or the thick polyimide film of 1.5mil, especially, when the composite membrane gross thickness is thicker, be to be good with the polyimide film of selecting for use thickness to be lower than 2mil, then except reducing cost, still can keep the flatness of composite membrane excellence, and it is more to contain the adhesion agent layer number of plies of additive, screening effect is better.
In addition, the utility model also provides a kind of stiffening plate, and it is to paste pure glue on polyimide composite film of the present utility model surface, and for example institute of Sony Corporation production model is the glue of D3430, and pressing under about 180 ℃ condition, to obtain stiffening plate of the present utility model.
First specific embodiment
In this instantiation, be to use two strata acid imide films to form polyimide composite film.At first, after first polyimide film surface is coated with one deck thermmohardening solid, places the baking oven heat drying, by hot roller and another second polyimide film pressing.Then, slaking is 2 hours under 160 ℃ condition, forms the polyimide composite film sample.
Second specific embodiment
In this instantiation, provide to form to contain three layers of polyimide composite film with polyimide (PI) film.At first, get the polyimide composite film that makes as first instantiation, then at this composite membrane surface coating one deck thermmohardening solid, after placing the baking oven heat drying, by hot roller and another polyimide film pressing, slaking 2 hours under 160 ℃ condition again forms the polyimide composite film sample that contains three strata acid imide films.On the other hand, if desire forms the polyimide composite film contain the even level polyimide film, the pressing each other of then available composite membrane can obtain the composite membrane of this type.Certainly, if desire forms the polyimide composite film contain the odd-level polyimide film, the composite membrane desired of one polyimide film of step pressing in the end and obtaining then.
In the utility model, the gross thickness Z error of gained polyimide composite film is less than within ± 5%.After obtaining composite membrane of the present utility model, measure instrument (model Agilent E444Xa PSA spectrum analyzer please be provided) by color difference meter (ColorQuestXEhunterlab) and EMI respectively and measure the lightness and the EMI shielding properties of this composite membrane, and will be recorded in following table according to exemplary sample and the measurement result that aforementioned specific embodiment makes.
| Sample | Composite membrane thickness (Z, mil) | The polyimide film number of plies (m) | The polyimides film thickness (X, mil) | Adhesion agent layer additive content (wt%) | Lightness | EMI measured value (as sheet resistance) |
| 1 | 3 | 2 | 1 | 10 | 26 | 10 4 |
| 2 | 4 | 3 | 1 | 10 | 25 | 10 4 |
| 3 | 5 | 3 | 1 | 10 | 23 | 10 4 |
| 4 | 6 | 4 | 1 | 5 | 21 | 10 5 |
| 5 | 7 | 4 | 1 | 5 | 20 | 10 5 |
| 6 | 8 | 5 | 1 | 5 | 19 | 10 5 |
| 7 | 9 | 5 | 1 | 5 | 18 | 10 5 |
| 8 | 10 | 6 | 1 | 5 | 16 | 10 5 |
| 9 | 11 | 6 | 1 | 5 | 15 | 10 5 |
| 10 | 12 | 7 | 1 | 5 | 12 | 10 5 |
| 11 | 13 | 7 | 1 | 5 | 11 | 10 5 |
| Sample | Composite membrane thickness (Z, mil) | The polyimide film number of plies (m) | The polyimides film thickness (X, mil) | Adhesion agent layer additive content (wt%) | Lightness | EMI measured value (as sheet resistance) |
| 12 | 14 | 8 | 1 | 5 | 9 | 10 5 |
| 14 | 15 | 8 | 1 | 5 | 8 | 10 5 |
Table 1
| Sample | Composite membrane thickness (Z, mil) | The polyimide film number of plies (m) | The polyimides film thickness (X, mil) | Adhesion agent layer additive content (wt%) | Lightness | EMI measured value (as sheet resistance) |
| 14 | 4 | 2 | 1 | 5 | 24 | 10 4 |
| 15 | 4 | 2 | 1.5 | 10 | 23 | 10 4 |
| 16 | 5 | 2 | 2 | 10 | 22 | 10 4 |
| 17 | 5 | 3 | 1.5 | 10 | 21 | 10 4 |
| 18 | 6 | 3 | 1 | 5 | 21 | 10 5 |
| 19 | 6 | 3 | 1.5 | 5 | 20 | 10 5 |
| 20 | 7 | 3 | 1 | 5 | 20 | 10 5 |
| 21 | 7 | 3 | 1.5 | 5 | 19 | 10 5 |
| 22 | 8 | 3 | 2 | 5 | 19 | 10 5 |
| 23 | 8 | 4 | 1 | 5 | 18 | 10 5 |
| 24 | 9 | 4 | 1 | 5 | 17 | 10 5 |
| 25 | 9 | 4 | 1.5 | 5 | 16 | 10 5 |
| 26 | 10 | 4 | 2 | 5 | 15 | 10 5 |
Table 2
In the polyimide composite film shown in table 1 and the table 2, each adhesion agent layer all contains the additive carbon dust, but result shown in sample 1,14,15 and 16, at brightness value is≤26 o'clock, the polyimide composite film that only has an adhesion agent layer promptly has pretty good screening effect, makes the naked eyes can't identification crested thing picture on surface.Be with, in the embodiment with multilayer adhesion agent layer, the screening effect of polyimide composite film of the present utility model is better, similarly, finds in back after tested, when polyimide film contains additive, also can promote the screening effect of composite membrane.
Above-mentioned specification and embodiment only are illustrative principle of the present utility model and effect thereof, but not are used to limit the utility model.Rights protection scope of the present utility model should be foundation with the scope of claims.
Claims (10)
1. a polyimide composite film that is used for printed circuit board (PCB) is characterized in that, comprising:
Multilayer polyimide film; And
Be formed at the adhesion agent layer between this polyimide film, its at least one deck adhesion agent layer comprise the additive that is selected from carbon dust, CNT, black pigment or its mixture, the gross thickness Z of this polyimide composite film meets the relation of following formula (I):
mX+nY＝Z (I)
In the formula, m represents the polyimide film number of plies in this composite membrane; N represents the adhesion agent layer number of plies in this composite membrane; X represents the respectively thickness of this polyimide film, and X is 1 to 2mil; And Y represents the thickness of this adhesion agent layer respectively, and this Y decides according to specific Z value.
2. polyimide composite film according to claim 1 is characterized in that: one deck at least of this polyimide film comprises that also the additive X that is selected from carbon dust, CNT, black pigment or its mixture is 1.5 to 2mil.
3. polyimide composite film according to claim 1 is characterized in that: this Z is 3, this m be 2 and X be 1mil.
4. polyimide composite film according to claim 1 is characterized in that: this Z is 4, and this m is 2 or 3.
5. polyimide composite film according to claim 1 is characterized in that: this Z is 5, and this m is 2 or 3.
6. polyimide composite film according to claim 1 is characterized in that: this Z is 6, and this m is 3 or 4.
7. polyimide composite film according to claim 1 is characterized in that: this Z is 7, and this m is 3 or 4.
8. polyimide composite film according to claim 1 is characterized in that: this Z is 8, and this m is selected from 3,4 or 5.
9. polyimide composite film according to claim 1 and 2 is characterized in that: this Z is 9, and this m is 4 or 5.
10. a stiffening plate comprises polyimide composite film according to claim 1 and is formed at the lip-deep pure glue of this polyimide composite film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201532378U CN201494071U (en) | 2009-06-03 | 2009-06-03 | Polyimide composite film for printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201532378U CN201494071U (en) | 2009-06-03 | 2009-06-03 | Polyimide composite film for printed circuit board |
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| CN201494071U true CN201494071U (en) | 2010-06-02 |
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| CN2009201532378U Expired - Lifetime CN201494071U (en) | 2009-06-03 | 2009-06-03 | Polyimide composite film for printed circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
| CN105992455A (en) * | 2015-02-11 | 2016-10-05 | 昆山雅森电子材料科技有限公司 | Matting-effect black reinforcing plate used for printed circuit board |
| CN108913094A (en) * | 2018-05-31 | 2018-11-30 | 深圳科诺桥科技股份有限公司 | A kind of adhesive, preparation method, its application method, screen light film and FPC |
-
2009
- 2009-06-03 CN CN2009201532378U patent/CN201494071U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
| CN105992455A (en) * | 2015-02-11 | 2016-10-05 | 昆山雅森电子材料科技有限公司 | Matting-effect black reinforcing plate used for printed circuit board |
| CN108913094A (en) * | 2018-05-31 | 2018-11-30 | 深圳科诺桥科技股份有限公司 | A kind of adhesive, preparation method, its application method, screen light film and FPC |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100602 |