CN1057318C - High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof - Google Patents
High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof Download PDFInfo
- Publication number
- CN1057318C CN1057318C CN95109152A CN95109152A CN1057318C CN 1057318 C CN1057318 C CN 1057318C CN 95109152 A CN95109152 A CN 95109152A CN 95109152 A CN95109152 A CN 95109152A CN 1057318 C CN1057318 C CN 1057318C
- Authority
- CN
- China
- Prior art keywords
- epoxy
- antioxidant
- solvent
- resins
- coupling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Test event | Test condition | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | Comparative example 1 | Comparative example 2 | Testing method |
Anti-tin-welding (second) | In 260 ℃ of tin baths | ?>60 | ?>60 | ?>60 | ?>60 | ?- | ?>60 | ?- | ?>60 | ?>60 | IPC-TM-650-2.4B (method A) |
In 288 ℃ of tin baths | ?>10 | ?>10 | ?>10 | ?>10 | ?- | ?10 | ?- | The foaming layering | The foaming layering | IPC-TM-650-2.4B (method B) | |
Stripping strength (kg/cm) | Normality | ?2.4 | ?2.3 | ?2.4 | ?2.1 | Film is torn | ?2.1 | Film is torn | ?2.0 | ?1.8 | The 3.1st of GB/T 13557 |
Handle after 30 minutes for 125 ℃ | ?2.4 | ?2.3 | ?2.4 | ?2.1 | Film is torn | ?2.0 | Film is torn | ?2.0 | ?1.7 | The 3.2nd of GB/T13557 | |
200 ℃ of thermal shockings are handled | ?2.2 | ?2.3 | ?2.2 | ?2.0 | Film is torn | ?1.9 | Film is torn | ?1.7 | ?1.5 | The 3.3rd of GB/T13557 | |
After trichloromethane soaks 3 minutes | ?2.1 | ?2.0 | ?2.1 | ?1.9 | Film is torn | ?1.8 | Film is torn | ?1.6 | ?1.5 | The 3.5th of GB/T13557 | |
Volume resistance (M Ω m) | After constant wet heat treatment is recovered | ?2.3×10 6 | ?1.8×10 6 | ?2.9×10 6 | ?1.4×10 6 | ?1.2×10 6 | ?2.0×10 6 | ?1.2×10 6 | ?1.4×10 6 | ?1.3×10 6 | GB4722 the 5th chapter |
Surface resistivity (M Ω) | After constant wet heat treatment is recovered | ?4.2×10 5 | ?3.7×10 5 | ?5.4×10 5 | ?2.6×10 5 | ?1.4×10 5 | ?1.6×10 5 | ?1.3×10 5 | ?2.4×10 5 | ?1.5×10 5 | GB4722 the 6th chapter |
Specific inductivity (maximum value) | After constant wet heat treatment is recovered | ?2.3 | ?2.6 | ?2.4 | ?2.8 | ?3.5 | ?3.2 | ?3.5 | ?2.3 | ?2.7 | GB4722 the 9th chapter |
Dielectric loss angle tangent (maximum value) | After constant wet heat treatment is recovered | ?0.035 | ?0.026 | ?0.042 | ?0.029 | ?0.033 | ?0.021 | ?0.031 | ?0.041 | ?0.043 | GB4722 the 9th chapter |
Perpendicular layers is to electrical strength (Kv/m) minimum value | ?74 | ?72 | ?82 | ?75 | ?63 | ?68 | ?65 | ?59 | ?68 | The GB4722 Chapter 11 | |
Flexural fatigue (minimum value) (inferior) 35 μ m Copper Foils | ?111 | ?142 | ?138 | ?125 | ?117 | ?124 | ?115 | ?119 | ?122 | GB/T13557 the 4th chapter | |
Chemical proofing | No change | No change | No change | No change | ?- | No change | ?- | No change | No change | ?IPC-TM-650-2.3.2A |
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN95109152A CN1057318C (en) | 1995-08-03 | 1995-08-03 | High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN95109152A CN1057318C (en) | 1995-08-03 | 1995-08-03 | High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1128782A CN1128782A (en) | 1996-08-14 |
CN1057318C true CN1057318C (en) | 2000-10-11 |
Family
ID=5077063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95109152A Expired - Lifetime CN1057318C (en) | 1995-08-03 | 1995-08-03 | High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1057318C (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1075543C (en) * | 1997-10-23 | 2001-11-28 | 湖北省化学研究所 | Heat-resistant fireproof adhesive for flexible printing circuit and preparation thereof |
CN1109085C (en) * | 2000-06-13 | 2003-05-21 | 湖北省化学研究所 | Multi-component copolymer acrylate adhesive, its preparation method and application for covering aluminium plate with polyimide |
CN1109086C (en) * | 2000-07-19 | 2003-05-21 | 湖北省化学研究所 | Reaction-type flame-retarding adhesive for flexible PCB and its preparing process |
JP2006301317A (en) * | 2005-04-21 | 2006-11-02 | Hitachi Ltd | Plasma display module |
CN101089110B (en) * | 2006-06-14 | 2010-12-08 | 新扬科技股份有限公司 | Main component of adhesive for insulating film |
CN101210077B (en) * | 2006-12-28 | 2010-07-14 | 财团法人工业技术研究院 | Halogen-free refractory composition |
CN102191004B (en) * | 2010-12-31 | 2014-02-05 | 莱芜金鼎电子材料有限公司 | Thermosetting adhesive for flexible basic material and preparation method thereof |
CN109747263B (en) * | 2019-01-28 | 2020-10-23 | 江西省航宇新材料股份有限公司 | Preparation process of novel copper-clad plate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100445A (en) * | 1984-10-23 | 1986-05-19 | 日立化成ポリマ−株式会社 | Manufacture of substrate for flexible printed circuit |
JPS61124245A (en) * | 1984-11-21 | 1986-06-12 | Hitachi Ltd | Cooler of magnet generator |
-
1995
- 1995-08-03 CN CN95109152A patent/CN1057318C/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100445A (en) * | 1984-10-23 | 1986-05-19 | 日立化成ポリマ−株式会社 | Manufacture of substrate for flexible printed circuit |
JPS61124245A (en) * | 1984-11-21 | 1986-06-12 | Hitachi Ltd | Cooler of magnet generator |
Also Published As
Publication number | Publication date |
---|---|
CN1128782A (en) | 1996-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: HUASHUO SCIENCE CO., LTD. Free format text: FORMER NAME: HUBEI PROV. CHEMICAL RESEARCH INST. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Hubei Province, Wuhan City, Wuchang mountain Patentee after: Huashuo Technology Co., Ltd. Address before: Hubei Province, Wuhan City, Wuchang mountain Patentee before: Hubei Research Institute of Chemistry |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof Effective date of registration: 20100907 Granted publication date: 20001011 Pledgee: Bank of Hankou, Limited by Share Ltd, Optics Valley branch Pledgor: Huashuo Technology Co., Ltd. Registration number: 2010990000869 |
|
CX01 | Expiry of patent term |
Expiration termination date: 20150803 Granted publication date: 20001011 |
|
EXPY | Termination of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20151106 Granted publication date: 20001011 Pledgee: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgor: Huashuo Technology Co., Ltd. Registration number: 2010990000869 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20151106 Registration number: 2010990000869 Pledgee after: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgee before: Bank of Hankou, Limited by Share Ltd, Optics Valley branch |