CN204616270U - A kind of high-effect Low-cost electric magnetic shield film - Google Patents
A kind of high-effect Low-cost electric magnetic shield film Download PDFInfo
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- CN204616270U CN204616270U CN201520303253.6U CN201520303253U CN204616270U CN 204616270 U CN204616270 U CN 204616270U CN 201520303253 U CN201520303253 U CN 201520303253U CN 204616270 U CN204616270 U CN 204616270U
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- 239000010410 layer Substances 0.000 claims abstract description 58
- 239000012790 adhesive layer Substances 0.000 claims abstract description 18
- 229920001971 elastomer Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920002799 BoPET Polymers 0.000 claims description 5
- 239000005041 Mylar™ Substances 0.000 claims description 5
- 239000000806 elastomer Substances 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 229920005749 polyurethane resin Polymers 0.000 claims description 5
- 239000005060 rubber Substances 0.000 claims description 5
- 229920006269 PPS film Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 43
- 239000000203 mixture Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 7
- 239000011231 conductive filler Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000003306 harvesting Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The utility model discloses a kind of electromagnetic shielding film of high-effect low cost, this electromagnetic shielding film comprises: carrier film layer, coat the ink layer on carrier film layer and coat the conductive adhesive layer on ink layer, conductive adhesive layer gives the conduction property of electromagnetic shielding film excellence, conducting resistance, between 1cm electrode, can reach 0.3 Ω during perforate 0.5mm diameter; Ink layer has good insulating properties and excellent flame resistance, can reach UL94VTM-0 effect, meets the high instructions for use of flexible circuitry plate material.
Description
Technical field
The utility model relates to a kind of high-effect Low-cost electric magnetic shield film, belongs to electromangnetic spectrum field.
Background technology
In order to avoid electromagnetic radiation is to the threat of health, avoid the signal disturbing that electromagnetic radiation causes, the requirement for electromagnetic shielding in electronic product is more and more higher simultaneously, therefore, the circuit of flexible circuit board can use electromagnetic shielding membrane material in a large number.And electromagnetic shielding film material fabrication process of the prior art is complicated, and noble silver can be used in a large number, cause the cost of electromagnetic shielding film to remain high, finally have impact on the price of electronic product, make the competitiveness of product in market not enough.
Utility model content
For solving the deficiencies in the prior art, the purpose of this utility model is the electromagnetic shielding film providing a kind of high-effect low cost.
In order to realize above-mentioned target, the utility model adopts following technical scheme:
A kind of high-effect Low-cost electric magnetic shield film, comprising: carrier film layer, coat the ink layer on carrier film layer and coat the conductive adhesive layer on ink layer, constitutes " three layers of electromagnetic shielding film " of low cost.
Further, on aforesaid conductive adhesive layer, also hot pressing is fitted with one deck release film layer, is " four layers of electromagnetic shielding film ".
Preferably, aforementioned bearer thin layer is the modified film of one or more of PET, PEN, PI, PBT and PPS film, and thickness is 25-200 μm.
More preferably, aforementioned ink layer is the mixture of one or more in epoxy resin, polyacrylic resin, rubber elastomer, phenolic resins, mylar and polyurethane resin, and thickness is 5-50 μm.
Preferably, aforesaid conductive adhesive layer thickness is 3-15 μm, is mixed and forms, optimize the conduction property of electromagnetic shielding film further by resin binder and conductive filler; Described resin binder is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, rubber elastomer, phenolic resins, mylar, polyurethane resin; Described conductive filler is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, and the particle diameter of conductive filler is 1-15 μm, and shape is sheet shape, spherical, oval or dendriform.
More preferably, aforementioned release film layer is the one in PET release film, PP release film, PBT release film or release liners, and thickness is 25-200 μm.
Usefulness of the present utility model is: electromagnetic shielding film cost of the present utility model is low and performance good, and conductive adhesive layer gives the conduction property of electromagnetic shielding film excellence, and conducting resistance, between 1cm electrode, can reach 0.3 Ω during perforate 0.5mm diameter; Ink layer has good insulating properties and excellent flame resistance, can reach UL94VTM-0 effect, meets the Special use requirement of flexible circuitry plate material.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1 " four layers of electromagnetic shielding film " of the present utility model;
Fig. 2 is the structural representation of embodiment 2 " three layers of electromagnetic shielding film " of the present utility model.
The implication of Reference numeral in figure: 1, carrier film layer, 2, ink layer, 3, conductive adhesive layer, 4, release film layer.
Embodiment
Below in conjunction with the drawings and specific embodiments, concrete introduction is done to the utility model.
Embodiment 1
" four layers of electromagnetic shielding film " of the present embodiment has low cost, dynamical feature, its structure as shown in Figure 1, comprise: carrier film layer 1, the conductive adhesive layer 3 coated the ink layer 2 on carrier film layer 1 and coat on ink layer 2, on conductive adhesive layer 3, also hot pressing is fitted with one deck release film layer 4.
Carrier film layer 1 is high-temperature resistant carrier, is high molecular polymer film, and mainly to ink layer 2 lamination protections and carrier function, be specifically as follows the modified film of one or more of PET, PEN, PI, PBT and PPS film, thickness is 25-200 μm.
Ink layer 2 can be the mixture of one or more in epoxy resin, polyacrylic resin, rubber elastomer, phenolic resins, mylar and polyurethane resin, and thickness is 5-50 μm.Also contain the functional materials such as fire retardant, colorant, inorganic filler and dispersant in ink layer 2 simultaneously, fire retardant can be the organic compound of phosphorous, nitrogenous class, colorant can be one or more mixtures in carbon black, graphite, titanium dioxide, inorganic filler can be one or more mixtures in silicon dioxide, calcium carbonate, talcum powder, kaolin, dispersant is the auxiliary agent improving dispersive property, can be one or more mixtures in polyester-type, polyether-type, polyacrylate, TPO.This ink layer 2 has rapid curing, softness and good insulated type, and flame resistance is also very excellent.
Conductive adhesive layer 3 thickness is 3-15 μm, is mixed and forms, optimize the conduction property of electromagnetic shielding film further by resin binder and conductive filler.Wherein, resin binder is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, rubber elastomer, phenolic resins, mylar, polyurethane resin; Conductive filler is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, and the particle diameter of conductive filler is 1-15 μm, various shapes, can be sheet shape, spherical, oval or dendriform.
Release film layer 4 gives the characteristic that electromagnetic shielding film is easily peeled off, and adopt the rationality protective material being coated with silicone oil or non-silicone oil mould release, specifically can be the one in PET release film, PP release film, PBT release film or release liners, thickness is 25-200 μm.
In order to understand the utility model better, briefly introduce the manufacture method of this " four layers of electromagnetic shielding film " below, manufacture method has two kinds, and first method step is:
A-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
A-2, the ink layer 2 prepared in the coating of carrier thin film volume inner face;
A-3, ink layer 2 carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
A-4, be then coated with one deck conductive adhesive layer 3 on ink layer 2 surface, and dry through coater oven, and coater oven set temperature is 30-80 DEG C, and linear velocity is set to 5-30m/min;
A-5, on conductive adhesive layer 3 hot pressing to fit one deck release film layer 4;
A-6, harvest volume.
Except adopting aforesaid manufacture method, also can adopt following steps manufacture:
B-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
B-2, the ink layer 2 prepared in the coating of carrier thin film volume inner face;
B-3, ink layer 2 carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
B-4, by carrier film layer 1 rolling of coated ink layer 2;
B-5, on release film layer 4, be coated with one deck conductive adhesive layer 3, and dry through coater oven, and coater oven set temperature is 30-80 DEG C, and linear velocity is set to 5-30m/min;
B-6, the ink layer 2 on carrier thin film and the conductive adhesive layer 3 on release film layer 4 are carried out hot pressing laminating;
B-7, harvest volume.
Embodiment 2
The electromagnetic shielding film of the present embodiment is three-decker, and compared to embodiment 1, difference part is the release film layer 4 eliminated, and under the prerequisite not affecting properties of product, can reduce product cost further, its manufacture method comprises the steps:
C-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
C-2, the ink layer 2 prepared in the coating of carrier thin film volume inner face;
C-3, ink layer 2 carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
C-4, be then coated with one deck conductive adhesive layer 3 on ink layer 2 surface, and dry through coater oven, and coater oven set temperature is 30-100 DEG C, and linear velocity is set to 5-30m/min;
C-5, harvest volume.
To sum up, electromagnetic shielding film of the present utility model has excellent conduction property, and conducting resistance, between 1cm electrode, can reach 0.3 Ω during perforate 0.5mm diameter; And ink layer 2 has good insulating properties and excellent flame resistance, can reach UL94VTM-0 effect, has the good prospect industrially applied.
More than show and describe general principle of the present utility model, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the utility model in any form, the technical scheme that the mode that all employings are equal to replacement or equivalent transformation obtains, and all drops in protection range of the present utility model.
Claims (6)
1. a high-effect Low-cost electric magnetic shield film, is characterized in that, comprising: carrier film layer, coat the ink layer on carrier film layer and coat the conductive adhesive layer on ink layer.
2. the high-effect Low-cost electric magnetic shield film of one according to claim 1, is characterized in that, on described conductive adhesive layer, also hot pressing is fitted with one deck release film layer.
3. the high-effect Low-cost electric magnetic shield film of one according to claim 1, is characterized in that, described carrier film layer is the one of PET, PEN, PI, PBT and PPS film, and thickness is 25-200 μm.
4. the high-effect Low-cost electric magnetic shield film of one according to claim 1, it is characterized in that, described ink layer is the one in epoxy resin, polyacrylic resin, rubber elastomer, phenolic resins, mylar and polyurethane resin, and thickness is 5-50 μm.
5. the high-effect Low-cost electric magnetic shield film of one according to claim 1, is characterized in that, described conductive adhesive layer thickness is 3-15 μm.
6. the high-effect Low-cost electric magnetic shield film of one according to claim 2, is characterized in that, described release film layer is the one in PET release film, PP release film, PBT release film or release liners, and thickness is 25-200 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520303253.6U CN204616270U (en) | 2015-05-12 | 2015-05-12 | A kind of high-effect Low-cost electric magnetic shield film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520303253.6U CN204616270U (en) | 2015-05-12 | 2015-05-12 | A kind of high-effect Low-cost electric magnetic shield film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204616270U true CN204616270U (en) | 2015-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520303253.6U Expired - Fee Related CN204616270U (en) | 2015-05-12 | 2015-05-12 | A kind of high-effect Low-cost electric magnetic shield film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204616270U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135641A (en) * | 2017-07-11 | 2017-09-05 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film of novel metalloid system and preparation method thereof |
| CN107172873A (en) * | 2017-07-11 | 2017-09-15 | 苏州城邦达力材料科技有限公司 | A kind of conducting polymer composite electromagnetic shielding film and preparation method thereof |
| CN109475075A (en) * | 2018-12-28 | 2019-03-15 | 浙江东尼电子股份有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
-
2015
- 2015-05-12 CN CN201520303253.6U patent/CN204616270U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135641A (en) * | 2017-07-11 | 2017-09-05 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film of novel metalloid system and preparation method thereof |
| CN107172873A (en) * | 2017-07-11 | 2017-09-15 | 苏州城邦达力材料科技有限公司 | A kind of conducting polymer composite electromagnetic shielding film and preparation method thereof |
| CN109475075A (en) * | 2018-12-28 | 2019-03-15 | 浙江东尼电子股份有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150902 |