KR20110085969A - Thermosetting resin composition - Google Patents

Abstract

[assignment]
When the electronic component is fixed to the adhesive layer by the tack of the adhesive layer and the adhesive layer is thermoset, the thermosetting resin composition which can manufacture the component-embedded board | substrate with which the component fixed position and high insulation reliability of a component are high can be provided. will be.
[Workaround]
Specific thermosetting resin compositions containing liquid epoxy resins, phenolic curing agents, inorganic fillers and acrylic resins are used.

Description

Thermosetting resin composition

The present invention relates to a thermosetting resin composition useful for the production of a component embedded substrate, an adhesive film having an adhesive layer using the thermosetting resin composition, and a method for producing a component embedded substrate using the adhesive film.

) 부품이 작아져, 매립시에 높은 위치 정밀도가 필요하게 된다. 또한, 기판 전체의 크기를 작게 할 필요가 있기 때문에, 매립 부품과 부품 주변의 회로의 사이에는, 높은 절연성을 갖는 재료가 필요하게 된다. In printed wiring boards, high density is required due to light and small size reduction. Also embedded in component embedded boards

) The parts become smaller, and high positional accuracy is required at the time of embedding. In addition, since the size of the entire substrate needs to be reduced, a material having high insulation is required between the buried component and the circuit around the component.

As a manufacturing method of a board | substrate with a component, the method of removing a sheet after temporarily fixing a component and sealing a component with resin by the sheet agent and the sheet agent with an adhesive (patent document 1) ) Is disclosed, but no specific composition is disclosed. Moreover, since it is necessary to remove an adhesive after sealing a component, the number of processes increases.

Moreover, the method (patent document 2) which temporarily fixes a component with an adhesive material to the electronic component mounting surface of a core board | substrate, and seals a component with resin is disclosed. As an adhesive material, since it is electrically insulating and when a high heat is added, it is preferable that the material which becomes evaporation or a gas is preferable, As a specific example of the polymer used, an acrylic resin, a polyester resin, a maleinized oil resin, a polybutene It is said that resin, an epoxy resin, etc. can be used individually or as a mixture by arbitrary combinations. Moreover, in order to provide adhesiveness to these polymer resins, it is said that tackifying resins, such as rosin type, a terpene type, a petroleum resin type, can be added as needed. However, the specific composition of the adhesive was not disclosed.

Moreover, the method (patent document 3) which temporarily fixes a component on the insulating base material provided in the whole surface as well as the adhesion point of an electronic component, and seals a component with resin is disclosed. Examples of the adhesive layer include epoxy resins, polyurethanes, reactive acrylics, ultraviolet curables and silicones. For example, epoxy resins, silicones, and the like are used in combination with curing agents such as phenol resins, organic acid anhydrides, amines and curing accelerators. . And the method of hardening by heating at the hardening temperature, irradiation of an ultraviolet-ray, etc. for fixing a component is disclosed. However, the specific composition of the adhesive layer has not been disclosed. Moreover, when fixing an electronic component by thermosetting of an adhesive layer, there exists a problem that the fixing position precision of a component falls by melting of an adhesive layer. In addition, curing with ultraviolet rays has a problem that the process is complicated.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2002-204045 [Patent Document 2] Japanese Unexamined Patent Publication No. 2004-296562 [Patent Document 3] Japanese Unexamined Patent Publication No. 2007-42829

An object of the present invention is to manufacture a component-embedded substrate having high fixing position accuracy and insulation reliability of a component when the electronic component is fixed to the adhesive layer by the adhesiveness of the adhesive layer and the adhesive layer is thermoset. It is to provide a thermosetting resin composition.

MEANS TO SOLVE THE PROBLEM As a result of earnestly examining in order to solve the said subject, the present inventors completed this invention by using the specific thermosetting resin composition containing a liquid epoxy resin, a phenolic hardening | curing agent, an inorganic filler, and an acrylic resin.

That is, this invention includes the following content.

[1] A thermosetting resin composition used for fixing parts and forming insulating layers of component embedded substrates, wherein the non-volatile content of the thermosetting resin composition is 100 wt%, 25 to 40 wt% of the liquid epoxy resin at 25 ° C; A thermosetting resin composition containing 0.1 to 5% by weight of an acrylic resin, 5 to 30% by weight of a phenolic curing agent and 20 to 70% by weight of an inorganic filler.

[2] The thermosetting resin composition according to the above [1], wherein the acrylic resin is an acrylic acid ester copolymer.

[3] The thermosetting resin composition according to the above [1] or [2], wherein the acrylic resin is an acrylate ester copolymer containing methyl acrylate, butyl acrylate, and acrylonitrile.

[4] The thermosetting resin composition according to the above [1] to [3], in which the acrylic resin contains at least one group selected from an epoxy group, a hydroxyl group, and a carboxyl group.

[5] The thermosetting resin composition according to the above [1] to [4], wherein the acrylic resin contains a hydroxyl group and a carboxyl group.

[6] An adhesive film used for component fixing and insulating layer formation of a component-embedded substrate, having an adhesive layer formed of the thermosetting resin composition according to the above [1] to [5] on a support.

[7] The adhesive film according to the above [6], wherein the adhesive layer has a thickness of 5 to 100 µm.

[8] The adhesive film according to the above [6] or [7], wherein the support is a plastic film.

[9] The adhesive film according to any one of the above [6] to [8], in which the surface on the adhesive layer side of the support is subjected to a release treatment.

[10] A method for manufacturing a component-embedded substrate comprising the step of fixing the electronic component on the adhesive layer of the adhesive film according to any one of [1] to [9], and the step of thermally curing the adhesive layer to form an insulating layer.

According to the present invention, by using a specific thermosetting resin composition containing a liquid epoxy resin, a phenolic curing agent, an inorganic filler, and an acrylic resin, the electronic component is fixed to the adhesive layer by tack of the adhesive layer, and the adhesive layer is heated. When hardened | cured, it became possible to provide the thermosetting resin composition which can manufacture the board | substrate with a high component fixed position accuracy and insulation reliability.

1 is a conceptual diagram of an evaluation method in a part fixation evaluation test.
It is a conceptual diagram of the evaluation method in a component position deviation evaluation test.

[Epoxy Resin Liquid at 25 ° C]

In this invention, "a liquid epoxy resin at 25 degreeC" mainly improves the heat resistance and insulation of hardened | cured material, and contributes to the adhesiveness of a thermosetting resin composition. Specific examples of the epoxy resin liquid at 25 ° C include bisphenol A epoxy resin, bisphenol F epoxy resin, novolac phenol epoxy resin, naphthalene epoxy resin, tertiary butylcatechol epoxy resin, and epoxy having butadiene structure. Resins, aliphatic glycidyl ethers, glycidyl ethers of alcohols, and halides and hydrogenated products of these epoxy resins. These can be used by 1 type or in combination of 2 or more types.

Among them, epoxy resins having a bisphenol A epoxy resin, a naphthol type epoxy resin, a naphthalene type epoxy resin, an aliphatic glycidyl ether, and a butadiene structure are preferable from the viewpoint of heat resistance and insulation reliability. As a specific example of such an epoxy resin, liquid bisphenol A-type epoxy resin (Japan Epi Resin Co., Ltd. product "Epicoat 828EL"), liquid bisphenol F type epoxy resin (Japan Epi Resin Co., Ltd. product "Epicoat 807"), Naphthalene type bifunctional epoxy resin (Dainippon Ink Chemical Co., Ltd. product "HP4032", "HP4032D"), aliphatic glycidyl ether (Totogase Co., Ltd. product "ZX-1658"), butadiene structure Epoxy resin (Deicel Chemical Co., Ltd. product "PB-3600") to have, etc. are mentioned. "Epoxy resin liquid at 25 degreeC" may be used in combination of 2 or more type.

When the non-volatile component of the thermosetting resin composition is 100% by weight, the upper limit of the content of the liquid epoxy resin at 25 ° C prevents the adhesiveness from increasing and the peelability of the cover film deteriorates, and at the time of film curing, From the viewpoint of preventing the positional deviation from occurring easily, 40% by weight is preferable, and 35% by weight is more preferable. On the other hand, when the non-volatile component of the thermosetting resin composition is 100% by weight, the lower limit of the content of the liquid epoxy resin at 25 ° C is preferably 25% by weight from the viewpoint of preventing the parts from being hardly fixed to the adhesive film. 30 weight% is more preferable.

[Acrylic resin]

In this invention, "acrylic resin" mainly contributes to the adhesiveness of a thermosetting resin composition. Examples of the acrylic resin include polyacrylic acid, polymethacrylic acid, polyacrylic acid ester, polymethacrylic acid ester, polyacrylic acid ester copolymer, polymethacrylic acid ester copolymer and the like. The acrylic resin is particularly preferably an acrylic ester copolymer having excellent adhesiveness, and further preferably an acrylic acid methyl ester copolymer and an acrylic acid ethyl ester copolymer. Examples of the copolymer compound include methyl acrylate, butyl acrylate, vinyl acetate, acrylonitrile and acrylamide. Among these, methyl acrylate, butyl acrylate and acrylonitrile are preferable. In addition, the acrylic acid methyl ester copolymer or acrylic acid ethyl ester copolymer preferably further contains at least one group selected from an epoxy group, a hydroxyl group, and a carboxyl group, and particularly preferably contains a hydroxyl group and / or a carboxyl group. . These can be used by 1 type or in combination of 2 or more types.

In the case where the nonvolatile component of the thermosetting resin composition is 100% by weight, the upper limit of the content of the acrylic resin is preferably 5% by weight from the viewpoint of preventing the cover film from being poor in peelability and poor handleability. , 3% by weight is more preferable. On the other hand, in the case where the nonvolatile component of the thermosetting resin composition is 100% by weight, the lower limit of the content of the acrylic resin is preferably 0.1% by weight, and 0.5% by weight from the viewpoint of preventing the fixing of the parts by difficulty in adhesion. % Is more preferred.

1,200,000 is preferable and 900,000 are more preferable from a viewpoint that the upper limit of the weight average molecular weight of an acrylic resin prevents the solubility to a solvent and an epoxy resin falling, and making it difficult to produce a uniform thermosetting resin composition. On the other hand, 400,000 are preferable and 500,000 are more preferable from a viewpoint that the lower limit of the weight average molecular weight of an acrylic resin prevents adhesiveness of a composition from falling and it becomes difficult to fix components. In addition, the weight average molecular weight in this invention is measured by the gel permeation chromatography (GPC) method (polystyrene conversion). As for the weight average molecular weight by GPC method, the Shodex K-800P / K-804L made by Showa Denko Co., Ltd. as LC as a measuring instrument by LC-9A / RID-6A made by Shimadzu Corporation / K-804L can be measured at a column temperature of 40 ° C. using chloroform or the like as a mobile phase, and can be calculated using a calibration curve of standard polystyrene.

As a commercially available acrylic resin, specifically, Aarontech S-1511L, S-1511X, S-1515, S-1517 (Toagasei Co., Ltd. product) Toacron AR-601, AR-602, AR-603 Nippon AR-31, AR-51, AR-54 (manufactured by Nihon Xeon Co., Ltd.), Knoxite PA-301, PA-501, PA-502 (manufactured by NOK Corporation), Teisan resin WS-022, WS-023, SG-51, SG-70L, SG-80 (manufactured by Nagase Camtex Co., Ltd.), KH-LT, KH-CT (manufactured by Hitachi Kasei Kogyo Co., Ltd.) Can be mentioned. "Acrylic resin" may be used in combination of 2 or more type.

[Phenol Curing Agent]

In this invention, a "phenolic hardening | curing agent" functions mainly as a hardening | curing agent of an epoxy resin. It will not specifically limit, if it has a phenolic hydroxyl group and functions as a hardening | curing agent of an epoxy resin as a phenolic hardening | curing agent. Generally, the phenol compound which has a 2 or more phenolic hydroxyl group in a molecule | numerator is used, Specifically, a phenol novolak resin, a cresol novolak resin, etc. are mentioned. As a commercially available phenolic hardener, for example, MEH-7700, MEH-7810, MEH-7851 (made by Meiwa Kasei Co., Ltd.), NHN, CBN, GPH (manufactured by Nihon Kayaku Co., Ltd.), SN170, SN180, SN190, SN475, SN485, SN495, SN375, SN395 (manufactured by Totogasei Co., Ltd.), TD2090, TD2093, KA1160, KA1163, LA7052, LA7054, LA3018, LA1356 (manufactured by Dainippon Ink Chemical Co., Ltd.) Etc. can be mentioned. You may use a "phenolic hardening | curing agent" in combination of 2 or more type.

When the non-volatile component of the thermosetting resin composition is 100% by weight, the upper limit of the content of the phenolic curing agent is to prevent the reduction of adhesive force and the curing agent component to be excessive, and to reduce the deterioration of important properties as an insulating material such as heat resistance and insulation. From the viewpoint of preventing the occurrence, 30% by weight is preferable, 25% by weight is more preferable, 20% by weight is even more preferable, and 15% by weight is particularly preferable. On the other hand, in the case where the nonvolatile component of the thermosetting resin composition is 100% by weight, the lower limit of the content of the phenolic curing agent is excessively low and the curing of the resin is extremely slow. From the standpoint of preventing the deterioration of important properties as the insulating material, 5% by weight is preferable, and 10% by weight is more preferable.

[Weapon filler]

In the present invention, the "inorganic filler" is mainly used for the purpose of reducing the thermal expansion coefficient of the insulating layer formed. Specific examples of the inorganic fillers include silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, and titanic acid. Calcium, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate, etc. are mentioned, Among these, silica, such as amorphous silica, fused silica, crystalline silica, synthetic silica, is especially suitable. As silica, a spherical thing is preferable. These can be used by 1 type or in combination of 2 or more types.

3 micrometers or less are preferable from a viewpoint of insulation reliability, and, as for the upper limit of the average particle diameter of an inorganic filler, 1.5 micrometers or less are more preferable. On the other hand, the lower limit of the average particle diameter of the inorganic filler is preferably 0.05 µm or more from the viewpoint of preventing the viscosity of the varnish from rising and the handleability from deteriorating when the thermosetting resin composition is used as the resin varnish. As for the largest particle diameter of an inorganic filler, 5 micrometers or less are preferable from an insulating viewpoint.

The average particle diameter of an inorganic filler can be measured by the laser diffraction scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be prepared on the basis of volume by a laser diffraction particle size distribution measuring device, and the median diameter can be measured as the average particle diameter. The measurement sample can use preferably what disperse | distributed the inorganic filler in water according to the ultrasonic wave. As a laser diffraction particle size distribution measuring apparatus, LA-500 manufactured by Horiba Seisakusho, etc. can be used.

When the non-volatile component of the thermosetting resin composition is 100% by weight, the upper limit of the content of the inorganic filler prevents the fluidity of the adhesive film from deteriorating, making it difficult to laminate in a vacuum laminator or the like, and greatly increases the flexibility of the cured adhesive film. In terms of preventing damage and deterioration of the original cured product properties, 70% by weight is preferable, and 60% by weight is more preferable. On the other hand, in the case where the nonvolatile component of the thermosetting resin composition is 100% by weight, the lower limit of the content of the inorganic filler is from the viewpoint that the fluidity of the resin varnish becomes too high, the handling properties deteriorate and the filming becomes difficult. 30 weight% is preferable and 20 weight% is more preferable.

Moreover, in order that an inorganic filler may improve moisture resistance, it is preferable to surface-treat with surface treating agents, such as an epoxy silane coupling agent, an aminosilane coupling agent, and a titanate coupling agent. You may use these 1 type or in combination of 2 or more types.

[Epoxy Resin Solid at 25 ° C]

You may mix | blend the epoxy resin which is solid at 25 degreeC with the thermosetting resin composition of this invention for the purpose of Tg of hardened | cured material accompanying the improvement of the crosslinking density of hardened | cured material of resin, improvement of breaking strength, etc. As an epoxy resin solid at 25 degreeC, a tetrafunctional naphthalene type epoxy resin, a bifunctional dicyclopentadiene type epoxy resin, a trisphenol epoxy resin, etc. are mentioned, for example. As what is marketed, Dai Nippon Ink Chemical Co., Ltd. EXA4700, EXA7200, Nippon Kayaku Co., Ltd. EPPN-502H etc. are mentioned. "The epoxy resin solid at 25 degreeC" may be used in combination of 2 or more type. Content in the case of mix | blending an epoxy resin which is solid at 25 degreeC, when the non volatile component of a thermosetting resin composition is 100 weight%, Preferably it is 30 weight% or less, Preferably it is 20 weight% or less. When content is too large, an adhesive film will fall at normal temperature and handling property will deteriorate.

[Thermoplastic resin]

The thermoplastic resin can be mix | blended with the thermosetting resin composition of this invention for the purpose of providing suitable flexibility to the thermosetting resin composition after hardening, etc. Examples of such thermoplastic resins include phenoxy resins, polyvinyl acetal resins, polyimide resins, polyamideimide resins, polyethersulfone resins, polysulfone resins, and the like. You may use "thermoplastic resin" in combination of 2 or more type. It is preferable to mix | blend content of the thermoplastic resin in a thermosetting resin composition in the ratio of 0.5-60 weight%, and it is more preferable to mix | blend in the ratio of 3-50 weight%.

As a commercial item of the phenoxy resin, Totogasei Co., Ltd. FX280, FX293, Japan Epoxy Resin Co., Ltd. product YX8100, YL6954, YL6974, etc. are mentioned, for example.

As polyvinyl acetal resin, polyvinyl butyral resin is preferable, As a commercial item of such a polyvinyl acetal resin, Denki Chemical Co., Ltd. make, telephone butyral 4000-2, 5000-A , 6000-C, 6000-EP, and Sekisuga Chemical Co., Ltd. Esrek BH series, BX series, KS series, BL series, BM series, etc. are mentioned.

As a commercial item of a polyimide, the polyimide "Rika coat SN20" and "Rika coat PN20" by Shin-Nippon Rica Co., Ltd. are mentioned, for example. Furthermore, linear polyimides (as described in JP 2006-37083) and polysiloxane skeleton-containing polyimides obtained by reacting a bifunctional hydroxyl group-terminated polybutadiene, a diisocyanate compound and a tetrabasic anhydride The modified polyimide, such as mead (thing of Unexamined-Japanese-Patent No. 2002-12667, Unexamined-Japanese-Patent No. 2000-319386, etc.) is mentioned.

As a commercial item of a polyamide imide, the polyamide imide "Biromax HR11NN" and "Biromax HR16NN" by Toyo Joseki Co., Ltd. are mentioned, for example. Moreover, modified polyamideimide, such as polysiloxane frame | skeleton containing polyamideimide "KS9100" and "KS9300" by Hitachi Chemical Co., Ltd., is mentioned.

As a commercial item of polyether sulfone, the polyether sulfone "PES5003P" by Sumitomo Chemical Co., Ltd. is mentioned, for example.

As a commercial item of polysulfone, the polysulfone "P1700", "P3500", etc. made by Solvent Advanced Polymers Co., Ltd. are mentioned, for example.

[Hardening accelerator]

In addition to a curing agent, the thermosetting resin composition of the present invention may further contain a curing accelerator for the purpose of shortening the curing time. As such a hardening accelerator, an imidazole compound, an organic phosphine compound, etc. are mentioned, for example, 2-methylimidazole, a triphenyl phosphine, etc. are mentioned as a specific example. You may use these 1 type or in combination of 2 or more types. When using a hardening accelerator, it is preferable to use a hardening accelerator in 0.1-3.0 mass% with respect to an epoxy resin.

[additive]

The thermosetting resin composition of this invention can be made to contain another component as needed. As other components, For example, flame retardants, such as an organic phosphorus flame retardant, an organic nitrogen containing phosphorus compound, a nitrogen compound, a silicone flame retardant, a metal hydroxide; Organic fillers such as silicone powder, nylon powder and fluorine powder; Thickeners such as olben and fenton; Polymeric antifoaming agents or leveling agents such as silicone-based and fluorine-based; Adhesion imparting agents such as imidazole series, thiazole series, triazole series, and silane coupling agents; And coloring agents such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, and carbon black. You may use these 1 type or in combination of 2 or more types.

[Organic Solvent]

As an organic solvent in preparing a varnish, for example, ketones such as acetone, methyl ethyl ketone, cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate Carbitols such as esters, cellosolves and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone and the like. You may use these 1 type or in combination of 2 or more types.

[Adhesive Film]

The adhesive film of this invention is comprised from a support body layer and the adhesive layer which has adhesiveness formed by the thermosetting resin composition on this support layer. The adhesive layer may be formed on both sides of the support layer.

As the support layer, a plastic film is suitably used. In addition to the plastic film, metal foils such as release paper, copper foil, and aluminum foil can also be used as the support layer. Examples of the plastic film include polyethylene terephthalate (hereinafter sometimes abbreviated as "PET"), polyesters such as polyethylene naphthalate, polycarbonate, acrylic, cyclic polyolefin, triacetyl cellulose, polyether sulfide, polyether ketone, and polyimide. Etc. can be mentioned. Among these, a polyethylene terephthalate film and a polyethylene naphthalate film are preferable, and a low cost polyethylene terephthalate film is especially preferable. In the support body, in particular, when a plastic film is used, in order to be able to peel from the hardened | cured material layer of a thermosetting resin composition, the support body which has a mold release layer to which the to-be-formed surface of this thermosetting resin composition layer was mold-released was used. It is desirable to. Although metal foil can also be removed by an etching solution, when a thermosetting resin composition is thermosetted using a plastic film as a support body, when there is no mold release layer, it will become difficult to peel a plastic film from hardened | cured material. As a mold release agent used for a mold release process, if a hardened | cured material can peel from a support body, it will not specifically limit, For example, a silicone type mold release agent, an alkyd resin type mold release agent, etc. are mentioned. Moreover, you may use the plastic film with a mold release layer marketed, As a preferable thing, SK-1 of the Lintech Co., Ltd. product which is a PET film which has a mold release layer which has an alkyd resin type mold release agent as a main component, AL-5, AL-7, etc. are mentioned. In addition, a plastic film may perform a mat process and a corona treatment, and may form a release layer on the said process surface. In addition, when copper foil is used as a support body, you may use this copper foil as a conductor layer, without peeling. Although the thickness of a support body is not specifically limited, 10-150 micrometers is preferable and 25-50 micrometers can be used preferably.

1-200 micrometers is preferable, as for the thickness of the adhesive layer of a thermosetting resin composition, in order to make it the insulating resin sheet suitable for thinning, the range of 5-100 micrometers is more preferable, The range of 5-40 micrometers is more preferable, The range of 30 micrometers is especially preferable. When the thickness of the adhesive layer is too thin, there is a tendency that the insulation between the external terminal of the electronic component and the circuit becomes insufficient, and the manufacturing also tends to be difficult. Moreover, when the thickness of an adhesive layer is too thick, there exists a tendency for thickness reduction of a multilayer printed wiring board to become difficult.

The adhesive film of this invention can melt | dissolve a thermosetting resin composition in the organic solvent first, and makes it a resin varnish, then apply it on a support layer, dry a solvent by hot air blowing, etc., and can form it to said predetermined thickness.

The protective film of an adhesive layer can prevent adhesion | attachment and a wound | wound to the surface of an adhesive layer, and it is effective also in improving the reliability of the printed wiring board manufactured using such an insulating resin sheet. Here, as a protective film, polyester, such as polyolefin, such as polyethylene, a polypropylene, and polyvinyl chloride, polyethylene terephthalate, a polycarbonate, a polyimide, a release paper, aluminum foil, etc. are mentioned. In addition, the protective film may perform mold release processing, such as forming a mat process, a corona treatment, and a silicone type release film layer. Moreover, it is preferable that the thickness of a protective film shall be 1-40 micrometers.

[Method of Manufacturing Component-embedded Substrate]

The method of manufacturing a component-embedded board | substrate with the adhesive film of this invention includes the process of fixing an electronic component on the adhesive layer of (A) adhesive film at least, and (B) the process of thermosetting the said adhesive layer and forming an insulating layer. do. The adhesive film of this invention has the adhesive force which can fix a part firmly, It is characterized by the above-mentioned.

Specifically, (A) process of fixing an electronic component or an electronic component and a circuit board on the adhesive layer of an adhesive film, (B) process of thermosetting the said adhesive layer to form an insulating layer, (C) resin composition for sealing, adhesion The board | substrate with a component is manufactured through the process of sealing an electronic component or an electronic component, and a circuit board with a film or a prepreg.

First, in the process of fixing an electronic component, or an electronic component, and a circuit board on the adhesive layer of (A) adhesive film, an electronic component and a circuit board are further fixed to the predetermined position on the adhesive layer surface which has adhesiveness as needed. . Since the upper limit of the temperature at the time of fixation works efficiently, 70 degreeC is preferable, 60 degreeC is more preferable, 55 degreeC is still more preferable, 50 degreeC is still more preferable, 45 degreeC is much more preferable, , 40 ° C is particularly preferred. On the other hand, since the lower limit of the temperature at the time of fixation does not reduce adhesiveness, -20 degreeC is preferable, -10 degreeC is more preferable, -5 degreeC is still more preferable, 0 degreeC is still more preferable, and 5 C is even more preferred, and 10 ° C. is particularly preferred.

Next, the electronic component and the circuit board are more firmly fixed on the insulating layer to be formed by the step of (B) thermosetting the adhesive layer to form an insulating layer. The curing temperature is preferably 140 to 200 ° C, more preferably 150 to 180 ° C. In addition, the curing time is preferably 15 minutes to 2 hours, more preferably 30 to 90 minutes.

Thereafter, the electronic component or the electronic component and the circuit board are sealed by the resin composition (C) for sealing, an adhesive film or a prepreg. Encapsulation may employ methods known to those skilled in the art. For example, the method of laminating | stacking and thermosetting the adhesive film in which the thermosetting resin composition layer was formed on the support body by laminators, such as a vacuum laminator, the method of laminating | stacking and precuring a prepreg by a lamination press, etc. are mentioned.

By using the adhesive film of this invention, it is preferable to use the belt conveyor which can be accompanied with a vibration in a process (A), a process (B), and a process (C). Moreover, by using the adhesive film of this invention, it becomes possible to use an adhesive layer as a thermosetting layer as it is. Moreover, by using the adhesive film of this invention, it becomes possible to seal an electronic component with high positional precision. In addition, since the number of steps is reduced, it becomes possible to manufacture the component embedded substrate at a lower cost.

[Example]

EXAMPLES Hereinafter, although an Example is disclosed and this invention is demonstrated in more detail, these do not limit this invention in any meaning. In addition, in the following description, "part" means a "weight part."

(Example 1)

20 weight part of bisphenol-type epoxy resins (the Totogassei Co., Ltd. make "ZX1059", epoxy equivalent approximately 165), epoxidized polybutadiene (the Daisk Chemical Co., Ltd. make "PB3600M", MEK solution of 80% of non volatile matters) 8 parts by weight, 14 parts by weight of naphthalene-type tetrafunctional epoxy (the Dainippon Ink, Inc. make "HP-4700"), novolak-type phenol resin (the Dainippon Ink, Inc. make "LA7054", hydroxyl group equivalent approximately 125 , 25 parts by weight of a methyl ethyl ketone (hereinafter referred to as MEK) solution containing 60% by weight of nonvolatile matter, 40 parts by weight of spherical silica (`` SO-C4 '' manufactured by Admatex Co., Ltd.), flame retardant filler (Sanko 6 parts by weight of manufactured `` HCA-HQ '', 3 parts by weight of an organic filler (Kantsu Chemical Co., Ltd. product `` AC3816N ''), butyral resin (Sekisui Chemical Co., Ltd. product "BL-1") 10 parts by weight diluted with toluene and methanol 1: 1 to form a non-volatile 15% solution) and acrylic ester copolymer resin (Nagase Camtex Co., Ltd.) as an acrylic resin. ) 5 parts by weight of petroleum naphtha (Junsei Chemical Co., Ltd. "Ipsol 150") 0.85 parts by weight of manufactured "SG-70L", 12.5% by weight of nonvolatile matter and 1.3: 1 mixed solution of toluene), and MEK The mixture is mixed with 21 parts by weight and uniformly dispersed by a high speed rotary mixer to prepare a thermosetting resin composition varnish (25% by weight of liquid epoxy resin, 14.2% by weight of phenolic curing agent, and 0.10% by weight of acrylic resin) in the resin composition (non-volatile content). Made. Next, the resin composition layer after drying this resin composition varnish on the release-processed polyethylene terephthalate film (38 micrometers in thickness) (Lintech Co., Ltd. AL-5) (henceforth 38 micrometer mold release PET) ( The thickness of the adhesive layer) was uniformly applied with a bar coater so as to be 40 μm, and dried at 65 to 120 ° C. (average 100 ° C.) for 10 minutes (amount of residual solvent in the resin composition layer: about 1% by weight). The polyethylene terephthalate film (thickness 25 micrometers; Lin-5 Co., Ltd. AL-5; hereafter referred to as 25 micrometers mold release PET) which carried out the release process was bonded to the resin composition layer surface after drying, and has a sheet-like 3-layer structure. An adhesive film was produced.

(Example 2)

The bisphenol-type epoxy resin (Totogase Co., Ltd. product "ZX1059", epoxy equivalent about 165) was changed to 21 weight part, and acrylic ester copolymer resin (Nagase Camtex Co., Ltd. product "SG-70L", The 12.5 weight% of non-volatile content of MEK and toluene 1.3: 1 mixed solution) was changed to 17.2 weight part (25.0 weight% of liquid epoxy resin, 13.9 weight% of phenolic hardeners, and 2 weight% of acrylic resin in resin composition (non-volatile content)) Except), an adhesive film was obtained in the same manner as in Example 1.

(Example 3)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 22 weight part, and naphthalene type | mold tetrafunctional epoxy (the Dai Nippon Ink Co., Ltd. product "HP-4700") was changed. ) Was changed to 13 parts by weight, and the acrylic ester copolymer resin (`` SG-70L '' manufactured by Nagase Camtex Co., Ltd., a 1.3: 1 mixed solution of 12.5% by weight of nonvolatile matter and toluene) was changed to 44.5 parts by weight. An adhesive film was obtained in the same manner as in Example 1 except for (25.0 wt% of liquid epoxy resin, 13.5 wt% of phenolic curing agent, and 5 wt% of acrylic resin) in the resin composition (nonvolatile content).

(Example 4)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent about 165) was changed to 26 weight part, and naphthalene type | mold tetrafunctional epoxy (The Dai Nippon Ink Co., Ltd. product "HP-4700"'') To 9 parts by weight (except for 30% by weight of liquid epoxy resin, 14.2% by weight of phenolic curing agent, and 0.1% by weight of acrylic resin) in the resin composition (non-volatile content), an adhesive film was obtained in the same manner as in Example 1. did.

(Example 5)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent about 165) was changed to 26 weight part, and the naphthalene type tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") was changed to 26 parts by weight. ) Was changed to 8 parts by weight, and the acrylic ester copolymer resin (`` SG-70L '' manufactured by Nagase Camtex Co., Ltd., a 1.3: 1 mixed solution of 12.5% by weight of nonvolatile matter and toluene) was changed to 17.3 parts by weight. An adhesive film was obtained in the same manner as in Example 1 except for (30 wt% of the liquid epoxy resin, 13.9 wt% of the phenolic curing agent, and 2 wt% of the acrylic resin) in the resin composition (nonvolatile content).

(Example 6)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 27 weight part, and naphthalene type | mold tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") ) Was changed to 7 parts by weight, and the acrylic ester copolymer resin (`` SG-70L '' manufactured by Nagase Camtex Co., Ltd., a 1.3: 1 mixed solution of 12.5% by weight of nonvolatile matter and toluene) was changed to 44.5 parts by weight. An adhesive film was obtained in the same manner as in Example 1 except for (30 wt% of the liquid epoxy resin, 13.5 wt% of the phenolic curing agent, and 5 wt% of the acrylic resin) in the resin composition (nonvolatile content).

(Example 7)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 35 weight part, and naphthalene type | mold tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") ), And changed spherical silica ("SO-C4" made by ADMATEX Co., Ltd.) to 37 weight part, and acrylic ester copolymer resin ("SG-70L" made by Nagase Camtex Co., Ltd., 12.5 weight of non volatile matter) Changed 1.3% mixed solution of MEK and toluene to 0.83 parts by weight, and changed MEK to 5 parts by weight (39.8% by weight of liquid epoxy resin in resin composition (non-volatile content), 14.5% by weight of phenolic curing agent) An adhesive film was obtained in the same manner as in Example 1 except for 0.1 wt% of an acrylic resin).

(Example 8)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 35 weight part, and naphthalene type | mold tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") ), And changed the spherical silica ("SO-C4" made by ADMATEX Co., Ltd.) to 35 weight part, and acrylic ester copolymer resin ("SG-70L" made by Nagase Camtex Co., Ltd., non-volatile content 12.5) Changed 1% by weight of MEK and toluene 1.3: 1 mixed solution) to 16.4 parts by weight, and changed MEK to 5 parts by weight (39.8% by weight of liquid epoxy resin in resin composition (non-volatile content), 14.6% by weight of phenolic curing agent) And 1.99% by weight of acrylic resin), an adhesive film was obtained in the same manner as in Example 1.

(Example 9)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 35 weight part, and naphthalene type | mold tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") ), And changed the spherical silica ("SO-C4" made by ADMATEX Co., Ltd.) to 32 weight part, and also acrylic ester copolymer resin ("SG-70L" by Nagase Camtex Co., Ltd., non-volatile content 12.5). Changed the weight% MEK and toluene 1.3: 1 mixed solution) to 41 parts by weight, and changed the MEK to 5 parts by weight (40% by weight of the liquid epoxy resin in the resin composition (non-volatile content), 14.6% by weight of the phenol-based curing agent) And 4.99% by weight of acrylic resin), an adhesive film was obtained in the same manner as in Example 1.

(Comparative Example 1)

What changed the acrylic ester copolymer resin (Nagase Camtex Co., Ltd. product "SG-70L" of Example 1, the 1.3: 1 mixed solution of MEK and toluene of 12.5 weight% of non volatile matters) to 0.43 weight part (resin composition (Fire The adhesive film was obtained by the method similar to Example 1 except 25 weight% of liquid epoxy resins in a volatile matter), 14.2 weight% of phenolic hardening agents, and 0.05 weight% of acrylic resins).

(Comparative Example 2)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 22 weight part, and naphthalene type | mold tetrafunctional epoxy (the Dai Nippon Ink Co., Ltd. product "HP-4700") was changed. ) Was changed to 13 parts by weight, and acrylic acid ester copolymer resin (`` SG-70L '' manufactured by Nagase Camtex Co., Ltd., 1.3: 1 mixed solution of 12.5% by weight of nonvolatile matter and toluene) was changed to 53.9 parts by weight. An adhesive film was obtained in the same manner as in Example 1 except for (25 wt% of the liquid epoxy resin in the resin composition (non-volatile content), 13.4 wt% of the phenolic curing agent, and 6 wt% of the acrylic resin).

(Comparative Example 3)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent about 165) was changed to 26 weight part, and the naphthalene type tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") was changed to 26 parts by weight. ) Was changed to 9 parts by weight, and the acrylic acid ester copolymer resin (`` SG-70L '' manufactured by Nagase Camtex Co., Ltd., a 1.3: 1 mixed solution of 12.5% by weight of nonvolatile matter and toluene) was changed to 0.43 parts by weight. An adhesive film was obtained in the same manner as in Example 1 except for (30 wt% of the liquid epoxy resin, 14.2 wt% of the phenolic curing agent, and 0.05 wt% of the acrylic resin) in the resin composition (nonvolatile content).

(Comparative Example 4)

The bisphenol-type epoxy resin (Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 28 weight part, and the naphthalene type tetrafunctional epoxy (The Dainippon Ink, Co., Ltd. product "HP-4700") was changed to 28 parts by weight. ) Was changed to 7 parts by weight, and acrylic acid ester copolymer resin (`` SG-70L '' manufactured by Nagase Camtex Co., Ltd., 1.3: 1 mixed solution of 12.5% by weight of nonvolatile matter and toluene) was changed to 54 parts by weight. An adhesive film was obtained in the same manner as in Example 1 except for (30 wt% of the liquid epoxy resin, 13.3 wt% of the phenolic curing agent, and 6 wt% of the acrylic resin) in the resin composition (nonvolatile content).

(Comparative Example 5)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 35 weight part, and naphthalene type | mold tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") ), And changed the spherical silica ("SO-C4" made by ADMATEX Co., Ltd.) to 37 weight part, and also acrylic ester copolymer resin ("SG-70L" by Nagase Camtex Co., Ltd., non-volatile content 12.5). Changed the weight% MEK and the toluene 1.3: 1 mixed solution to 0.4 parts by weight, and further changed the MEK to 5 parts by weight (40% by weight of the liquid epoxy resin in the resin composition (non-volatile content), 14.6% by weight of the phenolic curing agent) , Except for 0.05% by weight of acrylic resin), an adhesive film was obtained in the same manner as in Example 1.

(Comparative Example 6)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 35 weight part, and naphthalene type | mold tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") ), And changed the spherical silica ("SO-C4" made by ADMATEX Co., Ltd.) to 30 weight part, and also acrylic ester copolymer resin ("SG-70L" by Nagase Camtex Co., Ltd., non-volatile content 12.5). Changed the weight% MEK and toluene 1.3: 1 mixed solution) to 49.2 parts by weight, and changed the MEK to 5 parts by weight (40% by weight of the liquid epoxy resin in the resin composition (non-volatile content), 14.6% by weight of the phenolic curing agent) And the adhesive film was obtained by the method similar to Example 1 except 6 weight% of acrylic resins.

(Comparative Example 7)

The bisphenol-type epoxy resin (the Totogassei Co., Ltd. product "ZX1059", epoxy equivalent about 165) was changed to 16 weight part, and naphthalene type | mold tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") ) Was changed to 19 parts by weight, and the acrylic ester copolymer resin (`` SG-70L '' manufactured by Nagase Camtex Co., Ltd., a 1.3: 1 mixed solution of 12.5% by weight of nonvolatile matter and toluene) was changed to 17.2 parts by weight. An adhesive film was obtained in the same manner as in Example 1 except for (20 wt% of the liquid epoxy resin in the resin composition (non-volatile content), 13.9 wt% of the phenolic curing agent, and 2 wt% of the acrylic resin).

(Comparative Example 8)

The bisphenol-type epoxy resin (The Totogase Co., Ltd. product "ZX1059", epoxy equivalent approximately 165) was changed to 35 weight part, and naphthalene type | mold tetrafunctional epoxy (The Dainippon Ink Co., Ltd. product "HP-4700") Except), spherical silica ("SO-C4" manufactured by ADMATEX Co., Ltd.) was changed to 23 parts by weight, and acrylic ester copolymer resin (`` SG-70L '' manufactured by Nagase Camtex Co., Ltd.), non-volatile content 12.5 Changed the weight% MEK and toluene 1.3: 1 mixed solution) to 14.5 parts by weight, and changed the MEK to 5 parts by weight (45% by weight of the liquid epoxy resin in the resin composition (non-volatile content), 16.6% by weight of the phenolic curing agent) And 2% by weight of acrylic resin), an adhesive film was obtained by the same method as in Example 1.

Using the adhesive films of Examples and Comparative Examples, Tg (glass transition temperature) measurement, insulation resistance measurement, adhesive force measurement, 25 μm release PET (cover film) peelability evaluation, component fixation evaluation, maximum part position deviation amount measurement It was.

<Tg (glass transition temperature) measurement>

25 micrometers release PET is peeled from the adhesive film created by the Example and the comparative example, and it is a polyimide film (Ube) of 200 mm x 200 mm by a batch type vacuum pressurizing laminator (Nichigo-Moton Co., Ltd. product, "Morton-724"). It was laminated to Kosan Co., Ltd. product, "UPILEX50S". The laminating was carried out under vacuum suction for 30 seconds, and then pressurized at a pressure of 1 kg / cm 2 for 30 seconds using a pressure resistant rubber. The 38 micrometer mold release PET of the sample created above was peeled, it put in the batch type oven, and heated at 180 degreeC for 90 minutes, and hardened the resin composition layer (adhesive layer). Tg of this hardened | cured material was measured with the thermal analysis apparatus (The Seiko Instool Co., Ltd. product, "DMS6100").

<Measurement of Insulation Resistance>

25 micrometer mold release PET of the adhesive film produced by the Example and the comparative example was peeled off, and it was L / S = 15 micrometer / 15 micrometers by a batch type vacuum pressurizing laminator (Nichigo Motor Co., Ltd. product, "Morton-724"). It laminated to TAB tape (made by Mitsui Ginsoku Co., Ltd., "AJ-C0002-30 / 40"). The laminating was carried out under vacuum suction for 30 seconds, and then pressurized at a pressure of 1 kg / cm 2 for 30 seconds using a pressure resistant rubber. The 38 micrometer mold release PET of the sample produced above was peeled, and it heated in 180 degreeC in 90 degreeC in the batch type oven, and hardened the resin composition layer (adhesive layer). The resistance value of the sample after hardening was measured and it was set as initial stage resistance value. Subsequently, it was left to stand on a HAST tester (Katsumoto Chemical Co., Ltd. make, "ETAC PM422") for 100 hours on 130 degreeC and 85 weight% Rh, and the subsequent resistance value (HAST resistance value) was measured.

<Measurement of adhesive force>

25 micrometer mold release PET of the adhesive film produced by the Example and the comparative example was peeled off, it attached to the baseball dedicated for apparatus, and the adhesive force of the resin composition layer (adhesive layer) side was measured. The device is a probe tack tester (Tester Sangyo Co., Ltd., TE6002) using a probe of φ5.05mm stainless steel, the probe is pressed onto the adhesive layer surface of the adhesive film at 25 ° C., a load of 1 kgf / cm 2, and a contact speed of 5 mm / min. Press and hold for 10 seconds. Then, it peeled at 1 mm / min of peeling speed, and measured the load at that time. This measurement was performed 5 times and the average value of 3 measured values except the maximum value and the minimum value was made into adhesive force. 0.25N or less was made into ND in the measurement error.

<Evaluation of 25 µm Release PET (Cover Film) Peelability>

The adhesive film produced by the Example and the comparative example was cut out to square of about 10 cm in length, and the 38 micrometers release PET side was fixed to the fixed stage (stage which can fix a sheet by pressure reduction). Next, at room temperature (25 ° C.), only one 25 μm mold release PET in four corners was held by hand, and the adhesive film was pulled about 5 cm vertically at an angle of 90 degrees. (Circle) and the case where it peeled between 25 micrometers release PET and an adhesive layer were made between (circle) and an adhesive layer and 38 micrometers release PET, or when the adhesive film peeled from the fixed stage without peeling between layers.

<Evaluation of Part Fixation>

25 micrometers release PET was peeled from the adhesive film produced by the Example and the comparative example, and it is a 26 mm x 76 mm slide glass single side | piece (batch-type vacuum press laminator ("Morton-724")). Laminated to a piece. Laminating was performed by vacuum suction at room temperature (25 degreeC) for 30 second, and then pressurizing at 1 kg / cm <2> for 3 second using pressure-resistant rubber after that.

The 38 micrometer mold release PET of the sample produced above was peeled off, and three 1608 chip capacitors were mounted on the adhesive film with tweezers. Next, vacuum suction for 30 seconds with a batch type vacuum pressurized laminator (Nichigo Moton Co., Ltd. product, "Morton-724"), and then it is 1 kg / cm <2> for 30 seconds at room temperature (25 degreeC) using pressure-resistant rubber. The condenser was fixed on the adhesive film under the condition of pressing at a pressure of.

The capacitor | condenser fixed on the adhesive film was peeled off in the vertical direction with the tweezers, and the trace of the capacitor | condenser which remained on the adhesive layer surface was observed. As shown in FIG. 1, when there was a trace on the surface of an adhesive layer according to the shape of a capacitor | condenser, (circle) and the case where there was only a part of traces, (triangle | delta) and the case where there was no trace were made into x.

<Measurement of maximum part position deviation>

The slide glass which fixed the component was created by the method similar to evaluation of component fixability, and the position deviation amount immediately after fixing of a capacitor | condenser and after hardening was measured by the method shown in FIG.

The measurement of the component position after the component fixing is performed by a measuring instrument (trade name, manufactured by Mitsutoyo Co., Ltd., MF-UD2017B Co., Ltd.) to determine origins A and B as shown in FIG. The distances (W, X, Y, Z) were measured from the corners (four corners).

In the curing of the sample, the sample was placed in a batch oven so that the resin became vertical and heated at 180 ° C. for 30 minutes to cure the resin composition layer (adhesive layer).

The component position after hardening measured distance (W ', X', Y ', Z') from the origin A, B determined before hardening, and the edge (four corners) of the hardened part. (| W'-W |, | X'-X |, | Y'-Y |, | Z'-Z |) are the component position deviation amounts, and the maximum of these four values is the maximum component position deviation amount. did. The part which peeled from the contact bonding layer during hardening was described with ND.

From Table 1, it turns out that the adhesive film of an Example has a favorable component fixability, a small maximum part position deviation amount, and the peelability of a cover film (25 micrometer mold release PET) is also favorable. On the other hand, in the adhesive film of the comparative example, since the component fixability was inferior when adhesive force was low, the largest part position deviation was large, and when adhesive force was too strong, peeling property of the cover film (25 micrometer mold release PET) fell.

Claims (10)

Thermosetting resin composition used for component fixing of component embedded substrates and forming an insulating layer, when the nonvolatile content of the thermosetting resin composition is 100% by weight, 25 to 40% by weight of the liquid epoxy resin at 25 ° C. %, 0.1 to 5% by weight of acrylic resin, 5 to 30% by weight of phenolic curing agent and 20 to 70% by weight of inorganic filler. The thermosetting resin composition according to claim 1, wherein the acrylic resin is an acrylic acid ester copolymer. The thermosetting resin composition according to claim 1 or 2, wherein the acrylic resin is an acrylate ester copolymer containing methyl acrylate, butyl acrylate, and acrylonitrile. The thermosetting resin composition according to claim 1, wherein the acrylic resin contains at least one group selected from an epoxy group, a hydroxyl group, and a carboxyl group. The thermosetting resin composition according to claim 1, wherein the acrylic resin contains a hydroxyl group and a carboxyl group. The adhesive film used for component fixing of an internal component board | substrate, and insulating layer formation which has an adhesive layer formed by the thermosetting resin composition of Claims 1-5 on a support body. The adhesive film of Claim 6 whose thickness of an adhesive layer is 5-100 micrometers. The adhesive film according to claim 6 or 7, wherein the support is a plastic film. The adhesive film in any one of Claims 6-8 in which the surface by the side of the contact bonding layer of a support body is mold-release-processed. The manufacturing method of the component-embedded board | substrate which includes the process of fixing an electronic component on the adhesive layer of the adhesive film in any one of Claims 1-9, and the process of thermosetting the said adhesive layer and forming an insulating layer.

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