CN203912306U - Laminating protective ink for circuit board - Google Patents
Laminating protective ink for circuit board Download PDFInfo
- Publication number
- CN203912306U CN203912306U CN201320754867.7U CN201320754867U CN203912306U CN 203912306 U CN203912306 U CN 203912306U CN 201320754867 U CN201320754867 U CN 201320754867U CN 203912306 U CN203912306 U CN 203912306U
- Authority
- CN
- China
- Prior art keywords
- ink
- lamination
- layer
- heat
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 31
- 238000010030 laminating Methods 0.000 title abstract 8
- 239000010410 layer Substances 0.000 claims abstract description 42
- 239000012790 adhesive layer Substances 0.000 claims abstract description 12
- 238000003475 lamination Methods 0.000 claims description 45
- 150000001875 compounds Chemical class 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 8
- 229920002799 BoPET Polymers 0.000 claims description 5
- 229920006254 polymer film Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract 3
- 239000002131 composite material Substances 0.000 abstract 2
- 239000010408 film Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000806 elastomer Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 239000005041 Mylar™ Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 229920005749 polyurethane resin Polymers 0.000 description 4
- 229920002545 silicone oil Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 241001232787 Epiphragma Species 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229920006269 PPS film Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model relates to protective ink for a printed circuit board, in particular to laminating protective ink for the circuit board and with good conductivity. The laminating protective ink for the circuit board is characterized by comprising a four-layer structure of a heat-resisting laminating protective thin film layer, a composite ink layer, an adhesive layer and a release protective film layer sequentially from top to bottom. The laminating protective ink for the circuit board is advantageous in that the composite ink layer of the laminating protective ink contains cooling particles with an excellent cooling effect, so that the laminating protective ink has the advantage of high cooling efficiency. Due to the fact that an elastic body is added in the laminating protective ink, the whole ink layer has high flexibility, and the problems of fracturing and falling off will not occur.
Description
Technical field
The utility model relates to the protection ink that a kind of printed substrate is used, and the wiring board that especially a kind of thermal conductivity is good is used can lamination protection ink.
Background technology
Printed substrate is material indispensable in electronic product, and computer and ancillary equipment thereof, communication product and consumption electronic products etc. are at present widely used.And along with the sustainable growth of consumption electronic products demand, for the requirement of printed circuit board (PCB), also grow with each passing day.
Printed substrate mainly comprises copper clad laminate (FCCL or CCL) and protection epiphragma or printing-ink and forms.Protection epiphragma is that thin polymer film PET, PEN or PI coating one deck adhesive form, and is mainly used in flexible copper clad foil substrate (FCCL); Printing-ink is all widely used in flexible copper clad foil substrate (FCCL) and hardboard (CCL).
Existing ink, in the process of using, need to pass through a series of courses of processing such as allotment, dilution, silk-screen, oven dry, solvent evaporates contaminated air, workers ' health is impacted, operation is various, and ink for screen printing baking controls and not goodly can cause gross distortion, and the problem such as chap or come off.The long-term adhesive force of ink, without collateral security, causes circuit oxidation, affect electronic product use.
Utility model content
In order to overcome above-mentioned defect, the purpose of this utility model is to provide a kind of wiring board with protecting ink by lamination, and this ink has good thermal diffusivity and pliability simultaneously.Of the present utility model can lamination protection ink can directly by conventional FPC manufacturing procedures such as boring, stamps, carry out production and application.
To achieve these goals; the technical scheme that the utility model adopts is: a kind of wiring board is with protecting ink by lamination; it is characterized in that, comprise successively four-layer structure from top to bottom: heat-resisting lamination protective film layer, compound oil ink layer, adhesive layer and release protective film.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described heat-resisting lamination protective film layer is one deck high molecular polymer film, is heat-resisting PET, PEN, PI, PBT or PPS film.
Aforesaid a kind of wiring board is with protecting ink by lamination; described heat radiation ink layer is mixed and processed by ink and heat sink material; ink is one or more the mixture in epoxy resin, polyacrylic resin, polyimide resin, elastomer, phenolic resins, mylar, polyurethane resin, and heat sink material is one or more the mixture in aluminium oxide, aluminium nitride, carborundum and boron nitride.Heat radiation ink layer is existing in the prior art.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described adhesive layer is epoxy resin, polyacrylic resin, polyimide resin, phenolic resins, elastomer, mylar or polyurethane resin.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described release protective film is the release protective material layer that is coated with silicone oil or non-silicone oil mould release.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described heat-resisting lamination protective film layer is that thickness is 25-200um.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described compound oil ink layer thickness is 5-100um.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described adhesive layer thickness is 5-100um.
The beneficial effects of the utility model are: of the present utility modelly can lamination contain the heat radiation particle with good heat-radiating effect in the compound oil ink layer of protection ink, make to have advantages of that radiating efficiency is high by lamination protection ink; Of the present utility model can lamination in protection ink owing to adding elastomer, whole ink layer is had higher flexible, the problem can not chap, coming off.
Accompanying drawing explanation
Fig. 1 be implementation method one wiring board with can lamination the profile of protection ink;
Fig. 2 be implementation method two wiring board with can lamination the profile of protection ink.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Can comprise four-layer structure by lamination protection ink: the heat-resisting lamination protective film of an one deck layer, one deck has the compound oil ink layer of heat radiation, insulation function, one deck adhesive layer, the release protective film of one deck.
Can protect the related heat-resisting lamination protective film layer of ink by lamination, for one deck high molecular polymer film, mainly compound oil ink layer be played to lamination protective effect and carrier function.This film can be heat-resisting PET, PEN, PI, PBT or PPS film, and thickness is 25-200um.
Can lamination the related one deck heat radiation of protection ink, a heat radiation ink layer for insulation function, can be one or more the mixture in modified epoxy, polyacrylic resin, polyimide resin, elastomer, phenolic resins, mylar, polyurethane resin.The material of selected heat sinking function is one or more the mixture in aluminium oxide, aluminium nitride, carborundum and boron nitride.Also can be the structure of the ink layer that dispels the heat in prior art.The thickness of heat radiation ink layer is 5-100um.
A kind of can lamination the related adhesive layer of protection ink be one or more the mixture in modified epoxy, polyacrylic resin, polyimide resin, phenolic resins, elastomer, mylar, polyurethane resin.The thickness of this layer is 5-100um.
Can lamination the related release protective film of protection ink for thering is a light peel property, be coated with the release protective material of silicone oil or non-silicone oil mould release, a kind of in PET release film, PP release film, PBT release film, release liners.
A kind of can lamination the implementation method one of protection ink:
On heat-resisting lamination protective film layer 11, coating forms the compound oil ink layer 12(ink layer that dispels the heat), on compound oil ink layer 12, coating forms adhesive layer 13, the release protective film 14 of fitting on adhesive layer 13, complete can lamination protection ink production.Structure is as shown in figure mono-.
A kind of can lamination the implementation method two of protection ink:
On heat-resisting lamination protective film layer 11, coating forms compound oil ink layer 12, and on compound oil ink layer 12, coating forms adhesive layer 13, directly rolling, complete can lamination protection ink production.Structure as shown in Figure 2.
Above implementation method one and implementation method two differences having or not at release diaphragm 14; it is one side release material that the heat-resisting lamination protective film layer 11 of implementation method one can be selected inner face, but heat-resisting lamination protective film layer in implementation method two 11 is selected two-sided release material.
Related compound oil ink layer 12 in the utility model, the embodiment of adhesive layer 13 as shown in Table 1.In embodiment, lamination is 180 ℃, preheating in 10 seconds, and pressing in 60 seconds, pressure is 100kgf/cm
2.Comparative example is commercially available finished product.As shown in Table 1, add after conductive powder, conductive coefficient significantly increases, and heat conductivility obviously strengthens.
Table one
Above-described embodiment does not limit the utility model in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops on protection range of the present utility model.
Claims (5)
1. wiring board, with protecting an ink by lamination, is characterized in that, comprises successively four-layer structure from top to bottom: heat-resisting lamination protective film layer, heat radiation ink layer, adhesive layer and release protective film.
2. a kind of wiring board according to claim 1, with protecting ink by lamination, is characterized in that: described heat-resisting lamination protective film layer is one deck high molecular polymer film, is heat-resisting PET film.
3. a kind of wiring board according to claim 2, with protecting ink by lamination, is characterized in that: described heat-resisting lamination protective film layer is that thickness is 25-200um.
4. a kind of wiring board according to claim 3, with protecting ink by lamination, is characterized in that: described compound oil ink layer thickness is 5-100um.
5. a kind of wiring board according to claim 4, with protecting ink by lamination, is characterized in that: described adhesive layer thickness is 5-100um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320754867.7U CN203912306U (en) | 2013-11-26 | 2013-11-26 | Laminating protective ink for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320754867.7U CN203912306U (en) | 2013-11-26 | 2013-11-26 | Laminating protective ink for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203912306U true CN203912306U (en) | 2014-10-29 |
Family
ID=51786546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320754867.7U Expired - Lifetime CN203912306U (en) | 2013-11-26 | 2013-11-26 | Laminating protective ink for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203912306U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103619121A (en) * | 2013-11-26 | 2014-03-05 | 苏州城邦达力材料科技有限公司 | Laminating protective ink for circuit board |
| CN107787119A (en) * | 2016-08-30 | 2018-03-09 | 台虹科技股份有限公司 | Cover film for circuit board stamping process and manufacturing method of circuit board |
-
2013
- 2013-11-26 CN CN201320754867.7U patent/CN203912306U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103619121A (en) * | 2013-11-26 | 2014-03-05 | 苏州城邦达力材料科技有限公司 | Laminating protective ink for circuit board |
| CN107787119A (en) * | 2016-08-30 | 2018-03-09 | 台虹科技股份有限公司 | Cover film for circuit board stamping process and manufacturing method of circuit board |
| TWI634817B (en) * | 2016-08-30 | 2018-09-01 | 台虹科技股份有限公司 | Cover film for circuit board punching process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141029 |
|
| CX01 | Expiry of patent term |