CN101089110B - Main component of adhesive for insulating film - Google Patents
Main component of adhesive for insulating film Download PDFInfo
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- CN101089110B CN101089110B CN2006100927925A CN200610092792A CN101089110B CN 101089110 B CN101089110 B CN 101089110B CN 2006100927925 A CN2006100927925 A CN 2006100927925A CN 200610092792 A CN200610092792 A CN 200610092792A CN 101089110 B CN101089110 B CN 101089110B
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- insulating film
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Abstract
The present invention relates to the main components of adhesive for insulating film. The main components include epoxy resin with at least two functional epoxy groups in its molecule in 100 weight portions, softening agent in 20-100 weight portions, phenolic resin in 10-50 weight portions, benzoxazine in 1-100 weight portions, stuffing in 10-125 weight portions, adhering agent in 0.2-25 weight portions and solvent in 10-250 weight portions. The present invention has high glass transition temperature, high heat resistance, low heat expansion coefficient and high stripping strength.
Description
Technical field
The present invention relates to a kind of solid, the host of the solid that particularly a kind of insulating film is used.
Background technology
The main composition of back-adhesive film (coverlay) is polymer protection rete and solid rete, need be in solid rete applying one deck separate-type paper in commercialization fashion.The main application of back-adhesive film is the protective membrane that is used for flexible printed wiring board, the insulation protection of electronic component or the gum insulating film of lead frame.Because aforementioned applications all relates to the high temperature process of printed circuit board (PCB), thus back-adhesive film typically use have high-temperature stability polyimide film as the polymer protection rete.In addition, Resins, epoxy has remarkable electrical specification, physical strength and anti-ization characteristic, and for Copper Foil and polyimide film good then effect is arranged all, and therefore often being used in the polyimide back-adhesive film is used as the solid material.So the back-adhesive film of general printed circuit board (PCB) mainly is used as protective membrane with Kapton and is solid with Resins, epoxy.
Because the heat that printed circuit board (PCB) is produced when practice and the temperature of Working environment, usefulness and the stability that humidity all can influence solid itself, solid must can be stood the operation of high temperature, chemical solvents environment simultaneously, also need possess mechanical properties soft, higher-strength, otherwise the thermotolerance of solid and stability can influence the printed circuit board (PCB) quality.Therefore, the R﹠D direction of solid is just towards higher glass tansition temperature and stability development.
Summary of the invention
In order to address the above problem, one of the object of the invention is the host that proposes a kind of component of adhesive for insulating film, has high heat resistance, high glass tansition temperature and not halogen-containing characteristic.
One of the object of the invention is the host that proposes a kind of component of adhesive for insulating film; can be applicable to the protective membrane of printed circuit board (PCB), the insulating protective film of electronic component or the gum insulating film of lead frame; its back-adhesive film stiffening temperature is low and can shorten setting time, has advantage low-cost and high competitive power.
For reaching above-mentioned purpose, one embodiment of the invention provides a kind of host of component of adhesive for insulating film, comprising: 100 parts by weight of epoxy resin, contain at least two epoxide functional groups in each molecule of Resins, epoxy; The softening agent of 20～100 weight parts; The resol of 10～50 weight parts; The benzoxazine of 1～100 weight part; The filling agent of 10～125 weight parts; 0.2 the adhesive agent of～25 weight parts; And the solvent of 10～250 weight parts.
The host of component of adhesive for insulating film of the present invention has high heat resistance, high glass tansition temperature and not halogen-containing characteristic; and can be applicable to the protective membrane of printed circuit board (PCB), the insulating protective film of electronic component or the gum insulating film of lead frame; its back-adhesive film stiffening temperature is low and can shorten setting time, has advantage low-cost and high competitive power.
Embodiment
The host of the component of adhesive for insulating film that is disclosed in the present invention mainly comprises: Resins, epoxy, softening agent, stiffening agent, adhesive agent, filling agent and solvent.Its main component ratio is as follows: 100 parts by weight of epoxy resin, contain at least two epoxide functional groups in each molecule of Resins, epoxy; The softening agent of 20～100 weight parts; The benzoxazine (Benzoxazine resin) of resol that consists of 10～50 weight parts of stiffening agent (Phenolic resin) and 1～100 weight part; The filling agent of 10～125 weight parts; 0.2 the adhesive agent of～25 weight parts; And the solvent of 10～250 weight parts.
Wherein, the chemical formula of resol is as follows:
Wherein, the chemical formula of benzoxazine is as follows:
Though general Resins, epoxy has good electrical specification, Resins, epoxy all has inflammableness with general plastic material, in order to give the characteristic of the difficult combustion of Resins, epoxy, can be further qualified Resins, epoxy.The phosphorus type epoxy resin that includes 5～80 weight parts in the 100 weight part Resins, epoxy, and the phosphorus content of phosphorus type epoxy resin is at 1.5～3.5 weight percents.In addition, softening agent can be selected carboxylated nitrile rubber (CTBN) or liquid nitrile rubber (Hycar rubber), and the melting point of resol is 60～150 ℃.Filling agent can improve solid dimensional stability, thermotolerance and mechanical punching behind high-temperature maturing.Filling agent can be selected from aluminium hydroxide (Al (OH)
3), talcum powder (Talc), silicon-dioxide, magnesium hydroxide, lime carbonate, aluminum oxide and zinc molybdate one of them constitute.Adhesive agent can be selected methylethyl cyanamide resin for use.Solvent then can be selected from acetone, butanone, Virahol, isopropylcarbinol, methyl iso-butyl ketone (MIBK) (MIBK), toluene, methyl alcohol, ethanol and propylene glycol monomethyl ether one of them.
The above-mentioned explanation that continues can be added the catalyst of 0.1～10 weight part in the host of component of adhesive for insulating film, catalyst can be selected from tosic acid amine, tertiary amine, level Four ammonia salt and imidazoles one of them.The host of component of adhesive for insulating film is also added the additive of 0.1～10 weight part, additive can be selected from Resorcinol, Whitfield's ointment (salicylic acid), dihydroxyphenyl propane, phosphor-included additive, nitrogen phosphorus coexistence additive or have active hydrogen structural compounds one of them.
Describe the present invention by the following examples in detail, yet these embodiment are not that claim of the present invention should be as the criterion with the scope of claims in order to the qualification scope of the invention.
Embodiment 1.
The 40g carboxylated nitrile rubber is dissolved in the methyl iso-butyl ketone (MIBK) of 160g, is prepared into CTBN～MIBK solution of 20%.In the 1000ml reaction flask, add 100g phosphorous epoxy resin, 26g resol, 6.5g benzoxazine, 90g aluminium hydroxide, 10g talcum powder, 4g adhesive agent, 0.5g Whitfield's ointment and 0.8g tosic acid amine in regular turn.Be prepared into the host of finishing dispersive Resins, epoxy solid in CTBN～MIBK solution adding previous reaction bottle with 200g then.
Embodiment 2.
The 40g carboxylated nitrile rubber is dissolved in the methyl iso-butyl ketone (MIBK) of 160g, is prepared into CTBN～MIBK solution of 20%.In the 1000ml reaction flask, add 100g phosphorous epoxy resin, 26g resol, 3g benzoxazine, 90g aluminium hydroxide, 10g talcum powder, 4g adhesive agent, 0.5g Whitfield's ointment and 0.8g tosic acid amine in regular turn.Be prepared into the host of finishing dispersive Resins, epoxy solid in CTBN～MIBK solution adding previous reaction bottle with 200g then.
Control group 1.
The 40g carboxylated nitrile rubber is dissolved in the methyl iso-butyl ketone (MIBK) of 160g, is prepared into CTBN～MIBK solution of 20%.In the 1000ml reaction flask, add 100g phosphorous epoxy resin, 26g resol, 90g aluminium hydroxide, 10g talcum powder, 4g adhesive agent, 0.5g Whitfield's ointment and 0.8g tosic acid amine in regular turn.Be prepared into the host of finishing dispersive Resins, epoxy solid in CTBN～MIBK solution adding previous reaction bottle with 200g then.
Control group 2.
The 40g carboxylated nitrile rubber is dissolved in the methyl iso-butyl ketone (MIBK) of 160g, is prepared into CTBN～MIBK solution of 20%.In the 1000ml reaction flask, add 100g phosphorous epoxy resin, 26g resol, 90g aluminium hydroxide, 10g talcum powder, 0.5g Whitfield's ointment and 0.8g tosic acid amine in regular turn.Be prepared into the host of finishing dispersive Resins, epoxy solid in CTBN～MIBK solution adding previous reaction bottle with 200g then.
Embodiment 3.
The 40g carboxylated nitrile rubber is dissolved in the methyl iso-butyl ketone (MIBK) of 160g, is prepared into CTBN～MIBK solution of 20%.In the 1000ml reaction flask, add 100g phosphorous epoxy resin, 26g resol, 65g benzoxazine, 90g aluminium hydroxide, 10g talcum powder, 4g adhesive agent, 0.5g Whitfield's ointment and 0.8g tosic acid amine in regular turn.Be prepared into the host of finishing dispersive Resins, epoxy solid in CTBN～MIBK solution adding previous reaction bottle with 200g then.
The Resins, epoxy solid that the foregoing description and control group is made is the test that stripping strength, thermal expansivity (CTE) and glass transition temperature (Tg) are tested in the test piece of 25 μ m with thickness, and the result sees table one for details.
Table one
| Embodiment 1 | Embodiment 2 | Control group 1 | Control group 2 | Embodiment 3 | |
| Tg(℃) | 45 | 40 | 15 | 5 | 120 |
| CTE (ppm/℃) | 40 | 45 | 52 | 100 | 38 |
| Stripping strength (kg/cm 2) | 1.2 | 1.25 | 1.4 | 0.4 | 0.84 |
| Resins, epoxy | 100g | 100g | 100g | 100g | 100g |
| CTBN | 40g | 40g | 40g | 40g | 40g |
| Resol | 26g | 26g | 26g | 26g | 26g |
| Benzoxazine | 6.5g | 3g | 0 | 0 | 65g |
| Weighting agent | 100g | 100g | 100g | 100g | 100g |
| Adhesive agent | 4g | 4g | 4g | 0 | 4g |
| Solvent | 160g | 160g | 160g | 160g | 160g |
Compare group 1 and embodiment 2, stiffening agent increases the glass transition temperature and reduction thermal expansivity that benzoxazine can effectively increase solid in the host of solid.Comparing embodiment 1, embodiment 2 and embodiment 3, the content that increases the stiffening agent benzoxazine can continue to improve the glass transition temperature of solid.In addition, compare group 1 and control group 2, the use of adhesive agent can increase the stripping strength of solid.The raising of glass transition temperature all has greatly the thermotolerance of solid and stability in storage benefits, and avoids the heat that produced when using because of reality and the usefulness of working cycle temperature effect solid.
According to above-mentioned, the solid that generally is used for printed circuit board (PCB), its glass transition temperature is usually less than 15 ℃, thermal expansivity is about 100ppm/ ℃, and stripping strength is about 0.7～0.8kg/cm, compares with different embodiments of the invention, the character of the host of disclosed component of adhesive for insulating film is effectively promoted, the glass tansition temperature of solid rises to more than 40 ℃, and thermal expansivity drops to below 40ppm/ ℃, and stripping strength reaches more than the 0.8kg/cm.Use solid of the present invention to coat between a pi and a Copper Foil and give hot pressing, promptly can be made into and be used for the protection insulating film that flexible printed wiring board is used.
Comprehensively above-mentioned; the host of component of adhesive for insulating film of the present invention has high heat resistance, high glass tansition temperature and not halogen-containing characteristic; and can be applicable to the protective membrane of printed circuit board (PCB), the insulating protective film of electronic component or the gum insulating film of lead frame; its back-adhesive film stiffening temperature is low and can shorten setting time, has advantage low-cost and high competitive power.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes those skilled in the art can understand content of the present invention and is implementing according to this, when can not with qualification claim of the present invention, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.
Claims (11)
1. the host of a component of adhesive for insulating film is characterized in that, comprises:
100 parts by weight of epoxy resin contain at least two epoxide functional groups in each molecule of this Resins, epoxy;
The softening agent of 20～100 weight parts, this softening agent are carboxylated nitrile rubber;
The resol of 10～50 weight parts;
The benzoxazine of 1～100 weight part;
The filling agent of 10～125 weight parts;
0.2 the adhesive agent of～25 weight parts; And
The solvent of 10～250 weight parts.
2. the host of component of adhesive for insulating film as claimed in claim 1 wherein, includes the phosphorus type epoxy resin of 5～80 weight parts in this Resins, epoxy of 100 weight parts.
3. the host of component of adhesive for insulating film as claimed in claim 2, wherein, the phosphorus content of this phosphorus type epoxy resin is at 1.5～3.5 weight percents.
4. the host of component of adhesive for insulating film as claimed in claim 1, wherein, the melting point of this resol is 60～150 ℃.
5. the host of component of adhesive for insulating film as claimed in claim 1, wherein, this filling agent be selected from aluminium hydroxide, talcum powder, silicon-dioxide, magnesium hydroxide, lime carbonate, aluminum oxide and zinc molybdate one of them.
6. the host of component of adhesive for insulating film as claimed in claim 1, wherein, these adhesive agent are methylethyl cyanamide resin.
7. the host of component of adhesive for insulating film as claimed in claim 1, wherein, this solvent be selected from acetone, butanone, Virahol, isopropylcarbinol, methyl iso-butyl ketone (MIBK), toluene, methyl alcohol, ethanol and propylene glycol monomethyl ether one of them.
8. the host of component of adhesive for insulating film as claimed in claim 1 wherein, more comprises the catalyst of 0.1～10 weight part.
9. the host of component of adhesive for insulating film as claimed in claim 8, wherein, this catalyst be selected from tosic acid amine, tertiary amine, quarternary ammonium salt and imidazoles one of them.
10. the host of component of adhesive for insulating film as claimed in claim 1 wherein, more comprises the additive of 0.1～10 weight part, this additive be selected from Whitfield's ointment with have active hydrogen structural compounds one of them.
11. the host of component of adhesive for insulating film as claimed in claim 1 wherein, more comprises the additive of 0.1～10 weight part, this additive be selected from phosphor-included additive and nitrogen phosphorus coexistence additive one of them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100927925A CN101089110B (en) | 2006-06-14 | 2006-06-14 | Main component of adhesive for insulating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100927925A CN101089110B (en) | 2006-06-14 | 2006-06-14 | Main component of adhesive for insulating film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101089110A CN101089110A (en) | 2007-12-19 |
| CN101089110B true CN101089110B (en) | 2010-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2006100927925A Expired - Fee Related CN101089110B (en) | 2006-06-14 | 2006-06-14 | Main component of adhesive for insulating film |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106479113A (en) * | 2016-10-08 | 2017-03-08 | 青岛志卓通力新材料有限公司 | A kind of preparation method of hybrid resin |
| CN107603552B (en) * | 2017-09-12 | 2020-07-28 | 广东生益科技股份有限公司 | Halogen-free resin composition, cover film and method for preparing cover film |
| CN114479732B (en) * | 2021-12-28 | 2024-06-14 | 苏州赛伍应用技术股份有限公司 | Epoxy adhesive, polyimide covering film and printing screen |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5356698A (en) * | 1990-03-27 | 1994-10-18 | Hitachi, Ltd. | Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same |
| CN1128782A (en) * | 1995-08-03 | 1996-08-14 | 湖北省化学研究所 | High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof |
| CN1667073A (en) * | 2005-03-23 | 2005-09-14 | 中山大学 | Halogen-free flame resistant adhesive for preparing laminated sheet |
| CN1769357A (en) * | 2004-11-01 | 2006-05-10 | 中国科学院兰州化学物理研究所 | Shock-absorption support glide plane coating for construction and its preparation method |
-
2006
- 2006-06-14 CN CN2006100927925A patent/CN101089110B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5356698A (en) * | 1990-03-27 | 1994-10-18 | Hitachi, Ltd. | Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same |
| CN1128782A (en) * | 1995-08-03 | 1996-08-14 | 湖北省化学研究所 | High temp. resistant adhesive agent for flexible printed circuit and prepn. method thereof |
| CN1769357A (en) * | 2004-11-01 | 2006-05-10 | 中国科学院兰州化学物理研究所 | Shock-absorption support glide plane coating for construction and its preparation method |
| CN1667073A (en) * | 2005-03-23 | 2005-09-14 | 中山大学 | Halogen-free flame resistant adhesive for preparing laminated sheet |
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| CN101089110A (en) | 2007-12-19 |
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Assignee: Songyang Electronic Material (Kunshan) Co., Ltd. Assignor: Thinflex Corp. Contract record no.: 2011990000377 Denomination of invention: Main component of adhesive for insulating film Granted publication date: 20101208 License type: Exclusive License Open date: 20071219 Record date: 20110518 |
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Granted publication date: 20101208 Termination date: 20160614 |
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