CN103796419B - Extinction black stiffening plate for printed circuit board (PCB) - Google Patents
Extinction black stiffening plate for printed circuit board (PCB) Download PDFInfo
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- CN103796419B CN103796419B CN201210430581.3A CN201210430581A CN103796419B CN 103796419 B CN103796419 B CN 103796419B CN 201210430581 A CN201210430581 A CN 201210430581A CN 103796419 B CN103796419 B CN 103796419B
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Abstract
The invention discloses a kind of extinction black stiffening plate for printed circuit board (PCB), constituted by extinction black polyamide composite membrane and for the extinction black polyamide composite membrane to be adhered into the adhesion coating on printed circuit board (PCB), if the extinction black polyamide composite membrane is made up of two layers extinction black polyamide film, some strata imide layers and dried layer adhesion agent layer, the symmetry of extinction black polyamide film and polyimide layer can reduce extinction black polyamide composite membrane and paste the depth of camber to circuit board；Two layers of extinction black polyamide film is conducive to protection circuit pattern simultaneously；In addition, the adhesion agent layer and adhesion coating of stiffening plate of the present invention can include black developer, black developer can make circuit pattern screening effect more preferably, without increasing process, you can reach optimal circuit screening effect.
Description
Technical field
The present invention relates to a kind of extinction black stiffening plate for printed circuit board (PCB), it is difficult to stick up more particularly, to one kind
Bent, folded structure is special and with the stiffening plate of masking circuit effect.
Background technology
Polyimide resin heat endurance is high and with excellent insulating properties, mechanical strength and resistance to chemical corrosion, commonly uses
In a variety of electronics rapidoprints.Such as it is used for flexible printed wiring board（Flexible Printed Circuit）Insulating barrier, or
Person is further used for electronic components, the reinforcement purposes of such as printed circuit board (PCB).
Kapton has been widely used in electronic material, and wherein extinction black polyamide thin film is also widely
Applied to electronic material.Wherein, the polyimides stiffening plate used in printed circuit board (PCB), can typically divide into individual layer slab or compound
The polyimides stiffening plate of formula, and the stiffening plate of combined type, the polyimides as TaiWan, China patent I257898 is announced are hardened
Structure, it is with 2 Mills（mil）Polyimide plate and different-thickness thermmohardening solid formation different-thickness combined type
Polyimide plate, however, polyimide composite film is to be limited to polyimide film cost and multiple the problem of application upper experience
Close the thickness of film, it is impossible to cover circuit layout pattern and be easy to by same trade plagiarism.And in order that polyimide composite film has screening
The function of circuit layout is covered, then forms the combined type of different-thickness using the solid of black polyamide thin film and different-thickness
Polyimide plate.In addition, composite membrane is to be combined by polyimide film and adhesion agent layer and obtained, but the coefficient of thermal expansion differences both it
Exception causes pasting to flexible circuit board for the composite membrane of reinforcement, produces the phenomenon of warpage.
The content of the invention
, should the invention provides a kind of extinction black stiffening plate for printed circuit board (PCB) in order to overcome drawbacks described above
Extinction black stiffening plate for printed circuit board (PCB) has the advantages that masking circuit effect and has reduction depth of camber.
The technical scheme that is used to solve its technical problem of the present invention is：
A kind of extinction black stiffening plate for printed circuit board (PCB), by extinction black polyamide composite membrane and is used for
The adhesion coating extinction black polyamide composite membrane adhered on printed circuit board (PCB) is constituted, and the extinction black gathers
If acid imide composite membrane is made up of two layers extinction black polyamide film, some strata imide layers and dried layer adhesion agent layer,
Some strata imide layers be located at two layers of extinction black polyamide film between, the polyimide layer with it is described
It is bonded, is connect between the adjacent polyimide layer by described by the adhesion agent layer between extinction black polyamide film
Oxidant layer bonding, wherein, the gross thickness Z of the extinction black polyamide composite membrane meets following formula relation：
2T+mX+nY =Z
In formula, 2 represent the extinction black polyamide film layer number；M represents the polyimide layer number of plies；N is represented
The adhesion agent layer number of plies；T represents the thickness of the extinction black polyamide film, and T is 0.5 to 2mil；X represents described
The thickness of polyimide layer, and X is 1 to 2 mil；And Y represents the thickness of the adhesion agent layer, and Y value is according to specific Z value
It is fixed.
It is preferred that the adhesive layer thickness is 10~40 μm.
The adhesion coating can be black adhesion coating.
The adhesion coating is the epoxy resin layer containing inorganic filler.
The black adhesion coating is the epoxy resin layer containing black developer.
The adhesion agent layer is black adhesion agent layer.
The adhesion agent layer is thermmohardening black adhesion agent layer.
The thermmohardening black adhesion agent layer is the epoxy resin layer containing black developer.
In above-mentioned black adhesion coating or above-mentioned thermmohardening black adhesion agent layer, the black developer be black pigment,
At least one of carbon dust and carbon nanotube, by weight percentage, the black developer account for the epoxy resin solid content
3~15%.
It is preferred that the surface of the adhesion coating is fitted with one layer of release layer.
The beneficial effects of the invention are as follows：Extinction is black in the extinction black stiffening plate for printed circuit board (PCB) of the present invention
The symmetry of color polyimide film and polyimide layer can reduce extinction black polyamide composite membrane and paste to circuit board
Depth of camber afterwards；Two layers of extinction black polyamide film is conducive to protection circuit pattern simultaneously；In addition, stiffening plate of the present invention
Adhesion agent layer and adhesion coating can include black developer, black developer can make circuit pattern screening effect more preferably, without increasing
Process sequence, you can reach optimal circuit screening effect.
Brief description of the drawings
Fig. 1 is the extinction black stiffening plate profile of the present invention for printed circuit board (PCB)；
Fig. 2 is the profile that the extinction black stiffening plate of the present invention for printed circuit board (PCB) is fitted with release layer.
Embodiment
Illustrate the embodiment of the present invention below by way of particular specific embodiment, those of ordinary skill in the art can
Advantages of the present invention and effect are understood by content disclosed in the present specification easily.The present invention can also other different modes
Be practiced, i.e. do not depart from it is disclosed under the scope of, different modifications and change can be given.
Embodiment：A kind of extinction black stiffening plate for printed circuit board (PCB), as shown in figure 1, being gathered by extinction black
Acid imide composite membrane 10 and for the extinction black polyamide composite membrane to be adhered to the adhesion coating on printed circuit board (PCB)
14 are constituted, and the extinction black polyamide composite membrane 10 is by two layers extinction black polyamide film 11, some strata acyls
If imine layer 12 and dried layer adhesion agent layer 13 are constituted, some strata imide layers 12 are poly- positioned at two layers of extinction black
Between acid imide film 11, the solid is passed through between the polyimide layer 12 and the extinction black polyamide film 11
Layer 13 is bonded, and is bonded between the adjacent polyimide layer 12 by the adhesion agent layer 13, wherein, the extinction black gathers
The gross thickness Z of acid imide composite membrane 10 meets following formula relation：
2T+mX+nY =Z
In formula, 2 represent the extinction black polyamide film layer number；M represents the polyimide layer number of plies；N is represented
The adhesion agent layer number of plies；T represents the thickness of the extinction black polyamide film, and T is 0.5 to 2mil；X represents described
The thickness of polyimide layer, and X is 1 to 2 mil；And Y represents the thickness of the adhesion agent layer, and Y value is according to specific Z value
It is fixed.
When it is implemented, when Z is 3, then T is 0.5mil, and m is 1 and X is 1mil；When Z is 4, then T is 0.5mil, and m is 1
And X is 1mil；When Z is 5, then T is 0.5mil, and m is 1 and X is 2mil or m is 2；When Z is that 6, T is 0.5mil, then m is 2 or 3,
Or T is 1mil, then m is 1 or 2；When Z is that 7, T is 0.5mil, then m is 2 or 3, or T is 1mil, then m is 2 or 3；When Z is that 8, T is
0.5-2mil, then m is to be selected from one of 2,3 and 4；When Z is that 9, T is 0.5-2mil, then m is 3 or 4.Wherein, extinction black polyamides
Imines film and the symmetry of polyimide layer can reduce composite membrane and paste the depth of camber to circuit board, and two layers of extinction is black
Color polyimide film is conducive to protection circuit pattern simultaneously.
The thickness of adhesion coating 14 is 10~40 μm.
The adhesion coating 14 is black adhesion coating.
The black adhesion coating is the epoxy resin layer containing black developer.
The adhesion agent layer 13 is black adhesion agent layer.
The adhesion agent layer 13 is thermmohardening black adhesion agent layer.
The thermmohardening black adhesion agent layer is the epoxy resin layer containing black developer.
In above-mentioned black adhesion coating or above-mentioned thermmohardening black adhesion agent layer, the black developer is black face
At least one of material, carbon dust and carbon nanotube, by weight percentage, the black developer accounts for the epoxy resin and contained admittedly
The 3~15% of amount.
The extinction black polyamide film, polyimide layer and solid species are not particularly limited, preferably
More preferably it is to use to have from stickiness and not halogen-containing solid using not halogen-containing polyimide material and solid.
The present invention can be made for the extinction black stiffening plate of printed circuit board (PCB) by following methods：First, one
Individual extinction black polyamide film surface is coated with one layer of thermmohardening black solid, is placed in after baking oven heat drying, with heat rolling
Wheel is pressed with another polyimide layer, by that analogy, is finally coated with one layer of heat on an extinction black polyamide film surface
Black solid is hardened, is placed in after baking oven heat drying, is pressed with hot roller and composite membrane semi-finished product, to required extinction black
The thickness of polyimide composite film；Then, cured 1 hour under conditions of 180 DEG C；Finally, it is sub- in the extinction black polyamides
Amine composite film surface coats adhesion coating, forms the extinction black stiffening plate sample for printed circuit board (PCB).
In order to keep the viscosity of the adhesion coating 14, circuit board is bonded in or other pressure programmings are used in favor of follow-up,
As shown in Fig. 2 the one layer of release layer 15 that can be fitted on the surface of adhesion coating 14（Release liners or mould release membrance）.
Preparing the present invention according to the data in table 1 below is used for the extinction black stiffening plate of printed circuit board (PCB), another to prepare control
Example sample, the stiffening plate of the reference examples sample does not include extinction black polyamide film, using general adhesion coating and then
Oxidant layer, remaining is as embodiment.The sticky material of the stiffening plate of embodiment and reference examples sample is all to use institute of Sony Corporation
The pure glue of production（Trade name D3410）.Then, stiffening plate is cut into 25cm × 25cm size, and under the conditions of 180 DEG C
It is pressure bonded on 74.5 ± 1 μm of 3-Layer double-surface flexible copper foil substrates, then is cured with 160 DEG C of condition, then by each reality
Apply a sample to be placed in smooth flat with control sample, after standing 20 minutes, measure the depth of camber of four corners, carry out flat
Degree test, is as a result embedded in table 1.
Table 1
Preparing the present invention according to the data in table 2 below is used for the extinction black stiffening plate of printed circuit board (PCB), another to prepare control
Example sample, the composite membrane of the reference examples sample does not include extinction black polyamide film, using general adhesion coating and then
Oxidant layer, remaining is as embodiment.The sticky material of the stiffening plate of embodiment and reference examples sample is all to use institute of Sony Corporation
The pure glue (trade name D3410) of production.Then, stiffening plate is cut into 25cm × 25cm size, and under the conditions of 180 DEG C
It is pressure bonded on 74.5 ± 1 μm of 3-Layer double-surface flexible copper foil substrates, then is cured with 160 DEG C of conditions, then each is implemented
Example sample is placed in smooth flat with control sample, after standing 20 minutes, measures the depth of camber of four corners, carries out flatness
Test, is as a result embedded in table 2.
Table 2
It is in gross thickness under the same conditions, sub- compared to unused extinction black polyamides as shown in table 1 and the result of table 2
The composite films of amine film and black adhesion coating, the depth of camber of extinction black composite membrane of the present invention is relatively small, thus tool
There is preferably flatness, and as gross thickness increases, flatness becomes apparent.
Description above and embodiment are merely illustrative the principle and its effect of the present invention, are not to the present invention
Limitation.Any creation fallen within the scope of the appended claims comes under the scope that the present invention is protected.
Claims (10)
1. a kind of extinction black stiffening plate for printed circuit board (PCB), it is characterised in that：Answered by extinction black polyamide
Close film（10）With for the extinction black polyamide composite membrane to be adhered to the adhesion coating on printed circuit board (PCB)（14）Structure
Into the extinction black polyamide composite membrane（10）By two layers of extinction black polyamide film（11）, some strata acyls
Imine layer（12）If with dried layer adhesion agent layer（13）Constitute, some strata imide layers（12）Positioned at two layers of extinction
Black polyamide film（11）Between, the polyimide layer（12）With the extinction black polyamide film（11）Between lead to
Cross the adhesion agent layer（13）Bonding, the adjacent polyimide layer（12）Between pass through the adhesion agent layer（13）Bonding, its
In, the extinction black polyamide composite membrane（10）Gross thickness Z meet following formula relation：
2T+mX+nY =Z
In formula, 2 represent the extinction black polyamide film layer number；M represents the polyimide layer number of plies；N represents described
The adhesion agent layer number of plies；T represents the thickness of the extinction black polyamide film, and T is 0.5 to 2mil；X represents the polyamides
The thickness of imine layer, and X is 1 to 2 mil；And Y represents the thickness of the adhesion agent layer, and depending on Y value is according to specific Z value.
2. the extinction black stiffening plate according to claim 1 for printed circuit board (PCB), it is characterised in that：The adhesion
Layer（14）Thickness is 10~40 μm.
3. the extinction black stiffening plate according to claim 2 for printed circuit board (PCB), it is characterised in that：The adhesion
Layer（14）It is black adhesion coating.
4. the extinction black stiffening plate according to claim 2 for printed circuit board (PCB), it is characterised in that：The adhesion
Layer（14）It is the epoxy resin layer containing inorganic filler.
5. the extinction black stiffening plate according to claim 3 for printed circuit board (PCB), it is characterised in that：The black
Adhesion coating is the epoxy resin layer containing black developer.
6. the extinction black stiffening plate according to claim 1 for printed circuit board (PCB), it is characterised in that：It is described then
Oxidant layer（13）It is black adhesion agent layer.
7. the extinction black stiffening plate according to claim 6 for printed circuit board (PCB), it is characterised in that：It is described then
Oxidant layer（13）It is thermmohardening black adhesion agent layer.
8. the extinction black stiffening plate according to claim 7 for printed circuit board (PCB), it is characterised in that：The heat is hard
It is the epoxy resin layer containing black developer to change black adhesion agent layer.
9. the extinction black stiffening plate for printed circuit board (PCB) according to claim 5 or 8, it is characterised in that：It is described
Black developer is at least one of black pigment, carbon dust and carbon nanotube, by weight percentage, the black developer
Account for the 3~15% of the epoxy resin solid content.
10. the extinction black stiffening plate according to claim 1 for printed circuit board (PCB), it is characterised in that：It is described viscous
Layer（14）Surface be fitted with one layer of release layer（15）.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210430581.3A CN103796419B (en) | 2012-11-01 | 2012-11-01 | Extinction black stiffening plate for printed circuit board (PCB) |
| TW102220177U TWM474318U (en) | 2012-11-01 | 2013-10-30 | Black reinforcing plates for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210430581.3A CN103796419B (en) | 2012-11-01 | 2012-11-01 | Extinction black stiffening plate for printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103796419A CN103796419A (en) | 2014-05-14 |
| CN103796419B true CN103796419B (en) | 2017-08-01 |
Family
ID=50671554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210430581.3A Active CN103796419B (en) | 2012-11-01 | 2012-11-01 | Extinction black stiffening plate for printed circuit board (PCB) |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103796419B (en) |
| TW (1) | TWM474318U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992455A (en) * | 2015-02-11 | 2016-10-05 | 昆山雅森电子材料科技有限公司 | Matting-effect black reinforcing plate used for printed circuit board |
| CN112888170A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665013A (en) * | 2009-09-15 | 2010-03-10 | 律胜科技（苏州）有限公司 | Polyimide film with defilade property and application and preparation method thereof |
| CN102143646A (en) * | 2010-01-28 | 2011-08-03 | 昆山雅森电子材料科技有限公司 | Stiffening plate for printed circuit board |
| CN202889773U (en) * | 2012-11-01 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | Matte black reinforcement plate for printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI321517B (en) * | 2003-01-14 | 2010-03-11 | Opaque polyimide coverlay |
-
2012
- 2012-11-01 CN CN201210430581.3A patent/CN103796419B/en active Active
-
2013
- 2013-10-30 TW TW102220177U patent/TWM474318U/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665013A (en) * | 2009-09-15 | 2010-03-10 | 律胜科技（苏州）有限公司 | Polyimide film with defilade property and application and preparation method thereof |
| CN102143646A (en) * | 2010-01-28 | 2011-08-03 | 昆山雅森电子材料科技有限公司 | Stiffening plate for printed circuit board |
| CN202889773U (en) * | 2012-11-01 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | Matte black reinforcement plate for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103796419A (en) | 2014-05-14 |
| TWM474318U (en) | 2014-03-11 |
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