CN202889773U - Matte black reinforcement plate for printed circuit board - Google Patents
Matte black reinforcement plate for printed circuit board Download PDFInfo
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- CN202889773U CN202889773U CN 201220571090 CN201220571090U CN202889773U CN 202889773 U CN202889773 U CN 202889773U CN 201220571090 CN201220571090 CN 201220571090 CN 201220571090 U CN201220571090 U CN 201220571090U CN 202889773 U CN202889773 U CN 202889773U
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- layer
- black
- circuit board
- printed circuit
- extinction
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a matte black reinforcement plate for a printed circuit board. The matte black reinforcement plate comprises a matte black polyimide composite film and an adhesion layer used for adhering the matte black polyimide composite film onto the printed circuit board, wherein the matte black polyimide composite film comprises two layers of matte black polyimide films, a plurality of polyimide layers and a plurality of adhesive layers. The warp height after the matte black polyimide composite film is adhered onto the printed circuit board can be reduced through the symmetrical characteristic of the matte black polyimide films and the polyimide layers; the two layers of matte black polyimide films are favorable for protecting a circuit pattern at the same time; and in addition, the adhesive layers and the adhesion layer can contain black color developing agents capable of enabling the shading effect of the circuit pattern to be better, so that the best circuit shading effect can be obtained without addition of working procedures.
Description
Technical field
The utility model relates to a kind of extinction black stiffening plate for printed circuit board (PCB), especially relates to and a kind ofly is difficult for warpage, folded structure is special and have the stiffening plate that covers the circuit effect.
Background technology
The polyimide resin thermal stability is high and have excellent insulating properties, mechanical strength, reach resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As being used for the insulating barrier of flexible printed wiring board (Flexible Printed Circuit), perhaps be used for further electronic components, for example the reinforcement purposes of printed circuit board (PCB).
Polyimide film has been widely used in electronic material, and wherein the extinction black polyamide thin film also is widely used in electronic material.Wherein, the polyimides stiffening plate that printed circuit board (PCB) is used, generally can divide into the polyimides stiffening plate of individual layer slab or combined type, and the stiffening plate of combined type, the polyimides plate structure of announcing such as TaiWan, China patent I257898, it is the combined type polyimide plate that forms different-thickness with the thermmohardening solid of the polyimide plate of 2 Mills (mil) and different-thickness, yet, polyimide composite film is to be subject to the thickness of polyimide film cost and composite membrane in the problem that use to meet with, and can't cover the circuit layout pattern and is easy to be plagiarized by the same trade.And the function of covering circuit layout for polyimide composite film is had then uses the solid of black polyamide thin film and different-thickness to form the combined type polyimide plate of different-thickness.In addition, composite membrane is by the combination of polyimide film and adhesion agent layer and get, but its two thermal expansion coefficient difference often causes pasting to flexible circuit board for the composite membrane of reinforcement the phenomenon of generation warpage.
The utility model content
In order to overcome defects, the utility model provides a kind of extinction black stiffening plate for printed circuit board (PCB), and the extinction black stiffening plate that should be used for printed circuit board (PCB) has the advantage of covering the circuit effect and the reduction depth of camber being arranged.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of extinction black stiffening plate for printed circuit board (PCB), consist of by extinction black polyamide composite membrane with for the adhesion coating that described extinction black polyamide composite membrane is adhered on the printed circuit board (PCB), described extinction black polyamide composite membrane is by two-layer extinction black polyamide film, some strata imide layer and some layers of adhesion agent layer consist of, described some strata imide layer are between described two-layer extinction black polyamide film, bonding by described adhesion agent layer between described polyimide layer and the described extinction black polyamide film, bonding by described adhesion agent layer between the adjacent described polyimide layer, wherein, the gross thickness Z of described extinction black polyamide composite membrane meets the following formula relation:
2T+mX+nY?=Z
In the formula, the described extinction black polyamide rete number of 2 expressions; M represents the described polyimide layer number of plies; N represents the described adhesion agent layer number of plies; T represents the thickness of described extinction black polyamide film, and T is 0.5 to 2mil; X represents the thickness of described polyimide layer, and X is 1 to 2 mil; And Y represents the thickness of described adhesion agent layer, and Y value is decided according to specific Z value.
Preferably, described adhesive layer thickness is 10～40 μ m.
Described adhesion coating can be the black adhesion coating.
Described adhesion coating is the epoxy resin layer that contains inorganic filler.
Described black adhesion coating is the epoxy resin layer that contains the black developer.
Described adhesion agent layer is the black adhesion agent layer.
Described adhesion agent layer is thermmohardening black adhesion agent layer.
Described thermmohardening black adhesion agent layer is the epoxy resin layer that contains the black developer.
In above-mentioned black adhesion coating or above-mentioned thermmohardening black adhesion agent layer, described black developer is at least a in black pigment, carbon dust and the carbon nanotube, and by weight percentage, described black developer accounts for 3～15% of described epoxy resin solid content.
Preferably, the surface of described adhesion coating is fitted with one deck release layer.
The beneficial effects of the utility model are: extinction black stiffening plate extinction black polyamide film and the symmetry of polyimide layer for printed circuit board (PCB) of the present utility model can reduce extinction black polyamide composite membrane and paste depth of camber to the circuit board; Two-layer extinction black polyamide film is conducive to the protective circuit pattern simultaneously; In addition, the adhesion agent layer of the utility model stiffening plate and adhesion coating can comprise the black developer, and the black developer can make the circuit pattern screening effect better, need not to increase operation, can reach best circuit screening effect.
Description of drawings
Fig. 1 is the extinction black stiffening plate profile for printed circuit board (PCB) described in the utility model;
Fig. 2 is the profile that is fitted with release layer for the extinction black stiffening plate of printed circuit board (PCB) described in the utility model.
Embodiment
Below by particular specific embodiment embodiment of the present utility model is described, those of ordinary skills can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can other different mode be implemented, and, under the category that does not disclose departing from the utility model, can give different modifications and change that is.
Embodiment: a kind of extinction black stiffening plate for printed circuit board (PCB), as shown in Figure 1, consist of by extinction black polyamide composite membrane 10 with for the adhesion coating 14 that described extinction black polyamide composite membrane is adhered on the printed circuit board (PCB), described extinction black polyamide composite membrane 10 is by two-layer extinction black polyamide film 11, some strata imide layer 12 and some layers of adhesion agent layer 13 consist of, described some strata imide layer 12 are between described two-layer extinction black polyamide film 11, bonding by described adhesion agent layer 13 between described polyimide layer 12 and the described extinction black polyamide film 11, bonding by described adhesion agent layer 13 between the adjacent described polyimide layer 12, wherein, the gross thickness Z of described extinction black polyamide composite membrane 10 meets the following formula relation:
2T+mX+nY?=Z
In the formula, the described extinction black polyamide rete number of 2 expressions; M represents the described polyimide layer number of plies; N represents the described adhesion agent layer number of plies; T represents the thickness of described extinction black polyamide film, and T is 0.5 to 2mil; X represents the thickness of described polyimide layer, and X is 1 to 2 mil; And Y represents the thickness of described adhesion agent layer, and Y value is decided according to specific Z value.
During implementation, when Z is 3, then T is 0.5mil, m be 1 and X be 1mil; When Z is 4, then T is 0.5mil, m be 1 and X be 1mil; When Z is 5, then T is 0.5mil, m be 1 and X be that 2mil or m are 2; When Z is that 6, T is 0.5mil, then m is 2 or 3, or T is 1mil, and then m is 1 or 2; When Z is that 7, T is 0.5mil, then m is 2 or 3, or T is 1mil, and then m is 2 or 3; When Z is that 8, T is 0.5-2mil, then m is selected from one of 2,3 and 4; When Z is that 9, T is 0.5-2mil, then m is 3 or 4.Wherein, the symmetry of extinction black polyamide film and polyimide layer can reduce composite membrane and paste depth of camber to the circuit board, and two-layer extinction black polyamide film is conducive to the protective circuit pattern simultaneously.
Described adhesion coating 14 thickness are 10～40 μ m.
Described adhesion coating 14 is black adhesion coatings.
Described black adhesion coating is the epoxy resin layer that contains the black developer.
Described adhesion agent layer 13 is black adhesion agent layer.
Described adhesion agent layer 13 is thermmohardening black adhesion agent layer.
Described thermmohardening black adhesion agent layer is the epoxy resin layer that contains the black developer.
In above-mentioned black adhesion coating or above-mentioned thermmohardening black adhesion agent layer, described black developer is at least a in black pigment, carbon dust and the carbon nanotube, and by weight percentage, described black developer accounts for 3～15% of described epoxy resin solid content.
Described extinction black polyamide film, polyimide layer and solid kind are not particularly limited, and are preferably the not halogen-containing polyimide material of use and solid, and better is to use to have from stickiness and not halogen-containing solid.
The extinction black stiffening plate that the utility model is used for printed circuit board (PCB) can make by following method: at first, at extinction black polyamide film surface-coated one deck thermmohardening black solid, after placing the baking oven heat drying, with hot roller and another polyimide layer pressing, by that analogy, at last at extinction black polyamide film surface-coated one deck thermmohardening black solid, after placing the baking oven heat drying, with hot roller and the pressing of composite membrane semi-finished product, to the thickness of required extinction black polyamide composite membrane; Then, slaking 1 hour under 180 ℃ condition; At last, at this extinction black polyamide composite membrane surface-coated adhesion coating, be formed for the extinction black stiffening plate sample of printed circuit board (PCB).
In order to keep the viscosity of described adhesion coating 14, be beneficial to follow-up be bonded in circuit board or the use of other pressure programmings, as shown in Figure 2, can unify layer release layer 15(release liners or release film at described adhesion coating 14 surface labels).
Prepare the extinction black stiffening plate that the utility model is used for printed circuit board (PCB) according to the data in the following table 1, other prepares the reference examples sample, the stiffening plate of this reference examples sample does not comprise extinction black polyamide film, uses general adhesion coating and adhesion agent layer, and all the other are the same with embodiment.The sticky material of the stiffening plate of embodiment and reference examples sample all is the pure glue (trade name D3410) that uses Sony Corporation to produce.Then, stiffening plate is cut into the size of 25cm * 25cm, and in being pressure bonded under 180 ℃ of conditions on the 3-Layer double-surface flexible copper foil substrate of 74.5 ± 1 μ m, carry out slaking with 160 ℃ condition again, again each embodiment sample and control sample are placed on the smooth flat, leave standstill 20 minutes after, measure the depth of camber of four corners, carry out the flatness test, the result is embedded in table 1.
Table 1
Prepare the extinction black stiffening plate that the utility model is used for printed circuit board (PCB) according to the data in the following table 2, other prepares the reference examples sample, the composite membrane of this reference examples sample does not comprise extinction black polyamide film, uses general adhesion coating and adhesion agent layer, and all the other are the same with embodiment.The sticky material of the stiffening plate of embodiment and reference examples sample all is the pure glue (trade name D3410) that uses Sony Corporation to produce.Then, stiffening plate is cut into the size of 25cm * 25cm, and in being pressure bonded under 180 ℃ of conditions on the 3-Layer double-surface flexible copper foil substrate of 74.5 ± 1 μ m, carry out slaking with 160 ℃ of conditions again, again each embodiment sample and control sample are placed on the smooth flat, leave standstill 20 minutes after, measure the depth of camber of four corners, carry out the flatness test, the result is embedded in table 2.
Table 2
Shown in table 1 and table 2 result, under the identical condition of gross thickness, compared to the composite membrane sample that does not use extinction black polyamide film and black adhesion coating, the depth of camber less of the utility model extinction black composite membrane, thereby has a better flatness, and along with gross thickness increases, flatness is more obvious.
Above-mentioned specification and embodiment only are exemplary illustration principle of the present utility model and effect thereof, are not to be to restriction of the present utility model.Any creation that falls in the utility model claim scope all belongs to the scope that the utility model is protected.
Claims (6)
1. extinction black stiffening plate that is used for printed circuit board (PCB), it is characterized in that: consist of by extinction black polyamide composite membrane (10) with for the adhesion coating (14) that described extinction black polyamide composite membrane is adhered on the printed circuit board (PCB), described extinction black polyamide composite membrane (10) is by two-layer extinction black polyamide film (11), some strata imide layer (12) and some layers of adhesion agent layer (13) consist of, described some strata imide layer (12) are positioned between the described two-layer extinction black polyamide film (11), bonding by described adhesion agent layer (13) between described polyimide layer (12) and the described extinction black polyamide film (11), bonding by described adhesion agent layer (13) between the adjacent described polyimide layer (12), wherein, the gross thickness Z of described extinction black polyamide composite membrane (10) meets the following formula relation:
2T+mX+nY?=Z
In the formula, the described extinction black polyamide rete number of 2 expressions; M represents the described polyimide layer number of plies; N represents the described adhesion agent layer number of plies; T represents the thickness of described extinction black polyamide film, and T is 0.5 to 2mil; X represents the thickness of described polyimide layer, and X is 1 to 2 mil; And Y represents the thickness of described adhesion agent layer, and Y value is decided according to specific Z value.
2. the extinction black stiffening plate for printed circuit board (PCB) according to claim 1, it is characterized in that: described adhesion coating (14) thickness is 10～40 μ m.
3. the extinction black stiffening plate for printed circuit board (PCB) according to claim 2, it is characterized in that: described adhesion coating (14) is the black adhesion coating.
4. the extinction black stiffening plate for printed circuit board (PCB) according to claim 1, it is characterized in that: described adhesion agent layer (13) is the black adhesion agent layer.
5. the extinction black stiffening plate for printed circuit board (PCB) according to claim 4, it is characterized in that: described adhesion agent layer (13) is thermmohardening black adhesion agent layer.
6. the extinction black stiffening plate for printed circuit board (PCB) according to claim 1, it is characterized in that: the surface of described adhesion coating (14) is fitted with one deck release layer (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220571090 CN202889773U (en) | 2012-11-01 | 2012-11-01 | Matte black reinforcement plate for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220571090 CN202889773U (en) | 2012-11-01 | 2012-11-01 | Matte black reinforcement plate for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202889773U true CN202889773U (en) | 2013-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220571090 Withdrawn - After Issue CN202889773U (en) | 2012-11-01 | 2012-11-01 | Matte black reinforcement plate for printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN202889773U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796419A (en) * | 2012-11-01 | 2014-05-14 | 昆山雅森电子材料科技有限公司 | Light-extinction black reinforcing plate used for printed circuit board |
-
2012
- 2012-11-01 CN CN 201220571090 patent/CN202889773U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796419A (en) * | 2012-11-01 | 2014-05-14 | 昆山雅森电子材料科技有限公司 | Light-extinction black reinforcing plate used for printed circuit board |
| CN103796419B (en) * | 2012-11-01 | 2017-08-01 | 昆山雅森电子材料科技有限公司 | Extinction black stiffening plate for printed circuit board (PCB) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130417 Effective date of abandoning: 20170801 |