CN1837315A - Low-flowability acrylic ester for multilayer flexible printed circuit - Google Patents
Low-flowability acrylic ester for multilayer flexible printed circuit Download PDFInfo
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- CN1837315A CN1837315A CN 200610059066 CN200610059066A CN1837315A CN 1837315 A CN1837315 A CN 1837315A CN 200610059066 CN200610059066 CN 200610059066 CN 200610059066 A CN200610059066 A CN 200610059066A CN 1837315 A CN1837315 A CN 1837315A
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Abstract
The invention discloses a low-liquidity acrylate adhesive on multiple flexible printing circuits, whose superior information: 2005100189758 CN 2005-6-23. The adhesive is composed of polybasic acrylate monomer, crosslinking modified monomer, organic solvent, reaction initiator and special polyester rubber macromolecular modifier. The preparing method of acrylate adhesive comprises the following steps: selecting polybasic acrylate monomer; crosslinking monomer; putting the monomers, organic solvent and initiator in the reactor at certain proportion; stirring the reaction to polymerize; blending the macromolecular compound and acrylate adhesive to constitute a new gel type with half-interpirecing network structure.
Description
Technical field
The present invention relates to the prescription and the preparation of tackiness agent in the field of fine chemical, especially for the thermosetting macromolecule adhesive made of synthetic resin and the preparation of bonding usefulness between the layer flexible printed circuit flaggy of electronic industry printed electronic circuit board industry and the layer.
Background technology
Printed circuit board (PCB) (PCB) is the supporting body of electronic devices and components, is most important in the electronics, most basic integral part.Flexible printed circuit (seal C) has adapted to the needs that electronics develops to microminiaturized and multifunction direction, therefore in recent years, the FPC technology is used in computer, communication, aerospace, automobile, medical facilities, military affairs and consumer electronics industry more and more widely.And layer flexible printed circuit (M-FPC) has higher integrated level, is technology content high product in the FPC industry.
Flexible printed circuit board (FPCB) carries out the circuit moulding with chemical method for etching covering on the Copper Foil plastic film substrate, employed FPC base material normally sticks with glue the bonding back of agent lamination by insulation film such as polyimide, polyester and Copper Foil and forms, english name is Flexible Copper-Clad Laminate, abbreviating FCCL as, wherein is the consumption maximum of insulating carrier with the Kapton.
When making flexible print circuit base material (FCCL), modal method is bonding with Kapton and Copper Foil, as described in ZL95109152, ZL97109279.6, the base material of the bonding composition of also useful Kapton and other tinsels, as described in ZL00115907.0, ZL00114628.9, above-mentioned patent has been introduced several polyimide copper-clads (aluminium, nickel) board adhesive and manufacture method thereof.
Because the particular requirement of M-FPC manufacturing process and electronics use, the thermosetting macromolecule synthetic resin glue that is used for M-FPC must possess a series of property, and specific requirement is as: good adhesiveproperties, qualified anti-tin bath, appropriate resin flowability, suitable technological operation, resistance to acids and bases and electrical insulating property etc.
Directly can process single face and two-sided FPCB with the FPC base material, the production of M-FPCB then needs to use special matrix material to repeat to superpose single or double FPCB bonding.In general, employed high molecular synthetic resin glue in the above-mentioned several patents, also can satisfy the service requirements of M-FPCB, but because M-FPCB adds man-hour, need be at the condition compacted under of High Temperature High Pressure, and FPCB needs to reserve many pads and via before making, high molecular synthetic resin glue all has certain fluidity before hot setting, property is excessive if tackiness agent flows, and can overflow and blocking microporous from pad and via behind the pressurized.If property is too little but tackiness agent flows, fusion insufficient causing " false " is bonding between layer and the layer; The step that copper lines that forms after the etching simultaneously and ground form also needs the mobile resin to fill.Therefore the high molecular synthetic resin glue that uses of M-FPCB except the cohesiveness that possesses general FPC base material requires, soldering resistance, electrical property, before resin solidification, also needs the very resin flow of strict appropriateness of requirement.
Summary of the invention
Purpose of the present invention will overcome the deficiencies in the prior art exactly, providing a kind of is the A component with multi-component copolymer acrylate glue, by adding macromolecule modifier as the B component, behind organic solvent dissolution, add components such as antioxidant, coupling agent, solidifying agent and be mixed with a kind of novel glue kind with half interpenetrating network structure.This glue kind has not only kept the advantage of acrylate adhesive, has had again that the initial solidification temperature is low, set time is short, key is that resin flow is easy to advantages such as control.
Realize that the object of the invention technical scheme is made up of multi-component copolymer acrylate glue A component and urethanes family macromolecule properties-correcting agent B component, A component and the blending of B component physics is composite, promptly make low flow modified acrylic ester adhesion agent of the present invention.
Making multi-component copolymer acrylate adhesive by synthetic method among the Chinese invention patent ZL00114627.0 and synthesis step is the A component, it contains multicomponent methacrylate comonomer, cross-linking modified monomer, organic solvent, reaction initiator, and its composition weight ratio is:
Multicomponent methacrylate comonomer 100
Cross-linking modified monomer 0.5～20
Organic solvent 50～500
Reaction initiator 0.05～5
Better composition weight ratio is:
Multicomponent methacrylate comonomer 100
Cross-linking modified monomer 3～10
Organic solvent 150～300
Reaction initiator 0.3～1.2
The acrylate co-monomers of using in the A component of tackiness agent of the present invention is methacrylic acid C
1～C
8Alkyl ester, vinylformic acid C
1～C
8The mixture of one or more in alkyl ester, vinylbenzene, vinyl cyanide, the vinyl acetate;
The cross-linking modified monomer that uses in the A component of tackiness agent of the present invention is methacrylic acid, vinylformic acid, methacrylic acid β-C
2～C
8Hydroxy ester, propenoic acid beta-C
2～C
8In hydroxy ester, glycidyl methacrylate, glycidyl acrylate, Methacrylamide, acrylamide, n-methylolacrylamide, the hydroxyacrylamide two or more contains the mixture of different crosslinked groups;
The organic solvent that uses in the A component of tackiness agent of the present invention is one or more mixture of toluene, dimethylbenzene, ethyl acetate, butylacetate, ethylene dichloride, trichloroethane, trichloromethane, acetone, methylethylketone, pimelinketone;
The reaction initiator that uses in the A component of tackiness agent of the present invention is 2-(tertiary butyl azo) isopropyl cyanide of azo-compound class, 2,2 '-2,2'-Azobis(2,4-dimethylvaleronitrile), 2, the mixture of one or more of the dilauroyl peroxide of 2 '-Diisopropyl azodicarboxylate and organo-peroxide class, dibenzoyl peroxide, peroxide acetic acid butyl ester, dicumyl peroxide, ditertiary butyl peroxide.
The synthetic method and the synthesis step of the multi-component copolymer acrylate glue that the A component of confession tackiness agent of the present invention is used are:
1. selected multicomponent methacrylate comonomer, cross-linking modified monomer, reaction initiator, organic solvent are added in the reactor that has heating unit, whipping appts, reflux and thermometer in proportion and mix;
2. stir and heat up, feed nitrogen during the reaction beginning to shorten the reaction initiation time, control reaction temperature was reacted 3～24 hours between 50 ℃～150 ℃, and preferably control reaction temperature was reacted 8～18 hours between 70 ℃～110 ℃.
3. cooling discharging is 15%～35% promptly to get the multi-component copolymer acrylate glue that the described A of work component is used with solvent cut to solid content.
Realize technical scheme of the present invention:
A kind of low-flowability acrylic ester that is used for multi-layer flexible printed circuit, formed by multi-component copolymer acrylate glue A component and macromolecule modifier B component, wherein said multi-component copolymer acrylate adhesive A component is that multicomponent methacrylate comonomer, cross-linking modified monomer, organic solvent, reaction initiator make by synthetic method and the synthesis step of Chinese invention patent ZL00114627.0, it is characterized in that macromolecule modifier B component is one or more the mixture in the urethanes, it is formed weight ratio and is:
Multi-component copolymer acrylate glue A component (solid part): 100
Urethanes family macromolecule properties-correcting agent B component (solid part): 10～60
A kind of low-flowability acrylic ester that is used for layer flexible printed circuit of the present invention is characterized in that described urethanes can be urethanes polyether-type or polyester type.
A kind of low-flowability acrylic ester that is used for layer flexible printed circuit of the present invention, the urethanes that it is characterized in that described polyether-type be liquid state as NG315, NG320, NG370, solid state as SA-1, SA-1G; The urethanes of polyester type be liquid state as TA-1-3500B, TA-1-4000B, solid state as J
2H-80, J
2H-85, J
2H-90.
The preparation method who is used for a kind of low-flowability acrylic ester of layer flexible printed circuit of the present invention: the urethanes family macromolecule properties-correcting agent of using as the B component that will select is plasticated (fluid rubber does not need) at twin-screw extruder, is dissolved in then in the organic solvent; The good urethanes family macromolecule properties-correcting agent normal temperature uniform mixing in container used as the B component of the multi-component copolymer acrylate glue that will use as the A component and dissolving filters the back and uses in proportion; A component and the blending of B component physics is composite, promptly make the modified acrylic ester adhesion agent of low flow of the present invention.
The application method of the low-flowability acrylic ester stick of gained in M-FPCB makes is:
With the even coated of above-mentioned glue or with the one side of silk screen printing at single or double FPCB, the thick 0.010-0.050mm of glue, with preliminary drying in 60 ℃～160 ℃ the baking oven 5～120 minutes, flexible circuit board contraposition that needs are bonding stack, in the composite pressure machine in 130 ℃～210 ℃, 20～60Kg/cm
2Under the pressure, pressurize 20～180 minutes promptly gets described M-FPCB.
Better preliminary drying condition is 100 ℃～120 ℃/30～90 minutes;
Better lamination is: temperature is 155 ℃～185 ℃, and pressure is 30～55Kg/cm
2, the heat-insulation pressure keeping time is 40～120 minutes.
Prepared M-FPCB records stripping strength 〉=1.20N/mm according to the testing method of GB4722, GB/T13557 and IPC-TM-650, soldering resistance is not stratified after 260 ℃, 10 seconds, non-foaming in tin bath, bending fatigue resistance does not rupture more than 200 times, surface resistivity 1.0 * 10
5M Ω, volume resistance 1.0 * 10
6More than the M Ω m.Most importantly during lamination, Resin adhesive better mobile, degree of mobilization was controlled at 5～20 o'clock, and the glue that overflows just can not plugged line via and pad.
Realize that Kapton used in the present invention is aromatic series pyromellitic acid dianhydride and 4, the H type film that 4 '-diaminodiphenyl oxide forms through polycondensation, film forming, stretching, cyclisation in polar solvent, BPDA and 4, the S type film that 4 '-diaminodiphenyl oxide is made or compound dianhydride and 4, the X type film of 4 '-diaminodiphenyl oxide;
Realize that Copper Foil used in the present invention is calendering or electrolytic copper foil;
Above-mentioned material all is commercially available products.
Advantage of the present invention is:
1. tackiness agent is a liquid single-component packing, storage period long, 12 months unchangeability;
2. the solidification value of tackiness agent low (160 ℃～180 ℃), set time lack (40～100 minutes), and do not need post curing treatment;
3. use the crosslinked group more than two kinds and two kinds in the tackiness agent, do not needed secondary composite during use, can be used for bonding mutually between the multiple material;
4. be used for the M-FPCB layer and the layer between bonding the time, in tackiness agent, contain the urethanes macromolecule modifier, degree of mobilization before the adhesive solidification can be controlled in the suitable scope, the glue that can not overflow during lamination can not result in blockage to the pad and the via of wiring board.
Embodiments of the invention:
Embodiment 1.
Get methacrylic acid 4 grams, glycidyl methacrylate 6 grams, butyl acrylate 84 grams, methyl methacrylate 25 grams, vinyl cyanide 12 grams, 2-(tertiary butyl azo) isopropyl cyanide 0.75 gram, toluene: ethyl acetate=mixed solvent 265 of 2: 1 restrains the mixing liquid of composition, heating reflux reaction is 10 hours in 500 milliliters of three-necked bottles that have agitator, condenser, thermometer, gets multi-component copolymer acrylate glue A component.As base-material, other gets 18g urethanes NG-320, incorporates toluene: in mixed solvent 65 grams of ethyl acetate=2: 1, the B component, composite with above-mentioned A component, promptly get the low flow modified acrylic ester adhesion agent that layer flexible printed circuit of the present invention is used.
The test sample preparation method:
1. selected tackiness agent is evenly coated on the thick Kapton of 0.025mm, the thick 0.020mm of dried glue was cooled to room temperature to preliminary drying to dry in 30～90 minutes in 80 ℃～120 ℃ baking ovens;
2. the degree of mobilization test request that the gluing Kapton is provided in by IPC-TM-650 on special-purpose setting die punches out 7 standard apertures that vary in size;
3. superimposed with the thick alligatoring electrolytic copper foil of 0.035mm, in the composite pressure machine in 170 ℃, 50kg/cm
2Following hot-press solidifying 60 minutes is made flexible print circuit base material polyimide copper clad lamination sample;
4. measure the mobile distance of glue in 7 apertures with tester, calculate the degree of mobilization of Resin adhesive by standard method
5. above-mentioned flexible print circuit base material polyimide copper clad lamination sample is made the scaling circuit figure, record stripping strength, soldering resistance, folding resistance and electrical property etc., the results are shown in Table 1 by the method for GB4722, GB/T13557 and IPC-TM-650.
Embodiment 2.
Get vinylformic acid 15 grams, propenoic acid beta-hydroxy ethyl ester 18 grams, butyl methacrylate 380 grams, vinylbenzene 22 grams, methyl methacrylate 68 grams, benzoyl peroxide 6.4 grams, dimethylbenzene: acetone: mixed solvent 1500 grams of butylacetate=2: 1: 1, heating reflux reaction is 16 hours in the 10 liter reaction flasks that have agitator, condenser, thermometer, and the cold filtration discharging gets multi-component copolymer acrylate glue A component.As base-material, other gets 100g urethanes J
2H-85, in twin-screw extruder, plasticated through 30 minutes, be dissolved in dimethylbenzene then: acetone: composite in the 350 gram mixed organic solvents of butylacetate=2: 1: 1 as B component and A component, promptly get the low flow modified acrylic ester adhesion agent that layer flexible printed circuit of the present invention is used.
By the sample preparation methods operation identical with embodiment 1:
1. this tackiness agent is evenly coated on the thick Kapton of 0.0125mm, preliminary drying is 40～50 minutes in 80 ℃～120 ℃ baking ovens, and the thick 0.015mm of dried glue punches after being cooled to room temperature.
2. superimposed with the thick alligatoring electrolytic copper foil of 0.018mm, in the composite pressure machine in 165 ℃, 30kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide copper clad lamination sample after 140 minutes.
3. press the standard-required specimen of GB4722, GB/T13557 and IPC-TM-650, test result sees Table 1.
Embodiment 3.
Get Methacrylamide 10 grams, propenoic acid beta-hydroxy propyl ester 10 grams, ethyl acrylate 150 grams, vinyl acetate 10 grams, vinyl cyanide 25 grams, dilauroyl peroxide 0.50 gram, the mixing liquid that toluene 400 grams are formed, heating reflux reaction is 18 hours in 1000 milliliters of reaction flasks that have agitator, condenser, thermometer, and the cold filtration discharging gets multi-component copolymer acrylate glue A component.As base-material, other gets 120 gram urethanes SA-1G, plasticates in mill 60 minutes, and is dissolved in the 400 gram toluene solvants as the B component, composite with the A component, promptly get the low flow modified acrylic ester adhesion agent that layer flexible printed circuit of the present invention is used.
By the sample preparation methods operation identical with embodiment 1:
1. tackiness agent is evenly coated on the thick Kapton of 0.050mm, and preliminary drying is 60 minutes in 80 ℃～120 ℃ baking ovens, and the thick 0.030mm of dried glue punches after being cooled to room temperature.
2. superimposed with the thick alligatoring electrolytic copper foil of 0.050mm, in the composite pressure machine in 180 ℃, 45kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide copper clad lamination after 50 minutes.
3. press the standard-required specimen of GB4722, GB/T13557 and IPC-TM-650, test result sees Table 1.
Embodiment 4.
Get 0.5 kilogram of methacrylic acid, 0.8 kilogram of n-methylolacrylamide, 18.5 kilograms of Isooctyl acrylate monomers, 5.2 kilograms of vinyl cyanide, 2,0.16 kilogram of 2 '-2,2'-Azobis(2,4-dimethylvaleronitrile), trichloroethane: pimelinketone: the reaction liquid of 78 kilograms of compositions of mixed solvent of ethyl acetate=1: 2: 1, heating reflux reaction is 12 hours in the reactor of 300 liters that have agitator, condenser, thermometer, and the cold filtration discharging gets multi-component copolymer acrylate glue A component.As base-material, get 11.5 kilograms of urethanes J
2H-90 is dissolved in after plasticating in 40 kilograms of toluene solvants.Other gets 2.8 kilograms of urethanes NG-315, is dissolved in 8 kilograms of toluene solvants, and two kinds of urethane glues are mixed the component as B, and is composite with the A component, promptly gets the low flow modified acrylic ester adhesion agent that layer flexible printed circuit of the present invention is used.
By the sample preparation methods operation identical with embodiment 1:
1. this tackiness agent is evenly coated on the thick Kapton of 0.025mm, and preliminary drying is 80 minutes in 80 ℃～120 ℃ baking ovens, and the thick 0.018mm of dried glue punches after being cooled to room temperature.
2. superimposed with the thick alligatoring rolled copper foil of 0.018mm, in the composite pressure machine in 200 ℃, 35kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide copper clad lamination sample after 30 minutes.
3. press the standard-required specimen of GB4722, GB/T13557 and IPC-TM-650, test result sees Table 1.
Embodiment 5.
Get propenoic acid beta-hydroxy propyl ester 22 grams, glycidyl acrylate 28 grams, butyl acrylate 600 grams, vinylbenzene 160 grams, Diisopropyl azodicarboxylate 8.8 grams, ethylene dichloride: methylethylketone=mixed solvent 2200 of 1: 1 restrains the reaction liquid of composition, and heating reflux reaction is 8 hours in 10 liters of three-necked bottles that have agitator, condenser, thermometer, the cold filtration discharging gets multi-component copolymer acrylate glue A component.As base-material, other gets 50 gram urethanes TA-1-3500B, be dissolved in 150 gram toluene:, composite in the mixed solvent of acetone=2: 1 with the A component as the B component, promptly get the low flow modified acrylic ester adhesion agent that layer flexible printed circuit of the present invention is used.
By the sample preparation methods operation identical with embodiment 1:
1. this tackiness agent is evenly coated on the thick Kapton of 0.0125mm, and preliminary drying is 40 minutes in 80 ℃～120 ℃ baking ovens, and the thick 0.012mm of dried glue punches after being cooled to room temperature.
2. superimposed with the thick alligatoring rolled copper foil of 0.018mm, in the composite pressure machine in 160 ℃, 45kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide copper clad lamination sample after 110 minutes.
3. press the standard-required specimen of GB4722, GB/T13557 and IPC-TM-650, test result sees Table 1.
Embodiment 6.
Get methacrylic acid 5 grams, glycidyl methacrylate 5 grams, butyl methacrylate 75 grams, vinyl cyanide 10 grams, Diisopropyl azodicarboxylate 0.2 gram, ethyl acetate: methylethylketone=mixed solvent 240 of 1: 1 restrains the reaction liquid of composition, and heating reflux reaction is 16 hours in 1000 milliliters of three-necked bottles that have agitator, condenser, thermometer, the cold filtration discharging gets multi-component copolymer acrylate glue A component.As base-material, other gets urethanes NG-37020 gram and TA-1-4000825 gram, be dissolved in 180 gram ethyl acetate: in the mixed solvent of acetone=1: 1 as the B component, composite with the A component, promptly get the low flow modification acrylate hot setting adhesive that layer flexible printed circuit of the present invention is used.
By the sample preparation methods operation identical with embodiment 1:
1. this tackiness agent is evenly coated on the thick Kapton of 0.025mm, and preliminary drying is 60 minutes in 100 ℃ of baking ovens, and the thick 0.022mm of dried glue punches after being cooled to room temperature.
2. superimposed with the thick alligatoring rolled copper foil of 0.035mm, in the composite pressure machine in 155 ℃, 55kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide copper clad lamination sample after 150 minutes.
3. press the standard-required specimen of GB4722, GB/T13557 and IPC-TM-650, test result sees Table 1.
Embodiment 7.
Get vinylformic acid 20 grams, propenoic acid beta-hydroxy ethyl ester 10 grams, butyl methacrylate 400 grams, vinylbenzene 20 grams, methyl methacrylate 65 grams, benzoyl peroxide 6 grams, dimethylbenzene: acetone: mixed solvent 1500 grams of butylacetate=2: 1: 1, heating reflux reaction is 12 hours in the 10 liter reaction flasks that have agitator, condenser, thermometer, and the cold filtration discharging gets multi-component copolymer acrylate glue A component.As base-material, other gets urethanes SA-1150 gram and J
2H-80130 gram through after 50 minutes plasticate, is dissolved in the 400 gram toluene solvants respectively together, and is composite as B component and A component, promptly gets the low flow modified acrylic ester adhesion agent that layer flexible printed circuit of the present invention is used.
By the sample preparation methods operation identical with embodiment 1:
1. this tackiness agent is evenly coated on the thick Kapton of 0.0125mm, and preliminary drying is 45 minutes in 120 ℃ of baking ovens, and the thick 0.014mm of dried glue punches after being cooled to room temperature.
2. superimposed with the thick alligatoring electrolytic copper foil of 0.018mm, in the composite pressure machine in 170 ℃, 30kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide copper clad lamination sample after 60 minutes.
3. press the standard-required specimen of GB4722, GB/T13557 and IPC-TM-650, test result sees Table 1.
Comparative Examples 1.
Get vinylformic acid 6 grams, glycidyl acrylate 5 grams, butyl acrylate 70 grams, vinylbenzene 30, Diisopropyl azodicarboxylate 0.8 gram, butylacetate: mixed solvent 240 grams of toluene=1: 1 mix, and heating reflux reaction is 24 hours in having the 500ml three-necked bottle of agitator, condenser, thermometer, cooled and filtered must contrast tackiness agent.
The gained tackiness agent is evenly coated on the thick Kapton of 0.0125mm, and preliminary drying is 45 minutes in 100 ℃ of baking ovens, the thick 0.012mm of glue, punching back and the thick rolled copper foil poststack of 0.015mm, in the composite pressure machine in 175 ℃, 45kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide copper clad lamination sample after 60 minutes.
Make specimen and test with the method identical with embodiment 1, test result sees Table 1.
Comparative Examples 2.
Get methacrylic acid 5 grams, butyl acrylate 70 grams, vinyl cyanide 30, peroxide acetic acid butyl ester 0.8 gram, butylacetate: mixed solvent 300 grams of methylethylketone=2: 1 mix, heating reflux reaction is 16 hours in having the 1000ml three-necked bottle of agitator, condenser, thermometer, and cooling back adds 5 gram E-51 Resins, epoxy (Chinese Wuxi resin processing plant produce), must contrast tackiness agent.
The gained tackiness agent is evenly coated on the thick Kapton of 0.025mm, and preliminary drying is 30 minutes in 120 ℃ of baking ovens, the thick 0.022mm of glue, punching back and the thick alligatoring electrolytic copper foil poststack of 0.035mm, in the composite pressure machine in 165 ℃, 50kg/cm
2Following hot-press solidifying was made flexible print circuit base material polyimide copper clad lamination after 120 minutes.
Make specimen and test with the method identical with embodiment 1, test result sees Table 1.
Table 1
| Test event | Test condition | Standard value | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | Comparative Examples 1 | Comparative Examples 2 | Testing method |
| Stripping strength (N/mm) (minimum value) | After the etching, normality | 1.40 | 1.55 | 1.58 | 1.48 | 1.52 | 1.44 | 1.52 | 1.56 | 1.31 | 1.27 | IPC-TM-650-2.4.9 (method A) |
| After cutting sample, normality | 1.40 | 1.50 | 1.53 | 1.45 | 1.47 | 1.42 | 1.46 | 1.49 | 1.26 | 1.22 | IPC-TM-650-2.4.9 (method B) | |
| After the floating weldering of 288 ℃/5s is handled | 1.23 | 1.32 | 1.37 | 1.31 | 1.31 | 1.28 | 1.34 | 1.35 | 1.10 | 1.08 | IPC-TM-650-2.4.9 (method D) | |
| After trieline soaks 3 minutes | 0.50 | 1.09 | 1.14 | 0.98 | 1.10 | 0.92 | 1.11 | 1.22 | 0.88 | 0.86 | The 3.4th of GB/T13557 | |
| Anti-tin-welding (second) | In 260 ℃ of tin baths, 10 seconds | Not stratified, non-foaming | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | IPC-TM-650-2.4B (method A) |
| Resin flow | 170 ℃/4Mpa/60 minute | 2～20 | 18 | 11 | 8 | 16 | 12 | 5 | 10 | 34 | 41 | IPC-TM-650- 2.3.17.1 |
| Volume resistance (M Ω m) (minimum value) | After constant wet heat treatment is recovered | 1×10 6 | 3.6×10 6 | 4.7×10 6 | 2.8×10 6 | 2.6×10 6 | 3.3×10 6 | 1.8×10 6 | 2.5×10 6 | 2.6×10 6 | 1.8×10 6 | IPC-TM-650- 2.5.17 |
| Surface resistivity (M Ω) (minimum value) | After constant wet heat treatment is recovered | 1×10 5 | 2.8×10 5 | 2.2×10 5 | 2.5×10 5 | 2.1×10 5 | 3.6×10 5 | 3.1×10 5 | 3.2×10 5 | 1.8×10 5 | 2.3×10 5 | IPC-TM-650- 2.5.17 |
| Specific inductivity (maximum value) | After constant wet heat treatment is recovered | 4.0 | 3.3 | 3.4 | 3.2 | 3.6 | 3.3 | 3.8 | 3.4 | 3.5 | 3.6 | IPC-TM-650- 2.5.5.3 |
| Dielectric loss angle tangent (maximum value) | After constant wet heat treatment is recovered | 0.035 | 0.029 | 0.030 | 0.032 | 0.034 | 0.030 | 0.033 | 0.028 | 0.031 | 0.034 | IPC-TM-650- 2.5.5.3 |
| Perpendicular layers is to electrical strength (KV/mm) (minimum value) | After constant wet heat treatment is recovered | 40 | 107 | 103 | 103 | 108 | 110 | 106 | 102 | 107 | 102 | The GB4722 Chapter 11 |
| Chemical proofing | 2NNaOH/10 minute | No change | No change | No change | No change | No change | No change | No change | No change | No change | No change | IPC-TM-650- 2.3.2A |
| 2NHCl solution/10 minute | No change | No change | No change | No change | No change | No change | No change | No change | No change | No change | ||
| Flexural fatigue | Normality | 150 | 261 | 253 | 229 | 242 | 377 | 253 | 264 | 228 | 242 | GB/T13557 the 4th chapter |
Claims (4)
1. a kind of low-flowability acrylic ester that is used for layer flexible printed circuit, formed by a kind of multi-component copolymer acrylate glue A component and urethanes family macromolecule properties-correcting agent B component, wherein said multi-component copolymer acrylate adhesive A component is its poly-monomer of multicomponent methacrylate, cross-linking modified monomer, organic solvent, reaction initiator makes by synthetic method and the synthesis step of Chinese invention patent ZL00114627.0, it is characterized in that urethanes family macromolecule properties-correcting agent B component is one or more the mixture in the urethanes, it is formed weight ratio and is:
Multi-component copolymer acrylate glue A component (solid part): 100
Urethanes family macromolecule properties-correcting agent B component (solid part): 10～60.
2. a kind of low-flowability acrylic ester that is used for layer flexible printed circuit as claimed in claim 1 is characterized in that described urethanes can be urethanes polyether-type or polyester type.
3. a kind of low-flowability acrylic ester that is used for layer flexible printed circuit as claimed in claim 1, the urethanes that it is characterized in that described polyether-type be liquid state as NG315, NG320, NG370, solid state as SA-1, SA-1G; The urethanes of polyester type be liquid state as TA-1-3500B, TA-1-4000B, solid state as J
2H-80, J
2H-85, J
2H-90.
4. the preparation method who is used for a kind of low-flowability acrylic ester of layer flexible printed circuit: the urethanes family macromolecule properties-correcting agent of using as the B component that will select is plasticated (fluid rubber does not need) at twin-screw extruder, is dissolved in then in the organic solvent; The good urethanes family macromolecule properties-correcting agent normal temperature uniform mixing in container used as the B component of the multi-component copolymer acrylate glue that will use as the A component and dissolving filters the back and uses in proportion; A component and the blending of B component physics is composite, promptly make the modified acrylic ester adhesion agent of low flow of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610059066 CN1837315A (en) | 2005-06-23 | 2006-02-25 | Low-flowability acrylic ester for multilayer flexible printed circuit |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510018975 | 2005-06-23 | ||
| CN200510018975.8 | 2005-06-23 | ||
| CN 200610059066 CN1837315A (en) | 2005-06-23 | 2006-02-25 | Low-flowability acrylic ester for multilayer flexible printed circuit |
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| CN1837315A true CN1837315A (en) | 2006-09-27 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101925663A (en) * | 2008-04-17 | 2010-12-22 | 日立化成工业株式会社 | Adhesive composition, adhesive for circuit connection, connected structure, and semiconductor device |
| CN101409976B (en) * | 2007-10-12 | 2011-04-06 | 比亚迪股份有限公司 | Multilayer flexible circuit board |
| CN103045069A (en) * | 2013-01-31 | 2013-04-17 | 株洲时代电气绝缘有限责任公司 | Multifunctional modified crylic acid polyurethane rubber coating and preparation method thereof |
| CN104194687A (en) * | 2014-08-26 | 2014-12-10 | 安徽神舟飞船胶业有限公司 | Formula and preparation process of styrene and polyether urethane copolymer adhesive |
| CN109168249A (en) * | 2018-10-16 | 2019-01-08 | Oppo（重庆）智能科技有限公司 | A kind of circuit board and preparation method thereof |
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2006
- 2006-02-25 CN CN 200610059066 patent/CN1837315A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409976B (en) * | 2007-10-12 | 2011-04-06 | 比亚迪股份有限公司 | Multilayer flexible circuit board |
| CN101925663A (en) * | 2008-04-17 | 2010-12-22 | 日立化成工业株式会社 | Adhesive composition, adhesive for circuit connection, connected structure, and semiconductor device |
| CN105295764A (en) * | 2008-04-17 | 2016-02-03 | 日立化成工业株式会社 | Use of ADHESIVE COMPOSITION in preparing connection material, ADHESIVE FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND SEMICONDUCTOR DEVICE |
| CN103045069A (en) * | 2013-01-31 | 2013-04-17 | 株洲时代电气绝缘有限责任公司 | Multifunctional modified crylic acid polyurethane rubber coating and preparation method thereof |
| CN103045069B (en) * | 2013-01-31 | 2015-10-21 | 株洲飞鹿高新材料技术股份有限公司 | A kind of multifunctional modification acroleic acid polyurethane rubber coating and preparation method |
| CN104194687A (en) * | 2014-08-26 | 2014-12-10 | 安徽神舟飞船胶业有限公司 | Formula and preparation process of styrene and polyether urethane copolymer adhesive |
| CN109168249A (en) * | 2018-10-16 | 2019-01-08 | Oppo（重庆）智能科技有限公司 | A kind of circuit board and preparation method thereof |
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