KR101683821B1 - No baking cover layer tape and method for producing thereof - Google Patents

No baking cover layer tape and method for producing thereof Download PDF

Info

Publication number
KR101683821B1
KR101683821B1 KR1020150035867A KR20150035867A KR101683821B1 KR 101683821 B1 KR101683821 B1 KR 101683821B1 KR 1020150035867 A KR1020150035867 A KR 1020150035867A KR 20150035867 A KR20150035867 A KR 20150035867A KR 101683821 B1 KR101683821 B1 KR 101683821B1
Authority
KR
South Korea
Prior art keywords
release film
film
modified
skin layer
adhesive layer
Prior art date
Application number
KR1020150035867A
Other languages
Korean (ko)
Other versions
KR20160111123A (en
Inventor
손정환
김민기
Original Assignee
(주)알킨스
우수전자산업(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)알킨스, 우수전자산업(주) filed Critical (주)알킨스
Priority to KR1020150035867A priority Critical patent/KR101683821B1/en
Publication of KR20160111123A publication Critical patent/KR20160111123A/en
Application granted granted Critical
Publication of KR101683821B1 publication Critical patent/KR101683821B1/en

Links

Images

Classifications

    • C09J7/0264
    • C09J7/0232
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C09J2205/10

Abstract

The present invention relates to an inorganic type coverlay tape and a method of manufacturing the same, and more particularly, to a coverlay tape of an inorganic material type having a first release film, an adhesive layer coated on one surface of the first release film, 2 release film, wherein the adhesive layer of the first release film and the color skin layer of the second release film are thermally lapped while being in contact with each other, the color skin layer comprising a modified polyurethane , A modified polyester, and a modified polyimide.
According to the present invention, there is an advantage that it is easy to implement excellent flexibility by providing an inorganic material type coverlay film. In addition, it has advantages of miniaturization, thinned electricity, protection of electronic surface, insulation, concealment, shading, and color.

Description

TECHNICAL FIELD [0001] The present invention relates to a coverlay tape of inorganic material type and a method of manufacturing the same,

The present invention relates to an inorganic material type coverlay tape and a method of manufacturing the same, and more particularly, to a coverlay tape which is easy to implement because of lack of a film type substrate and a method of manufacturing the same.

In recent years, trends such as miniaturization, high integration, simplification, and high performance have been conspicuous in the fields of electric and electronic industries. In order to satisfy such demands, it is absolutely necessary to develop a flexible printed circuit board having good flexibility and integration of circuits. The flexible printed circuit board can be folded according to the internal structure of the product by being flexible, and the flexible printed circuit board is made of a very thin material, so that the flexible printed circuit board can sufficiently perform a role as a circuit board while occupying a small space.

In general, a flexible printed circuit board is made of a copper foil or aluminum or the like by using an adhesive on a film such as a polyimide resin, a polyester resin, a polyamide-imide resin, or a polyester imide resin as a basic substrate. These films are used as a substrate because they have excellent thermal, mechanical and electrical properties. Therefore, an adhesive is applied to these substrates, and a conductor such as copper or aluminum is adhered. To print the circuit and etch the metal foil. In order to protect the printed circuit, the coverlay film is formed by applying an adhesive to a film of a material such as a circular plate, semi-curing the film, and then attaching the releasable film or paper as a protective sheet to the adhesive surface. It covers and protects the circuit surface printed on flexible printed circuit board.

The adhesives used in the production of such flexible printed circuit boards and coverlay films are excellent in heat resistance, chemical resistance, solvent resistance, electrical insulation, flame retardancy, water resistance and flexibility, and in the case of a coverlay film, It needs less flow to the outside, better filling gap between circuits, and longer maintenance life in semi-hardened condition. The shelf life should be approximately 3 months at room temperature and 6 months or longer at 5 ° C.

Conventional coverlay films have a structure in which an adhesive excellent in heat resistance, chemical resistance, solvent resistance, electrical insulation, flame retardancy, water resistance and flexibility is coated on a polyimide film and then the adhesive layer is protected by a release film .

However, due to the circuit formation technology, the thinning of electronic products, and the pursuit of various functions, the qualitative requirements applied to the coverlay can not but be increased.

For example, the uniformity of the foreign matter management and the coating surface is the basic, and the crack problem after the hot press and the solvent resistance, the discoloration in the electroless plating solution, the crack or burr accompanying the punching, the reflectance, It is necessary to satisfy the conditions such as heat resistance necessary for heat treatment. In addition, the kinds of plastic films used as substrates have been diversified.

These prior arts include Korean Patent Laid-open Patent No. 10-2011-0034191 and Korean Patent Registration No. 10-1169369.

However, the above-mentioned prior arts have improved the properties of the adhesive, and are therefore expected to improve the cracking and solvent resistance after the hot press, the discoloration in the electroless plating solution, the cracks and burrs involved in punching, And the like, but all of them were of the type having a substrate, and there were restrictions on the implementation of the flexible type.

KR 10-2011-0034191 A KR 10-1169369 B1

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a coverlay tape of inorganic material type in order to solve the problems of conventional coverlay films and to realize excellent flexibility.

That is, it is possible to provide a cover tape of an inorganic material type which is a release film, an adhesive, a color skin layer and a release film to enable surface protection, insulation, concealment, shading and color implementation of small and thin electrical and electronic materials will be.

According to an aspect of the present invention, there is provided a coverlay film comprising a first release film, an adhesive layer coated on one surface of the first release film, a second release film, Wherein the adhesive layer of the first release film and the color skin layer of the second release film are thermally lapped while being in contact with each other, and the color skin layer comprises a modified polyurethane, a modified polyester, a modified poly Meade. ≪ / RTI >

The second release film is a mat type polyethylene terephthalate film, and the polyethylene terephthalate film is coated with silica to give a matting effect.

Wherein the adhesive layer comprises an epoxy resin, a modified polyurethane or an epoxy resin, and a modified nylon elastomer.

The method comprises the steps of: forming a color skin layer on one surface of a second release film, the color skin layer being one of modified polyurethane, modified polyester and modified polyimide; forming an adhesive layer on one surface of the first release film; And thermally laminating the adhesive layer and the color skin layer in contact with each other.

The thermal laminating step is performed at a temperature of 60 to 120 ° C and a pressure of 1 to 5 kgf / cm 2.

According to the present invention, there is an advantage that it is easy to implement excellent flexibility by providing an inorganic material type coverlay film. In addition, it has advantages of miniaturization, thinned electricity, protection of electronic surface, insulation, concealment, shading, and color.

1 is a perspective view of an inorganic material type coverlay tape according to the present invention.
2 is a sectional view of an inorganic type coverlay tape according to the present invention.
3 is a view showing a manufacturing procedure of an inorganic material type coverlay tape according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the case of a conventional coverlay, an adhesive is applied to a film made of polyimide or another material, and the protective layer, that is, the release film, is made to protect the adhesive. Such a coverlay film adhered to a copper clad laminate (CCL) to protect the circuit and functioned as insulation.

However, in the case of the above-mentioned coverlay, a film is used as a base material, and the flexibility thereof is limited.

Therefore, in order to solve the disadvantage of such conventional coverlay films, the present invention provides a coverlay tape of inorganic material type that does not use a substrate.

1 and 2, a coverlay tape according to the present invention includes a first release film 1, an adhesive layer 2 coated on one surface of the first release film 1, (2) of the first release film (1) and the second release film (4), and a color skin layer (3) coated on one side of the second release film (4) The color skin layer 3 is thermally laminated while being in contact with each other.

That is, finally, the first release film 1, the adhesive layer 2, the color skin layer 3, and the second release film 4 are sequentially laminated. The color skin layer 3 is composed of one kind of modified polyurethane, modified polyester and modified polyimide.

First, the first release film (1) may be a polyethylene terephthalate (PET) film widely used as a release film, more preferably a biaxially stretched PET film or the like. It is also possible to use a polyolefin-based film or the like instead of the PET film, or to coat the PET film with silicone or a fluorine compound. In addition, non-biaxially stretched and non-twisted products other than biaxial stretching may be used for the PET film, and the kind thereof is not limited.

If the thickness of the first release film 1 is too thin, the first release film 1 may be inconvenient to handle. If the first release film 1 is too thick, the cost may increase , But this is not necessarily the case. That is, since the first release film 1 is to be removed when using the coverlay, its thickness is not limited to a great extent.

The adhesive layer (2) coated on the surface of the first release film (1) is a portion directly bonded to the circuit surface through the press, and functions to wrap the circuit through a proper adhesive flow in the pressing process do. Such an adhesive includes a thermosetting resin (epoxy-based) having a functional group capable of crosslinking so as to perform a function of curing through crosslinking between molecules after the press, and a thermoplastic resin capable of controlling flowability, such as a modified polyurethane , Modified nylon elastomer, and the like. In addition, a brominated flame retardant or a phosphorus flame retardant may be included in order to have a level of flame retardancy that must be satisfied as an electronic component, and organic or inorganic particles may be included to improve mechanical properties and flame retardancy.

In the present invention, for example, an adhesive made of a modified polyurethane and an epoxy resin or an adhesive made of a modified nylon elastomer and an epoxy resin may be used. In addition, an adhesive made of a brominated or phosphorus flame retardant And it is also possible to mix various known additives which improve the physical properties of other adhesives. When the above-mentioned adhesive is used, it is most preferable to mix the modified polyurethane and the epoxy resin at a ratio of 1: 0.1 ~ 3 by weight and the modified nylon elastomer and the epoxy resin at a ratio of 1: 0.1 ~ 3 by weight to realize the properties of the adhesive layer 2 Do.

The thickness of the adhesive layer 2 is determined according to the thickness of the circuit pattern formed from the CCL. The thickness of the adhesive layer 2 is preferably in the range of 2 to 30 占 퐉. This is because if the thickness of the adhesive layer 2 is too thin, it can not sufficiently protect the circuit and can not serve as a coverlay. If it exceeds 30 μm, it is too thick to implement a thin film type electronic product. It falls.

Next, the color skin layer 3 is formed by coating on the second release film 4, which is another release film. The color skin layer 3 is formed by using one selected from a modified polyurethane, a modified polyester and a modified polyimide, Insulation, high heat resistance, chemical resistance, weather resistance, and excellent printability. In addition, various colored colors such as black, white, red, yellow and blue are imparted to the modified polyurethane, modified polyester and modified polyimide to realize the color skin layer 3 of various colors.

Here, the implementation of the hue may include 1 to 20% by weight of the inorganic colored pigment based on 100% by weight of the entire color skin layer (3). That is, the above-mentioned modified polyurethane, modified polyester and modified polyimide may be mixed with an inorganic coloring pigment. As the inorganic coloring pigment, various products known in this field can be used.

If the thickness of the color skin layer 3 is less than 3 mu m, the adhesive layer can not be sufficiently protected. When the thickness of the color skin layer 3 is more than 50 mu m This is because the cost is increased as well as the effect of flexible implementation is also lowered because it is thicker than necessary.

In the present invention, the color skin layer 3 may be used with the adhesive layer 2, and the color skin layer 3 may be formed on the second release film 4 It is possible to more easily implement the flexible structure.

The second release film 4 for forming the color skin layer 3 may be a biaxially stretched, uniaxially stretched or non-stretched PET film like the first release film 1 described above.

In addition, in the case of the second release film 4, a mat type film may be used in order to enhance the effect of the matte effect. The mat type means that the surface of the PET film is coated with silica, . Herein, the method of coating the surface of the PET film with silica is well known in the art, so that detailed description thereof will be omitted. And the coating of the silica can be carried out on one or both surfaces.

The thickness of the second release film 4 may be 25 to 120 탆. The thickness of the second release film 4 is the sum of the thickness of the PET film and the thickness of the coated silica. If it is too thick, the cost will increase.

The coverlay tape of the present invention constructed as described above removes and applies both the first release film 1 and the second release film 4 when used on the CCL so that the adhesive layer 2 and the color skin layer (3).

Accordingly, since the coverlay tape of the present invention is an inorganic material type that does not use a base film, it is easy to realize a flexible CCL, and the effect of excellent surface protection, insulation, concealment, .

Hereinafter, a manufacturing method thereof will be described with reference to FIG. In the following description of the manufacturing method, the matters described in the description of the coverlay tape will be omitted.

Forming a colored skin layer (3) made of one kind of modified polyurethane, modified polyester or modified polyimide on one surface of the second release film (4).

3, after preparing a second release film 4, a color skin layer 4 comprising one kind of a modified polyurethane, a modified polyester, and a modified polyimide is formed on one surface of the second release film 4, (3).

At this time, one of the modified polyurethane, modified polyester and modified polyimide was coated with an inorganic coloring pigment for color representation. The coating conditions were heat-lapped at a pressure of 1 to 5 kgf / cm 2 at a temperature of 60 to 120 ° C.

And forming an adhesive layer (2) on one surface of the first release film (1).

Next, the first release film 1 was prepared, and an adhesive layer 2 was formed on one surface thereof. At this time, the adhesive layer (2) was dried at a temperature of 60 to 120 ° C for 2 minutes and heat-laminated at a pressure of 1 to 5 kgf / cm 2 at a temperature of 60 to 120 ° C. And aged at 45 ~ 55 ℃ for 20 ~ 30 hours.

And heat-joining the adhesive layer (2) and the color skin layer (3) in contact with each other.

Then, the adhesive layer (2) and the color skin layer (3) were brought into contact with each other, and then heat-laminated. The thermal laminate was subjected to a pressure of 1 to 5 kgf / cm 2 at a temperature of 60 to 120 ° C.

The coverlay tape produced by the above method is applied in a state in which both the first release film 1 and the second release film 2 are removed when the CCL is applied, And then a separate release film is placed thereon and hot-pressed. In addition, the effect of CCL surface protection, insulation, concealment, light shielding and color implementation is excellent, and flexible implementation is possible.

Hereinafter, the present invention will be described with reference to specific examples.

(Example 1)

A color skin layer made of a modified polyurethane was formed on a Matt type PET film (thickness 35 mu m). At this time, the thickness of the color skin layer was 3 mu m. Then, an adhesive layer comprising a 1: 5 mixture of an epoxy resin and a modified polyurethane was coated on a PET film (thickness: 35 탆), and this was dried at 100 캜 for 2 minutes. Then, the color skin layer and the adhesive layer were heat-laminated at a pressure of 2 kgf / cm 2 and a temperature of 70 ° C, and aged at 50 ° C for 24 hours.

(Example 2)

The same procedure as in Example 1 was carried out except that the thickness of the color skin layer was 50 탆.

(Example 3)

In the same manner as in Example 1, a modified polyester was used in place of the modified polyurethane.

(Example 4)

In the same manner as in Example 2, a modified polyester was used in place of the modified polyurethane.

(Example 5)

In the same manner as in Example 1, a modified polyimide was used in place of the modified polyurethane.

(Example 6)

In the same manner as in Example 2, a modified polyimide was used in place of the modified polyurethane.

(Comparative Examples 1, 3, and 5)

A polyimide film (thickness: 12.5 占 퐉) was laminated in place of the second release film having the color skin layer formed thereon in the same manner as in Examples 1 to 6.

(Comparative Examples 1, 3, and 6)

A polyimide film (thickness: 22.5 mu m) was laminated in place of the second release film on which the color skin layer was formed in the same manner as in Examples 1 to 6. [

(Measurement of Flexibility)

In order to measure the bending resistance, the number of times until the resistance was increased by 20% while repeating bending at 60 캜 was measured. Specifically, a pattern of the flexural strength test sample of JISC-6481 was prepared on a film for a flexible substrate, and a coverlay film was pressed and adhered thereto. Then, the change in resistance value at 60 ° C was measured under the condition that the frequency was 1500 cpm, the stroke was 20 mm, the curvature was 2.5 mmR, and the coverlay was directed outward to the FPC high-speed bending tester. If the cracks in the copper foil occur due to the bending, the bending characteristics are confirmed by using the increase in resistance and the decrease in volume.

The results are shown in Table 1 below.

Test results. division Flexibility division Flexibility Example 1 More than 1000 times Comparative Example 1 10 times Example 2 More than 1000 times Comparative Example 2 8 times Example 3 More than 1000 times Comparative Example 3 11 times Example 4 More than 1000 times Comparative Example 4 8 times Example 5 More than 1000 times Comparative Example 5 10 times Example 6 More than 1000 times Comparative Example 6 8 times

As can be seen from the above Table 1, it was confirmed that Examples 1 to 6 of the present invention all had excellent flexural resistance as compared with Comparative Examples 1 to 6.

Although the present invention has been described and illustrated in detail, it should be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention as defined by the appended claims. It will be understood that various modifications and changes may be made in the present invention.

1: first release film 2: adhesive layer
3: Color skin layer 4: Second release film

Claims (5)

A first release film (1)
An adhesive layer (2) coated on one surface of the first release film (1)
A second release film 4,
And a color skin layer (3) coated on one side of the second release film (4)
The adhesive layer 2 of the first release film 1 and the color skin layer 3 of the second release film 4 are heat-
The color skin layer 3 is composed of one kind of modified polyurethane, modified polyester and modified polyimide,
The second release film 4 is a mat type polyethylene terephthalate (PET) film,
Wherein the polyethylene terephthalate film is coated with silica to provide a matte effect.
delete The method according to claim 1,
Wherein the adhesive layer (2) comprises an epoxy resin, a modified polyurethane or an epoxy resin, and a modified nylon elastomer.
delete delete
KR1020150035867A 2015-03-16 2015-03-16 No baking cover layer tape and method for producing thereof KR101683821B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150035867A KR101683821B1 (en) 2015-03-16 2015-03-16 No baking cover layer tape and method for producing thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150035867A KR101683821B1 (en) 2015-03-16 2015-03-16 No baking cover layer tape and method for producing thereof

Publications (2)

Publication Number Publication Date
KR20160111123A KR20160111123A (en) 2016-09-26
KR101683821B1 true KR101683821B1 (en) 2016-12-08

Family

ID=57068516

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150035867A KR101683821B1 (en) 2015-03-16 2015-03-16 No baking cover layer tape and method for producing thereof

Country Status (1)

Country Link
KR (1) KR101683821B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102014583B1 (en) * 2016-12-20 2019-08-26 주식회사 두산 Film for coverlay
CN108504294A (en) * 2017-02-24 2018-09-07 昆山雅森电子材料科技有限公司 A kind of coloured ultra-thin cover film of high frequency and preparation method
CN116052530B (en) * 2022-05-19 2023-10-20 荣耀终端有限公司 Composite film and preparation method thereof, cover plate assembly, display screen and electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012094850A (en) 2010-09-30 2012-05-17 Ube Ind Ltd Method of manufacturing flexible wiring board for tape carrier package, and resin composition for curable insulating film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101125423B1 (en) 2009-09-28 2012-03-27 도레이첨단소재 주식회사 Coverlay film and the preparing process thereof
KR101176424B1 (en) * 2010-01-28 2012-08-30 도레이첨단소재 주식회사 Non-carrier color adhesive film
KR101169369B1 (en) * 2010-03-24 2012-08-03 김제환 Coverlay and Fabricating Method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012094850A (en) 2010-09-30 2012-05-17 Ube Ind Ltd Method of manufacturing flexible wiring board for tape carrier package, and resin composition for curable insulating film

Also Published As

Publication number Publication date
KR20160111123A (en) 2016-09-26

Similar Documents

Publication Publication Date Title
KR102438820B1 (en) Resin composition
JP4709326B1 (en) Polyimide resin composition and polyimide resin comprising the polyimide resin composition
KR101683821B1 (en) No baking cover layer tape and method for producing thereof
KR102537333B1 (en) Electromagnetic interference shielding film and flexible printed circuit board the same
CN106961782A (en) Cover layer
US8647518B2 (en) Resin coated copper foil, method for manufacturing same and multi-layer circuit board
WO2009051343A1 (en) Manufacturing method of release films and release films
KR20110085969A (en) Thermosetting resin composition
KR101591409B1 (en) Release film
TWI764998B (en) Coverlay film and cell phone and electronic device using the same
KR101126972B1 (en) Releasing film for hot press processing and method for preparing the same
KR102014583B1 (en) Film for coverlay
JP2022065264A (en) Molded film, molded body, and method for manufacturing the same
KR101414815B1 (en) Halogen-free coverlay adhesive composition and coverlay film using the same
US9574720B2 (en) Flexible white reflective dielectric for electronic circuits
KR102007234B1 (en) Thermosetting white film and method for preparing the same
KR102039245B1 (en) Coverlay film structure
KR20120037644A (en) Releasing film for hot press processing of fpcb and method for preparing the same
KR101975450B1 (en) Manufacturing method of multilayer printed circuit board comprising surface-treated insulating film
KR200483278Y1 (en) Polyimide composite film structure for circuit board
KR20160003270U (en) Copper Clad Laminate using heat resisting plastics
US11021606B2 (en) Multilayer film for electronic circuitry applications
JP2022001414A (en) Molded film, molded body, and method for manufacturing the same
CN112840747A (en) Thermal substrate
US20210111097A1 (en) Thermal substrates

Legal Events

Date Code Title Description
A201 Request for examination
N231 Notification of change of applicant
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190930

Year of fee payment: 4