CN105283056A - Electromagnetic wave interference shielding film - Google Patents
Electromagnetic wave interference shielding film Download PDFInfo
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- CN105283056A CN105283056A CN201410335469.0A CN201410335469A CN105283056A CN 105283056 A CN105283056 A CN 105283056A CN 201410335469 A CN201410335469 A CN 201410335469A CN 105283056 A CN105283056 A CN 105283056A
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Abstract
The invention relates to an electromagnetic wave interference shielding film. The electromagnetic wave interference shielding film comprises an electromagnetic wave absorbing layer containing electromagnetic wave absorbing particles; a conductive layer containing conductive particles and positioned on one surface of the electromagnetic wave absorbing layer; a metal layer positioned on the other surface of the electromagnetic wave absorbing layer; and an insulating layer positioned on the metal layer. The electromagnetic wave interference shielding film effectively prevents electromagnetic waves from interfering with contiguous lines and assembles.
Description
Technical field
The present invention is about a kind of structure of resisting Electromagnetic Interference, and for electronic installation, wire rod and assembly, the electromagnetic interference shielding film of such as printed circuit board (PCB), especially about the structure of the opposing Electromagnetic Interference for soft electronic material substrate.
Background technology
Along with portable electronic and communication product is frivolous and the multi-functional market demand, the IC structure dress of circuit substrate needs lighter, thin, short, little, functionally then needs powerful and signal transmission at a high speed.Therefore, the density of I/O pin number certainly will improve, and also increases along with pin number order thereupon.Distance between IC support plate circuit is more and more nearer, add that operating frequency is broadband towards height, make the electromagnetic interference (Electromagneticinterference between IC, EMI) situation is more and more serious, therefore how effectively management of EMC, maintaining electronic product normal signal transmission and improving reliability to become important issue.
General solution soft board electromagnetic interference problem, can by routing path design example as designed the cabling of complexity, a signal transmitting layer can be adopted to arrange in pairs or groups a ground plane, so can reduce electromagnetic interference.Another kind of mode, can be combined with the masking material of electromagnetic interference protective function to guarantee good ground connection effect, and then reach the object suppressing electromagnetic interference by soft board signal lead.
The electromagnetic interference masking material seen on the market utilizes conductive label glued membrane, normally with vacuum splashing and plating or chemical deposition mode, the conductive metal films such as single or multiple lift such as silver, copper or nickel are amassed in Shen on conductive label adhesive film material, promote conductive label adhesive film material whereby to the screening capacity of electromagnetic interference.Conductive label adhesive film material is mainly arranged in pairs or groups by electroconductive particle and is had the macromolecular material of certain curing cross-linking reaction degree B-stage.
The electronics of high power running or electric device inevitably will in the face of the problems of heat radiation.The hot type that electronics or electric device produce falls apart by the extra equipment of traditional solution device, such as, install the forced convertion system be made up of one or more fan additional.Such as, but small-sized or miniature electronic building brick such as CPU is used in a little space, installs on a printed circuit, additional space is not had to solve heat dissipation problem for installing forced convertion system.
Have prior art to disclose a kind of high thermal conductivity composite magnetic body, as shown in Figure 1, the electromagnetic interference suppressor 10 of composite magnetic body comprises the composite magnetic body 1 of conductivity support 4 and two sides lamination thereof, and wherein conductivity support 4 is such as conducting fibre fabric; Composite magnetic body 1, at organic bond 2, such as, in polyethylene-based resin or polyester based resin, adds the soft magnetic powder 3 in order to electromagnetic wave absorption, wherein soft magnetic powder 3 such as Fe-Al-Si alloy or Fe-Ni alloy/C.Composite magnetic body 1 utilizes the high-frequency absorption of many permeabilities of soft magnetic powder 3, can suppress the interference of unwanted electromagnetic wave.But the organic bond that the formation of this composite magnetic body 1 uses, easily because the impact of being heated, produces the shortcoming such as distortion, deterioration.And the heat conductivity of organic bond is not good, can hinder the heat radiation of the electronic building brick that caloric value is large.The problem that the used heat row that above-mentioned electromagnetic interference suppressor 10 cannot solve EMI Electromagnetic Interference and electronic installation generation simultaneously falls apart.
Summary of the invention
The object of the present invention is to provide a kind of electromagnetic interference shielding film, conductive layer wherein contains conducting particles, except can reducing the resistance value of conductive layer, more can significantly lower because electromagnetic wave enters the heat that this electromagnetic interference shielding film produces, and electromagnetic wave absorbing layer contains electromagnetic wave absorbent material, electromagnetic interference shielding function can be promoted.
In order to reach the object of the invention described above, proposing a kind of electromagnetic interference shielding film, comprising: the electromagnetic wave absorbing layer containing electro-magnetic wave absorption particle, there is first surface and second; Conductive layer containing conducting particles, is positioned on the first surface of electromagnetic wave absorbing layer; Metal level, is positioned on second of electromagnetic wave absorbing layer; And insulating barrier, be positioned on metal level.Electromagnetic interference shielding film also comprises setting the first release film on the electrically conductive, and arranges the second release film on the insulating layer.
In order to reach the object of the invention described above, proposing a kind of electromagnetic interference shielding film in addition, comprising: the first electromagnetic wave absorbing layer containing electro-magnetic wave absorption particle, there is first surface and second; Conductive layer containing conducting particles, is positioned on the first surface of electromagnetic wave absorbing layer; The first metal layer, is positioned on second of the first electromagnetic wave absorbing layer; The second electromagnetic wave absorbing layer containing electro-magnetic wave absorption particle, is positioned on the first metal layer; Second metal level, is positioned on the second electromagnetic wave absorbing layer; And insulating barrier, be positioned on the second metal level.Electromagnetic interference shielding film also comprises setting the first release film on the electrically conductive, and arranges the second release film on the insulating layer.
The advantage that the present invention has is:
Electromagnetic interference shielding film of the present invention can produce following advantage: the conductive layer in electromagnetic interference shielding film contains conducting particles, except can reducing the resistance value of conductive layer, more can significantly lower because electromagnetic wave enters the heat that this electromagnetic interference shielding film produces, and electromagnetic wave absorbing layer contains electromagnetic wave absorbent material in electromagnetic interference shielding film, electromagnetic interference shielding function can be promoted.
Accompanying drawing explanation
Fig. 1: show traditional electromagnetic interference shielding film.
Fig. 2: the electromagnetic interference shielding film of display one embodiment of the invention.
Fig. 3: display electromagnetic wave incident is to the reflection of the electromagnetic interference shielding film of one embodiment of the invention and absorption.
Fig. 4: the electromagnetic interference shielding film of display another embodiment of the present invention.
In figure:
1 composite magnetic body; 2 organic bonds; 3 soft magnetic powders; 4 conductivity supports;
10 electromagnetic interference suppressors; 20 electromagnetic interference shielding films; 21 electromagnetic wave absorbing layers;
212 electro-magnetic wave absorption particles; 213 first surfaces; 214 second; 23 conductive layers;
232 conducting particless; 24 metal levels; 27 insulating barriers; 28 first release films; 29 release films;
30 electromagnetic interference shielding films; 31 first electromagnetic wave absorbing layers; 312 electro-magnetic wave absorption particles;
313 first surfaces; 314 second; 33 conductive layers; 332 conducting particless; 34 the first metal layers;
35 second electromagnetic wave absorbing layers; 352 electro-magnetic wave absorption particles; 36 second metal levels; 37 insulating barriers;
38 first release films; 39 second release films; The electromagnetic wave of I incidence; R1 reflected wave;
R21 primary reflection; R22 secondary counter ejected wave; R31 reflected wave; R32 reflected wave;
R41 reflected wave; R42 reflected wave; R51 reflected wave; R52 reflected wave; T penetrated wave.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, can better understand the present invention and can be implemented, but illustrated embodiment is not as a limitation of the invention to make those skilled in the art.
Please refer to Fig. 2, Fig. 2 shows the present invention and to generate heat the electromagnetic interference shielding film of an embodiment, and as shown in Figure 2, electromagnetic interference shielding film 20, comprising: the electromagnetic wave absorbing layer 21 containing electro-magnetic wave absorption particle 212, has first surface 213 and the second face 214; Conductive layer 23 containing conducting particles 232, is positioned on the first surface 213 of electromagnetic wave absorbing layer 21; Metal level 24, is positioned on the second face 214 of electromagnetic wave absorbing layer 21; And insulating barrier 27, be positioned on metal level 24.Electromagnetic interference shielding film 20 also comprises the first release film 28 be arranged on conductive layer 23, and is arranged on the second release film 29 on insulating barrier 27.
The material of electromagnetic wave absorbing layer 21 is epoxy resin or acryl resin.The electro-magnetic wave absorption particle 212 be dispersed in electromagnetic wave absorbing layer 21 can be particles such as iron oxide, sendust, permalloy or iron silicochromium nickel alloy.Utilize the high-frequency absorption of many permeabilities of particles, electromagnetic interference can be suppressed.In addition, electro-magnetic wave absorption particle 212 also can be calcium carbonate, cement, natural crystal, far infrared ore materials.The content of electro-magnetic wave absorption particle 212 can be 5wt%-30wt%.The thickness of electromagnetic wave absorbing layer 21 is 5 microns to 20 microns.
The material of conductive layer 23 is epoxy resin or acryl resin.The conducting particles 232 be dispersed in conductive layer 23 is gold, silver, copper, aluminium, nickel, iron or tin metal particle, surface-coated have the copper of silver or aluminum metal particle, surface-coated have resin particle or the bead of gold, silver, copper, aluminium, nickel, iron or tin or carbon dust, carbon 60, carbon black, graphite, expanded graphite, carbon nanotube or Graphene.The content of conducting particles 232 can be 15wt%-40wt%.The thickness of conductive layer 23 is 15 microns to 40 microns.Conductive layer 23, containing conducting particles 232, outside the resistance value that not only can reduce conductive layer 23, more can significantly lower because electromagnetic wave enters the heat that this electromagnetic interference shielding film 20 produces.
Metal level 24 mainly provides the function of electromagnetic wave shielding.The material of metal level 24 can be gold, silver, copper, aluminium, nickel, titanium or tin, is preferably silver or aluminium.Metal level 24 thickness can be 0.05 micron to 5 microns.Metal level 24 can utilize the filming equipments such as vacuum evaporation, sputter, plating, vacuum moulding machine, chemical vapour deposition (CVD) (CVD), by volume to volume (roll-to-roll) mode, completes continuous coating.In addition, metal level 24 does not limit and uses aforesaid way to carry out plated film, and metal forming also can be selected as another selection of metal level 24.
Insulating barrier 27, is positioned on metal level 24.Form the mode of insulating barrier 27, can paste the special coverlay of soft board on metal level 24, wherein composition comprises: hard formation is PI, and soft formation is Epoxy resin.Forming the other mode of insulating barrier 27 for use insulating cement merely, such as, is epoxy resin, acryl resin or can through UV/ electron beam curing resin.Preferably insulating cement can not flow out from the second release film 29.The thickness of insulating barrier 27 can be 5 microns to 50 microns.
First release film 28 for be made by engineering plastics, the engineering plastic materials that the macromolecules such as such as polypropylene (PP), (interlinkage) polyethylene (PE), Merlon (PC), polyester (PET), polyimides (PI), polyimide amide (PAI), Polyetherimide (PEI), epoxy resin (Epoxy), polyurethane resin and acryl resin (Acrylic) are formed.In addition, the first release film 28 also can select release liners or the engineering plastics film containing mould release.The function of the first release film 28 is that protection conductive layer 23 prevents from being subject to the pollution of external environment (as hydrolysis, dust ... etc.), when this electromagnetic interference shielding film 20 uses, the first release film 28 can be torn off.The thickness of the first release film 28 can be 7.5 microns to 50 microns.
Second release film 29 is made by engineering plastics, the engineering plastic materials that the macromolecules such as such as polypropylene (PP), (interlinkage) polyethylene (PE), Merlon (PC), polyester (PET), polyimides (PI), polyimide amide (PAI), Polyetherimide (PEI), epoxy resin (Epoxy), polyurethane resin and acryl resin (Acrylic) are formed.In addition, the second release film 29 also can select release liners or the engineering plastics film containing mould release.The function of the second release film 29 is that protection insulating barrier 27 prevents from being subject to the pollution of external environment (as hydrolysis, dust ... etc.), when this electromagnetic interference shielding film 20 uses, the second release film 29 can be torn off.The thickness of the second release film 29 can be 7.5 microns to 50 microns.
Then, please refer to Fig. 3, Fig. 3 shows electromagnetic wave incident to the reflection of the electromagnetic interference shielding film of one embodiment of the invention and absorption.As shown in Figure 3, when the electromagnetic wave I of incidence runs into electromagnetic interference shielding film 20 of the present invention, a part becomes reflected wave R1 from conductive layer 23 surface reflection, another part penetrates conductive layer 23 of the present invention and electromagnetic wave absorbing layer 21 becomes penetrated wave T, penetrated wave T encounters metal level 24 surface reflection and returns to become primary reflection R21 and meet the secondary counter ejected wave R22 that electromagnetic wave absorbing layer 21 inner surface reflects again afterwards, secondary counter ejected wave R22 encounters metal level 24 surface reflection and returns to become reflected wave R31 and meet the reflected wave R32 that electromagnetic wave absorbing layer 21 internal surface reflection returns, reflected wave R32 encounters metal level 24 surface reflection and returns to become reflected wave R41 and meet the reflected wave R42 that electromagnetic wave absorbing layer 21 internal surface reflection returns, reflected wave R42 encounters metal level 24 surface reflection and returns to become reflected wave R51 and meet the reflected wave R52 that electromagnetic wave absorbing layer 21 internal surface reflection returns, continue to carry out making electromagnetic wave have multipath reflection and multi-absorption in electromagnetic wave absorbing layer 21.By the electromagnetic property controlling electro-magnetic wave absorption particle 212 in electromagnetic wave absorbing layer 21, electromagnetic wave is allowed to have suitable amplitude and phase place multipath reflection in electromagnetic wave absorbing layer 21, electromagnetic wave is made to have multi-absorption in electromagnetic wave absorbing layer 21, and electromagnetic total volume reflection reduces, reach the lifting of electro-magnetic wave absorption efficiency.
Please refer to Fig. 4, Fig. 4 shows the electromagnetic interference shielding film of another embodiment of the present invention.Be that the electromagnetic interference shielding film of the present embodiment has two metal layers and two-layer absorbed layer with the difference of the 3rd figure embodiment, different types of metal level can cover the electromagnetic wave of different frequency.As shown in Figure 4, electromagnetic interference shielding film 30, comprising: the first electromagnetic wave absorbing layer 31 containing electro-magnetic wave absorption particle 312, has first surface 313 and the second face 314; Conductive layer 33 containing conducting particles 332, is positioned on the first surface 313 of the first electromagnetic wave absorbing layer 31; The first metal layer 34, is positioned on the second face 314 of the first electromagnetic wave absorbing layer 31; The second electromagnetic wave absorbing layer 35 containing electro-magnetic wave absorption particle 352, is positioned on the first metal layer 34; Second metal level 36, is positioned on the second electromagnetic wave absorbing layer 35; And insulating barrier 37, be positioned on the second metal level 36.Electromagnetic interference shielding film 30 also comprises the first release film 38 be arranged on conductive layer 33, and is arranged on the second release film 39 on insulating barrier 37.
The material of the first electromagnetic wave absorbing layer 31 and the second electromagnetic wave absorbing layer 35 is epoxy resin or acryl resin.The electro-magnetic wave absorption particle 312 be dispersed in the first electromagnetic wave absorbing layer 31 can be particles such as iron oxide, sendust, permalloy or iron silicochromium nickel alloy.The electro-magnetic wave absorption particle 352 be dispersed in the second electromagnetic wave absorbing layer 35 can be particles such as iron oxide, sendust, permalloy or iron silicochromium nickel alloy.Utilize the high-frequency absorption of many permeabilities of particles, electromagnetic interference can be suppressed.In addition, electro-magnetic wave absorption particle 312 and electro-magnetic wave absorption particle 352 also can be calcium carbonate, cement, natural crystal, far infrared ore materials.The content of electro-magnetic wave absorption particle 312 can be 5wt%-30wt%.The content of electro-magnetic wave absorption particle 352 can be 5wt%-30wt%.The thickness of the first electromagnetic wave absorbing layer 31 is 2 microns to 10 microns.The thickness of the second electromagnetic wave absorbing layer 35 is 2 microns to 10 microns.
The material of conductive layer 33 is epoxy resin or acryl resin.The conducting particles 332 be dispersed in conductive layer 33 is gold, silver, copper, aluminium, nickel, iron or tin metal particle, surface-coated have the copper of silver or aluminum metal particle, surface-coated have resin particle or the bead of gold, silver, copper, aluminium, nickel, iron or tin or carbon dust, carbon 60, carbon black, graphite, expanded graphite, carbon nanotube or Graphene.The content of conducting particles 232 can be 15wt%-40wt%.The thickness of conductive layer 33 is 15 microns to 40 microns.Conductive layer 33, containing conducting particles 332, outside the resistance value that not only can reduce conductive layer 33, more can significantly lower because electromagnetic wave enters the heat that this electromagnetic interference shielding film 30 produces.
The first metal layer 34 and the second metal level 36 mainly provide the function of electromagnetic wave shielding.The material of the first metal layer 34 can be the alloy of gold, silver, copper, aluminium, nickel, titanium, tin or above-mentioned metal, is preferably silver, aluminium or silver-aluminium alloy.The material of the second metal level 36 can be selected different from the material of the first metal layer 34, and different types of metal level can cover the electromagnetic wave of different frequency.The first metal layer 34 thickness can be 0.05 micron to 2.5 microns.Second metal level 36 thickness can be 0.05 micron to 2.5 microns.The first metal layer 34 and the second metal level 36 can utilize the filming equipments such as vacuum evaporation, sputter, plating, vacuum moulding machine, chemical vapour deposition (CVD) (CVD), by volume to volume (roll-to-roll) mode, complete continuous coating.In addition, the first metal layer 34 and the second metal level 36 do not limit and use aforesaid way to carry out plated film, and metal forming or Alloy Foil also can be selected to select as another of the first metal layer 34 and the second metal level 36.
Insulating barrier 37, is positioned on the second metal level 36.Form the mode of insulating barrier 37, can paste the special coverlay of soft board on the second metal level 36, wherein composition comprises: hard formation is PI, and soft formation is Epoxy resin.Forming the other mode of insulating barrier 37 and use insulating cement merely, such as, is epoxy resin, acryl resin or can through UV/ electron beam curing resin.Preferably insulating cement can not flow out from the second release film 39.The thickness of insulating barrier 37 can be 5 microns to 50 microns.
First release film 38 is made by engineering plastics, the engineering plastic materials that the macromolecules such as such as polypropylene (PP), (interlinkage) polyethylene (PE), Merlon (PC), polyester (PET), polyimides (PI), polyimide amide (PAI), Polyetherimide (PEI), epoxy resin (Epoxy), polyurethane resin and acryl resin (Acrylic) are formed.In addition, the first release film 38 also can select release liners or the engineering plastics film containing mould release.The function of the first release film 38 is that protection conductive layer 33 prevents from being subject to the pollution of external environment (as hydrolysis, dust ... etc.), when this electromagnetic interference shielding film 30 uses, the first release film 38 can be torn off.The thickness of the first release film 38 can be 7.5 microns to 50 microns.
Second release film 39 is made by engineering plastics, the engineering plastic materials that the macromolecules such as such as polypropylene (PP), (interlinkage) polyethylene (PE), Merlon (PC), polyester (PET), polyimides (PI), polyimide amide (PAI), Polyetherimide (PEI), epoxy resin (Epoxy), polyurethane resin and acryl resin (Acrylic) are formed.In addition, the second release film 39 also can select release liners or the engineering plastics film containing mould release.The function of the second release film 39 is that protection insulating barrier 37 prevents from being subject to the pollution of external environment (as hydrolysis, dust ... etc.), when this electromagnetic interference shielding film 30 uses, the second release film 39 can be torn off.The thickness of the second release film 39 can be 7.5 microns to 50 microns.
Embodiment
First embodiment-electromagnetic interference shielding film
Electromagnetic interference shielding film of the present invention can complete by following fabrication steps, and its fabrication steps is as follows:
First a thickness is provided to be first release film of 10 microns; First release film is formed the conductive layer that a thickness is 20 microns; A thickness is provided to be second release film of 10 microns; Second release film forms electromagnetic wave absorbing layer; Electromagnetic wave absorbing layer on second release film is stacked and placed on conductive layer; On electromagnetic wave absorbing layer, use sputter (or evaporation) mode to form the silver metal layer that a thickness is 1.0 microns; Insulating barrier is formed on the 3rd release film; And insulating barrier and the 3rd release film are stacked and placed on silver metal layer, namely form electromagnetic interference shielding film.
The electromagnetic interference shielding film of the second embodiment-have two metal levels
The electromagnetic interference shielding film with two metal levels of the present invention, can complete by following fabrication steps, its fabrication steps is as follows:
First a thickness is provided to be first release film of 10 microns; First release film is formed the conductive layer that a thickness is 20 microns; A thickness is provided to be second release film of 10 microns; Second release film is formed the first electromagnetic wave absorbing layer; The first electromagnetic wave absorbing layer on second release film is stacked and placed on conductive layer; On the first electromagnetic wave absorbing layer, use sputter (or evaporation) mode to form the silver metal layer that a thickness is 1.0 microns; 3rd release film forms the second electromagnetic wave absorbing layer; The second electro-magnetic wave absorption on 3rd release film is stacked and placed on silver metal layer; Use sputter (or evaporation) mode to be formed on the second electromagnetic wave absorbing layer silver-aluminum metal layer that a thickness is 1.0 microns; Insulating barrier is formed on the 4th release film; And insulating barrier and the 4th release film are stacked and placed on silver-aluminum metal layer, namely form the electromagnetic interference shielding film with two metal levels.
With the electromagnetic interference shielding film of the first embodiment, the impact for electromagnetic interference shielding film characteristics of conducting particles content, electro-magnetic wave absorption particle content and metal layer thickness is described below.In the conductive layer of table 1 except conducting particles, being still added with inorganic filler aluminium oxide increases thermal diffusivity.As seen from Table 1 in conductive layer along with Graphene content increase, resistance value reduce.In the electromagnetic wave absorbing layer of table 2 except electro-magnetic wave absorption particle, being still added with inorganic filler aluminium oxide increases thermal diffusivity.As seen from Table 2 along with electro-magnetic wave absorption particle content increases, resistance value there is no the trend obviously increased, and resistance value is greatly about 1014.As seen from Table 3, along with the thickness of metal level increases, electromagnetic shielding value presents the trend of increase.In the conductive layer of table 4 except conducting particles, being still added with inorganic filler aluminium oxide increases thermal diffusivity.In conductive layer, conducting particles content increases as seen from Table 4, and heat radiation K value increases.
In table 1 conductive layer, conducting particles content is for the impact of resistance value
| Graphene content (wt%) | Epoxy resin content (wt%) | Resistance value (Ω/) |
| 0.00 | 40.00 | 7.13×1015 |
| 15.00 | 40.00 | 1.8 *106 |
| 25.00 | 40.00 | 1.2*104 |
| 40.00 | 40.00 | 9.43*102 |
| 50.00 | 40.00 | < 10 |
| 60.00 | 40.00 | < 1 |
Table 2 electro-magnetic wave absorption particle content is for the impact of resistance value
| Electro-magnetic wave absorption particle content (wt%) | Epoxy resin content (wt%) | Resistance value (Ω/) |
| 0.00 | 40.00 | 1.2×1014 |
| 5.00 | 40.00 | 1.3 *1014 |
| 10.00 | 40.00 | 3.8*1014 |
| 30.00 | 40.00 | 1.2*1014 |
| 60.00 | 40.00 | >1014 |
Table 3 metal layer thickness is on the impact of electromagnetic shielding value
| The kind of metal level | Thickness (micron) | Electromagnetic shielding value (dB1.0GHz) |
| Silver | 0.5 | 56 |
| Silver | 1.0 | 65 |
| Silver | 4.0 | 73 |
| Silver | 7.0 | 78 |
| Silver | 10.0 | >80 |
In table 4 conductive layer, conducting particles content is for the impact of heat radiation K value
Note: other materials in table 4, comprises non-thermally conductive material and Heat Conduction Material.Wherein, non-thermally conductive material is such as curing agent, catalyst and fire retardant etc.; Heat Conduction Material is such as silicon dioxide, molten state silicon dioxide, aluminium oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, aluminium nitride, boron nitride, aluminium hydroxide, aluminum silicon carbide, carborundum, sodium carbonate, titanium dioxide, zinc oxide, zirconia, quartz, metal oxide, nonmetal oxide, nitride, silicon compound, silicate thing, glass, ceramic material, calcined kaolin and glaze etc.
The above embodiment is only that protection scope of the present invention is not limited thereto in order to absolutely prove the preferred embodiment that the present invention lifts.The equivalent alternative or conversion that those skilled in the art do on basis of the present invention, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (10)
1. an electromagnetic interference shielding film, is characterized in that, comprises:
An electromagnetic wave absorbing layer containing electro-magnetic wave absorption particle, has a first surface and one second;
A conductive layer containing conducting particles, is positioned on this first surface of this electromagnetic wave absorbing layer;
One metal level, is positioned on this second of this electromagnetic wave absorbing layer; And
One insulating barrier, is positioned on this metal level.
2. electromagnetic interference shielding film according to claim 1, is characterized in that, wherein the material of this conductive layer is epoxy resin or acryl resin.
3. electromagnetic interference shielding film according to claim 1; it is characterized in that; wherein this conducting particles is gold, silver, copper, aluminium, nickel, iron or tin metal particle, surface-coated have the copper of silver or aluminum metal particle, surface-coated has gold, silver, copper, aluminium, nickel, iron or tin resin particle or bead, or carbon dust, carbon 60, carbon black, graphite, expanded graphite, carbon nanotube or Graphene.
4. electromagnetic interference shielding film according to claim 1, is characterized in that, wherein the thickness of this conductive layer is 15 microns to 40 microns.
5. electromagnetic interference shielding film according to claim 1, is characterized in that, wherein the material of this electromagnetic wave absorbing layer is epoxy resin or acryl resin.
6. electromagnetic interference shielding film according to claim 1, is characterized in that, wherein this electro-magnetic wave absorption particle is particles.
7. electromagnetic interference shielding film according to claim 6, is characterized in that, wherein this particles is iron oxide, sendust, permalloy or iron silicochromium nickel alloy.
8. electromagnetic interference shielding film according to claim 1, is characterized in that, wherein this electro-magnetic wave absorption particle is calcium carbonate, cement, natural crystal, far infrared ore materials.
9. electromagnetic interference shielding film according to claim 1, is characterized in that, wherein the thickness of this electromagnetic wave absorbing layer is 5 microns to 20 microns.
10. electromagnetic interference shielding film according to claim 1, is characterized in that, wherein the material of this metal level is gold, silver, copper, aluminium, nickel, titanium or tin.
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| CN107333461A (en) * | 2017-08-16 | 2017-11-07 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film and electromagnetic shielding film production process |
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| CN110876254B (en) * | 2018-08-30 | 2021-04-13 | 神讯电脑(昆山)有限公司 | Wave-absorbing heat dissipation structure |
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| WO2021230140A1 (en) * | 2020-05-11 | 2021-11-18 | パナソニック株式会社 | Electromagnetic wave shielding laminated sheet |
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Application publication date: 20160127 |