KR101683821B1 - No baking cover layer tape and method for producing thereof - Google Patents
No baking cover layer tape and method for producing thereof Download PDFInfo
- Publication number
- KR101683821B1 KR101683821B1 KR1020150035867A KR20150035867A KR101683821B1 KR 101683821 B1 KR101683821 B1 KR 101683821B1 KR 1020150035867 A KR1020150035867 A KR 1020150035867A KR 20150035867 A KR20150035867 A KR 20150035867A KR 101683821 B1 KR101683821 B1 KR 101683821B1
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- KR
- South Korea
- Prior art keywords
- release film
- film
- modified
- skin layer
- adhesive layer
- Prior art date
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Classifications
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- C09J7/0264—
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- C09J7/0232—
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2205/10—
Abstract
The present invention relates to an inorganic type coverlay tape and a method of manufacturing the same, and more particularly, to a coverlay tape of an inorganic material type having a first release film, an adhesive layer coated on one surface of the first release film, 2 release film, wherein the adhesive layer of the first release film and the color skin layer of the second release film are thermally lapped while being in contact with each other, the color skin layer comprising a modified polyurethane , A modified polyester, and a modified polyimide.
According to the present invention, there is an advantage that it is easy to implement excellent flexibility by providing an inorganic material type coverlay film. In addition, it has advantages of miniaturization, thinned electricity, protection of electronic surface, insulation, concealment, shading, and color.
Description
The present invention relates to an inorganic material type coverlay tape and a method of manufacturing the same, and more particularly, to a coverlay tape which is easy to implement because of lack of a film type substrate and a method of manufacturing the same.
In recent years, trends such as miniaturization, high integration, simplification, and high performance have been conspicuous in the fields of electric and electronic industries. In order to satisfy such demands, it is absolutely necessary to develop a flexible printed circuit board having good flexibility and integration of circuits. The flexible printed circuit board can be folded according to the internal structure of the product by being flexible, and the flexible printed circuit board is made of a very thin material, so that the flexible printed circuit board can sufficiently perform a role as a circuit board while occupying a small space.
In general, a flexible printed circuit board is made of a copper foil or aluminum or the like by using an adhesive on a film such as a polyimide resin, a polyester resin, a polyamide-imide resin, or a polyester imide resin as a basic substrate. These films are used as a substrate because they have excellent thermal, mechanical and electrical properties. Therefore, an adhesive is applied to these substrates, and a conductor such as copper or aluminum is adhered. To print the circuit and etch the metal foil. In order to protect the printed circuit, the coverlay film is formed by applying an adhesive to a film of a material such as a circular plate, semi-curing the film, and then attaching the releasable film or paper as a protective sheet to the adhesive surface. It covers and protects the circuit surface printed on flexible printed circuit board.
The adhesives used in the production of such flexible printed circuit boards and coverlay films are excellent in heat resistance, chemical resistance, solvent resistance, electrical insulation, flame retardancy, water resistance and flexibility, and in the case of a coverlay film, It needs less flow to the outside, better filling gap between circuits, and longer maintenance life in semi-hardened condition. The shelf life should be approximately 3 months at room temperature and 6 months or longer at 5 ° C.
Conventional coverlay films have a structure in which an adhesive excellent in heat resistance, chemical resistance, solvent resistance, electrical insulation, flame retardancy, water resistance and flexibility is coated on a polyimide film and then the adhesive layer is protected by a release film .
However, due to the circuit formation technology, the thinning of electronic products, and the pursuit of various functions, the qualitative requirements applied to the coverlay can not but be increased.
For example, the uniformity of the foreign matter management and the coating surface is the basic, and the crack problem after the hot press and the solvent resistance, the discoloration in the electroless plating solution, the crack or burr accompanying the punching, the reflectance, It is necessary to satisfy the conditions such as heat resistance necessary for heat treatment. In addition, the kinds of plastic films used as substrates have been diversified.
These prior arts include Korean Patent Laid-open Patent No. 10-2011-0034191 and Korean Patent Registration No. 10-1169369.
However, the above-mentioned prior arts have improved the properties of the adhesive, and are therefore expected to improve the cracking and solvent resistance after the hot press, the discoloration in the electroless plating solution, the cracks and burrs involved in punching, And the like, but all of them were of the type having a substrate, and there were restrictions on the implementation of the flexible type.
SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a coverlay tape of inorganic material type in order to solve the problems of conventional coverlay films and to realize excellent flexibility.
That is, it is possible to provide a cover tape of an inorganic material type which is a release film, an adhesive, a color skin layer and a release film to enable surface protection, insulation, concealment, shading and color implementation of small and thin electrical and electronic materials will be.
According to an aspect of the present invention, there is provided a coverlay film comprising a first release film, an adhesive layer coated on one surface of the first release film, a second release film, Wherein the adhesive layer of the first release film and the color skin layer of the second release film are thermally lapped while being in contact with each other, and the color skin layer comprises a modified polyurethane, a modified polyester, a modified poly Meade. ≪ / RTI >
The second release film is a mat type polyethylene terephthalate film, and the polyethylene terephthalate film is coated with silica to give a matting effect.
Wherein the adhesive layer comprises an epoxy resin, a modified polyurethane or an epoxy resin, and a modified nylon elastomer.
The method comprises the steps of: forming a color skin layer on one surface of a second release film, the color skin layer being one of modified polyurethane, modified polyester and modified polyimide; forming an adhesive layer on one surface of the first release film; And thermally laminating the adhesive layer and the color skin layer in contact with each other.
The thermal laminating step is performed at a temperature of 60 to 120 ° C and a pressure of 1 to 5 kgf /
According to the present invention, there is an advantage that it is easy to implement excellent flexibility by providing an inorganic material type coverlay film. In addition, it has advantages of miniaturization, thinned electricity, protection of electronic surface, insulation, concealment, shading, and color.
1 is a perspective view of an inorganic material type coverlay tape according to the present invention.
2 is a sectional view of an inorganic type coverlay tape according to the present invention.
3 is a view showing a manufacturing procedure of an inorganic material type coverlay tape according to the present invention.
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
In the case of a conventional coverlay, an adhesive is applied to a film made of polyimide or another material, and the protective layer, that is, the release film, is made to protect the adhesive. Such a coverlay film adhered to a copper clad laminate (CCL) to protect the circuit and functioned as insulation.
However, in the case of the above-mentioned coverlay, a film is used as a base material, and the flexibility thereof is limited.
Therefore, in order to solve the disadvantage of such conventional coverlay films, the present invention provides a coverlay tape of inorganic material type that does not use a substrate.
1 and 2, a coverlay tape according to the present invention includes a
That is, finally, the
First, the first release film (1) may be a polyethylene terephthalate (PET) film widely used as a release film, more preferably a biaxially stretched PET film or the like. It is also possible to use a polyolefin-based film or the like instead of the PET film, or to coat the PET film with silicone or a fluorine compound. In addition, non-biaxially stretched and non-twisted products other than biaxial stretching may be used for the PET film, and the kind thereof is not limited.
If the thickness of the
The adhesive layer (2) coated on the surface of the first release film (1) is a portion directly bonded to the circuit surface through the press, and functions to wrap the circuit through a proper adhesive flow in the pressing process do. Such an adhesive includes a thermosetting resin (epoxy-based) having a functional group capable of crosslinking so as to perform a function of curing through crosslinking between molecules after the press, and a thermoplastic resin capable of controlling flowability, such as a modified polyurethane , Modified nylon elastomer, and the like. In addition, a brominated flame retardant or a phosphorus flame retardant may be included in order to have a level of flame retardancy that must be satisfied as an electronic component, and organic or inorganic particles may be included to improve mechanical properties and flame retardancy.
In the present invention, for example, an adhesive made of a modified polyurethane and an epoxy resin or an adhesive made of a modified nylon elastomer and an epoxy resin may be used. In addition, an adhesive made of a brominated or phosphorus flame retardant And it is also possible to mix various known additives which improve the physical properties of other adhesives. When the above-mentioned adhesive is used, it is most preferable to mix the modified polyurethane and the epoxy resin at a ratio of 1: 0.1 ~ 3 by weight and the modified nylon elastomer and the epoxy resin at a ratio of 1: 0.1 ~ 3 by weight to realize the properties of the
The thickness of the
Next, the
Here, the implementation of the hue may include 1 to 20% by weight of the inorganic colored pigment based on 100% by weight of the entire color skin layer (3). That is, the above-mentioned modified polyurethane, modified polyester and modified polyimide may be mixed with an inorganic coloring pigment. As the inorganic coloring pigment, various products known in this field can be used.
If the thickness of the
In the present invention, the
The
In addition, in the case of the
The thickness of the
The coverlay tape of the present invention constructed as described above removes and applies both the
Accordingly, since the coverlay tape of the present invention is an inorganic material type that does not use a base film, it is easy to realize a flexible CCL, and the effect of excellent surface protection, insulation, concealment, .
Hereinafter, a manufacturing method thereof will be described with reference to FIG. In the following description of the manufacturing method, the matters described in the description of the coverlay tape will be omitted.
Forming a colored skin layer (3) made of one kind of modified polyurethane, modified polyester or modified polyimide on one surface of the second release film (4).
3, after preparing a
At this time, one of the modified polyurethane, modified polyester and modified polyimide was coated with an inorganic coloring pigment for color representation. The coating conditions were heat-lapped at a pressure of 1 to 5 kgf /
And forming an adhesive layer (2) on one surface of the first release film (1).
Next, the
And heat-joining the adhesive layer (2) and the color skin layer (3) in contact with each other.
Then, the adhesive layer (2) and the color skin layer (3) were brought into contact with each other, and then heat-laminated. The thermal laminate was subjected to a pressure of 1 to 5 kgf /
The coverlay tape produced by the above method is applied in a state in which both the
Hereinafter, the present invention will be described with reference to specific examples.
(Example 1)
A color skin layer made of a modified polyurethane was formed on a Matt type PET film (thickness 35 mu m). At this time, the thickness of the color skin layer was 3 mu m. Then, an adhesive layer comprising a 1: 5 mixture of an epoxy resin and a modified polyurethane was coated on a PET film (thickness: 35 탆), and this was dried at 100 캜 for 2 minutes. Then, the color skin layer and the adhesive layer were heat-laminated at a pressure of 2 kgf /
(Example 2)
The same procedure as in Example 1 was carried out except that the thickness of the color skin layer was 50 탆.
(Example 3)
In the same manner as in Example 1, a modified polyester was used in place of the modified polyurethane.
(Example 4)
In the same manner as in Example 2, a modified polyester was used in place of the modified polyurethane.
(Example 5)
In the same manner as in Example 1, a modified polyimide was used in place of the modified polyurethane.
(Example 6)
In the same manner as in Example 2, a modified polyimide was used in place of the modified polyurethane.
(Comparative Examples 1, 3, and 5)
A polyimide film (thickness: 12.5 占 퐉) was laminated in place of the second release film having the color skin layer formed thereon in the same manner as in Examples 1 to 6.
(Comparative Examples 1, 3, and 6)
A polyimide film (thickness: 22.5 mu m) was laminated in place of the second release film on which the color skin layer was formed in the same manner as in Examples 1 to 6. [
(Measurement of Flexibility)
In order to measure the bending resistance, the number of times until the resistance was increased by 20% while repeating bending at 60 캜 was measured. Specifically, a pattern of the flexural strength test sample of JISC-6481 was prepared on a film for a flexible substrate, and a coverlay film was pressed and adhered thereto. Then, the change in resistance value at 60 ° C was measured under the condition that the frequency was 1500 cpm, the stroke was 20 mm, the curvature was 2.5 mmR, and the coverlay was directed outward to the FPC high-speed bending tester. If the cracks in the copper foil occur due to the bending, the bending characteristics are confirmed by using the increase in resistance and the decrease in volume.
The results are shown in Table 1 below.
As can be seen from the above Table 1, it was confirmed that Examples 1 to 6 of the present invention all had excellent flexural resistance as compared with Comparative Examples 1 to 6.
Although the present invention has been described and illustrated in detail, it should be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention as defined by the appended claims. It will be understood that various modifications and changes may be made in the present invention.
1: first release film 2: adhesive layer
3: Color skin layer 4: Second release film
Claims (5)
An adhesive layer (2) coated on one surface of the first release film (1)
A second release film 4,
And a color skin layer (3) coated on one side of the second release film (4)
The adhesive layer 2 of the first release film 1 and the color skin layer 3 of the second release film 4 are heat-
The color skin layer 3 is composed of one kind of modified polyurethane, modified polyester and modified polyimide,
The second release film 4 is a mat type polyethylene terephthalate (PET) film,
Wherein the polyethylene terephthalate film is coated with silica to provide a matte effect.
Wherein the adhesive layer (2) comprises an epoxy resin, a modified polyurethane or an epoxy resin, and a modified nylon elastomer.
Priority Applications (1)
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KR1020150035867A KR101683821B1 (en) | 2015-03-16 | 2015-03-16 | No baking cover layer tape and method for producing thereof |
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KR1020150035867A KR101683821B1 (en) | 2015-03-16 | 2015-03-16 | No baking cover layer tape and method for producing thereof |
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KR20160111123A KR20160111123A (en) | 2016-09-26 |
KR101683821B1 true KR101683821B1 (en) | 2016-12-08 |
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KR102014583B1 (en) * | 2016-12-20 | 2019-08-26 | 주식회사 두산 | Film for coverlay |
CN108504294A (en) * | 2017-02-24 | 2018-09-07 | 昆山雅森电子材料科技有限公司 | A kind of coloured ultra-thin cover film of high frequency and preparation method |
CN116052530B (en) * | 2022-05-19 | 2023-10-20 | 荣耀终端有限公司 | Composite film and preparation method thereof, cover plate assembly, display screen and electronic device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012094850A (en) | 2010-09-30 | 2012-05-17 | Ube Ind Ltd | Method of manufacturing flexible wiring board for tape carrier package, and resin composition for curable insulating film |
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KR101125423B1 (en) | 2009-09-28 | 2012-03-27 | 도레이첨단소재 주식회사 | Coverlay film and the preparing process thereof |
KR101176424B1 (en) * | 2010-01-28 | 2012-08-30 | 도레이첨단소재 주식회사 | Non-carrier color adhesive film |
KR101169369B1 (en) * | 2010-03-24 | 2012-08-03 | 김제환 | Coverlay and Fabricating Method thereof |
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JP2012094850A (en) | 2010-09-30 | 2012-05-17 | Ube Ind Ltd | Method of manufacturing flexible wiring board for tape carrier package, and resin composition for curable insulating film |
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