CN1057318C - High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof - Google Patents
High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof Download PDFInfo
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- CN1057318C CN1057318C CN95109152A CN95109152A CN1057318C CN 1057318 C CN1057318 C CN 1057318C CN 95109152 A CN95109152 A CN 95109152A CN 95109152 A CN95109152 A CN 95109152A CN 1057318 C CN1057318 C CN 1057318C
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- epoxy
- antioxidant
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- coupling agent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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Abstract
The present invention relates to a high temperature resistant adhesive for a flexible printed circuit and a preparation method thereof, and the adhesive is prepared by nitrile rubber modified by bismaleimide resin, epoxy, phenolic resin, a coupling agent and an antioxidant by a chemical reaction method or a physical mixing method. The adhesive can stick insulation material thin films of polyimide, polyester, etc. and metal foil (copper, aluminum, etc.), enhance the tin solderability resistance and the peeling strength of the base material of the flexible printed circuit, shorten the curing time and have favorable insulation property and chemical medicine resistance.
Description
The invention belongs to macromolecular material tackiness agent and preparation, particularly bonding macromolecule adhesive and the preparation of insulation film and tinsel.
In the industry of making flexible print circuit, carry out bonding to insulation film and tinsel, once worked out multiple tackiness agent, as day the disclosure specially permit clear 49-33988 with epoxy-phenol aldehyde modified paracril system, the advantage of this glue kind is that solidification value is low, and preparation is simple, and its shortcoming is that set time is long, poor heat resistance, stripping strength is low.Research subsequently improves it, and a day disclosure is speciallyyed permit clear 61-100445 and adopted liquid nbr carboxyl terminal to replace the solid butyronitrile, replaces the way of common phenolic aldehyde to improve the thermotolerance of tackiness agent with amino phenolic aldehyde.Day disclosure is speciallyyed permit flat 01--80009 and is adopted the way of a kind of priming paint of precoating to improve the stripping strength of tackiness agent, and these two kinds of shortcomings of improving one's methods are the raw materials cost height, and complete processing is complicated.Day disclosure is speciallyyed permit clear 61-174245 with bonding insulating substrate of acrylic elastomer modified bismaleimide and tinsel, can give the cementability of base material excellence, anti-tin-welding, but have solidification value height (190 ℃), set time long (3 hours), also need shortcomings such as post curing treatment 3 hours.
Purpose of the present invention will overcome the deficiencies in the prior art exactly, provides a kind of high-temperature resistance adhesive and method for making that is used for flexible print circuit.This tackiness agent is used for the bonding of insulating plastics film such as polyimide, polyester and tinsel (as copper, aluminium foil), and good anti-tin-welding is arranged, higher stripping strength, and folding resistance, chemical proofing, industrial implementation is convenient simultaneously, and is with low cost.
The technical scheme that realizes the object of the invention is to be base-material with the bimaleimide resin modified butadiene acrylonitrile rubber, behind organic solvent dissolution, introduces antioxidant, coupling agent, resol and cross linking of epoxy resin resin, is mixed with high-temperature resistance adhesive.
Above-mentioned paracril is solid nitrile rubber, liquid acrylonitrile butadiene rubber and carboxyl end of the liquid acrylonitrile-butadiene rubber.Bimaleimide resin is meant that structure is:
Wherein R is-CH
2-,-O-or-bismaleimide resin of S-.
Resins, epoxy is the E-21 of dihydroxyphenyl propane glycidyl ether type, E-44, E-51, the mixture of one or more of F-21, the F-44 of linear phenolic resin polyglycidyl ether type, F-51.
Resol is pure dissolubility lacquer resins.
Coupling agent is the silane type coupling agent, as γ-aminopropyl triethyl silicane (KH-550), and γ-glycidyl ether propyl group trimethoxy silane (KH-560), γ-propyl methacrylate base Trimethoxy silane (KH-570).
Antioxidant is a 2,6 di tert butyl 4 methyl phenol, 2,2, and 4-trimethylammonium-1,2-dihyaroquinoline polymer, or one or more mixtures of sulfuration dipropionic acid two lauryls.Solvent is a toluene, the mixture of one or more of dimethylbenzene, chlorobenzene, hexanaphthene, ethyl acetate, butylacetate, Isoamyl Acetate FCC, ethylene dichloride, trichloromethane, acetone, butanone, pimelinketone, aniline, dimethyl formamide, N,N-DIMETHYLACETAMIDE.
Above-mentioned material all is commercially available products.
The composition that is used for the high-temperature resistance adhesive of flexible print circuit provided by the invention is by weight:
100 parts of paracrils
Bimaleimide resin 5-60 part
Resins, epoxy 1-20 part
Resol 1-40 part
Coupling agent 1-5 part
Antioxidant 0.5-3 part
Solvent 300-700 part.
Originally the better ingredients by weight ratio of high-temperature resistance adhesive that is used for flexible print circuit is:
100 parts of paracrils
Bimaleimide resin 20-40 part
Resins, epoxy 5-10 part
Resol 10-30 part
Coupling agent 2-4 part
Antioxidant 1-2 part
Solvent 400-600 part.
Its method for making is to form by above weight, bismaleimides and solid butyronitrile are carried out the mixing antioxidant that adds simultaneously, finish and be cut into fragment after the modification thin slice discharging of butadiene-acrylonitrile rubber and be dissolved in the solvent, after treating to dissolve fully, add above-mentioned Resins, epoxy, resol, coupling agent, be deployed into the satisfactory glue paste of solid content with solvent then, perhaps with bismaleimides elder generation and the prepolymerization in solvent of epoxy aniline, mix the modification of finishing paracril with nitrile (HTBN) or end carboxyl nitrile (HTBN) then, use above-mentioned resol again, coupling agent, antioxidant and solvent are modulated into the high-temperature resistance adhesive that is used for flexible print circuit.The gained tackiness agent connects plastics film and Copper Foil, makes the flexible print circuit base material, and this base material has following characteristics:
(1) anti-tin-welding: in tin bath 260 ℃＞60 seconds; 288 ℃＞10 seconds;
(2) stripping strength＞2.0kg/cm;
(3) volume resistance＞1.0 * 10
5M Ω m;
The advantage that is used for the high-temperature resistance adhesive of flexible print circuit provided by the invention is:
(1) tackiness agent is the single-component package of liquid.Storage period is long, and 12 months unchangeability are easy to use, toxicity is little, and cost is low;
(2) solidification value low (150 ℃) in polyimide (polyester) film and copper (aluminium) paper tinsel bonding, set time＜60 minute, and need not post curing treatment;
(3) in the adhesive formulation, adopt high temperature resistant bimaleimide resin, can improve the anti-tin-welding of flexible print circuit, can improve cementability again simultaneously;
(4) owing to adopted butyronitrile, the superpolymer component of span, epoxy, several different in kinds of phenolic aldehyde and coupling agent and multiple solvent, single packed liq tackiness agent of composition, it has multi-usage, can be used for the bonding compound of multiple insulating plastics film and tinsel.
Embodiments of the invention:
Embodiment 1: get liquid nbr 500 grams, diphenyl methane dimaleimide 100 grams, solid content 40% pure dissolubility lacquer resins 150 grams, KH-550 coupling agent 2.5 grams, Resins, epoxy E-215 gram, the E-4415 gram, antioxidant 2,6-di-tert-butyl-4-methy phenol 5 grams, solvent aniline 5 grams, toluene 175 grams, acetone: ethyl acetate: butanone=mixed solvent was an amount of in 1: 1: 1, and by following step preparation.
(available 50-500 rises reactor on the industrial production) adds diphenyl methane dimaleimide, aniline, epoxy E-21 and E-44, toluene in the three-necked bottle that has agitator, condenser, reflux prepolymerization 120 minutes, get the brown transparent glue of solid content 40%, this glue is mixed with nitrile (HTBN), add solid content 40% pure dissolubility lacquer resins, antioxidant, coupling agent, use acetone then: ethyl acetate: it is 30% that the mixed solvent of butanone=1: 1: 1 is diluted to solid content, promptly gets the high-temperature resistance adhesive that is used for flexible print circuit.
The glue mucus that obtains is evenly coated on the Kapton, superimposed with the alligatoring Copper Foil of 35 micron thickness, make the flexible print circuit base material.Record stripping strength, anti-tin-welding and electrical property etc. by standard, the results are shown in Table 1.
Embodiment 2, get 100 gram solid nitrile rubbers-40, phenyl ether bimaleimide resin 30 grams, Resins, epoxy E-515 gram, pure dissolubility lacquer resins 15 grams of solid content 40%, coupling agent KH-550 2.5 grams, antioxidant 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer 2 gram, ethyl acetate: gram surplus the mixed solvent 200 of butanone=1: 1, by following step preparation tackiness agent.
On rubber mixing mill, solid butyronitrile-40 is plasticated, add antioxidant simultaneously, the phenyl ether bimaleimide resin carries out mixing, thin slice discharging then is dissolved in the mixed solvent after being cut into fragment, treats to dissolve fully the pure dissolubility lacquer resins that the back adds 40% solid content, Resins, epoxy, coupling agent, and to be diluted to solid content with mixed solvent liquid be 25%, promptly obtains tackiness agent of the present invention.
The tackiness agent of gained is evenly coated on the Kapton compound with Copper Foil, makes the flexible print circuit base material, record stripping strength by standard, data such as anti-tin-welding and electrical property the results are shown in table 1.
Embodiment 3, get end carboxyl nitrile (HTBN) 700 grams, the solid content that contains diphenyl methane dimaleimide among the embodiment 1 is 40% pre-polymerization glue, 500 grams (having contained epoxy), solid content 40% pure dissolubility lacquer resins 200 grams, coupling agent KH-560 10 grams, antioxidant Tyox B 15 grams, toluene: acetone=mixed solvent was an amount of in 1: 1, by following step preparation tackiness agent.
To hold the carboxyl nitrile (HTBN) and contain diphenyl methane dimaleimide pre-polymerization glue and mix, add solid content 40% pure dissolubility lacquer resins.Antioxidant, coupling agent, use toluene then: it is 35% glue that the mixing solutions of acetone=1: 1 is diluted to solid content, promptly gets tackiness agent of the present invention.
This tackiness agent is used for polyimide and the alligatoring Copper Foil is bonding, makes the flexible print circuit base material, record use properties, the results are shown in table 1 by standard.
Embodiment 4, get solid butyronitrile-40 100 gram, polyamines base bimaleimide resin 20 grams, solid content 40% pure dissolubility lacquer resins 50 grams, F-51 Resins, epoxy 5 grams, KH-570 coupling agent 3 grams, antioxidant 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer 2 grams, ethyl acetate: pimelinketone=mixed solvent was an amount of in 1: 1, by following step preparation tackiness agent.
Solid butyronitrile 40 put in the mill plasticate, add antioxidant simultaneously, carry out mixing with the two bismaleimide resins of polyamines base, thin slice goes out sample, be cut into and be dissolved in 200 gram ethyl acetate behind the fragment: in the mixed solvent of pimelinketone=1: 1, treat to dissolve fully pure dissolubility lacquer resins, F-51 Resins, epoxy and coupling agent kh-570 that the back adds solid content 40%, and be diluted to solid content with ethyl acetate-cyclohexanone mixed solvent and be about 25%, promptly get tackiness agent of the present invention.
The gained tackiness agent is evenly coated on the Kapton, bonding compound with the alligatoring Copper Foil, make the flexible print circuit base material, record stripping strength by standard, anti-tin-welding and electrical property the results are shown in table 1.
Embodiment 5, with embodiment 2 gained tackiness agent, are used for polyester film and alligatoring bonding foil, make the flexible print circuit base material, record stripping strength by standard, and anti-tin-welding and electrical property the results are shown in table 1.
Embodiment 6, get solid nitrile rubber-40 100 gram, sulfobenzide bismaleimides 5 grams, epoxy E-51 5 grams, F-21 5 gram solid contents 40% pure dissolubility lacquer resins 40 grams, coupling agent KH-560 1 gram, antioxidant 2,6-di-tert-butyl-4-methy phenol 0.5 gram, dimethylbenzene: hexanaphthene=solvent was an amount of in 2: 1, by following step allotment tackiness agent.
On rubber mixing mill, solid butyronitrile-40 is plasticated, add antioxidant simultaneously, the sulfobenzide bimaleimide resin carries out mixing, thin slice discharging then, be dissolved in the mixed solvent after being cut into fragment, after treating to dissolve fully, add Resins, epoxy, resol, coupling agent, be deployed into the glue of solid content 15% then with mixed solvent, promptly get tackiness agent of the present invention.
This tackiness agent is used for the bonding of Kapton and alligatoring Copper Foil, makes the flexible print circuit base material,, the results are shown in table 1 by the standard test applicable performance.
Embodiment 7, get solid butyronitrile-40 100 gram, phenyl ether bimaleimide resin 60 grams, epoxy E-210.5 gram, F-44 0.5 gram, 40% solid content alcohol dissolubility lacquer resins, 1 gram, coupling agent kh-570 5 grams, antioxidant 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer 1 gram, Tyox B 1 gram, 2,6-di-tert-butyl-4-methy phenol 1 gram, the solvent ethylene dichloride: the mixed solvent of butyl butyrate=1: 1 is an amount of, by following step modulation tackiness agent.
On rubber mixing mill, solid butyronitrile-40 is plasticated, add antioxidant simultaneously, the phenyl ether bimaleimide resin carries out mixing, thin slice discharging then, be dissolved in the mixed solvent after being cut into fragment, after treating to dissolve fully, add Resins, epoxy, resol, coupling agent, be deployed into the glue of solid content 40% with mixed solvent again, promptly get tackiness agent of the present invention.
This tackiness agent is used for polyester film and the alligatoring Copper Foil is bonding, makes the flexible print circuit base material, by the standard test suitability, its data are listed in table 1.
Comparative example is without bismaleimides resin modified butadiene acrylonitrile rubber.
1, on rubber mixing mill, 100 gram solid butyronitrile-40 are plasticated, and add antioxidant 2,2,4-trimethylammonium-1 or 2-dihyaroquinoline polymer 2 grams mixing, thin slice goes out sample then, be dissolved in the pimelinketone after being cut into fragment, add solid content 40% pure dissolubility lacquer resins 30 grams, E-51 Resins, epoxy 5 grams, being diluted to solid content with pimelinketone is 30%, and stirring at room is dissolved into tackiness agent.
With bonding Kapton of this tackiness agent and alligatoring Copper Foil, make the flexible print circuit base material, by its stripping strength of standard test, anti-tin-welding and electrical property the results are shown in table 1.
2,100 gram liquid acrylonitrile butadiene rubber and 40 are restrained the pure dissolubility lacquer resins of solid contents 40%, 10 gram E-44 Resins, epoxy and 1 gram 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer mixes, with the glue mucus of toluene with said mixture melt into solid content 30%.With Kapton and alligatoring Copper Foil compound sticking, make the flexible print circuit base material with this glue mucus, by standard test exploitation intensity, anti-tin-welding.Electrical property, the result is with listing in table 1.
By data in the table 1 as seen, the bi-maleimide modified paracril of embodiment 1-7 behind organic solvent dissolution, is introduced antioxidant again, coupling agent, resol and Resins, epoxy, resulting tackiness agent is than the prepared tackiness agent of paracril without the modification of span imide resin, be used for polyimide (polyester) film and copper, (aluminium) when paper tinsel is bonding, the anti-tin-welding of the flexible print circuit that makes, stripping strength and electrical property are all better.
Table 1
| Test event | Test condition | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | Comparative example 1 | Comparative example 2 | Testing method |
| Anti-tin-welding (second) | In 260 ℃ of tin baths | ?＞60 | ?＞60 | ?＞60 | ?＞60 | ?- | ?＞60 | ?- | ?＞60 | ?＞60 | IPC-TM-650-2.4B (method A) |
| In 288 ℃ of tin baths | ?＞10 | ?＞10 | ?＞10 | ?＞10 | ?- | ?10 | ?- | The foaming layering | The foaming layering | IPC-TM-650-2.4B (method B) | |
| Stripping strength (kg/cm) | Normality | ?2.4 | ?2.3 | ?2.4 | ?2.1 | Film is torn | ?2.1 | Film is torn | ?2.0 | ?1.8 | The 3.1st of GB/T 13557 |
| Handle after 30 minutes for 125 ℃ | ?2.4 | ?2.3 | ?2.4 | ?2.1 | Film is torn | ?2.0 | Film is torn | ?2.0 | ?1.7 | The 3.2nd of GB/T13557 | |
| 200 ℃ of thermal shockings are handled | ?2.2 | ?2.3 | ?2.2 | ?2.0 | Film is torn | ?1.9 | Film is torn | ?1.7 | ?1.5 | The 3.3rd of GB/T13557 | |
| After trichloromethane soaks 3 minutes | ?2.1 | ?2.0 | ?2.1 | ?1.9 | Film is torn | ?1.8 | Film is torn | ?1.6 | ?1.5 | The 3.5th of GB/T13557 | |
| Volume resistance (M Ω m) | After constant wet heat treatment is recovered | ?2.3×10 6 | ?1.8×10 6 | ?2.9×10 6 | ?1.4×10 6 | ?1.2×10 6 | ?2.0×10 6 | ?1.2×10 6 | ?1.4×10 6 | ?1.3×10 6 | GB4722 the 5th chapter |
| Surface resistivity (M Ω) | After constant wet heat treatment is recovered | ?4.2×10 5 | ?3.7×10 5 | ?5.4×10 5 | ?2.6×10 5 | ?1.4×10 5 | ?1.6×10 5 | ?1.3×10 5 | ?2.4×10 5 | ?1.5×10 5 | GB4722 the 6th chapter |
| Specific inductivity (maximum value) | After constant wet heat treatment is recovered | ?2.3 | ?2.6 | ?2.4 | ?2.8 | ?3.5 | ?3.2 | ?3.5 | ?2.3 | ?2.7 | GB4722 the 9th chapter |
| Dielectric loss angle tangent (maximum value) | After constant wet heat treatment is recovered | ?0.035 | ?0.026 | ?0.042 | ?0.029 | ?0.033 | ?0.021 | ?0.031 | ?0.041 | ?0.043 | GB4722 the 9th chapter |
| Perpendicular layers is to electrical strength (Kv/m) minimum value | ?74 | ?72 | ?82 | ?75 | ?63 | ?68 | ?65 | ?59 | ?68 | The GB4722 Chapter 11 | |
| Flexural fatigue (minimum value) (inferior) 35 μ m Copper Foils | ?111 | ?142 | ?138 | ?125 | ?117 | ?124 | ?115 | ?119 | ?122 | GB/T13557 the 4th chapter | |
| Chemical proofing | No change | No change | No change | No change | ?- | No change | ?- | No change | No change | ?IPC-TM-650-2.3.2A |
Claims (4)
1, a kind of high-temperature resistance adhesive that is used for flexible print circuit, contain one or more epoxy resin compositions, coupling agent, antioxidant among F-21, F-44, the F-51 of the bimaleimide resin of paracril, structural formula (1), pure dissolubility lacquer resins, the E-21 that is selected from dihydroxyphenyl propane glycidyl ether type, E-44, E-51, linear phenolic resin polyglycidyl ether type, it is characterized in that the prescription of this tackiness agent is by weight:
100 parts of paracrils
Bimaleimide resin 1-60 part
Resins, epoxy 1-20 part
Resol 1-40 part
Coupling agent 1-5 part
Antioxidant 0.5-3 part
Solvent 300-700 part.
2, by the described tackiness agent of claim 1, it is characterized in that the prescription of this tackiness agent is by weight:
100 parts of paracrils
Bimaleimide resin 20-40 part
Resins, epoxy 5-10 part
Resol 10-30 part
Coupling agent 2-4 part
Antioxidant 1-2 part
Solvent 400-600 part.
3, produce the method for claim 1 or 2 described tackiness agent, it is characterized in that forming by weight and carry out bismaleimides and solid butyronitrile mixing, add antioxidant simultaneously, after finishing the modification, thin slice discharging of butadiene-acrylonitrile rubber, being cut into fragment is dissolved in the solvent, after treating to dissolve fully, the Resins, epoxy of adding, resol, coupling agent form with the solvent allotment then.
4, produce the method for claim 1 or 2 described tackiness agent, it is characterized in that with bismaleimides elder generation and Resins, epoxy, aniline prepolymerization in solvent, mix the modification of finishing paracril with nitrile (HTBN) or end carboxyl nitrile (HTBN) then, form with resol, coupling agent, antioxidant and solvent modulation again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN95109152A CN1057318C (en) | 1995-08-03 | 1995-08-03 | High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN95109152A CN1057318C (en) | 1995-08-03 | 1995-08-03 | High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1128782A CN1128782A (en) | 1996-08-14 |
| CN1057318C true CN1057318C (en) | 2000-10-11 |
Family
ID=5077063
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95109152A Expired - Lifetime CN1057318C (en) | 1995-08-03 | 1995-08-03 | High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof |
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| CN (1) | CN1057318C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1075543C (en) * | 1997-10-23 | 2001-11-28 | 湖北省化学研究所 | Heat-resistant fireproof adhesive for flexible printing circuit and preparation thereof |
| CN1109085C (en) * | 2000-06-13 | 2003-05-21 | 湖北省化学研究所 | Multi-component copolymer acrylate adhesive, its preparation method and application for covering aluminium plate with polyimide |
| CN1109086C (en) * | 2000-07-19 | 2003-05-21 | 湖北省化学研究所 | Reaction-type flame-retarding adhesive for flexible PCB and its preparing process |
| JP2006301317A (en) * | 2005-04-21 | 2006-11-02 | Hitachi Ltd | Plasma display module |
| CN101089110B (en) * | 2006-06-14 | 2010-12-08 | 新扬科技股份有限公司 | Main component of adhesive for insulating film |
| CN101210077B (en) * | 2006-12-28 | 2010-07-14 | 财团法人工业技术研究院 | Halogen-free refractory composition |
| CN102191004B (en) * | 2010-12-31 | 2014-02-05 | 莱芜金鼎电子材料有限公司 | Thermosetting adhesive for flexible basic material and preparation method thereof |
| CN109747263B (en) * | 2019-01-28 | 2020-10-23 | 江西省航宇新材料股份有限公司 | Preparation process of novel copper-clad plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61100445A (en) * | 1984-10-23 | 1986-05-19 | 日立化成ポリマ−株式会社 | Manufacture of substrate for flexible printed circuit |
| JPS61124245A (en) * | 1984-11-21 | 1986-06-12 | Hitachi Ltd | Cooler of magnet generator |
-
1995
- 1995-08-03 CN CN95109152A patent/CN1057318C/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61100445A (en) * | 1984-10-23 | 1986-05-19 | 日立化成ポリマ−株式会社 | Manufacture of substrate for flexible printed circuit |
| JPS61124245A (en) * | 1984-11-21 | 1986-06-12 | Hitachi Ltd | Cooler of magnet generator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1128782A (en) | 1996-08-14 |
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