WO2009051343A1 - Manufacturing method of release films and release films - Google Patents

Manufacturing method of release films and release films Download PDF

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Publication number
WO2009051343A1
WO2009051343A1 PCT/KR2008/005232 KR2008005232W WO2009051343A1 WO 2009051343 A1 WO2009051343 A1 WO 2009051343A1 KR 2008005232 W KR2008005232 W KR 2008005232W WO 2009051343 A1 WO2009051343 A1 WO 2009051343A1
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WO
WIPO (PCT)
Prior art keywords
film
weight
release film
pcb
polypropylene
Prior art date
Application number
PCT/KR2008/005232
Other languages
French (fr)
Inventor
Bo-Yeong Lee
Original Assignee
Negopack.Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Negopack.Co., Ltd filed Critical Negopack.Co., Ltd
Publication of WO2009051343A1 publication Critical patent/WO2009051343A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/10—Polymers of propylene
    • B29K2023/12—PP, i.e. polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/10—Homopolymers or copolymers of propene
    • C08J2323/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Definitions

  • the present invention relates to a release film used to manufacture a printed circuit board (PCB) and a method for fabricating the same, in which polyimide is coated on a copper plate to manufacture the PCB. More particularly, the present invention relates to a release film used to manufacture a printed circuit board (PCB) and a method for fabricating the same, capable of lowering a cost of the release film by laminating low- priced polypropylene and polydimethylsiloxane with a predetermined weight ratio to fabricate the release film, lowering the manufacturing cost of the release film while representing the same effect as that of a conventional release film by performing corona treatment for the release film and then coating the polyimide on the copper plate using the release film having a semi cross-linked surface when the high temperature occurs in a PCB process, and raising work efficiency by employing a buffer film.
  • PCB printed circuit board
  • PCB printed circuit board
  • PI polyimide
  • the polymethylpentene which is a release film and provided to manufacture the PCB through the pressing based on heat and pressure, is rarely attached to the copper plate and the PI by the heat and the pressure, the polymethylpentene is widely used in the whole area of Asia as well as domestic manufacturers for manufacturing the PCB.
  • polymethylpentene which is a release film used in the PCB process
  • Japan since a domestic area and an Asian area are equipped with a product line capable of manufacturing the PCB employing the polymethylpentene, the domestic area and the Asian area cannot but use the polymethylpentene.
  • Japan does not export a raw material of the polymethylpentene, the domestic area and the Asian area having used the polymethylpentene must import only processed polymethylpentene. Accordingly, the manufacturing cost of the PCB is increased.
  • the method for fabricating a release film used to manufacture a PCB includes a first step of fabricating a multi-layer film by laminating 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of polydimethylsiloxane resin through co-extrusion.
  • PP polypropylene
  • the release film can represent the same effect as that of a conventional release film, and the manufacturing cost of the release film can be reduced.
  • the polypropylene is not melted to enable the manufacturing of the PCB even if the PCB is manufactured at the high temperature under high pressure.
  • a buffer film is subject to co-extrusion together with the polypropylene and the polydimethylsiloxane, work efficiency can be raised.
  • FIG. 1 is a view schematically showing a PCB manufactured according to the present invention.
  • a release film used to manufacture a printed circuit board (PCB) according to the present invention includes a film obtained by mixing 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of polydimethylsiloxane resin through co-extrusion to fabricate a typical film.
  • PP polypropylene
  • the co-extrusion is performed based on pressure and a velocity ratio required when typically manufacturing a film.
  • a buffer film including polyolefin may be further provided.
  • the outer portion of the above film is treated by a corona treater, so that only the surface of the film is semi cross-linked.
  • the film is formed by using 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of the polydimethylsiloxane resin (typically used among silicon resins) through co-extrusion (step SlO).
  • PP polypropylene
  • step SlO polydimethylsiloxane resin
  • the reason to form the film by mixing 1 weight% to 20 weight% of the polydimethylsiloxane resin with the polypropylene is that the surface of polyimide can be prevented from sticking to each release film by heat and pressure when the PCB is manufactured by coating the polyimide on a copper plate in the next process, and the film can be easily detached after the PCB has been fabricated due to slip properties of the polydimethylsiloxane resin.
  • the buffer film including polyolefin may be simultaneously formed through co-extrusion.
  • step SlO the film fabricated in the first step (step SlO) is surface-treated by a corona treater so that only the surface of the film can be semi cross-linked (step S20).
  • Cross-linking is to convert polymer having a linear structure into polymer having a network structure by chemically/physically bonding molecules to each other, such that the softening temperature and the elasticity of the cross-linked film are enhanced.
  • the cross-linking is classified into electron-beam irradiation cross-linking using radioactivity and chemical cross-linking using a cross-linking agent.
  • the electron-beam irradiation cross-linking must use the radioactivity that is a dangerous material, and the chemical cross-linking has explosiveness even though a film is fabricated using the cross-linking agent.
  • the quality of a film may not be uniform.
  • the present invention employs semi cross-linking to change only the surface characteristic of a film by a corona treater employing high- voltage discharge.
  • corona treatment does not belong to the cross-linking method
  • the corona treatment is generally known to those skilled in the art who treat the surface of a film.
  • radicals are applied to the surface of the film such that ink is sufficiently attached to a film when printing is performed with respect to the film by processing the surface of the film, and concave-convexes are formed on the surface of the film by using flame generated by high- voltage discharge.
  • the softening temperature and the melting point of the film including the mixture of the polypropylene and the polydimethylsiloxane resin must be raised through the corona treatment. This is because an actual temperature required for manufacturing a PCB may be set in the range of 14O 0 C to 19O 0 C due to the number of PCBs to be processed and other reasons even though a temperature of about 14O 0 C is typically required to manufacture the PCB (in this case, the melting point of the polypropylene is 165 0 C or less).
  • the PCB is lower than the temperature of heat required for manufacturing the PCB, only the surface of the release film 10 used to manufacture the PCB must be semi cross- linked through the corona treatment to enhance the softening temperature and the elasticity of the release film 10. Accordingly, if only the surface of the release film 10 is semi cross-linked, the polypropylene and the polydimethylsiloxane resin can be used to fabricate the release film 10 in a PCB process even if the polypropylene and the polydimethylsiloxane resin have a low price.

Abstract

Disclosed is a manufacturing method of release films and the release films. The method includes a first step of fabricating a multi-layer film by laminating 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of polydimethylsiloxane resin through co- extrusion. A cost of the release film is lowered by laminating low-priced polypropylene and polydimethylsiloxane with a predetermined weight ratio to fabricate the release film. The manufacturing cost of the release film is reduced while representing the same effect as that of a conventional release film by performing corona treatment for the release film. The polyimide is coated on the copper plate using the release film having a semi cross-linked surface when the high temperature occurs in a PCB process. Work efficiency is raised by employing a buffer film.

Description

Description
MANUFACTURING METHOD OF RELEASE FILMS AND
RELEASE FILMS
Technical Field
[1] The present invention relates to a release film used to manufacture a printed circuit board (PCB) and a method for fabricating the same, in which polyimide is coated on a copper plate to manufacture the PCB. More particularly, the present invention relates to a release film used to manufacture a printed circuit board (PCB) and a method for fabricating the same, capable of lowering a cost of the release film by laminating low- priced polypropylene and polydimethylsiloxane with a predetermined weight ratio to fabricate the release film, lowering the manufacturing cost of the release film while representing the same effect as that of a conventional release film by performing corona treatment for the release film and then coating the polyimide on the copper plate using the release film having a semi cross-linked surface when the high temperature occurs in a PCB process, and raising work efficiency by employing a buffer film.
[2]
Background Art
[3] Generally, a printed circuit board (PCB) has been extensively used as main components of a semiconductor, a display, a hand-held phone, and a television. The PCB is provided by laminating polyimide (PI) on a copper plate.
[4] In order to coat the PI on the copper plate through a lamination scheme, the copper plate and the polyimide are stacked, polymethylpentene (TPX, PMP) that is a release film is provided on the PI, a buffer film is stacked on the polymethylpentene to perform a buffer action, and then the copper plate and the PI are again stacked on the resultant structure. The above process is repeated and the resultant structure is pressed using predetermined pressure and predetermined heat, so that the PI is coated on the copper plate.
[5] Since the polymethylpentene, which is a release film and provided to manufacture the PCB through the pressing based on heat and pressure, is rarely attached to the copper plate and the PI by the heat and the pressure, the polymethylpentene is widely used in the whole area of Asia as well as domestic manufacturers for manufacturing the PCB.
[6]
Disclosure of Invention Technical Problem [7] However, polymethylpentene, which is a release film used in the PCB process, is conventionally produced in Japan. Recently, since a domestic area and an Asian area are equipped with a product line capable of manufacturing the PCB employing the polymethylpentene, the domestic area and the Asian area cannot but use the polymethylpentene. Particularly, since Japan does not export a raw material of the polymethylpentene, the domestic area and the Asian area having used the polymethylpentene must import only processed polymethylpentene. Accordingly, the manufacturing cost of the PCB is increased.
[8] In addition, since the buffer film is additionally laminated on polymethylpentene, work efficiency may be degraded.
[9]
Technical Solution
[10] In order to solve the above problems, there is provided a release film used to manufacture a printed circuit board (PCB) and a method for fabricating the same.
[11] According to an aspect of the present invention, the method for fabricating a release film used to manufacture a PCB, includes a first step of fabricating a multi-layer film by laminating 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of polydimethylsiloxane resin through co-extrusion.
Advantageous Effects
[12] In a release film used to manufacture a printed circuit board (PCB) and a method for fabricating the same according to the present invention, since polypropylene and polydimethylsiloxane having a low price are laminated with a predetermined ratio, the release film can represent the same effect as that of a conventional release film, and the manufacturing cost of the release film can be reduced. Particularly, if corona treatment is performed with respect to the surface of the release film for the PCB to semi crosslink the surface of the release film, the polypropylene is not melted to enable the manufacturing of the PCB even if the PCB is manufactured at the high temperature under high pressure. In addition, since a buffer film is subject to co-extrusion together with the polypropylene and the polydimethylsiloxane, work efficiency can be raised.
[13]
Brief Description of the Drawings
[14] FIG. 1 is a view schematically showing a PCB manufactured according to the present invention.
[15]
Mode for the Invention
[16] Hereinafter, the present invention will be described in more detail.
[17] A release film used to manufacture a printed circuit board (PCB) according to the present invention includes a film obtained by mixing 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of polydimethylsiloxane resin through co-extrusion to fabricate a typical film.
[18] The co-extrusion is performed based on pressure and a velocity ratio required when typically manufacturing a film. When manufacturing the film having been subject to the co-extrusion by mixing the polypropylene and the polydimethylsiloxane resin, a buffer film including polyolefin may be further provided.
[19] Meanwhile, the outer portion of the above film is treated by a corona treater, so that only the surface of the film is semi cross-linked.
[20] Hereinafter, a method for fabricating a release film 10 used to manufacture the PCB and having the structure according to the present invention will be described.
[21] The film is formed by using 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of the polydimethylsiloxane resin (typically used among silicon resins) through co-extrusion (step SlO).
[22] In this case, 80 weight% to 99 weight% of the polypropylene (PP) is used because the polypropylene is inexpensive and has a higher melting point. In addition, the reason to form the film by mixing 1 weight% to 20 weight% of the polydimethylsiloxane resin with the polypropylene is that the surface of polyimide can be prevented from sticking to each release film by heat and pressure when the PCB is manufactured by coating the polyimide on a copper plate in the next process, and the film can be easily detached after the PCB has been fabricated due to slip properties of the polydimethylsiloxane resin.
[23] In addition, when the polypropylene is mixed with the polymethylsiloxane to fabricate the film, the buffer film including polyolefin may be simultaneously formed through co-extrusion.
[24] Meanwhile, when the PCB is manufactured with desired heat having the temperature of 14O0C to 17O0C under desired pressure, polypropylene constituting the release film of the PCB may be melted by the heat. Accordingly, the film fabricated in the first step (step SlO) is surface-treated by a corona treater so that only the surface of the film can be semi cross-linked (step S20).
[25] Cross-linking is to convert polymer having a linear structure into polymer having a network structure by chemically/physically bonding molecules to each other, such that the softening temperature and the elasticity of the cross-linked film are enhanced.
[26] The cross-linking is classified into electron-beam irradiation cross-linking using radioactivity and chemical cross-linking using a cross-linking agent. The electron-beam irradiation cross-linking must use the radioactivity that is a dangerous material, and the chemical cross-linking has explosiveness even though a film is fabricated using the cross-linking agent. In addition, through the chemical cross-linking, the quality of a film may not be uniform.
[27] Therefore, the present invention employs semi cross-linking to change only the surface characteristic of a film by a corona treater employing high- voltage discharge.
[28] Although the corona treatment does not belong to the cross-linking method, the corona treatment is generally known to those skilled in the art who treat the surface of a film.
[29] In detail, according to the corona treatment using high- voltage discharge, radicals are applied to the surface of the film such that ink is sufficiently attached to a film when printing is performed with respect to the film by processing the surface of the film, and concave-convexes are formed on the surface of the film by using flame generated by high- voltage discharge.
[30] In this case, if the film is subject to the corona treatment as described above, the sealing temperature and the adhesive strength of the film are significantly degraded after sealing as compared with those of the film before the corona treatment, generally known to those skilled in the art.
[31] This is because the corona treatment generates a semi cross-linking phenomenon in which a linear structure of polymer material is converted into a net structure to change the surface characteristic of the film, similarly to a case in which the characteristic of a film is changed upon cross-linking to enhance the softening temperature and elasticity of the film as described above.
[32] According to the present invention, the softening temperature and the melting point of the film including the mixture of the polypropylene and the polydimethylsiloxane resin must be raised through the corona treatment. This is because an actual temperature required for manufacturing a PCB may be set in the range of 14O0C to 19O0C due to the number of PCBs to be processed and other reasons even though a temperature of about 14O0C is typically required to manufacture the PCB (in this case, the melting point of the polypropylene is 1650C or less).
[33] In other words, since the melting point of the release film 10 used to manufacture the
PCB is lower than the temperature of heat required for manufacturing the PCB, only the surface of the release film 10 used to manufacture the PCB must be semi cross- linked through the corona treatment to enhance the softening temperature and the elasticity of the release film 10. Accordingly, if only the surface of the release film 10 is semi cross-linked, the polypropylene and the polydimethylsiloxane resin can be used to fabricate the release film 10 in a PCB process even if the polypropylene and the polydimethylsiloxane resin have a low price.
[34] In order to manufacture a PCB by laminating polyimide on a copper plate, after interposing the release film 10 fabricated according to the present invention between the copper plate and the polyimide as shown in FIG. 1, predetermined pressure and prede- termined heat are exerted on the resultant structure. At this time, the release film 10, only the surface of which has been semi cross-linked through the corona treatment, is not melted until the polyimide is coated on the copper plate while enduring the exerted heat for the manufacturing of the PCB. In addition, after the polyimide is coated on the copper plate to manufacture the PCB, the release film 10 can be smoothly separated from the PCB due to 1 weight% to 20 weight% of the polydimethylsiloxane resin.

Claims

Claims
[1] A method for fabricating a release film used to manufacture a PCB, the method comprising a first step of fabricating a multi-layer film by laminating 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of polydimethylsiloxane resin through co-extrusion.
[2] The method of claim 1, wherein the first step further includes a step of laminating a buffer film including polyolefin.
[3] The method of claim 1, further comprising a second step of semi cross-linking the multi-layer film fabricated in the first step.
[4] The method of claim 3, wherein the semi cross-linking of the multi-layer film in the second step is achieved by semi cross-linking only a surface of the multilayer film by a corona treater employing high-voltage discharge treatment.
[5] A release film used to manufacture a PCB, the release film comprising a multilayer film fabricated by laminating 80 weight% to 99 weight% of polypropylene (PP) and 1 weight% to 20 weight% of polydimethylsiloxane resin through co- extrusion.
[6] The release film of claim 5, wherein a buffer film, which includes polyolefin, is further laminated on the multi-layer film fabricated by laminating the polypropylene and the polydimethylsiloxane resin.
[7] The release film of claim 5, wherein an outer portion of the multi-layer film fabricated through the co-extrusion is treated by a corona treater, so that only a surface of the multi-layer film is semi cross-linked.
PCT/KR2008/005232 2007-10-20 2008-09-04 Manufacturing method of release films and release films WO2009051343A1 (en)

Applications Claiming Priority (2)

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WO2015017309A1 (en) * 2013-07-29 2015-02-05 3M Innovative Properties Company Release films via solventless extrusion processes
WO2021154469A1 (en) * 2020-01-29 2021-08-05 Toray Plastics (America), Inc. Oriented polyolefin release films

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KR101305370B1 (en) 2010-08-26 2013-09-09 주식회사 폴리사이언텍 Release film for printed circuit board
KR101040307B1 (en) 2010-08-26 2011-06-10 삼민화학공업(주) Cushioned release composite film for printed circuit board
CN104924638A (en) * 2015-04-27 2015-09-23 苏州斯迪克新材料科技股份有限公司 Technique for manufacturing embossed base material film for release film
KR101714901B1 (en) 2015-10-01 2017-03-09 주식회사 대산하이텍 Release film for asphalt sheet and preparing thereof
KR102475226B1 (en) 2022-04-29 2022-12-07 제이엔제이 주식회사 Release film laminating apparatus and method

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US6440566B1 (en) * 1998-10-01 2002-08-27 Airtech International, Inc. Method of molding or curing a resin material at high temperatures using a multilayer release film
JP2003174247A (en) * 2001-09-28 2003-06-20 Ube Ind Ltd Cover-laid film, and circuit board using the film
WO2004060033A1 (en) * 2002-12-24 2004-07-15 Sentrex Company Multilayer product to make printed circuit boards
KR20050095199A (en) * 2004-03-25 2005-09-29 엘에스전선 주식회사 Dicing film having shrinkage film and method of manufacturing semiconductor package using the dicing film
KR20070028262A (en) * 2005-09-07 2007-03-12 김성민 Release film for pcb lamination process

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US6440566B1 (en) * 1998-10-01 2002-08-27 Airtech International, Inc. Method of molding or curing a resin material at high temperatures using a multilayer release film
JP2003174247A (en) * 2001-09-28 2003-06-20 Ube Ind Ltd Cover-laid film, and circuit board using the film
WO2004060033A1 (en) * 2002-12-24 2004-07-15 Sentrex Company Multilayer product to make printed circuit boards
KR20050095199A (en) * 2004-03-25 2005-09-29 엘에스전선 주식회사 Dicing film having shrinkage film and method of manufacturing semiconductor package using the dicing film
KR20070028262A (en) * 2005-09-07 2007-03-12 김성민 Release film for pcb lamination process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015017309A1 (en) * 2013-07-29 2015-02-05 3M Innovative Properties Company Release films via solventless extrusion processes
US9187678B2 (en) 2013-07-29 2015-11-17 3M Innovative Properties Company Release films via solventless extrusion processes
WO2021154469A1 (en) * 2020-01-29 2021-08-05 Toray Plastics (America), Inc. Oriented polyolefin release films

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