JP2008270370A - Electromagnetic wave shielding sheet - Google Patents

Electromagnetic wave shielding sheet Download PDF

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Publication number
JP2008270370A
JP2008270370A JP2007108731A JP2007108731A JP2008270370A JP 2008270370 A JP2008270370 A JP 2008270370A JP 2007108731 A JP2007108731 A JP 2007108731A JP 2007108731 A JP2007108731 A JP 2007108731A JP 2008270370 A JP2008270370 A JP 2008270370A
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electromagnetic wave
wave shielding
layer
shielding sheet
film
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Hiroshi Tsutagatani
洋 蔦ヶ谷
Takashi Ishiguro
隆 石黒
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Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
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Priority to JP2007108731A priority Critical patent/JP2008270370A/en
Priority to US12/104,149 priority patent/US20080292891A1/en
Priority to CNA2008100910730A priority patent/CN101291578A/en
Publication of JP2008270370A publication Critical patent/JP2008270370A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Soft Magnetic Materials (AREA)
  • Laminated Bodies (AREA)
  • Hard Magnetic Materials (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding sheet having a high shielding effect against electromagnetic waves and capable of suppressing secondary radiation causing a noise without being connected to GND. <P>SOLUTION: The electromagnetic wave shielding sheet 10 is provided with a laminate film 14 on a base paper 12. The laminate film 14 has a laminate structure in which an adhesive layer 16 having adhesive performance, a resistor film layer 18 and an insulating layer 20 are laminated. A specific resistance value of the insulating layer 20 is set at ≥10<SP>6</SP>Ω/cm and a specific resistance value of the resistor film layer 18 is set at 10-300 Ω. Thus, the secondary radiation can be reduced while maintaining a high shielding effect. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、電子機器などから外部への電磁波の漏洩や、外部からの電磁波の侵入を遮蔽ないしシールドするための電磁波遮蔽シートに関するものである。   The present invention relates to an electromagnetic wave shielding sheet for shielding or shielding leakage of an electromagnetic wave from an electronic device or the like to the outside or invasion of an electromagnetic wave from the outside.

携帯電話，デジタルカメラ，液晶ＴＶ，プリンタ等の電子機器の内部配線として、ＦＰＣ（フレキシブルプリンティングサーキット）やＦＦＣ（フレキシブルフラットケーブル）が用いられている。これらＦＰＣ，ＦＦＣ等の電気配線や、電子機器の内部に実装するＬＳＩ等の電子部品は、電磁波遮蔽機能を有するフィルムなどで覆うことによって、電磁波の漏洩防止やノイズ対策が図られている。従来の電磁波遮蔽シートは、樹脂フィルムなどの基材の表面に導電層（金属層など）を形成し、該導電層によって、電磁波を吸収して遮蔽する構成となっている。   FPC (flexible printing circuit) and FFC (flexible flat cable) are used as internal wiring of electronic devices such as mobile phones, digital cameras, liquid crystal TVs, and printers. These electric wiring such as FPC and FFC, and electronic parts such as LSI mounted inside the electronic device are covered with a film having an electromagnetic wave shielding function to prevent leakage of electromagnetic waves and noise countermeasures. A conventional electromagnetic wave shielding sheet has a configuration in which a conductive layer (metal layer or the like) is formed on the surface of a substrate such as a resin film, and electromagnetic waves are absorbed and shielded by the conductive layer.

このような電磁波遮蔽技術としては、例えば、下記特許文献１の「電磁シールドフィルム及びそれを用いたシールド構造体」や、下記特許文献２の「電磁波シールドシート及び電子機器」がある。また、下記特許文献３の「電波吸収部の形成方法、電波吸収シート、高周波機器、及び電波吸収部形成装置」には、合成ゴム等の柔軟性を有する樹脂に、磁性体，カーボン等の電波吸収材料を分散して形成した電波吸収シートが開示されている。
特開平６−９７６９４号公報 特開２００５−６４２６６公報 特開２００６−３３２３６２公報 Examples of such an electromagnetic wave shielding technique include “Electromagnetic shield film and shield structure using the same” in Patent Document 1 below and “Electromagnetic shield sheet and electronic device” in Patent Document 2 below. In addition, in “Patent Document 3 Forming Method, Radio Wave Absorbing Sheet, High Frequency Device, and Radio Wave Absorber Forming Device” of Patent Document 3 below, a flexible resin such as synthetic rubber, a magnetic material, carbon or the like An electromagnetic wave absorbing sheet formed by dispersing an absorbing material is disclosed.
JP-A-6-97694 JP-A-2005-64266 JP 2006-332362 A

しかしながら、従来の技術では、導電層の抵抗が小さすぎ、反射による遮蔽効果は望めるものの、電磁波の吸収効果が低くノイズの二次放射の原因となる場合がある。これを防止するために、導電層をＧＮＤないしアースに接続することもあるが、そのためのスペースの確保や構造が必要となり、使い勝手が悪く取り付けにも手間がかかるほか、コストも高くなるという不都合がある。また、導電性を有していない（あるいは導電性が低い）電波吸収シートの場合には、良好なシールド効果が得られにくい。   However, in the conventional technique, although the resistance of the conductive layer is too small and the shielding effect by reflection can be expected, the electromagnetic wave absorption effect is low and may cause secondary emission of noise. In order to prevent this, the conductive layer may be connected to GND or ground. However, it is necessary to secure a space and structure for the conductive layer, and it is not easy to use and troublesome to install, and the cost is high. is there. Further, in the case of a radio wave absorbing sheet that does not have electrical conductivity (or has low electrical conductivity), it is difficult to obtain a good shielding effect.

本発明は、以上の点に着目したもので、その目的は、電磁波の遮蔽効果が高く、ＧＮＤ接続をしなくてもノイズの原因となる二次放射を抑制することができる電磁波遮蔽シートを提供することである。   The present invention pays attention to the above points, and its purpose is to provide an electromagnetic wave shielding sheet that has a high electromagnetic wave shielding effect and can suppress secondary radiation that causes noise without GND connection. It is to be.

前記目的を達成するため、本発明の電磁波遮蔽シートは、抵抗膜層の一方の主面に、接着性を有する接着層を貼り合わせた積層フィルム構造を有するとともに、前記抵抗膜層の抵抗値が、長さ１００ｍｍ，幅２ｍｍの大きさとして幅の中央にて９８ｍｍの距離で測定した場合に、１０Ω〜３００Ω，であることを特徴とする。   In order to achieve the object, the electromagnetic wave shielding sheet of the present invention has a laminated film structure in which an adhesive layer having adhesiveness is bonded to one main surface of the resistive film layer, and the resistance value of the resistive film layer is When measured at a distance of 98 mm at the center of the width as a size of 100 mm in length and 2 mm in width, it is 10Ω to 300Ω.

主要な形態の一つは、前記抵抗膜層の他方の主面に、絶縁層を貼り合わせた積層フィルム構造を有するとともに、前記絶縁層の抵抗率が、１０６Ω／ｃｍ以上，であることを特徴とする。他の形態は、前記接着層が、熱可塑性樹脂または熱硬化性樹脂により形成されていることを特徴とする。更に他の形態は、前記抵抗膜層が、アルミニウム薄膜であることを特徴とする。更に他の形態は、前記アルミニウム薄膜の厚みが、１００〜５００Åであることを特徴とする。本発明の前記及び他の目的，特徴，利点は、以下の詳細な説明及び添付図面から明瞭になろう。 One of the main forms has a laminated film structure in which an insulating layer is bonded to the other main surface of the resistive film layer, and the resistivity of the insulating layer is 10 6 Ω / cm or more. It is characterized by. In another embodiment, the adhesive layer is formed of a thermoplastic resin or a thermosetting resin. Yet another embodiment is characterized in that the resistive film layer is an aluminum thin film. Yet another embodiment is characterized in that the aluminum thin film has a thickness of 100 to 500 mm. The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.

本発明によれば、抵抗膜層の一方の主面に、接着性を有する接着層を貼り合わせた積層フィルム構造を有する電磁波遮蔽シートにおいて、前記抵抗膜層の抵抗値を、長さ１００ｍｍ，幅２ｍｍの大きさとして幅の中央にて９８ｍｍの距離で測定した場合に、１０Ω〜３００Ω，に設定する。あるいは、抵抗膜層の一方の主面に磁性層を設けるとともに、前記抵抗膜層の抵抗値を、長さ１００ｍｍ，幅２ｍｍの大きさとして幅の中央にて９８ｍｍの距離で測定した場合に、１０Ω〜３００Ω，に設定することで、高いシールド効果を保ちながら、二次放射を低減した良好な電波吸収特性が得られる。また、吸収特性の更なる向上も図ることができる。   According to the present invention, in the electromagnetic wave shielding sheet having a laminated film structure in which an adhesive layer having adhesiveness is bonded to one main surface of the resistive film layer, the resistance value of the resistive film layer is set to a length of 100 mm and a width. When measured at a distance of 98 mm at the center of the width as a size of 2 mm, it is set to 10Ω to 300Ω. Alternatively, when a magnetic layer is provided on one main surface of the resistance film layer, and the resistance value of the resistance film layer is measured at a distance of 98 mm at the center of the width as a size of length 100 mm and width 2 mm, By setting the impedance to 10Ω to 300Ω, it is possible to obtain good radio wave absorption characteristics with reduced secondary radiation while maintaining a high shielding effect. Further, the absorption characteristics can be further improved.

以下、本発明を実施するための最良の形態を、実施例に基づいて詳細に説明する。   Hereinafter, the best mode for carrying out the present invention will be described in detail based on examples.

最初に、図１及び図２を参照しながら、本発明の実施例１を説明する。図１(A)は、本実施例の電磁波遮蔽シートの積層構造を示す断面図であり、(B)は抵抗値の測定方法を示す図である。図２は、本実施例の電磁波遮蔽シートと比較例の特性比較試験の結果を示す図であり、(A)は吸収特性を示す図，(B)は透過特性を示す図である。   First, Embodiment 1 of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1A is a cross-sectional view showing a laminated structure of an electromagnetic wave shielding sheet of this example, and FIG. 1B is a view showing a method for measuring a resistance value. 2A and 2B are diagrams showing the results of a characteristic comparison test between the electromagnetic wave shielding sheet of this example and the comparative example, in which FIG. 2A is a diagram showing absorption characteristics and FIG. 2B is a diagram showing transmission characteristics.

まず、図１(A)を参照して、本実施例の構造を説明する。本実施例の電磁波遮蔽シートは、電子機器のノイズ対策や、外部への電磁波漏洩の防止，あるいは、外部からの電磁波の影響の防止ないし低減を図るためのシールド機能を有するものであって、例えば、ＦＰＣ（フレキシブルプリンティングサーキット），ＦＦＣ（フレキシブルフラットケーブル）などの配線部材や、ＬＳＩ等の電子部品の表面を覆うように設けられる。なお、本発明でいうシールドとは、電磁波の吸収作用及び反射作用の両方を含んでいる。図１(A)に示すように、本実施例の電磁波遮蔽シート１０は、台紙（離型紙）１２と積層フィルム１４を積層した構造となっている。前記積層フィルム１４は、接着層１６，抵抗膜層１８，絶縁層２０を貼り合わせた積層構造となっている。なお、前記台紙１２は、電磁波遮蔽シート１０を所望の寸法・形状に切断しやすくするために設けられているが、必要に応じて設けるようにすればよい。   First, the structure of this embodiment will be described with reference to FIG. The electromagnetic wave shielding sheet of this example has a shielding function for preventing noise from electronic devices, preventing leakage of electromagnetic waves to the outside, or preventing or reducing the influence of external electromagnetic waves, for example, The wiring member such as FPC (flexible printing circuit) and FFC (flexible flat cable) and the surface of the electronic component such as LSI are provided. The shield referred to in the present invention includes both an electromagnetic wave absorbing action and a reflecting action. As shown in FIG. 1A, the electromagnetic wave shielding sheet 10 of this example has a structure in which a mount (release paper) 12 and a laminated film 14 are laminated. The laminated film 14 has a laminated structure in which an adhesive layer 16, a resistive film layer 18, and an insulating layer 20 are bonded together. In addition, although the said mount 12 is provided in order to make it easy to cut | disconnect the electromagnetic wave shielding sheet 10 to a desired dimension and shape, what is necessary is just to provide it as needed.

前記接着層１６としては、接着性を有した材料として、例えば、ＥＭＭＡ（エチレン系樹脂）フィルムが用いられるが、下地となる台紙１２に合わせて他の公知の各種の熱接着性を備えた材料（例えば、ポリイミド樹脂やＣＰＰ（無延伸ポリプロピレン）など）を用いてよい。本実施例では、前記ＥＭＭＡを用いて厚さ３０μｍの接着層１６を形成した。   As the adhesive layer 16, for example, an EMMA (ethylene resin) film is used as an adhesive material, and other known materials having various thermal adhesive properties in accordance with the base paper 12 serving as a base. (For example, polyimide resin, CPP (non-stretched polypropylene), etc.) may be used. In this example, the adhesive layer 16 having a thickness of 30 μm was formed using the EMMA.

次に、前記抵抗膜層１８としては、蒸着やメッキなどで形成した金属薄膜が用いられる。本実施例では、前記抵抗膜層１８として、アルミニウムを蒸着したアルミニウム薄膜を使用している。前記アルミニウム薄膜の抵抗値は、１０Ω〜３００Ωの範囲内となるように調整される。これは、１０Ωよりも抵抗値が小さいと電磁波の吸収特性が悪化し、３００Ωよりも大きいと電磁波の透過特性が悪化するためである。なお、抵抗値の測定は、図１(B)に示すように、長さ１００ｍｍ，幅２ｍｍの電磁波遮蔽シート１０上の抵抗膜層１８に、抵抗計５０を端子５２，５４によって接続することで行った。端子５２，５４の先端位置は電磁波遮蔽シート１０の幅の略中央となっており、端子５２，５４の距離は９８ｍｍである。   Next, as the resistance film layer 18, a metal thin film formed by vapor deposition or plating is used. In this embodiment, an aluminum thin film deposited with aluminum is used as the resistance film layer 18. The resistance value of the aluminum thin film is adjusted to be within a range of 10Ω to 300Ω. This is because when the resistance value is smaller than 10Ω, the electromagnetic wave absorption characteristics deteriorate, and when it exceeds 300Ω, the electromagnetic wave transmission characteristics deteriorate. As shown in FIG. 1B, the resistance value is measured by connecting a resistance meter 50 to the resistance film layer 18 on the electromagnetic wave shielding sheet 10 having a length of 100 mm and a width of 2 mm by terminals 52 and 54. went. The tip positions of the terminals 52 and 54 are substantially the center of the width of the electromagnetic wave shielding sheet 10, and the distance between the terminals 52 and 54 is 98 mm.

次に、前記アルミニウム薄膜の厚みは、好ましくは２００〜４００Åに設定されるが、１００〜５００Åの範囲内であれば、必要に応じて適宜変更可能である。本実施例では、前記アルミニウム薄膜を、４００Åの厚みとなるように形成している。この厚みの範囲は、前記抵抗値の範囲に対応している。このように、前記抵抗膜層１８の厚みを薄くすることにより、該抵抗膜層１８を抵抗膜として作用させ、電磁波の吸収能力の向上を図ることができる。   Next, the thickness of the aluminum thin film is preferably set to 200 to 400 mm, but can be appropriately changed as necessary as long as it is within the range of 100 to 500 mm. In this embodiment, the aluminum thin film is formed to have a thickness of 400 mm. This thickness range corresponds to the resistance value range. Thus, by reducing the thickness of the resistive film layer 18, the resistive film layer 18 can act as a resistive film, and the ability to absorb electromagnetic waves can be improved.

前記抵抗膜層１８の他方の主面には、絶縁層２０が貼り合わせられている。本実施例では、前記絶縁層２０として、厚さ２０μｍのＣＰＰ（無延伸ポリプロピレン）フィルムを用いているが、他の公知の絶縁材料を用いてもよい。例えば、ＰＥＴ，ＰＥ，ＰＩ等の有機材料を用いるようにしてもよいし、ＳｉＯ２コートやＳｉＮ等の無機膜であってもよい。このような絶縁層２０は、例えば、蒸着やスパッタなどの方法のほか、公知の湿式法によって成膜される。このような絶縁層２０の抵抗率は、１０６Ω／ｃｍ以上である。これは、抵抗率が１０６Ω／ｃｍ未満では絶縁性が失われ、上部に配線を載せた場合にショートするおそれがあるためである。 An insulating layer 20 is bonded to the other main surface of the resistance film layer 18. In this embodiment, a CPP (unstretched polypropylene) film having a thickness of 20 μm is used as the insulating layer 20, but other known insulating materials may be used. For example, an organic material such as PET, PE, or PI may be used, or an inorganic film such as SiO 2 coat or SiN may be used. Such an insulating layer 20 is formed by, for example, a known wet method in addition to a method such as vapor deposition or sputtering. The resistivity of such an insulating layer 20 is 10 6 Ω / cm or more. This is because if the resistivity is less than 10 6 Ω / cm, the insulating property is lost, and there is a possibility of short-circuiting when wiring is placed on top.

以上のような積層フィルム１４は、例えば、前記絶縁層２０の主面に、抵抗膜層１８（アルミニウム薄膜）を蒸着で形成してから、前記接着層１６をドライラミネート加工によって貼り合わせて形成される。そして、所望の形状・寸法に切断し、例えば、フレキシブルケーブルの一部（例えば、信号入力側の位置）などに貼り付けて使用される。   The laminated film 14 as described above is formed, for example, by forming a resistance film layer 18 (aluminum thin film) on the main surface of the insulating layer 20 by vapor deposition, and then bonding the adhesive layer 16 by dry lamination. The And it cut | disconnects to a desired shape and dimension, for example, it affixes and uses it for a part (for example, position of a signal input side) etc. of a flexible cable.

次に、本実施例の作用を説明すると、積層フィルム１４に進入した電磁波のうち、まず、一部が抵抗膜層１８によって反射される。次に、反射されない電磁波は抵抗膜層１８に入射するが、抵抗膜層１８に電磁波の入射により渦電流が流れるようになり、これが抵抗膜層１８の抵抗による発熱となって、結果的に電磁波は吸収されるようになる。   Next, the operation of the present embodiment will be described. First, a part of the electromagnetic wave that has entered the laminated film 14 is reflected by the resistance film layer 18. Next, the electromagnetic wave that is not reflected is incident on the resistive film layer 18, and an eddy current flows through the resistive film layer 18 due to the incident electromagnetic wave, which generates heat due to the resistance of the resistive film layer 18. Will be absorbed.

このように、本実施例の基本構造の電磁波遮蔽シート１０によれば、接着層１６，抵抗膜層１８，絶縁層２０からなる積層フィルム１４を形成し、前記絶縁層２０の抵抗率を１０６Ω／ｃｍ以上に設定するとともに、前記抵抗膜層１８の抵抗値を１０Ω〜３００Ωにすることとした。このため、高いシールド効果を保ちながら、ＧＮＤ接続をしなくても、ノイズの原因となる二次放射を低減した良好な電波吸収特性が得られる。また、抵抗膜層１８を薄くすることにより抵抗膜として作用させるため、従来のシールドフィルムに匹敵する遮蔽特性を有するシートを、低コストで製造することができるとともに、電磁波遮蔽シート１０の薄型化を図ることができる。 Thus, according to the electromagnetic wave shielding sheet 10 having the basic structure of the present embodiment, the laminated film 14 including the adhesive layer 16, the resistive film layer 18, and the insulating layer 20 is formed, and the resistivity of the insulating layer 20 is 10 6. The resistance value of the resistive film layer 18 was set to 10Ω to 300Ω while being set to Ω / cm or more. For this reason, it is possible to obtain good radio wave absorption characteristics in which secondary radiation that causes noise is reduced without maintaining a high shielding effect and without GND connection. Further, since the resistive film layer 18 is made thin to act as a resistive film, a sheet having a shielding characteristic comparable to that of a conventional shield film can be manufactured at low cost, and the electromagnetic wave shielding sheet 10 can be made thin. Can be planned.

＜実験例＞・・・次に、本実施例と比較例についてそれぞれサンプルを作製し、吸収特性及び透過特性を比較した実験例について説明する。本実験例としては、上述した電磁波遮蔽シート１０をサンプルＳＡとして用いた。また、比較例としては、金属磁性体粉末を樹脂中に分散・混合した複合磁性体をシート化したノイズ抑制シートを比較例１とし、転写フィルム，柔軟性樹脂層と耐磨耗性樹脂層からなる絶縁層，金属薄膜層，異方導電性接着剤層，保護フィルムからなる構造の電磁波シールドフィルムを比較例２として使用した。   <Experimental Example> Next, an experimental example in which samples are prepared for the present example and the comparative example and the absorption characteristics and the transmission characteristics are compared will be described. As this experimental example, the electromagnetic wave shielding sheet 10 described above was used as a sample SA. In addition, as a comparative example, a noise suppression sheet obtained by forming a composite magnetic material in which a metal magnetic powder is dispersed and mixed in a resin is used as Comparative Example 1, and the transfer film, the flexible resin layer, and the wear-resistant resin layer are used. An electromagnetic wave shielding film having a structure comprising an insulating layer, a metal thin film layer, an anisotropic conductive adhesive layer, and a protective film was used as Comparative Example 2.

図２(A)は、電磁波の吸収特性を示す図であり、横軸は周波数（ＭＨｚ）、縦軸は吸収率（Ｐloss／Ｐin）を表している。また、図２(B)は電磁波の透過特性を示す図であり、横軸は周波数（ＭＨｚ）、縦軸は減衰量（ｄＢ）を表している。図２(A)及び(B)ともに、点線がサンプルＳＡ（電磁波遮蔽シート１０），一点鎖線が比較例１，実線が比較例２，をそれぞれ表している。   FIG. 2A is a diagram showing the absorption characteristics of electromagnetic waves, where the horizontal axis represents frequency (MHz) and the vertical axis represents absorption rate (Ploss / Pin). FIG. 2B is a graph showing electromagnetic wave transmission characteristics, where the horizontal axis represents frequency (MHz) and the vertical axis represents attenuation (dB). 2A and 2B, the dotted line represents sample SA (electromagnetic wave shielding sheet 10), the alternate long and short dash line represents comparative example 1, and the solid line represents comparative example 2.

まず、図２(A)に示すように、サンプルＳＡは、周波数が２ＧＨｚ以下の範囲では比較例１及び２よりも吸収率が高くなっている。この結果から、本実施例の積層フィルム１４を利用した積層構造の吸収効率が高いことが確認できた。   First, as shown in FIG. 2A, the sample SA has a higher absorption rate than Comparative Examples 1 and 2 in the frequency range of 2 GHz or less. From this result, it has confirmed that the absorption efficiency of the laminated structure using the laminated | multilayer film 14 of a present Example is high.

一方、図２(B)に示すように、減衰量に関しては、２ＧＨｚ以下の範囲において、サンプルＳＡは、比較例１よりは減衰量が大きく、比較例２よりは減衰量が小さくなっている。減衰量が大きすぎると、電磁波が電子機器内に閉じ込められるようになり、信号波形を乱す原因となる。逆に、減衰量が小さすぎると、電磁波が電子機器から外部に放出されるようになり、遮蔽効果が低い。このような点からみると、本実施例の電磁波遮蔽シート１０は、極めて良好な減衰特性を有していると考えられる。   On the other hand, as shown in FIG. 2 (B), with respect to the attenuation, in the range of 2 GHz or less, the sample SA has a larger attenuation than the comparative example 1 and a smaller attenuation than the comparative example 2. If the amount of attenuation is too large, the electromagnetic wave is confined in the electronic device, which causes the signal waveform to be disturbed. Conversely, if the attenuation is too small, electromagnetic waves are emitted from the electronic device to the outside, and the shielding effect is low. From this point of view, it is considered that the electromagnetic wave shielding sheet 10 of this example has extremely good attenuation characteristics.

図３には、本実施例の適用例が示されている。ＦＦＣ１００は、フレキシブルな絶縁シート１０２，１０６に導体パターン１０４が挟まれた構造となっている。上記実施例で示した電磁波遮蔽シート１１０は、ＦＦＣ１００を覆うように設けられる。ＦＦＣ１００の全体を覆うと、ノイズが増大するなどの不都合が生ずるので、良好な電磁波遮蔽効果が得られるような範囲を覆うようにする。   FIG. 3 shows an application example of this embodiment. The FFC 100 has a structure in which a conductive pattern 104 is sandwiched between flexible insulating sheets 102 and 106. The electromagnetic wave shielding sheet 110 shown in the above embodiment is provided so as to cover the FFC 100. When the entire FFC 100 is covered, inconveniences such as an increase in noise occur, so that a range where a good electromagnetic wave shielding effect can be obtained is covered.

なお、本発明は、上述した実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることができる。例えば、以下のものも含まれる。
(1)前記実施例で示した形状，寸法は一例であり、必要に応じて適宜変更してよい。また、前記実施例で示した膜厚や材料も一例であり、同様の効果を奏するものであれば、上述した実施例で示した範囲内で適宜変更可能である。
(2)前記台紙１２も一例であり、必要に応じて設けるようにすればよい。
(3)上述した製造工程も一例であり、同様の効果を奏するように適宜変更してよい。
(4)前記実施例では、本発明の電磁波遮蔽シートを、ＦＰＣやＦＦＣなどの配線を覆うために用いることとしたが、これも一例であり、本発明は、電磁波ノイズを出すような電子機器全般（例えば、ＰＣ，携帯電話，デジタルカメラ）に設けるほか、外部からの電磁波を遮蔽するためにも利用可能である。例えば、本発明の電磁波遮蔽シートを利用した衣服を着用することにより、心臓ペースメーカの電磁波障害を防止するなどである。このほか、本発明は、電磁波の漏洩や侵入を防止する用途全般に適用可能である。 In addition, this invention is not limited to the Example mentioned above, A various change can be added in the range which does not deviate from the summary of this invention. For example, the following are also included.
(1) The shapes and dimensions shown in the above embodiments are examples, and may be appropriately changed as necessary. Moreover, the film thickness and material shown in the above-described embodiment are also examples, and can be appropriately changed within the range shown in the above-described embodiment as long as the same effect is obtained.
(2) The mount 12 is an example, and may be provided as necessary.
(3) The manufacturing process described above is also an example, and may be changed as appropriate so as to achieve the same effect.
(4) In the above embodiment, the electromagnetic wave shielding sheet of the present invention is used for covering wiring such as FPC and FFC. However, this is also an example, and the present invention is an electronic device that emits electromagnetic noise. In addition to being provided in general (for example, PC, mobile phone, digital camera), it can also be used for shielding electromagnetic waves from the outside. For example, by wearing clothes using the electromagnetic wave shielding sheet of the present invention, an electromagnetic interference of a cardiac pacemaker can be prevented. In addition, the present invention can be applied to all uses for preventing leakage and intrusion of electromagnetic waves.

本発明によれば、抵抗膜層の一方の主面に、接着性を有する接着層を貼り合わせた積層フィルム構造において、前記抵抗膜層の抵抗値を長さ１００ｍｍ，幅２ｍｍの大きさとして幅の中央にて９８ｍｍの距離で測定した場合に、１０Ω〜３００Ωに設定した。このため、高いシールド（遮蔽）効果を保ちながら二次放射を低減することができるため、電磁波遮蔽シートの用途に適用できる。特に、携帯電話などの高密度な電子機器の電磁波遮蔽の用途に好適である。   According to the present invention, in the laminated film structure in which an adhesive layer having adhesiveness is bonded to one main surface of the resistive film layer, the resistance value of the resistive film layer is set to a length of 100 mm and a width of 2 mm. When measured at a distance of 98 mm at the center of the film, it was set to 10Ω to 300Ω. For this reason, since secondary radiation can be reduced while maintaining a high shielding (shielding) effect, it can be applied to an electromagnetic wave shielding sheet. In particular, it is suitable for electromagnetic wave shielding applications of high-density electronic devices such as mobile phones.

(A)は本発明の実施例１の電磁波遮蔽シートの積層構造を示す断面図，(B)は抵抗値の測定方法を示す図である。(A) is sectional drawing which shows the laminated structure of the electromagnetic wave shielding sheet of Example 1 of this invention, (B) is a figure which shows the measuring method of resistance value. 前記実施例１の電磁波遮蔽シートと比較例の特性比較試験の結果を示す図であり、(A)は吸収特性を示す図，(B)は透過特性を示す図である。It is a figure which shows the result of the characteristic comparison test of the electromagnetic wave shielding sheet of the said Example 1, and a comparative example, (A) is a figure which shows an absorption characteristic, (B) is a figure which shows a permeation | transmission characteristic. 本発明の電磁波遮蔽シートの適用例を示す平面図である。It is a top view which shows the example of application of the electromagnetic wave shielding sheet of this invention.

符号の説明Explanation of symbols

１０：電磁波遮蔽シート
１２：台紙
１４：積層フィルム
１６：接着層
１８：抵抗膜層
２０：絶縁層
５０：抵抗計
５２，５４：端子
１００：ＦＦＣ
１０２，１０６：絶縁シート
１０４：導体パターン
１１０：電磁波遮蔽シート 10: Electromagnetic wave shielding sheet 12: Mount 14: Laminated film 16: Adhesive layer 18: Resistance film layer 20: Insulating layer 50: Resistance meter 52, 54: Terminal 100: FFC
102, 106: Insulating sheet 104: Conductor pattern 110: Electromagnetic wave shielding sheet

Claims (8)

抵抗膜層の一方の主面に、接着性を有する接着層を貼り合わせた積層フィルム構造を有するとともに、
前記抵抗膜層の抵抗値が、長さ１００ｍｍ，幅２ｍｍの大きさとして幅の中央にて９８ｍｍの距離で測定した場合に、１０Ω〜３００Ω，
であることを特徴とする電磁波遮蔽シート。 While having a laminated film structure in which an adhesive layer having adhesiveness is bonded to one main surface of the resistive film layer,
When the resistance value of the resistance film layer is 100 mm in length and 2 mm in width and measured at a distance of 98 mm at the center of the width, 10Ω to 300Ω,
An electromagnetic wave shielding sheet characterized by the above. 前記抵抗膜層の他方の主面に、絶縁層を貼り合わせた積層フィルム構造を有するとともに、
前記絶縁層の抵抗率が、１０６Ω／ｃｍ以上，
であることを特徴とする請求項１記載の電磁波遮蔽シート。 While having a laminated film structure in which an insulating layer is bonded to the other main surface of the resistive film layer,
The resistivity of the insulating layer is 10 6 Ω / cm or more,
The electromagnetic wave shielding sheet according to claim 1, wherein: 前記接着層が、熱可塑性樹脂または熱硬化性樹脂により形成されていることを特徴とする請求項１記載の電磁波遮蔽シート。   The electromagnetic wave shielding sheet according to claim 1, wherein the adhesive layer is formed of a thermoplastic resin or a thermosetting resin. 前記抵抗膜層が、アルミニウム薄膜であることを特徴とする請求項１記載の電磁波遮蔽シート。   The electromagnetic wave shielding sheet according to claim 1, wherein the resistance film layer is an aluminum thin film. 前記アルミニウム薄膜の厚みが、１００〜５００Åであることを特徴とする請求項４記載の電磁波遮蔽シート。   The electromagnetic wave shielding sheet according to claim 4, wherein the aluminum thin film has a thickness of 100 to 500 mm. 前記積層フィルム構造の接着層側主面に磁性層を設けるとともに、該磁性層の主面に第２の接着層を設けたことを特徴とする請求項１〜５のいずれかに記載の電磁波遮蔽シート。   The electromagnetic wave shielding according to claim 1, wherein a magnetic layer is provided on the main surface of the laminated film structure on the side of the adhesive layer, and a second adhesive layer is provided on the main surface of the magnetic layer. Sheet. 抵抗膜層の一方の主面に磁性層が設けられるとともに、
前記抵抗膜層の抵抗値が、長さ１００ｍｍ，幅２ｍｍの大きさとして幅の中央にて９８ｍｍの距離で測定した場合に、１０Ω〜３００Ω，
であることを特徴とする電磁波遮蔽シート。 A magnetic layer is provided on one main surface of the resistive film layer,
When the resistance value of the resistance film layer is 100 mm in length and 2 mm in width and measured at a distance of 98 mm at the center of the width, 10Ω to 300Ω,
An electromagnetic wave shielding sheet characterized by the above. 前記磁性層の主面に接着層を設けたことを特徴とする請求項７記載の電磁波遮蔽シート。   The electromagnetic wave shielding sheet according to claim 7, wherein an adhesive layer is provided on a main surface of the magnetic layer.
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Cited By (4)

* Cited by examiner, † Cited by third party
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WO2012081369A1 (en) * 2010-12-17 2012-06-21 新日鐵化学株式会社 Electromagnetic noise suppressing body, use of same, and electronic device
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